Photovoltaic protection power device module with high heat dissipation rate

Abstract

The utility model discloses a photovoltaic protection power device module with high heat dissipation rate, which comprises a first conductive copper sheet, a second conductive copper sheet, a jumper wire and an epoxy plastic package body, one end of the first conductive copper sheet is provided with a first copper sheet packaging area, one end of the second conductive copper sheet is provided with a second copper sheet packaging area, and a heat dissipation gap is arranged between the second copper sheet packaging area and the first copper sheet packaging area. One end of the jumper wire is conductively welded with the first copper sheet packaging area, the other end of the jumper wire is conductively welded with the chip, the chip is arranged on the second copper sheet packaging area, the first copper sheet packaging area, the second copper sheet packaging area and the jumper wire are packaged and fixed in the epoxy plastic packaging body, the epoxy plastic packaging body is T-shaped, L-shaped notch parts are arranged at two side shoulder positions of the epoxy plastic packaging body, and the first copper sheet packaging area and the second copper sheet packaging area are arranged in the notch parts. The exposed area of the first copper sheet packaging area or the second copper sheet packaging area is increased through the notch part. By adopting the technical scheme, the heat dissipation surface area of the power diode module during working can be increased, the heat dissipation effect is enhanced, and the junction temperature capability and the heat escape capability are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of diode module structures, in particular to a photovoltaic protection power device module with high heat dissipation rate. Background Art

[0002] Solar photovoltaic modules are devices that convert solar energy into electrical energy. In photovoltaic power generation systems, junction boxes play an important role. They are mainly used to output the current generated by each photovoltaic module and converge it to the system control box. In addition, the junction box also protects the solar photovoltaic modules. The junction box is generally equipped with a power diode module, which is connected to the battery string in the photovoltaic module. When there is a cell damage in the battery string or a hot spot effect caused by light blocking, the faulty battery string can be separated from the photovoltaic system to avoid its adverse effect on the entire photovoltaic system.

[0003] In the power diode module, a gap distance is maintained between two copper sheets, and the two copper sheets are conductively welded through a jumper wire. Finally, the jumper wire and the welding ends thereof are fixed by epoxy packaging, thereby forming a modular structure of the power diode. In the prior art, the epoxy plastic package between the two copper sheets usually adopts a regular rectangular package, which easily leads to insufficient heat dissipation surface area of ​​the jumper wire and the welding ends thereof with the two copper sheets, resulting in poor heat dissipation effect of the power diode module product. In addition, when the two ends of the copper sheet are subjected to external pressure, it is easy to cause damage to the body, leading to problems such as product failure. Utility Model Content

[0004] The utility model aims to provide a photovoltaic protection power device module with high heat dissipation rate, which is used to solve the problems in the prior art that the power diode module product has poor heat dissipation effect and the body is easily damaged due to the rectangular epoxy plastic package.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] A photovoltaic protection power device module with high heat dissipation rate, comprising:

[0007] A conductive copper sheet 1, one end of which is provided with a copper sheet 1 packaging area;

[0008] A second conductive copper sheet, one end of which is provided with a second copper sheet packaging area, and a heat dissipation gap is provided between the second copper sheet packaging area and the first copper sheet packaging area;

[0009] A jumper wire, one end of which is conductively welded to the copper sheet first packaging area, and the other end of which is conductively welded to a chip, wherein the chip is arranged on the copper sheet second packaging area;

[0010] An epoxy plastic encapsulation body, which internally encapsulates and fixes the copper sheet first encapsulation area, the copper sheet second encapsulation area and the jumper;

[0011] The epoxy plastic encapsulation body is T-shaped, and L-shaped notches are provided at the shoulders on both sides thereof, so that the exposed area of ​​the copper sheet first packaging area or the copper sheet second packaging area is increased through the notches.

[0012] As a further solution of the utility model: the conductive copper sheet 1 and the conductive copper sheet 2 are respectively provided with assembly holes, and the side ends of the epoxy plastic sealing body are penetrated and arranged in the assembly holes.

[0013] As a further solution of the utility model: serrated strips are respectively arranged on the two side surfaces of the packaging area of ​​the copper sheet 1, and serrated edges 1 are respectively arranged on the two side outer edges; serrated U-shaped strips are respectively arranged on the two side surfaces of the packaging area of ​​the copper sheet 2, and serrated edges 2 are respectively arranged on the two side outer edges.

[0014] As a further solution of the utility model: the jumper is a U-shaped conductive sheet, a bent ear end on one side of the U-shaped conductive sheet is welded to the sawtooth strip on one side surface, and a bent ear end on the other side is welded to the chip.

[0015] As a further solution of the utility model: at least two copper sheet one through holes are arranged between the two side surfaces of the copper sheet one packaging area; at least three copper sheet two through holes are arranged between the two side surfaces of the copper sheet two packaging area.

[0016] As a further solution of the utility model: an end face folding groove is arranged on the edge of the copper sheet one packaging area facing the copper sheet two packaging area, and an end face protrusion matching the end face folding groove is arranged on the edge of the copper sheet two packaging area, and a heat dissipation gap is provided between the end face protrusion and the end face folding groove.

[0017] As a further solution of the utility model: the conductive copper sheet 1 and the conductive copper sheet 2 are respectively provided with tin block welding areas.

[0018] As a further solution of the utility model: the conductive copper sheet 1 and the conductive copper sheet 2 are respectively provided with positioning holes; the conductive copper sheet 1 or the conductive copper sheet 2 is provided with an anti-reverse positioning opening.

[0019] The beneficial effects of the utility model are as follows: the conductive copper sheet one and the conductive copper sheet two are encapsulated and fixed by the epoxy plastic encapsulation body, so that the copper sheet one encapsulation area, the copper sheet two encapsulation area and the jumper are encapsulated and fixed inside the epoxy plastic encapsulation body, and the shape structure of the epoxy plastic encapsulation body is improved to a T shape, so that the exposed area of ​​the copper sheet one encapsulation area or the copper sheet two encapsulation area can be increased through the notch portion, which can increase the heat dissipation surface area of ​​the power diode module when it is working, enhance the heat dissipation effect, and improve the junction temperature capacity and thermal escape capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The utility model is further described below in conjunction with the accompanying drawings.

[0021] Figure 1 It is a side structural schematic diagram of the utility model;

[0022] Figure 2 It is another lateral structural schematic diagram of the utility model;

[0023] Figure 3 The utility model is a schematic diagram of a structure in which a first conductive copper sheet and a second conductive copper sheet are connected via a jumper wire.

[0024] In the figure: 1. Conductive copper sheet 1; 10. Copper sheet 1 packaging area; 100. Sawtooth strip; 101. Sawtooth edge 1; 102. Copper sheet 1 through hole; 103. End face folding groove; 2. Conductive copper sheet 2; 20. Copper sheet 2 packaging area; 200. Sawtooth U-shaped strip; 201. Sawtooth edge 2; 202. Copper sheet 2 through hole; 203. End face protrusion; 3. Epoxy plastic package; 30. Notch; 4. Jumper; 5. Chip; 6. Assembly hole; 7. Tin block welding area; 8. Positioning hole; 9. Anti-reverse positioning port. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] In the description of the present invention, it should be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention; in the description of the present invention, "multiple" and "several" mean at least two, for example two, three, etc., unless otherwise clearly and specifically defined.

[0027] See also Figures 1 to 3As shown, the utility model is a photovoltaic protection power device module with high heat dissipation rate, comprising a conductive copper sheet 1, a conductive copper sheet 2, a jumper 4 and an epoxy plastic package 3, wherein a copper sheet 1 packaging area 10 is arranged at one end of the conductive copper sheet 1, a copper sheet 2 packaging area 20 is arranged at one end of the conductive copper sheet 2, a heat dissipation gap is provided between the copper sheet 2 packaging area 20 and the copper sheet 1 packaging area 10, one end of the jumper 4 is conductively welded to the copper sheet 1 packaging area 10, and the other end is conductively welded to a chip 5, the chip 5 is arranged on the copper sheet 2 packaging area 20, and the epoxy plastic package 3 internally encapsulates and fixes the copper sheet 1 packaging area 10, the copper sheet 2 packaging area 20 and the jumper 4, wherein the epoxy plastic package 3 is T-shaped, and L-shaped notches 30 are arranged at the shoulder positions on both sides thereof, and the exposed area of ​​the copper sheet 1 packaging area 10 or the copper sheet 2 packaging area 20 is increased by the notch 30.

[0028] In the power diode module structure with high heat dissipation rate of the present application, the conductive copper sheet 1 and the conductive copper sheet 2 are encapsulated and fixed by the epoxy plastic encapsulation body 3, so that the copper sheet 1 encapsulation area 10, the copper sheet 2 encapsulation area 20 and the jumper 4 are encapsulated and fixed inside the epoxy plastic encapsulation body 3. The shape structure of the epoxy plastic encapsulation body 3 is improved to a T shape, so as to increase the exposed area of ​​the copper sheet 1 encapsulation area 10 or the copper sheet 2 encapsulation area 20 through the notch portion 30, which can increase the heat dissipation surface area of ​​the power diode module when it is working, enhance the heat dissipation effect, and improve the junction temperature capacity and thermal escape capability.

[0029] In this specific embodiment, assembly holes 6 are respectively opened on the conductive copper sheet 1 and the conductive copper sheet 2 2, and the side ends of the epoxy plastic sealing body 3 are set through the assembly holes 6. The set assembly holes 6 can make the epoxy plastic sealing body 3 as a whole encapsulated and fixed, thereby improving the molding quality of the epoxy plastic sealing body 3.

[0030] In this specific embodiment, serrated strips 100 are respectively provided on the surfaces of both sides of the copper sheet packaging area 10, and serrated edges 101 are respectively provided on the outer edges of both sides; serrated U-shaped strips 200 are respectively provided on the surfaces of both sides of the copper sheet packaging area 20, and serrated edges 201 are respectively provided on the outer edges of both sides. The jumper 4 is a U-shaped conductive sheet, and the bent ear end on one side of the U-shaped conductive sheet is welded and connected to the serrated strip 100 on the surface of one side, and the bent ear end on the other side is welded and connected to the chip 5, which can increase the welding contact area of ​​the jumper 4. The serrated strip 100, serrated edge 101, serrated U-shaped strip 200 and serrated edge 201 can increase the contact area with the epoxy plastic package 3, so that the molding of the epoxy plastic package 3 is stable and the molding quality of the power diode module is ensured.

[0031] In this specific embodiment, at least two copper sheet through holes 102 are arranged between the two side surfaces of the copper sheet packaging area 10; at least three copper sheet through holes 202 are arranged between the two side surfaces of the copper sheet packaging area 20, so that the epoxy plastic sealing body 3 arranged on the two side surfaces of the copper sheet packaging area 10 and the copper sheet packaging area 20 can be penetrated and fixed; the through holes strengthen the bonding strength between the epoxy plastic sealing body 3 and the copper guide sheet by locking glue, thereby enhancing the bonding stability, thereby offsetting the pressure of the copper sheets on both sides and better protecting the main body; at the same time, it can increase the penetration ability of the curing glue during the molding of the epoxy plastic sealing body 3, and improve the appearance of the plastic sealing body such as bubbles, missing corners, incomplete filling and other undesirable problems.

[0032] In this specific embodiment, an end face folding groove 103 is provided on the edge of the copper sheet one packaging area 10 facing the copper sheet two packaging area 20, and an end face protrusion 203 matching the end face folding groove 103 is provided on the edge of the copper sheet two packaging area 20, and a heat dissipation gap is provided between the end face protrusion 203 and the end face folding groove 103; when the conductive copper sheet one 1 and the conductive copper sheet two 2 are packaged by the epoxy plastic packaging body 3, the facing end faces are designed from traditional flat ends to bent ends, which can increase the heat dissipation area of ​​the heating ends of the conductive copper sheet one 1 and the conductive copper sheet two 2, facilitate rapid heat dissipation, and during the molding process of the epoxy plastic packaging body 3, the heat stress resistance of the epoxy plastic packaging body 3 can be enhanced.

[0033] In this specific implementation manner, a tin block welding area 7 is respectively provided on the conductive copper sheet 1 and the conductive copper sheet 2 2 .

[0034] In this specific implementation manner, a positioning hole 8 is provided on each of the conductive copper sheet 1 and the conductive copper sheet 2 2 ; and an anti-reverse positioning opening 9 is provided on the conductive copper sheet 1 or the conductive copper sheet 2 2 .

[0035] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A photovoltaic protection power device module with high heat dissipation rate, characterized in that: include: A conductive copper sheet (1), one end of which is provided with a copper sheet packaging area (10); A second conductive copper sheet (2), one end of which is provided with a second copper sheet packaging area (20), and a heat dissipation gap is provided between the second copper sheet packaging area (20) and the first copper sheet packaging area (10); A jumper wire (4), one end of which is conductively welded to the copper sheet first packaging area (10), and the other end of which is conductively welded to a chip (5), wherein the chip (5) is arranged on the copper sheet second packaging area (20); An epoxy plastic encapsulation body (3), the copper sheet first encapsulation area (10), the copper sheet second encapsulation area (20) and the jumper wire (4) being encapsulated and fixed therein; The epoxy plastic encapsulation body (3) is T-shaped, and L-shaped notches (30) are provided at the shoulder positions on both sides thereof, and the notches (30) are used to increase the exposed area of ​​the copper sheet first encapsulation area (10) or the copper sheet second encapsulation area (20).

2. A photovoltaic protection power device module with high heat dissipation rate according to claim 1, characterized in that: The conductive copper sheet 1 (1) and the conductive copper sheet 2 (2) are each provided with an assembly hole (6), and the side end of the epoxy plastic sealing body (3) is arranged through the assembly hole (6).

3. A photovoltaic protection power device module with high heat dissipation rate according to claim 1, characterized in that: The copper sheet one packaging area (10) is provided with sawtooth strips (100) on both side surfaces, and the outer edges on both sides are provided with sawtooth edges (101); the copper sheet two packaging area (20) is provided with sawtooth U-shaped strips (200) on both side surfaces, and the outer edges on both sides are provided with sawtooth edges (201).

4. A photovoltaic protection power device module with high heat dissipation rate according to claim 3, characterized in that: The jumper (4) is a U-shaped conductive sheet, one side of the U-shaped conductive sheet is bent and connected to the sawtooth strip (100) on one side surface by welding, and the other side of the U-shaped conductive sheet is bent and connected to the chip (5) by welding.

5. A photovoltaic protection power device module with high heat dissipation rate according to claim 3, characterized in that: At least two copper sheet one through holes (102) are arranged between the two side surfaces of the copper sheet one packaging area (10); and at least three copper sheet two through holes (202) are arranged between the two side surfaces of the copper sheet two packaging area (20).

6. A photovoltaic protection power device module with high heat dissipation rate according to claim 1, characterized in that: An end face folding groove (103) is arranged on the edge of the copper sheet first packaging area (10) facing the copper sheet second packaging area (20), and an end face protrusion (203) matching the end face folding groove (103) is arranged on the edge of the copper sheet second packaging area (20), and a heat dissipation gap is provided between the end face protrusion (203) and the end face folding groove (103).

7. A photovoltaic protection power device module with high heat dissipation rate according to claim 1, characterized in that: The conductive copper sheet one (1) and the conductive copper sheet two (2) are each provided with a tin block welding area (7).

8. The photovoltaic protection power device module with high heat dissipation rate according to claim 1, characterized in that: The conductive copper sheet one (1) and the conductive copper sheet two (2) are each provided with a positioning hole (8); the conductive copper sheet one (1) or the conductive copper sheet two (2) is provided with an anti-reverse positioning opening (9).

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