Substrate package for removing PCB solder resist

Abstract

The utility model relates to a substrate package for removing a PCB solder resist, and solves the problem of poor bonding during packaging of an existing PCB substrate. The packaging structure comprises a PCB substrate and a chip packaged with the PCB, solder resist is arranged on the PCB substrate, a packaging part without the solder resist is arranged on the PCB substrate corresponding to the packaging position of the chip, a top bonding pad pin is arranged on the packaging part, the chip is located in a sealing cover, and a spherical welding spot welded with the top bonding pad pin is arranged on the chip. Therefore, the chip is bonded with the top bonding pad pin on the packaging part on the PCB substrate through the spherical welding spots, no solder resist is arranged on the packaging part, the height difference between the periphery of the PCB substrate and a middle device is reduced, meanwhile, bonding is firm, and the welding strength and stability of the PCB substrate are improved.

Description

Technical Field

[0001] The utility model relates to the field of filter CSP microelectronic packaging, in particular to a substrate packaging with PCB solder resist removed. Background Art

[0002] CSP technology was proposed when electronic products were being replaced. Its purpose is to keep the area of ​​the printed board occupied by the package unchanged or smaller when using large chips (chips with more functions, better performance, and more complex chips) to replace the previous small chips. It is precisely because the package of CSP products is small and thin that it has been quickly applied in handheld mobile electronic devices.

[0003] The price of PCB is lower than that of ceramic substrate. Ceramic substrate needs to be pre-set and manufactured in production model, and the process of mixing, casting, lamination and punching is more difficult. Ceramic also has shrinkage and low yield rate, which makes the price of ceramic substrate high. The price of PCB is only 1 / 3 of that of ceramic substrate, and its process is mature and widely used, making it an excellent substrate material. In addition, the development and design cost of PCB substrate is much lower than that of ceramic substrate. Ceramic substrate is difficult to optimize and modify, and there is no way to change it after it is finalized. PCB board has flexible wiring experience and customizable graphics of the surface layer, so it has considerable flexibility in the pre-set of PCB board, and the optimization and modification can be very fast. In the production process, PCB substrate is not easy to be damaged, and the product yield rate is higher than that of ceramic substrate. Using PCB substrate to replace ceramic substrate is a good choice to reduce cost and adapt to the market. PCB substrate is generally coated with a layer of solder resist green oil, which is easy to bond poorly during welding package. Utility Model Content

[0004] The utility model aims to solve the problem of poor bonding during the packaging of the existing PCB substrate.

[0005] The technical solution adopted to solve the technical problem proposed by the utility model is as follows: the substrate package for removing PCB solder resist of the utility model includes a PCB substrate and a chip packaged with the PCB, the PCB substrate is provided with solder resist, a packaging part without solder resist is provided at the chip packaging portion on the PCB substrate, a top solder pad pin is provided on the packaging part, the chip is located in a sealing cover, and a spherical solder joint welded to the top solder pad pin is provided on the chip.

[0006] The technical solutions further defining the utility model include:

[0007] A sealing cover for sealing the packaging part is arranged above the packaging part.

[0008] The spherical solder joints are welded to the aluminum solder feet on the chip by a ball implantation machine.

[0009] The spherical solder joints are gold ball solder joints.

[0010] The height of the ball solder joints on the chip and the top solder pad pins on the PCB substrate packaging part after soldering is 15um±5um.

[0011] The top pad pins are gold solder pins.

[0012] The bottom of the PCB substrate is provided with solder pins.

[0013] Through the above technical scheme, the beneficial effects of the utility model are as follows: the substrate package of the utility model that removes the PCB solder resist is provided with a packaging part without solder resist at the chip packaging position on the PCB substrate, and a top solder pad pin is provided on the packaging part. The chip is located in the sealing cover, and a spherical solder joint is provided on the chip to be welded with the top solder pad pin, so that the chip is bonded to the top solder pad pin on the packaging part on the PCB substrate through the spherical solder joint, and there is no solder resist on the packaging part, which reduces the height difference between the surrounding of the PCB substrate and the intermediate device, and at the same time the bonding is firm, thereby improving the welding strength and stability of the PCB substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 The utility model is a structural schematic diagram of a substrate package for removing PCB solder resist. DETAILED DESCRIPTION

[0015] The structure of the utility model is further described below in conjunction with the accompanying drawings.

[0016] Reference Figure 1 A substrate package with PCB solder resist removed includes a PCB substrate 1 and a chip 2 packaged with the PCB, a solder resist 3 is provided on the PCB substrate, a packaging part 11 without solder resist is provided at the corresponding chip packaging on the PCB substrate 1, a top pad pin 12 is provided on the packaging part, the chip is located in a sealing cover, and a ball solder joint 21 is provided on the chip 2 to be welded with the top pad pin. Thus, the chip is bonded to the top pad pin on the packaging part on the PCB substrate through the ball solder joint, there is no solder resist on the packaging part, the height difference between the surrounding of the PCB substrate and the intermediate device is reduced, and the bonding is firm, which improves the welding strength and stability of the PCB substrate.

[0017] In this embodiment, the spherical solder joints are welded to the aluminum solder feet on the chip through a ball planting machine. The spherical solder joints are gold ball solder joints. This process generally involves igniting and sintering the gold wire under the ball planting machine equipment into a connectable gold ball that is adsorbed on the splitter, and then the gold ball is welded to one end of the chip under the action of ultrasonic power, temperature, and pressure to form a connection point. The gold ball and the aluminum solder foot on the chip realize the AU-AL eutectic bonding layer. In this embodiment, the height of the spherical solder joints on the chip and the top pad pins on the PCB substrate packaging part after welding is 15um±5 um. In this embodiment, the top pad pins are gold solder pins. The chip with the gold ball is welded to the substrate side to form an AU-AU eutectic bonding layer. The gold ball has good conductivity and ductility, and can achieve good transmission of electrical signals between the chip and the substrate.

[0018] In this embodiment, a solder pin 13 is provided at the bottom of the PCB substrate to facilitate the welding connection between the PCB substrate and other components.

[0019] Although the specific implementation of the utility model is described in detail in conjunction with the drawings, it should not be understood as limiting the protection scope of the utility model. Within the scope described in the claims, various modifications and variations that can be made by those skilled in the art without creative work still belong to the protection scope of the utility model.

Claims

1. A substrate package with PCB solder resist removed, comprising a PCB substrate and a chip packaged with the PCB, wherein the PCB substrate is provided with solder resist, and characterized in that: A packaging part without solder resist is provided on the PCB substrate corresponding to the chip packaging, a top solder pad pin is provided on the packaging part, the chip is located in the sealing cover, and a spherical solder joint is provided on the chip to be welded with the top solder pad pin.

2. A substrate package for removing PCB solder resist as claimed in claim 1, characterized in that: A sealing cover for sealing the packaging part is arranged above the packaging part.

3. A substrate package for removing PCB solder resist as claimed in claim 1, characterized in that: The spherical solder joints are welded to the aluminum solder feet on the chip by a ball implantation machine.

4. A substrate package for removing PCB solder resist as claimed in claim 1, characterized in that: The spherical solder joints are gold ball solder joints.

5. The substrate package for removing PCB solder resist as claimed in claim 1, characterized in that: The height of the ball solder joints on the chip and the top solder pad pins on the PCB substrate packaging part after soldering is 15um±5um.

6. The substrate package for removing PCB solder resist as claimed in claim 1, characterized in that: The top pad pins are gold solder pins.

7. The substrate package for removing PCB solder resist as claimed in claim 1, characterized in that: The bottom of the PCB substrate is provided with solder pins.

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