TCB multi-hole placing tool

Abstract

According to the TCB multi-hole placing tool, an adsorption table used for adsorbing a chip is arranged on the top face of a base, and the height of the adsorption table protruding out of the top face of the base is 0.5 mm; the adsorption holes are formed in the top face of the adsorption table. By arranging a plurality of groove type adsorption holes, the adsorption force to the chip is enhanced, and the welding stability of the chip is improved; the negative pressure holes in the back surface are interconnected, so that the suction uniformity of the adsorption holes in the front surface is ensured, and the adsorption stability is improved; by reducing the height of the adsorption table to 0.5 mm, when the chips are welded, heat is reserved, heat loss is reduced, mutual interference of interconnection areas when the two chips are subjected to thermocompression bonding is effectively avoided, poor welding of the second chip is prevented, yield loss caused by abnormal combination of the micro-bumps is further improved, and the method has very high practicability and wide applicability.

Description

Technical Field

[0001] The invention relates to a TCB multi-hole placement tool, in particular to a thermal compression bonding multi-hole placement tool, belonging to the technical field of semiconductor packaging. Background Art

[0002] When the existing placement tool performs thermal compression bonding (TCB / Thermal Compression Bonding), the first chip is made in a unit, and the micro bumps and micro pads are well welded; when the second chip is made later, the micro bumps and micro pads are poorly welded.

[0003] On the contrary, if the second chip is made first and then the first chip, the result will be the opposite.

[0004] Poor welding mainly occurs at the interconnection point between the two chips, and poor welding will cause the product to fail and be scrapped, with a low yield rate.

[0005] Therefore, it is necessary to provide a multi-hole placement tool to improve the yield loss caused by micro-bump bonding abnormalities. Summary of the invention

[0006] To address the deficiencies of the prior art, the present invention aims to provide a TCB multi-hole placement tool.

[0007] In order to achieve the above object, the present invention adopts the following technical solution:

[0008] A TCB multi-hole placement tool is provided with an adsorption platform for adsorbing chips on the top surface of a base, the height of the adsorption platform protruding from the top surface of the base is 0.5mm; adsorption holes are provided on the top surface of the adsorption platform.

[0009] There are several adsorption holes, which are in the shape of grooves.

[0010] Furthermore, the adsorption hole passes through the back side of the base and is a negative pressure hole for receiving negative pressure.

[0011] Furthermore, the negative pressure hole is longitudinally penetrated through the back side of the base.

[0012] Furthermore, the negative pressure hole is horizontally penetrated through the back side of the base.

[0013] The present invention is beneficial in that:

[0014] A TCB multi-hole placement tool of the present invention enhances the adsorption force on the chip and improves the stability of chip welding by arranging a plurality of groove-type adsorption holes; the interconnection of the negative pressure holes on the back side ensures the uniformity of the suction force of the adsorption holes on the front side and improves the stability of adsorption; by lowering the height of the adsorption platform to 0.5 mm, heat is retained and heat loss is reduced during chip welding, effectively avoiding mutual interference between the interconnection areas when the two chips are hot-pressed and bonded, preventing poor welding of the second chip, and further improving the yield loss caused by abnormal micro-bump bonding, the tool has strong practicality and wide applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A top view of the schematic diagram of the structure for placing the tool.

[0016] Figure 2 A bottom view of the structural diagram for placing the tool.

[0017] Figure 3 A side view of a schematic diagram of the structure for placing a tool.

[0018] Figure 4 This is a photo of the first chip and the second chip after thermal compression bonding.

[0019] Figure 5 This is a cross-sectional electron microscope image of the solder ball of the second chip after soldering using a 1mm high adsorption platform.

[0020] Figure 6 This is a cross-sectional electron microscope image of the solder ball of the second chip after soldering using the adsorption platform of the present invention.

[0021] The meanings of the marks in the accompanying drawings are as follows: 1. adsorption hole, 2. adsorption platform. DETAILED DESCRIPTION

[0022] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] A TCB multi-hole placement tool consists of a base and an adsorption platform arranged on the top surface of the base.

[0024] like Figure 3 As shown, based on the top surface of the base, the height of the adsorption platform is 0.5 mm.

[0025] like Figure 1 The top surface of the adsorption platform is provided with a plurality of groove-shaped adsorption holes, and the adsorption holes are through to the back side of the base, forming negative pressure holes for receiving vacuum negative pressure.

[0026] like Figure 2 As shown, on the back of the base, the negative pressure hole penetrates in the longitudinal and transverse directions.

[0027] When using,

[0028] The back side of the base is attached to the welding mechanism by vacuum adsorption.

[0029] like Figure 4 As shown, the first chip and the second chip are adsorbed by the adsorption platform and placed side by side on the top of the middle layer. The micro bumps of the chips and the micro pads in the interposer are welded together by hot pressing to finally achieve interconnection.

[0030] Destructive testing:

[0031] The second chip was sliced ​​and the soldering condition of the solder balls of the second chip was observed using an electron microscope. Figure 6 As shown, the solder balls are tightly welded without cracks.

[0032] Comparative Example:

[0033] After the first chip and the second chip are adsorbed and welded in sequence using a placement tool (adsorption platform height of 1 mm) in the prior art, the second chip is sliced ​​and the welding condition of the solder balls of the second chip is observed using an electron microscope. Figure 5 As shown, the solder ball has solder cracks.

[0034] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the above embodiments do not limit the present invention in any form, and any technical solution obtained by equivalent replacement or equivalent transformation falls within the protection scope of the present invention.

Claims

1. A TCB multi-hole placement tool, characterized in that: An adsorption platform for adsorbing the chip is provided on the top surface of the base, and the height of the adsorption platform protruding from the top surface of the base is 0.5 mm; The adsorption holes are arranged on the top surface of the adsorption platform.

2. A TCB multi-hole placement tool according to claim 1, characterized in that: There are several adsorption holes in a groove shape.

3. A TCB multi-hole placement tool according to claim 2, characterized in that: The adsorption hole passes through the back side of the base and is a negative pressure hole for receiving negative pressure.

4. A TCB multi-hole placement tool according to claim 3, characterized in that: The negative pressure hole is vertically penetrated through the back side of the base.

5. A TCB multi-hole placement tool according to claim 3, characterized in that: The negative pressure hole is horizontally penetrated through the back side of the base.

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