Slicing device for monocrystalline silicon wafer
By designing a single crystal silicon wafer slice device including a clamping motor, a adjustment motor and a cutter, the problems of low slice efficiency and inconsistent slice thickness in the prior art are solved, and the consistency of slice thickness and stable clamping of single crystal silicon rods are achieved, and the slice efficiency and quality are improved.
Patent Information
- Application Number
- CN202420702115.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-08
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-04-08
AI Technical Summary
The existing slicing device cannot effectively clamp and fix the single crystal silicon rod during slicing, resulting in low slicing efficiency and inability to adjust the down-cut position, resulting in inconsistent slice thickness and affecting subsequent use.
A single crystal silicon wafer slice device including an operating platform, a support column, a support base, a mounting base, a adjustment base, a adjustment motor, a clamping motor and a cutting knife is designed. The clamping of the single crystal silicon rod is achieved by clamping the motor and the clamping plate, and the downward cutting position of the cutter is adjusted by adjusting the motor and the adjustment seat to ensure the consistency of the slice thickness.
The consistency of slice thickness is achieved, meeting the needs of different thicknesses, and the clamping motor and clamping ensure that the single crystal silicon rod remains stable during the slice process, avoids skewness, and improves the slice efficiency and quality.
Smart Images
Figure CN222681365U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of slicing devices, in particular to a slicing device for single crystal silicon slices. Background Art
[0002] Silicon crystals are widely used in the photovoltaic industry. In order to meet the quality parameters of silicon crystal rods and the shape and size of the next process, the initial processing of silicon rods is an indispensable step in the early process of photovoltaic solar cells. First, it is necessary to process the seed crystal, square the seed crystal, and then pull out single crystal silicon rods or cast polycrystalline silicon blocks through the seed crystal, and then cut and slice the single crystal silicon rods and polycrystalline silicon blocks.
[0003] If the existing slicing device cannot clamp and fix the single crystal silicon rod during slicing, it may lead to low slicing efficiency, and the lower cutting position of the single crystal silicon rod cannot be adjusted during slicing, resulting in inconsistent slice thickness, affecting subsequent use. Therefore, the utility model proposes a single crystal silicon wafer slicing device to solve the above problems. Utility Model Content
[0004] The purpose of the utility model is to provide a device for slicing single crystal silicon wafers to solve the problems raised in the above background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a device for slicing single crystal silicon wafers, comprising an operating platform, a support column, a support seat, a mounting seat, an adjustment seat, an adjustment motor, a clamping motor and a cutter, wherein a plurality of support columns are arranged on the lower side of the operating platform, and the plurality of support columns are distributed in a rectangular shape at the four corners of the operating platform, a support seat is arranged on one side of the operating platform, a mounting seat is arranged on the side of the support seat away from the operating platform, an adjustment motor is arranged on one side of the mounting seat, an adjustment screw is arranged at the shaft end of the adjustment motor, the adjustment screw extends into the mounting seat, a sliding rod is arranged in the mounting seat near the adjusting screw, an adjustment seat is sleeved on the sliding rod and the adjusting screw, and a fixing column is arranged on the lower side of the adjusting seat.
[0006] Preferably, an adjustment groove is provided at a position on the mounting seat corresponding to the fixing column, the size of the adjustment groove is adapted to the size of the fixing column, a fixing plate is provided on the side of the fixing column away from the adjustment seat, an electric telescopic rod is provided on the lower side of the fixing plate, and a cutter is fixedly connected to one end of the electric telescopic rod away from the fixing plate.
[0007] Preferably, a fixing box is provided on the lower side of the operating platform, a clamping motor is provided on one side of the fixing box, a bidirectional screw is provided at the shaft end of the clamping motor, the bidirectional screw extends into the fixing box, and a guide rod is provided in the fixing box near the bidirectional screw.
[0008] Preferably, two movable seats are sleeved on the guide rod and the bidirectional screw, and movable columns are provided on the two movable seats. A slide groove is provided at a position corresponding to the movable column on the operating platform, and the size of the slide groove is adapted to the size of the movable column.
[0009] Preferably, a clamping plate is provided on one side of the two movable columns away from the movable seat, and the two clamping plates are symmetrically arranged relative to the operating platform, and the two clamping plates are semicircular plates.
[0010] Compared with the prior art, the beneficial effects of the utility model are: the utility model has a simple structure, the slice thickness is consistent, and can meet the needs of different thicknesses. By adjusting the seat and the adjusting motor, the cutter can be adjusted to the lower cutting position to meet the needs of different slice thicknesses. By clamping the motor and the clamping plate, the single crystal silicon rod can be clamped and tightened during the slicing process to avoid skewing and affect subsequent use. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0012] Figure 2 It is a longitudinal cross-sectional structural schematic diagram of the utility model;
[0013] Figure 3 It is a schematic diagram of the internal structure of the fixing box of the utility model.
[0014] In the figure: 1. operating platform; 2. supporting column; 3. supporting seat; 4. mounting seat; 5. adjusting seat; 6. adjusting motor; 7. clamping motor; 8. cutting knife; 9. adjusting screw; 10. sliding rod; 11. fixing column; 12. fixing plate; 13. electric telescopic rod; 14. fixing box; 15. moving seat; 16. moving column; 17. clamping plate. DETAILED DESCRIPTION
[0015] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0016] In the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0017] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0018] See also Figure 1-3 The utility model provides a technical solution: a device for slicing single crystal silicon wafers, comprising an operating platform 1, a supporting column 2, a supporting seat 3, a mounting seat 4, an adjusting seat 5, an adjusting motor 6, a clamping motor 7 and a cutter 8. A plurality of supporting columns 2 are arranged on the lower side of the operating platform 1, and a plurality of supporting columns 2 are distributed in a rectangular shape at the four corners of the operating platform 1. A supporting seat 3 is arranged on one side of the operating platform 1, and a mounting seat 4 is arranged on the side of the supporting seat 3 away from the operating platform 1. An adjusting motor 6 is arranged on one side of the mounting seat 4, and an adjusting screw 9 is arranged at the shaft end of the adjusting motor 6. The adjusting screw 9 extends into the mounting seat 4, and a sliding rod 10 is arranged in the mounting seat 4 near the adjusting screw 9. The sliding rod 10 and the adjusting screw 9 are sleeved with an adjusting seat 5, and a fixing column 11 is arranged on the lower side of the adjusting seat 5.
[0019] In this embodiment, an adjustment groove is provided at a position on the mounting seat 4 corresponding to the fixed column 11, and the size of the adjustment groove is adapted to the size of the fixed column 11. A fixing plate 12 is provided on the side of the fixed column 11 away from the adjustment seat 5, and an electric telescopic rod 13 is provided on the lower side of the fixing plate 12. The end of the electric telescopic rod 13 away from the fixed plate 12 is fixedly connected to the cutter 8.
[0020] In this embodiment, a fixing box 14 is provided on the lower side of the operating platform 1, a clamping motor 7 is provided on one side of the fixing box 14, a bidirectional screw is provided at the shaft end of the clamping motor 7, the bidirectional screw extends into the fixing box 14, and a guide rod is provided in the fixing box 14 near the bidirectional screw.
[0021] In this embodiment, two moving seats 15 are sleeved on the guide rod and the bidirectional screw, and both moving seats 15 are provided with moving columns 16. A slide groove is provided at a position corresponding to the moving column 16 on the operating platform 1, and the size of the slide groove is adapted to the size of the moving column 16.
[0022] In this embodiment, a clamping plate 17 is provided on one side of the two movable columns 16 away from the movable seat 15 . The two clamping plates 17 are symmetrically arranged relative to the operating platform 1 , and the two clamping plates 17 are semicircular plates.
[0023] Working principle: the staff places the single crystal silicon rod on the operating platform 1 and aligns the end with the clamping plate 17, and then drives the bidirectional screw to rotate through the clamping motor 7, and then the two clamping plates 17 move relative to the single crystal silicon rod, thereby clamping the single crystal silicon rod, and then the adjusting motor 6 is used to rotate the adjusting screw 9, and the adjusting seat 5 moves along the direction of the sliding rod 10, thereby adjusting the cutter 8 to the lower cutting position, and then the electric telescopic rod 13 is used to make the cutter 8 complete the lower cutting operation, and then the slices can be collected.
[0024] It is worth noting that the entire device is controlled by a main control button. Since the device matched with the control button is a common device and belongs to the existing mature technology, its electrical connection relationship and specific circuit structure will not be described in detail here.
[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A device for slicing single crystal silicon wafers, characterized in that: The invention comprises an operating platform (1), a supporting column (2), a supporting seat (3), a mounting seat (4), an adjusting seat (5), an adjusting motor (6), a clamping motor (7) and a cutter (8). A plurality of supporting columns (2) are arranged on the lower side of the operating platform (1). The plurality of supporting columns (2) are arranged at the four corners of the operating platform (1) in a rectangular shape. A supporting seat (3) is arranged on one side of the operating platform (1). A mounting seat (4) is arranged on the side of the supporting seat (3) away from the operating platform (1). An adjusting motor (6) is arranged on one side of the mounting seat (4). An adjusting screw (9) is arranged at the shaft end of the adjusting motor (6). The adjusting screw (9) extends into the mounting seat (4). A sliding rod (10) is arranged in the mounting seat (4) near the adjusting screw (9). The sliding rod (10) and the adjusting screw (9) are sleeved with an adjusting seat (5). A fixing column (11) is arranged on the lower side of the adjusting seat (5).
2. The device for slicing single crystal silicon wafers according to claim 1, characterized in that: An adjustment slot is provided at a position on the mounting seat (4) corresponding to the fixing column (11), the size of the adjustment slot being adapted to the size of the fixing column (11); a fixing plate (12) is provided on the fixing column (11) at a side away from the adjustment seat (5); an electric telescopic rod (13) is provided on the lower side of the fixing plate (12); and a cutter (8) is fixedly connected to one end of the electric telescopic rod (13) away from the fixing plate (12).
3. The device for slicing single crystal silicon wafers according to claim 1, characterized in that: A fixing box (14) is provided on the lower side of the operating platform (1), a clamping motor (7) is provided on one side of the fixing box (14), a bidirectional screw is provided at the shaft end of the clamping motor (7), the bidirectional screw extends into the fixing box (14), and a guide rod is provided in the fixing box (14) near the bidirectional screw.
4. The device for slicing single crystal silicon wafers according to claim 3, characterized in that: Two movable seats (15) are sleeved on the guide rod and the bidirectional screw rod, and movable columns (16) are arranged on the two movable seats (15). A slide groove is arranged at a position corresponding to the movable column (16) on the operating platform (1), and the size of the slide groove is adapted to the size of the movable column (16).
5. The device for slicing single crystal silicon wafers according to claim 4, characterized in that: A clamping plate (17) is provided on one side of the two movable columns (16) away from the movable seat (15). The two clamping plates (17) are symmetrically arranged relative to the operating platform (1) and are semicircular plates.