Chip pin adjusting device for chip design
By designing a chip pin adjustment device, the T-shaped slide, heating plate, tin removal mechanism and adjustment mechanism are used to achieve continuous tin removal and adjustment of pins after chip disassembly, solving the problem of low efficiency in the existing technology and improving the adjustment efficiency of chip pins.
Patent Information
- Application Number
- CN202421425388.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-21
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-06-21
AI Technical Summary
In the prior art, pin detinning and adjustment of the chip after chip removal are divided into two steps, and the continuous operation cannot be carried out, resulting in low efficiency of chip pin adjustment.
A chip pin adjustment device is designed, including a T-shaped slide, a heating plate, a tin removal mechanism and a regulating mechanism. The chip movement is driven by the first cylinder and the push plate, and the heating plate and the tin removal mechanism removes solder, and the adjustment mechanism flattens the pins.
It realizes continuous detinning and adjustment of chip pins, improving chip pin adjustment efficiency and easy to use.
Smart Images
Figure CN222690645U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of pin adjustment, in particular to a chip pin adjustment device for chip design. Background Art
[0002] Circuit chips are mainly composed of circuit substrates and pins. Pins are the wiring that connects the inside and outside of the circuit. There are many pins, the material is light and easy to deform. Therefore, trimming the pins is an important process for chip installation or removal. During the pin trimming process, an adjustment device is required. However, currently, after chip removal, pin detinning and pin adjustment are divided into two steps, and it is impossible to connect detinning and pin adjustment operations, and the chip pin adjustment efficiency is low. Utility Model Content
[0003] In view of the above-mentioned deficiencies in the prior art, the utility model provides a chip pin adjustment device for chip design, which aims to solve the problems that pin detinning and pin adjustment after chip disassembly are currently carried out in two steps, the detinning and pin adjustment operations cannot be connected, and the chip pin adjustment efficiency is low.
[0004] In order to achieve the above utility model purpose, the technical solution adopted by the utility model is:
[0005] A chip pin adjustment device for chip design includes a base, a track is provided on the base, a T-shaped slot is provided on the track, a heating plate is provided on the T-shaped slot, a first cylinder is installed in the T-shaped slot, a push plate is fixedly connected to the piston rod of the first cylinder, a first bracket is fixedly provided on the base, a tin removal mechanism is provided on the first bracket, a second bracket is provided on the side of the first bracket away from the first cylinder, and an adjustment mechanism is provided on the second bracket.
[0006] Furthermore, the heating plate is located below the tin removal mechanism.
[0007] Furthermore, the tin removal mechanism includes a fixing plate fixed on the first bracket, a motor is fixedly mounted on the fixing plate, and a brush is fixedly connected to the output shaft of the motor.
[0008] Furthermore, the adjustment mechanism includes a second cylinder fixedly mounted on the second bracket, a pressure plate is fixedly connected to the piston rod of the second cylinder, a pressure head is fixedly provided at the bottom of the pressure plate, and a guide rod is fixedly provided at the top of the pressure plate.
[0009] Furthermore, the guide rod is slidably connected to the second bracket.
[0010] The beneficial effects of the utility model are:
[0011] The utility model discloses a chip pin adjustment device for chip design. The disassembled chip is placed in a T-shaped slide groove. The chip is pushed to move by a first cylinder and a push plate. The solder on the chip pin is heated and removed by a heating plate and a tin removal mechanism. The chip pin is flattened and adjusted by an adjustment mechanism. The device has a simple structure, can continuously remove tin and adjust the chip pin, and is easy to use. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0013] Figure 2 It is a three-dimensional structural schematic diagram of the utility model;
[0014] Figure 3 This is a schematic diagram of the track and heating plate structure of the utility model.
[0015] Reference table of reference numerals:
[0016] 1. Base; 2. Track; 3. T-shaped slide; 4. Heating plate; 5. First cylinder; 6. Push plate; 7. First bracket; 8. Detinning mechanism; 9. Second bracket; 10. Adjustment mechanism; 11. Fixed plate; 12. Motor; 13. Brush; 14. Second cylinder; 15. Pressing plate; 16. Pressing head; 17. Guide rod. DETAILED DESCRIPTION
[0017] The specific implementation of the utility model is further described below in conjunction with the accompanying drawings, wherein the same parts are represented by the same reference numerals.
[0018] It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to directions in the drawings, and the words "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively.
[0019] In order to make the contents of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.
[0020] like Figures 1 to 3 As shown, a chip pin adjustment device for chip design includes a base 1, a track 2 is provided on the base 1, a T-shaped slot 3 is opened on the track 2, a first cylinder 5 is installed in the T-shaped slot 3, and a push plate 6 is fixedly connected to the piston rod of the first cylinder 5. When the device is in use, the disassembled chip is placed in the T-shaped slot 3, the chip pins are placed on the T-shaped slot 3, the first cylinder 5 is started to drive the push plate 6 to move, and the push plate 6 drives the chip to move.
[0021] A first bracket 7 is fixedly provided on the base 1, a heating plate 4 is provided on the T-shaped slide groove 3, a tin removal mechanism 8 is provided on the first bracket 7, the heating plate 4 is located below the tin removal mechanism 8, the tin removal mechanism 8 includes a fixed plate 11 fixed on the first bracket 7, a motor 12 is fixedly mounted on the fixed plate 11, and a brush 13 is fixedly connected to the output shaft of the motor 12.
[0022] The chip moves to the heating plate 4, and the heat generated by the heating plate 4 melts the solder on the chip pins. At the same time, the motor 12 drives the brush 13 to rotate, and the brush 13 brushes the melted solder off the chip pins.
[0023] A second bracket 9 is provided on the side of the first bracket 7 away from the first cylinder 5, and an adjusting mechanism 10 is provided on the second bracket 9. The adjusting mechanism 10 includes a second cylinder 14 fixedly mounted on the second bracket 9, a pressure plate 15 is fixedly connected to the piston rod of the second cylinder 14, a pressure head 16 is fixedly provided at the bottom of the pressure plate 15, a guide rod 17 is fixedly provided on the top of the pressure plate 15, and the guide rod 17 is slidably connected to the second bracket 9.
[0024] When the chip moves to the bottom of the adjustment mechanism 10, the second cylinder 14 drives the pressing plate 15 and the pressing head 16 to move downward to adjust the chip pins.
[0025] The device has a simple structure, can continuously remove tin and adjust chip pins, and is easy to use.
[0026] The above description is only a preferred embodiment of the present utility model patent and is not intended to limit the present utility model patent. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model patent shall be included in the protection scope of the present utility model patent.
Claims
1. A chip pin adjustment device for chip design, characterized in that: The invention comprises a base (1), wherein the base (1) is provided with a track (2), the track (2) is provided with a T-shaped slide groove (3), the T-shaped slide groove (3) is provided with a heating plate (4), a first cylinder (5) is installed in the T-shaped slide groove (3), a push plate (6) is fixedly connected to the piston rod of the first cylinder (5), a first bracket (7) is fixedly provided on the base (1), a tin removal mechanism (8) is provided on the first bracket (7), a second bracket (9) is provided on the side of the first bracket (7) away from the first cylinder (5), and an adjustment mechanism (10) is provided on the second bracket (9).
2. The chip pin adjustment device for chip design according to claim 1, characterized in that: The heating plate (4) is located below the tin removal mechanism (8).
3. The chip pin adjustment device for chip design according to claim 2, characterized in that: The tin removal mechanism (8) comprises a fixing plate (11) fixed on the first bracket (7), a motor (12) is fixedly mounted on the fixing plate (11), and a brush (13) is fixedly connected to the output shaft of the motor (12).
4. The chip pin adjustment device for chip design according to claim 1, characterized in that: The regulating mechanism (10) comprises a second cylinder (14) fixedly mounted on a second bracket (9); a pressure plate (15) is fixedly connected to a piston rod of the second cylinder (14); a pressure head (16) is fixedly provided at the bottom of the pressure plate (15); and a guide rod (17) is fixedly provided at the top of the pressure plate (15).
5. The chip pin adjustment device for chip design according to claim 4, characterized in that: The guide rod (17) is slidably connected to the second bracket (9).