Paster magnetic bead with vertical structure

Abstract

The utility model discloses a paster magnetic bead with a vertical structure, which comprises a magnetic bead body, the magnetic bead body is in a sealed state, the left side and the right side of the magnetic bead body are respectively provided with an outer electrode layer, a ferrite raw ceramic chip and an interlayer raw ceramic chip are arranged in the magnetic bead body, and the ferrite raw ceramic chip and the interlayer raw ceramic chip are vertically stacked. The electrode rings are arranged between the ferrite raw ceramic chip and the interlayer raw ceramic chip in a penetrating connection mode, the first leading-out end is arranged on the left side of the outer side of the ferrite raw ceramic chip and the left side of the outer side of the interlayer raw ceramic chip in a connected mode, and the second leading-out end is arranged on the right side of the outer side of the ferrite raw ceramic chip and the right side of the interlayer raw ceramic chip in a connected mode. The first leading-out end and the second leading-out end penetrate through the interior of the outer electrode layer. According to the patch magnetic bead of the vertical structure, the distance of the patch magnetic bead passing through the left and right lead-out parts is longer, the stray capacitance is smaller, through the arrangement, the stray capacitance between the coils of the vertical structure is more, and the total capacitance value after parallel connection is smaller. Through the principle, lower capacitance is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of magnetic bead arrays, in particular to a patch magnetic bead with a vertical structure. Background Art

[0002] Magnetic beads are important EMC components. They mainly play the role of filtering noise and resisting electromagnetic interference in circuits. The suppressed frequency requires the magnetic bead impedance to remove heat through its own absorption. The higher the impedance, the better the suppression effect. The self-resonance frequency of the magnetic bead is the maximum impedance of the magnetic bead. The closer the suppressed frequency is to the self-resonance frequency, the stronger the ability to filter noise. In today's world, with the popularity of 5G, the frequency is getting higher and higher, and the frequency of the magnetic bead itself needs to be increased. If the operating frequency that needs to be suppressed exceeds the self-resonance frequency of the magnetic bead, the magnetic bead will show a capacitive state, lose the properties of the magnetic bead itself, and cannot play a suppressive role. However, there are still certain problems when using the existing magnetic beads:

[0003] For example, a vertical sealed magnetic bead array with announcement number CN216812824U has the following technical solution: it includes a sealed box, a clamping mechanism is provided at the bottom end of the sealed box, and a blocking mechanism is provided inside the sealed box; the clamping mechanism includes a baffle, a sliding plate, a slider, a spring and an elastic column, and a sliding groove is provided on the opposite sides of the two baffles, the slider is slidably connected to the sliding groove, an elastic column is provided inside the sliding groove, a spring is provided on the surface of the elastic column, and the slider is fixedly connected to both ends of the elastic column; the blocking mechanism includes an adhesive chip and magnetic beads, an adhesive chip is provided inside the sealed box, and multiple groups of magnetic beads are provided on both sides of the adhesive chip. The utility model utilizes friction force to offset the gravity of the sealed box through the arrangement of a clamping mechanism and a blocking mechanism, so as to achieve the purpose of improving the connection stability; a plurality of groups of magnetic beads form a circuit that does not interfere with each other, which can enhance the ability to suppress noise and solve the problem of crosstalk between adjacent circuits. However, magnetic beads of the same type use a vertical structure, which makes the distributed capacitance larger, affects the frequency of the magnetic beads, and cannot meet the high impedance requirements of higher frequency bands. The larger the distributed stray capacitance, the smaller the self-resonant frequency.

[0004] In view of this, we conducted in-depth research on the above issues, which led to the present case.

[0005] In view of the above problems, an innovative design is carried out based on the original magnetic bead array. Utility Model Content

[0006] The utility model aims to provide a vertical structure of a patch magnetic bead to solve the problem in the above background technology that the distributed capacitance is large, which affects the frequency of the magnetic bead and cannot meet the impedance requirements of higher frequency bands.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] A vertical structured patch magnetic bead comprises a magnetic bead body, wherein the magnetic bead body is in a sealed state, and outer electrode layers are arranged on the left and right sides of the magnetic bead body, a ferrite green ceramic sheet and an interlayer green ceramic sheet are arranged inside the magnetic bead body, and the ferrite green ceramic sheet and the interlayer green ceramic sheet are stacked vertically, and the interlayer green ceramic sheet is located between the ferrite green ceramic sheets, and electrode rings are connected and penetrated between the ferrite green ceramic sheet and the interlayer green ceramic sheet, and a first lead-out terminal is connected and disposed on the left side of the outer side of the ferrite green ceramic sheet and the interlayer green ceramic sheet, and a second lead-out terminal is connected and disposed on the right side of the outer side of the ferrite green ceramic sheet and the interlayer green ceramic sheet, and the first lead-out terminal and the second lead-out terminal both penetrate the inner side of the external electrode layer.

[0009] Preferably, the main raw material of the magnetic bead body is ferrite, and the ferrite material is iron-magnesium alloy or iron-nickel alloy.

[0010] Using the above technical solution, ferrite is a ferrimagnetic material with a cubic lattice structure. The characteristics of this material are very large high-frequency loss and high magnetic permeability. It can minimize the capacitance generated between the coil windings of the inductor under high frequency and high resistance conditions.

[0011] Preferably, the raw material of the ferrite green ceramic sheet is ferrite, and the raw material of the interlayer green ceramic sheet is a non-magnetic intermediate interlayer material, and both the ferrite green ceramic sheet and the interlayer green ceramic sheet are manufactured by a tape casting process.

[0012] By adopting the above technical solution, for the ferrite used to suppress electromagnetic interference, the loss of the magnetic core increases, the resistance component increases, and the total impedance increases. When the high-frequency signal passes through the ferrite, the electromagnetic interference is absorbed and converted into heat energy and dissipated.

[0013] Preferably, the ferrite green ceramic sheets and the interlayer green ceramic sheets are vertically stacked in designated numbers, and the ferrite green ceramic sheets and the interlayer green ceramic sheets are stacked to obtain a green block, and the green block is formed into a single stacked device.

[0014] By adopting the above technical solution, since the length, width and height of the chip magnetic bead are larger than the height, the distance between the two left and right lead parts of the vertical structure is longer and the parasitic capacitance is smaller.

[0015] Preferably, holes are horizontally penetrated through the front and rear positions of the ferrite green ceramic sheet and the interlayer green ceramic sheet, and the holes are located at the corners of the ferrite green ceramic sheet and the interlayer green ceramic sheet.

[0016] By adopting the above technical solution, holes are opened after the ferrite green ceramic sheets and the interlayer green ceramic sheets are stacked to provide connection positions for the electrode rings.

[0017] Preferably, an electrode ring is provided between the ferrite green porcelain sheet and the interlayer green porcelain sheet, and the electrode rings inside and outside the ferrite green porcelain sheet and the interlayer green porcelain sheet are filled with ferrite.

[0018] Using the above technical solution, ferrite magnetic rings or beads are specially used to suppress high-frequency interference and spike interference on signal lines and power lines. They also have the ability to absorb electrostatic discharge pulse interference. The suppressed frequency requires the impedance of the magnetic beads to remove heat through their own absorption. The higher the impedance, the better the suppression effect. The self-resonance frequency of the magnetic beads is the maximum impedance of the magnetic beads. The closer the suppressed frequency is to the self-resonance frequency, the stronger the ability to filter out noise.

[0019] Preferably, a first lead-out terminal is connected to the upper left side of the ferrite green ceramic sheet and the interlayer green ceramic sheet, and the first lead-out terminal is connected to the external electrode layer, and a second lead-out terminal is connected to the lower right side of the ferrite green ceramic sheet and the interlayer green ceramic sheet, and the second lead-out terminal is connected to the external electrode layer.

[0020] By adopting the above technical solution, through this arrangement, the parasitic capacitance between each coil of the vertical structure is greater, and the total capacitance value after parallel connection is smaller. This principle is used to achieve lower capacitance.

[0021] Compared with the prior art, the utility model has the following beneficial effects: the vertical structure of the patch magnetic bead,

[0022] 1. There are vertically stacked ferrite green ceramic sheets and interlayer green ceramic sheets, and the ferrite green ceramic sheets and interlayer green ceramic sheets are stacked vertically in a specified number, and the ferrite green ceramic sheets and interlayer green ceramic sheets are stacked to obtain a green block, and the green block is formed into a single stacked device. Since the length, width and height of the patch magnetic beads are larger than the height, the distance between the two left and right lead parts of the vertical structure is longer, and the parasitic capacitance is smaller. Through this arrangement, the parasitic capacitance between each coil of the vertical structure is more, and the total capacitance value after parallel connection is smaller. This principle is used to achieve lower capacitance;

[0023] 2. Ferrite raw ceramic sheets and interlayer raw ceramic sheets are filled with ferrite materials. Electrode rings are set through and connected between the ferrite raw ceramic sheets and interlayer raw ceramic sheets, and the electrode rings inside and outside the ferrite raw ceramic sheets and interlayer raw ceramic sheets are filled with ferrite. Ferrite magnetic rings or magnetic beads are specially used to suppress high-frequency interference and spike interference on signal lines and power lines. It also has the ability to absorb electrostatic discharge pulse interference. The suppressed frequency requires the magnetic bead impedance to remove heat through its own absorption. The higher the impedance, the better the suppression effect. The self-resonance frequency of the magnetic bead is the maximum impedance of the magnetic bead. The closer the suppressed frequency is to the self-resonance frequency, the stronger the ability to filter out noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the front structure of the utility model;

[0025] Figure 2 This is a schematic diagram of the top view structure of the utility model;

[0026] Figure 3 This is a schematic diagram of the front structure of the raw ceramic sheet of the utility model;

[0027] Figure 4 This is a schematic diagram of the three-dimensional structure of the raw ceramic sheet of the utility model;

[0028] Figure 5 It is a schematic diagram of the three-dimensional structure of the magnetic bead body of the utility model.

[0029] In the figure: 1. Magnetic bead body; 2. External electrode layer; 3. Ferrite green ceramic sheet; 4. Interlayer green ceramic sheet; 5. Electrode ring; 6. First lead-out terminal; 7. Second lead-out terminal. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] See also Figure 1-5 , the utility model provides a technical solution:

[0032] A vertical structure patch magnetic bead comprises a magnetic bead body 1, the magnetic bead body 1 is in a sealed state, and outer electrode layers 2 are arranged on the left and right sides of the magnetic bead body 1, ferrite green ceramic sheets 3 and interlayer green ceramic sheets 4 are arranged inside the magnetic bead body 1, and the ferrite green ceramic sheets 3 and interlayer green ceramic sheets 4 are stacked vertically, and the interlayer green ceramic sheets 4 are located between the ferrite green ceramic sheets 3, and electrode rings 5 ​​are connected and penetrated between the ferrite green ceramic sheets 3 and the interlayer green ceramic sheets 4, and a first lead-out terminal 6 is connected to the left side of the outer side of the ferrite green ceramic sheets 3 and the interlayer green ceramic sheets 4, and a second lead-out terminal 7 is connected to the right side of the outer side of the ferrite green ceramic sheets 3 and the interlayer green ceramic sheets 4, and the first lead-out terminal 6 and the second lead-out terminal 7 both penetrate the inner part of the external electrode layer 2.

[0033] The main raw material of the magnetic bead body 1 is ferrite, and the ferrite material is an iron-magnesium alloy or an iron-nickel alloy. Ferrite is a ferrimagnetic material with a cubic lattice structure. The characteristics of this material are that the high-frequency loss is very large and it has a very high magnetic permeability. It can minimize the capacitance generated between the coil windings of the inductor under high frequency and high resistance conditions.

[0034] The raw material of the ferrite green ceramic sheet 3 is ferrite, and the raw material of the interlayer green ceramic sheet 4 is a non-magnetic intermediate interlayer material, and both the ferrite green ceramic sheet 3 and the interlayer green ceramic sheet 4 are made by tape casting process. For ferrite used to suppress electromagnetic interference, the loss of the magnetic core increases, the resistance component increases, and the total impedance increases. When a high-frequency signal passes through the ferrite, the electromagnetic interference is absorbed and converted into heat energy and dissipated.

[0035] The ferrite green ceramic sheets 3 and the interlayer green ceramic sheets 4 are stacked vertically in a specified number, and the ferrite green ceramic sheets 3 and the interlayer green ceramic sheets 4 are stacked to obtain a green block, and the green block is formed into a single stacked device. The ferrite green ceramic sheets 3 and the interlayer green ceramic sheets 4 are horizontally penetrated in the front and back positions, and the holes are located at the corners of the ferrite green ceramic sheets 3 and the interlayer green ceramic sheets 4. Since the length, width and height of the patch magnetic beads are larger than the height, the distance between the two left and right lead parts of the vertical structure is longer and the parasitic capacitance is smaller. After the ferrite green ceramic sheets 3 and the interlayer green ceramic sheets 4 are stacked, holes are opened to provide a connection position for the electrode ring 5.

[0036] An electrode ring 5 is connected between the ferrite green ceramic sheet 3 and the interlayer green ceramic sheet 4, and the electrode rings 5 ​​inside and outside the ferrite green ceramic sheet 3 and the interlayer green ceramic sheet 4 are filled with ferrite. A first lead-out terminal 6 is connected to the upper left side of the ferrite green ceramic sheet 3 and the interlayer green ceramic sheet 4, and the first lead-out terminal 6 is connected to the outer electrode layer 2. A second lead-out terminal 7 is connected to the lower right side of the ferrite green ceramic sheet 3 and the interlayer green ceramic sheet 4, and the second lead-out terminal 7 is connected to the outer electrode layer 2. Ferrite magnetic rings or magnetic beads are specially used to suppress high-frequency interference and spike interference on signal lines and power lines. It also has the ability to absorb electrostatic discharge pulse interference. The suppressed frequency requires the magnetic bead impedance to remove heat through its own absorption. The higher the impedance, the better the suppression effect. The self-resonance frequency of the magnetic bead is the maximum impedance of the magnetic bead. The closer the suppressed frequency is to the self-resonance frequency, the stronger the ability to filter out noise. Through this arrangement, the parasitic capacitance between each coil of the vertical structure is more, and the total capacitance value after parallel connection is smaller. This principle is used to achieve lower capacitance.

[0037] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A vertical structured patch magnetic bead, comprising a magnetic bead body (1), characterized in that: The magnetic bead body (1) is in a sealed state, and the magnetic bead body (1) is provided with an outer electrode layer (2) on both the left and right sides. A ferrite raw ceramic sheet (3) and an interlayer raw ceramic sheet (4) are provided inside the magnetic bead body (1), and the ferrite raw ceramic sheet (3) and the interlayer raw ceramic sheet (4) are stacked vertically, and the interlayer raw ceramic sheet (4) is located between the ferrite raw ceramic sheets (3). An electrode ring (5) is provided between the ferrite raw ceramic sheets (3) and the interlayer raw ceramic sheets (4), and a first lead-out terminal (6) is provided on the left side of the outer side of the ferrite raw ceramic sheet (3) and the interlayer raw ceramic sheet (4), and a second lead-out terminal (7) is provided on the right side of the outer side of the ferrite raw ceramic sheet (3) and the interlayer raw ceramic sheet (4), and the first lead-out terminal (6) and the second lead-out terminal (7) are both provided through the inner side of the outer electrode layer (2).

2. The vertical structure chip magnetic bead according to claim 1, characterized in that: The ferrite green ceramic sheets (3) and the interlayer green ceramic sheets (4) are stacked vertically in designated numbers, and the ferrite green ceramic sheets (3) and the interlayer green ceramic sheets (4) are stacked to obtain a green block, and the green block is formed into a single stacked device.

3. The vertical structure chip magnetic bead according to claim 2, characterized in that: The ferrite green ceramic sheet (3) and the interlayer green ceramic sheet (4) are both horizontally penetrated with holes and grooves at the front and rear positions, and the holes and grooves are both located at the corners of the ferrite green ceramic sheet (3) and the interlayer green ceramic sheet (4).

4. The vertical structure chip magnetic bead according to claim 3, characterized in that: An electrode ring (5) is provided between the ferrite green porcelain sheet (3) and the interlayer green porcelain sheet (4) and is connected therebetween. The electrode rings (5) inside and outside the ferrite green porcelain sheet (3) and the interlayer green porcelain sheet (4) are filled with ferrite.

5. The vertical structure chip magnetic bead according to claim 4, characterized in that: A first lead-out terminal (6) is connected to the upper left side of the ferrite green ceramic sheet (3) and the interlayer green ceramic sheet (4), and the first lead-out terminal (6) is connected to the outer electrode layer (2). A second lead-out terminal (7) is connected to the lower right side of the ferrite green ceramic sheet (3) and the interlayer green ceramic sheet (4), and the second lead-out terminal (7) is connected to the outer electrode layer (2).

Images