Gravity-following heat dissipation device

Abstract

A gravity-following heat dissipation device comprises a fixing frame, a heat conduction block, a first heat pipe and a second heat pipe. The heat conduction block is installed in the fixing frame and used for making contact with a heat source. The first heat pipe is connected to the heat conduction block, the connecting part of the first heat pipe is connected between the heat absorption part of the first heat pipe and the heat dissipation part of the first heat pipe, and the connecting part of the first heat pipe is located below the heat absorption part of the first heat pipe and the heat dissipation part of the first heat pipe. The second heat pipe is connected to the heat conduction block and connected to the first heat pipe, the first connecting part of the second heat pipe is connected between the heat absorption part of the second heat pipe and the first heat dissipation part of the second heat pipe, and the first connecting part of the second heat pipe is located above the heat absorption part of the second heat pipe and the first heat dissipation part of the second heat pipe, so that the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The invention relates to a heat dissipation device, and in particular to a heat dissipation device following gravity. Background Art

[0002] With the advancement of technology, electronic products are becoming more and more popular, and gradually changing the way many people live or work. As computer computing power increases, the temperature control of electronic components such as CPUs and graphics chips becomes more and more important.

[0003] Electronic components such as CPUs and graphics chips generate heat when running and require proper cooling to achieve optimal performance. In order to keep electronic components such as CPUs and graphics chips running at ideal temperatures, the appropriate gravity cooling device configuration will determine the performance of the electronic device.

[0004] In addition, as the appearance size of current electronic devices is getting smaller and smaller, and the number of cores of their computing chips is increasing, the heat generated is also increasing. In a small space, not only computing chips and heat dissipation devices are installed, but also other mechanisms and electronic components are installed at the same time.

[0005] In order to match the design of the chassis of small computer equipment, some computer equipment adopts the design of vertically mounted graphics cards to provide better space utilization. However, vertically mounted graphics cards and traditional graphics cards will produce different results in performance testing.

[0006] Therefore, how to take into account the performance of vertically and horizontally mounted display cards to improve heat dissipation efficiency and reduce the operating temperature of computing chips will help improve the overall operating efficiency of electronic devices. Utility Model Content

[0007] The new content is intended to provide a simplified summary of the present disclosure so that readers can have a basic understanding of the present disclosure. This new content is not a complete overview of the present disclosure, and its intention is not to point out the important / critical elements of the present embodiment or to define the scope of the present invention.

[0008] An object of the present invention is to provide a gravity-following heat dissipation device that can improve heat dissipation efficiency and thereby improve the overall working efficiency of the electronic device.

[0009] To achieve the above-mentioned purpose, according to one embodiment of the present disclosure, a gravity heat dissipation device is provided, which includes a fixed frame, a heat conductive block, a first heat pipe and a second heat pipe. The heat conductive block is installed in the fixed frame to contact a heat source. The first heat pipe is connected to the heat conductive block, and the first heat pipe includes a heat absorbing part, a connecting part and a heat dissipating part. The connecting part of the first heat pipe is connected between the heat absorbing part of the first heat pipe and the heat dissipating part of the first heat pipe, and the connecting part of the first heat pipe is located below the heat absorbing part of the first heat pipe and the heat dissipating part of the first heat pipe. The second heat pipe is connected to the heat conductive block and connected to the first heat pipe. The second heat pipe includes a heat absorbing part, a first connecting part and a first heat dissipating part, wherein the first connecting part of the second heat pipe is connected between the heat absorbing part of the second heat pipe and the first heat dissipating part of the second heat pipe, and the first connecting part of the second heat pipe is located above the heat absorbing part of the second heat pipe and the first heat dissipating part of the second heat pipe.

[0010] In some embodiments, the second heat pipe further includes a second connecting portion and a second heat dissipating portion. The second connecting portion is connected below the heat absorbing portion of the second heat pipe, and the second heat dissipating portion is connected to the second connecting portion of the second heat pipe.

[0011] In some embodiments, the gravity heat dissipation device also includes a third heat pipe connected to the heat conductive block and to the second heat pipe, wherein the third heat pipe includes a heat absorption part, a first connection part, a first heat dissipation part, a second connection part and a second heat dissipation part, wherein the first connection part of the third heat pipe is connected between the heat absorption part of the third heat pipe and the first heat dissipation part of the third heat pipe, and the first connection part of the third heat pipe is located above the heat absorption part of the third heat pipe and the first heat dissipation part of the third heat pipe, the second connection part of the third heat pipe is connected below the heat absorption part of the third heat pipe, and the second heat dissipation part of the third heat pipe is connected to the second connection part of the third heat pipe.

[0012] In some embodiments, a second heat pipe and a third heat pipe are sequentially and symmetrically arranged on both sides of the first heat pipe.

[0013] In some embodiments, the gravity heat dissipation device also includes a fourth heat pipe connected to the heat conductive block and to the third heat pipe, wherein the fourth heat pipe includes a heat absorbing part, a connecting part and a heat dissipating part, wherein the connecting part of the fourth heat pipe is connected between the bottom of the heat absorbing part of the fourth heat pipe and the top of the heat dissipating part of the fourth heat pipe.

[0014] In some embodiments, the gravity heat dissipation device also includes a fifth heat pipe connected to the heat conductive block and to the fourth heat pipe, wherein the fifth heat pipe includes a heat absorbing part, a connecting part and a heat dissipating part, wherein the connecting part of the fifth heat pipe is connected between the bottom of the heat absorbing part of the fifth heat pipe and the top of the heat dissipating part of the fifth heat pipe.

[0015] In some embodiments, on both sides of the first heat pipe, a second heat pipe, a third heat pipe, a fourth heat pipe and a fifth heat pipe are sequentially and symmetrically arranged.

[0016] In some embodiments, the gravity heat dissipation device also includes a first heat dissipation fin module, wherein the heat absorption part of the first heat pipe and the heat dissipation part of the first heat pipe, the heat absorption part of the second heat pipe and the first heat dissipation part of the second heat pipe, the heat absorption part of the third heat pipe and the first heat dissipation part of the third heat pipe, the heat absorption part of the fourth heat pipe, and the heat absorption part of the fifth heat pipe are arranged in the first heat dissipation fin module.

[0017] In some embodiments, the gravity heat dissipation device further includes a second heat dissipation fin module, which is separated from the first heat dissipation fin module in upper and lower parts. The second heat dissipation part of the second heat pipe, the second heat dissipation part of the third heat pipe, the heat dissipation part of the fourth heat pipe and the heat dissipation part of the fifth heat pipe are arranged in the second heat dissipation fin module.

[0018] In some embodiments, the gravity heat dissipation device further includes a module fixing bracket and a fan module. The module fixing bracket is fixed to the first heat dissipation fin module and the second heat dissipation fin module, and the fan module is fixed on the module fixing bracket.

[0019] In some embodiments, the fan module includes a fan fixing frame and a plurality of fans. The fan fixing frame is used to be fixed on the module fixing bracket, and the plurality of fans are installed on the fan fixing frame.

[0020] In some embodiments, the first heat pipe includes a metal tube, an annular tooth groove layer and a powder sintering layer. The annular tooth groove layer is formed on the inner wall of the metal tube, and the powder sintering layer is formed on the inner side of the annular tooth groove layer. The annular tooth groove layer of the first heat pipe includes a groove depth and a groove width, and the groove depth of the annular tooth groove layer of the first heat pipe is approximately 40-60% of the groove depth of the second heat pipe, and the groove width of the annular tooth groove layer of the first heat pipe is approximately 30-50% of the groove width of the second heat pipe. In some embodiments, the diameter of the metal powder particles of the powder sintering layer of the first heat pipe is approximately 35-45% of the diameter of the metal powder particles of the powder sintering layer of the second heat pipe.

[0021] Therefore, the gravity heat sink device can utilize gravity heat pipes to effectively improve the performance of the vertically mounted display card, reduce the operating temperature of the computing chip, and thus improve the overall working efficiency of the electronic device. In addition, the gravity heat pipe is combined with finer metal powder to form a sintered layer, which effectively improves the capillary force to increase the heat dissipation performance. The shallow grooves replace the deep grooves to further ensure that the heat dissipation liquid flows unimpeded, thereby further improving the heat dissipation performance, thereby increasing the heat dissipation capacity of the gravity heat sink device, and is more suitable for use on the vertically mounted display card device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to make the above and other purposes, features, advantages and embodiments of the present disclosure more obvious and understandable, the description of the accompanying drawings is as follows:

[0023] Figure 1 It is a front view schematic diagram of a gravity heat dissipation device according to an embodiment of the present invention.

[0024] Figure 2 It is a schematic diagram of an explosion of a gravity heat dissipation device according to an embodiment of the present invention.

[0025] Figure 3 FIG. 1 is an exploded schematic diagram of a portion of a heat pipe of a gravity heat dissipation device according to an embodiment of the present invention.

[0026] Figure 4 The figure is a cross-sectional schematic diagram of a heat absorbing portion of a heat pipe of a gravity heat dissipation device according to an embodiment of the present invention.

[0027] Figure 5 The figure is a cross-sectional schematic diagram of a heat pipe of a gravity heat dissipation device according to an embodiment of the present invention.

[0028] Description of reference numerals:

[0029] 100: Gravity cooling device

[0030] 101: Arrow

[0031] 102: Arrow

[0032] 103: Heat Source

[0033] 110: First heat pipe

[0034] 112: Heat absorption part

[0035] 114: Connection

[0036] 116: Heat dissipation

[0037] 120: Second heat pipe

[0038] 122: Heat absorption part

[0039] 124: First connection

[0040] 126: First heat dissipation unit

[0041] 128: Second connection part

[0042] 129: Second heat dissipation unit

[0043] 130: The third heat pipe

[0044] 132: Heat absorption part

[0045] 134: First connection part

[0046] 136: First heat dissipation unit

[0047] 138: Second connection part

[0048] 139: Second heat dissipation unit

[0049] 140: Fourth heat pipe

[0050] 142: Heat absorption part

[0051] 144: Connection

[0052] 146: Heat dissipation

[0053] 150: Fifth heat pipe

[0054] 152: Heat absorption part

[0055] 154: Connection

[0056] 156: Heat dissipation

[0057] 160: First heat sink fin module

[0058] 170: Second heat sink fin module

[0059] 180: Module fixing bracket

[0060] 182: First fixed bracket

[0061] 184: Second fixed bracket

[0062] 190: Fixed frame

[0063] 192: Heat conduction block

[0064] 200: Fan module

[0065] 210: First Fan

[0066] 220: Second Fan

[0067] 230: The Third Fan

[0068] 240: Fan fixing frame

[0069] 412: Bottom plate

[0070] 414: Sidewall

[0071] 416: Up the wall

[0072] 422: Base plate

[0073] 424: Sidewall

[0074] 426: Up the wall

[0075] 432: Bottom plate

[0076] 434: Sidewall

[0077] 436: Up the wall

[0078] 442: Base plate

[0079] 444: Sidewall

[0080] 446: Up the wall

[0081] 452: Base plate

[0082] 454: Sidewall

[0083] 456: Up the wall

[0084] 500: Heat pipe

[0085] 510: Metal pipe

[0086] 520: Annular groove layer

[0087] 522: Groove depth

[0088] 524: Groove width

[0089] 530: Powder sintering layer DETAILED DESCRIPTION

[0090] The following is a detailed description of the embodiments with the help of the drawings in the specification, but the embodiments provided are not intended to limit the scope of the present disclosure, and the description of the structure operation is not intended to limit the order of its execution. Any device with equal technical effects produced by the re-combination of components is within the scope of the present disclosure. In addition, the drawings are for illustrative purposes only and are not drawn in their original size. For ease of understanding, the same or similar components in the following description will be indicated by the same symbols.

[0091] In addition, the terms used throughout the specification and claims generally have the ordinary meaning of each term used in the field, in the context of this disclosure, and in the specific context, unless otherwise noted. Certain terms used to describe the present disclosure will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the description of the present disclosure.

[0092] In the embodiments and claims, unless otherwise specified in the context, "a", "an" and "the" may refer to one or more. The numbers used in the steps are only used to mark the steps for ease of description, and are not used to limit the order and implementation methods.

[0093] Secondly, the words "include", "including", "have", "contain" and the like used in this article are all open terms, which mean including but not limited to.

[0094] Figure 1 is a front view schematic diagram showing a gravity heat dissipation device according to an embodiment of the present invention, Figure 2 The explosion diagram is shown. Figure 3 is an exploded schematic diagram showing a portion of a heat pipe of a gravity heat sink, and Figure 4 is a schematic cross-sectional view showing the heat absorbing portion of a heat pipe of a gravity heat dissipation device. Figure 5 FIG. 4 is a schematic cross-sectional view showing a heat pipe.

[0095] See first Figures 1 to 3 As shown in the figure, the gravity heat dissipation device 100 includes a fixing frame 190, a heat conductive block 192, a first heat pipe 110 and a second heat pipe 120. The heat conductive block 192 is installed in the fixing frame 190 to contact a heat source 103, such as a chip or other heating element, which does not deviate from the concept and protection scope of the present invention. Figure 3 Only some of the heat pipes are shown, for example, in the figure, the first heat pipe 110 and the heat pipes on its right or left side, such as the second heat pipe 120 , the third heat pipe 130 , the fourth heat pipe 140 and the fifth heat pipe 150 .

[0096] In some embodiments, the fixing frame 190 is formed of metals such as aluminum, copper, and stainless steel, and the heat conducting block 192 is formed of metals such as copper, but the present invention is not limited thereto.

[0097] The first heat pipe 110 is connected to the heat conductive block 192 to absorb heat from the heat source 103. The first heat pipe 110 includes a heat absorbing portion 112, a connecting portion 114 and a heat dissipating portion 116, and the connecting portion 114 is connected between the heat absorbing portion 112 and the heat dissipating portion 116, and the connecting portion 114 is located below the heat absorbing portion 112 and the heat dissipating portion 116 to form a U-shaped heat pipe, and the U-shaped opening faces upward, that is, the U-shaped opening faces the direction of arrow 101.

[0098] The second heat pipe 120 is also connected to the heat conductive block 192 to absorb heat from the heat source 103. The second heat pipe 120 is connected to the first heat pipe 110. The second heat pipe 120 includes a heat absorbing portion 122, a first connecting portion 124 and a first heat dissipating portion 126. The first connecting portion 124 is connected between the heat absorbing portion 122 and the first heat dissipating portion 126, and the first connecting portion 124 is located above the heat absorbing portion 122 and the first heat dissipating portion 126, so that the heat absorbing portion 112, the first connecting portion 124 and the first heat dissipating portion 126 form a U-shaped heat pipe, and the U-shaped opening faces downward, that is, the U-shaped opening faces the direction of the arrow 102.

[0099] In addition, the heat absorbing portion 112 of the first heat pipe 110 and the heat absorbing portion 122 of the second heat pipe 120 are preferably arranged in parallel, for example, arranged side by side on the surface of the heat conductive block 192 .

[0100] In some embodiments, the second heat pipe 120 further includes a second connection portion 128 and a second heat dissipation portion 129 . The second connection portion 128 is connected to the lower portion of the heat absorption portion 122 , and the second connection portion 128 is connected to the upper portion of the second heat dissipation portion 129 .

[0101] In some embodiments, the gravity heat dissipation device 100 includes a plurality of second heat pipes 120 , such as two second heat pipes 120 , which are symmetrically disposed on both sides of the first heat pipe 110 .

[0102] In some embodiments, the gravity heat dissipation device 100 further includes a third heat pipe 130 connected to the heat conductive block 192 to absorb heat from the heat source 103. The third heat pipe 130 is connected to one side of the second heat pipe 120. The third heat pipe 130 includes a heat absorbing portion 132, a first connecting portion 134, and a first heat dissipating portion 136. The first connecting portion 134 of the third heat pipe 130 is connected between the heat absorbing portion 132 and the first heat dissipating portion 136, and the first connecting portion 134 is located above the heat absorbing portion 132 and the first heat dissipating portion 136 to form a U-shaped heat pipe, and the U-shaped opening faces downward, that is, the U-shaped opening faces the direction of the arrow 102.

[0103] In addition, the third heat pipe 130 further includes a second connection portion 138 and a second heat dissipation portion 139 . The second connection portion 138 is connected to the lower portion of the heat absorption portion 132 , and the second connection portion 138 is connected to the upper portion of the second heat dissipation portion 139 .

[0104] In some embodiments, the gravity heat dissipation device 100 includes a plurality of third heat pipes 130 , such as two third heat pipes 130 , which are symmetrically disposed on sides of the second heat pipe 120 .

[0105] In some embodiments, the gravity heat dissipation device 100 further includes a fourth heat pipe 140 connected to the heat conductive block 192 to absorb heat from the heat source 103. The fourth heat pipe 140 is connected to one side of the third heat pipe 130, and the fourth heat pipe 140 includes a heat absorbing portion 142, a connecting portion 144, and a heat dissipating portion 146. The connecting portion 144 of the fourth heat pipe 140 is connected between the lower portion of the heat absorbing portion 142 and the upper portion of the heat dissipating portion 146.

[0106] In some embodiments, the gravity heat dissipation device 100 includes a plurality of fourth heat pipes 140 , such as two fourth heat pipes 140 , which are symmetrically disposed on both sides of the third heat pipe 130 .

[0107] In some embodiments, the gravity heat dissipation device 100 further includes a fifth heat pipe 150 connected to the heat conductive block 192 to absorb heat from the heat source 103. The fifth heat pipe 150 is connected to one side of the fourth heat pipe 140, and the fifth heat pipe 150 includes a heat absorbing portion 152, a connecting portion 154, and a heat dissipating portion 156. The connecting portion 154 of the fifth heat pipe 150 is connected between the lower portion of the heat absorbing portion 152 and the upper portion of the heat dissipating portion 156.

[0108] In some embodiments, the gravity heat dissipation device 100 includes a plurality of fifth heat pipes 150 , such as two fifth heat pipes 150 , which are symmetrically disposed on sides of the fourth heat pipe 140 .

[0109] It is worth noting that the gravity heat dissipation device 100 further includes a first heat dissipation fin module 160 and a second heat dissipation fin module 170. The heat absorption portion 112 of the first heat pipe 110 and the heat dissipation portion 116 of the first heat pipe 110, the heat absorption portion 122 of the second heat pipe 120 and the first heat dissipation portion 126 of the second heat pipe 120, the heat absorption portion 132 of the third heat pipe 130 and the first heat dissipation portion 136 of the third heat pipe 130, the heat absorption portion 142 of the fourth heat pipe 140, and the heat absorption portion 152 of the fifth heat pipe 150 are all disposed in the first heat dissipation fin module 160.

[0110] The second heat dissipation fin module 170 is separated from the first heat dissipation fin module 160 in an upper and lower manner, but the present invention is not limited thereto. The second heat dissipation portion 129 of the second heat pipe 120, the second heat dissipation portion 139 of the third heat pipe 130, the heat dissipation portion 146 of the fourth heat pipe 140, and the heat dissipation portion 156 of the fifth heat pipe 150 are disposed in the second heat dissipation fin module 170.

[0111] It is worth noting that the heat absorbing portion 112 of the first heat pipe 110 and the heat dissipating portion 116 of the first heat pipe 110 are not disposed in the second heat dissipating fin module 170 .

[0112] When the upper side of the gravity heat sink 100 is installed in the direction of arrow 101, the first heat pipe 110 forms a gravity heat pipe, which can effectively guide the cooled heat dissipation liquid to the connecting part 114 by using gravity and capillary phenomenon, and then guide it to the heat absorption part 112, so as to improve the overall heat dissipation efficiency of the gravity heat sink 100, and can evenly distribute the heat on the heat dissipation fins of the gravity heat sink 100, so as to further improve the heat dissipation efficiency of the gravity heat sink 100.

[0113] In some embodiments, the gravity heat dissipation device 100 further includes a module fixing bracket 180 and a fan module 200. The module fixing bracket 180 is fixed to the first heat dissipation fin module 160 and the second heat dissipation fin module 170, and the fan module 200 is fixed on the module fixing bracket 180 to facilitate the installation of the fan module 200. In some embodiments, the module fixing bracket 180 includes a first fixing bracket 182 and a second fixing bracket 184, which are respectively fixed to the two sides of the first heat dissipation fin module 160 and the second heat dissipation fin module 170.

[0114] In some embodiments, the fan module 200 includes a fan fixing frame 240 and a plurality of fans, such as a first fan 210, a second fan 220, and a third fan 230. The fan fixing frame 240 is used to be fixed on the module fixing bracket 180, and the first fan 210, the second fan 220, and the third fan 230 are respectively installed on the fan fixing frame 240 to be fixed on the module fixing bracket 180, and further fixed on the first heat sink fin module 160 and the second heat sink fin module 170.

[0115] Further reading Figure 4 As shown in the figure, the heat absorbing part 112, the heat absorbing part 122, the heat absorbing part 132, the heat absorbing part 142 and the heat absorbing part 152 have a flat bottom shape. For example, the heat absorbing part 112 of the first heat pipe 110 has a bottom plate 412, two side walls 414 and an upper wall 416. The two side walls 414 are connected between the bottom plate 412 and the upper wall 416, and preferably the bottom plate 412 is a flat shape, and the two side walls 414 extend upward from the bottom plate 412 and are connected to the upper wall 416.

[0116] Similarly, the heat absorbing portion 122 of the second heat pipe 120 has a bottom plate 422, two side walls 424 and an upper wall 426. The two side walls 424 are connected between the bottom plate 422 and the upper wall 426, and preferably the bottom plate 422 is a flat shape, and the two side walls 424 extend upward from the bottom plate 422 and are connected to the upper wall 426.

[0117] The heat absorbing portion 132 of the third heat pipe 130 has a bottom plate 432, two side walls 434 and an upper wall 436. The two side walls 434 are connected between the bottom plate 432 and the upper wall 436, and the bottom plate 432 is preferably a flat shape, and the two side walls 434 extend upward from the bottom plate 432 and are connected to the upper wall 436.

[0118] The heat absorbing portion 142 of the fourth heat pipe 140 has a bottom plate 442, two side walls 444 and an upper wall 446. The two side walls 444 are connected between the bottom plate 442 and the upper wall 446, and preferably the bottom plate 442 is a flat shape, and the two side walls 444 extend upward from the bottom plate 442 and are connected to the upper wall 446.

[0119] In addition, the heat absorbing portion 152 of the fifth heat pipe 150 has a bottom plate 452, two side walls 454 and an upper wall 456. The two side walls 454 are connected between the bottom plate 452 and the upper wall 456, and preferably the bottom plate 452 is a flat shape, and the two side walls 454 extend upward from the bottom plate 452 and are connected to the upper wall 456.

[0120] It is worth noting that the bottom plate 412, the bottom plate 422, the bottom plate 432, the bottom plate 442 and the bottom plate 452 are preferably coplanar and connected to the surface of the heat conductive block 192. In addition, the two side walls 414 of the first heat pipe 110 are respectively connected to the one side wall 424 of the second heat pipe 120, the other side wall 424 of the second heat pipe 120 is connected to the one side wall 434 of the third heat pipe 130, the other side wall 434 of the third heat pipe 130 is connected to the one side wall 444 of the fourth heat pipe 140, and the other side wall 444 of the fourth heat pipe 140 is connected to the one side wall 454 of the fifth heat pipe 150, so that the heat pipes can effectively contact the surface of the heat conductive block 192 and evenly use the heat pipes to take the heat away from the heat conductive block 192.

[0121] See also Figure 5 As shown in the figure, the heat pipe 500 can form a first heat pipe 110 , a second heat pipe 120 , a third heat pipe 130 , a fourth heat pipe 140 and / or a fifth heat pipe 150 .

[0122] The heat pipe 500 includes a metal pipe 510, an annular groove layer 520 and a powder sintering layer 530. The annular groove layer 520 is formed on the inner wall of the metal pipe 510, and the powder sintering layer 530 is formed on the inner side of the annular groove layer 520. In addition, the annular groove layer 520 of the heat pipe 500 includes a groove depth 522 and a groove width 524.

[0123] However, it is worth noting that the groove depth 522 of the annular groove layer 520 of the heat pipe 500 forming the first heat pipe 110 is approximately 40-60% of the groove depth of other heat pipes, such as the second heat pipe 120, the third heat pipe 130, the fourth heat pipe 140, and / or the fifth heat pipe 150. The groove width 524 of the annular groove layer 520 of the heat pipe 500 forming the first heat pipe 110 is approximately 30-50% of the groove width of other heat pipes, such as the second heat pipe 120, the third heat pipe 130, the fourth heat pipe 140, and / or the fifth heat pipe 150.

[0124] In addition, in some embodiments, the diameter of the metal powder particles of the powder sintered layer 530 of the heat pipe 500 forming the first heat pipe 110 is approximately 35-45% of the diameter of the metal powder particles of the powder sintered layer of other heat pipes, such as the second heat pipe 120, the third heat pipe 130, the fourth heat pipe 140 and / or the fifth heat pipe 150.

[0125] In some embodiments, the metal powder particles of the powder sintering layer 530 of the heat pipe 500 are copper metal powder particles or other metal powder particles or non-metal powder particles, which do not deviate from the concept and protection scope of the present invention.

[0126] In summary, the gravity heat sink disclosed in the present invention can utilize gravity heat pipes to effectively improve the performance of vertically mounted display cards, reduce the operating temperature of computing chips, and thus improve the overall operating efficiency of electronic devices. In addition, the gravity heat pipes are combined with finer metal powders to form a sintered layer, which effectively improves capillary force to increase heat dissipation performance. The shallow grooves replace the deep grooves to further ensure that the heat dissipation liquid flows unimpeded, thereby further improving the heat dissipation performance, thereby increasing the heat dissipation capacity of the gravity heat sink, and are more suitable for use on vertically mounted display card devices.

[0127] Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Any person skilled in the art can make various changes and modifications without departing from the concept and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be based on what is defined in the claims.

Claims

1. A gravity heat dissipation device, characterized in that: Include: a fixed frame; a heat conducting block installed in the fixing frame and used for contacting a heat source; a first heat pipe connected to the heat conductive block, wherein the first heat pipe comprises a heat absorbing portion, a connecting portion and a heat dissipating portion, wherein the connecting portion of the first heat pipe is connected between the heat absorbing portion of the first heat pipe and the heat dissipating portion of the first heat pipe, and the connecting portion of the first heat pipe is located below the heat absorbing portion of the first heat pipe and the heat dissipating portion of the first heat pipe; and A second heat pipe is connected to the heat conductive block and to the first heat pipe, wherein the second heat pipe comprises a heat absorbing portion, a first connecting portion and a first heat dissipating portion, wherein the first connecting portion of the second heat pipe is connected between the heat absorbing portion of the second heat pipe and the first heat dissipating portion of the second heat pipe, and the first connecting portion of the second heat pipe is located above the heat absorbing portion of the second heat pipe and the first heat dissipating portion of the second heat pipe.

2. The gravity heat dissipation device according to claim 1, characterized in that: The second heat pipe further comprises: a second connecting portion connected to the lower part of the heat absorbing portion of the second heat pipe; and A second heat dissipation portion is connected to the second connection portion of the second heat pipe.

3. The gravity heat dissipation device according to claim 2, characterized in that: Also includes: A third heat pipe is connected to the heat conductive block and to the second heat pipe, wherein the third heat pipe comprises a heat absorbing portion, a first connecting portion, a first heat dissipating portion, a second connecting portion and a second heat dissipating portion, wherein the first connecting portion of the third heat pipe is connected between the heat absorbing portion of the third heat pipe and the first heat dissipating portion of the third heat pipe, and the first connecting portion of the third heat pipe is located above the heat absorbing portion of the third heat pipe and the first heat dissipating portion of the third heat pipe, the second connecting portion of the third heat pipe is connected below the heat absorbing portion of the third heat pipe, and the second heat dissipating portion of the third heat pipe is connected to the second connecting portion of the third heat pipe.

4. The gravity heat dissipation device according to claim 3, characterized in that: The second heat pipe and the third heat pipe are respectively and sequentially and symmetrically arranged on both sides of the first heat pipe.

5. The gravity heat dissipation device according to claim 3, characterized in that: Also includes: A fourth heat pipe is connected to the heat conductive block and to the third heat pipe, wherein the fourth heat pipe comprises a heat absorbing portion, a connecting portion and a heat dissipating portion, wherein the connecting portion of the fourth heat pipe is connected between the lower portion of the heat absorbing portion of the fourth heat pipe and the upper portion of the heat dissipating portion of the fourth heat pipe.

6. The gravity heat dissipation device according to claim 5, characterized in that: Also includes: A fifth heat pipe is connected to the heat conductive block and to the fourth heat pipe, wherein the fifth heat pipe comprises a heat absorbing portion, a connecting portion and a heat dissipating portion, wherein the connecting portion of the fifth heat pipe is connected between the lower portion of the heat absorbing portion of the fifth heat pipe and the upper portion of the heat dissipating portion of the fifth heat pipe.

7. The gravity heat dissipation device according to claim 6, characterized in that: The second heat pipe, the third heat pipe, the fourth heat pipe and the fifth heat pipe are respectively and sequentially and symmetrically arranged on both sides of the first heat pipe.

8. The gravity heat dissipation device according to claim 6, characterized in that: Also includes: A first heat dissipation fin module, wherein the heat absorption portion of the first heat pipe and the heat dissipation portion of the first heat pipe, the heat absorption portion of the second heat pipe and the first heat dissipation portion of the second heat pipe, the heat absorption portion of the third heat pipe and the first heat dissipation portion of the third heat pipe, the heat absorption portion of the fourth heat pipe, and the heat absorption portion of the fifth heat pipe are arranged in the first heat dissipation fin module.

9. The gravity heat dissipation device according to claim 8, characterized in that: Also includes: A second heat dissipation fin module is arranged separately from the first heat dissipation fin module up and down, wherein the second heat dissipation part of the second heat pipe, the second heat dissipation part of the third heat pipe, the heat dissipation part of the fourth heat pipe and the heat dissipation part of the fifth heat pipe are arranged in the second heat dissipation fin module.

10. The gravity heat dissipation device according to claim 9, characterized in that: Also includes: a module fixing bracket, fixed to the first heat dissipation fin module and the second heat dissipation fin module; and A fan module is fixed on the module fixing bracket.

11. The gravity heat dissipation device according to claim 10, characterized in that: The fan module includes: a fan fixing frame, used to be fixed on the module fixing bracket; and A plurality of fans are installed on the fan fixing frame.

12. The gravity heat dissipation device according to claim 1, characterized in that: The first heat pipe comprises: a metal tube; an annular tooth groove layer formed on the inner wall of the metal tube; and A powder sintered layer is formed on the inner side of the annular tooth groove layer, wherein the annular tooth groove layer of the first heat pipe includes a groove depth and a groove width, wherein the groove depth of the annular tooth groove layer of the first heat pipe is approximately 40-60% of the groove depth of the second heat pipe, and the groove width of the annular tooth groove layer of the first heat pipe is approximately 30-50% of the groove width of the second heat pipe, wherein the diameter of the metal powder particles of the powder sintered layer of the first heat pipe is approximately 35-45% of the diameter of the metal powder particles of the powder sintered layer of the second heat pipe.

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