Photovoltaic protection power device module
By setting the inclined surface and reinforcement portion at the edges and angles on both sides of the epoxy plastic seal body, the heat dissipation and mechanical performance of the power diode module are improved, and the problems of poor heat dissipation effect and easy destruction of the copper sheet in the prior art are solved, thereby achieving better heat dissipation effect and mechanical strength.
Patent Information
- Application Number
- CN202421450671.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-24
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-06-24
AI Technical Summary
In the prior art, the rectangular epoxy plastic seal body causes poor heat dissipation effect of the power diode module, and the copper sheet is susceptible to external pressure to cause damage to the body and failure.
By setting a beveled surface at the edges and angles on both sides of the epoxy plastic seal body, the exposed area of the copper sheet packaging area is increased, the shape and structure of the epoxy plastic seal body is improved, and reinforcement ribs are provided at the edges and angles on the other sides to enhance mechanical strength and thermal stress resistance.
The heat dissipation surface area and mechanical strength of the power diode module are improved, the heat dissipation effect and heat escape ability are enhanced, the wrapping area of the copper sheet packaging area is reduced, and the risk of damage caused by external pressure is reduced.
Smart Images

Figure CN222690666U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of diode module structures, in particular to a photovoltaic protection power device module. Background Art
[0002] Solar photovoltaic modules are devices that convert solar energy into electrical energy. In photovoltaic power generation systems, junction boxes play an important role. They are mainly used to output the current generated by each photovoltaic module and converge it to the system control box. In addition, the junction box also protects the solar photovoltaic modules. The junction box is generally equipped with a power diode module, which is connected to the battery string in the photovoltaic module. When there is a cell damage in the battery string or a hot spot effect caused by light blocking, the faulty battery string can be separated from the photovoltaic system to avoid its adverse effect on the entire photovoltaic system.
[0003] In the power diode module, a gap distance is maintained between two copper sheets, and the two copper sheets are conductively welded through a jumper wire. Finally, the jumper wire and the welding ends thereof are fixed by epoxy packaging, thereby forming a modular structure of the power diode. In the prior art, the epoxy plastic package between the two copper sheets usually adopts a regular rectangular package, which easily leads to insufficient heat dissipation surface area of the jumper wire and the welding ends thereof with the two copper sheets, resulting in poor heat dissipation effect of the power diode module product. In addition, when the two ends of the copper sheet are subjected to external pressure, it is easy to cause damage to the body, leading to problems such as product failure. Utility Model Content
[0004] The utility model aims to provide a photovoltaic protection power device module, which is used to solve the problems in the prior art that the rectangular epoxy plastic package causes poor heat dissipation effect of the power diode module product and the body is easily damaged.
[0005] The purpose of the utility model can be achieved through the following technical solutions:
[0006] A photovoltaic protection power device module, comprising:
[0007] A conductive copper sheet 1, one end of which is provided with a copper sheet 1 packaging area;
[0008] A second conductive copper sheet, one end of which is provided with a second copper sheet packaging area, and a heat dissipation gap is provided between the second copper sheet packaging area and the first copper sheet packaging area;
[0009] A jumper wire, one end of which is conductively welded to the copper sheet first packaging area, and the other end of which is conductively welded to a chip, wherein the chip is arranged on the copper sheet second packaging area;
[0010] An epoxy plastic encapsulation body, which internally encapsulates and fixes the copper sheet first encapsulation area, the copper sheet second encapsulation area and the jumper;
[0011] The epoxy plastic encapsulation body is rectangular in shape, and has chamfered portions at the corners on both sides thereof, so that the exposed area of the first packaging area of the copper sheet or the second packaging area of the copper sheet is increased by the chamfered portions.
[0012] As a further solution of the utility model: the conductive copper sheet 1 and the conductive copper sheet 2 are respectively provided with assembly holes, and the side ends of the epoxy plastic sealing body are penetrated and arranged in the assembly holes.
[0013] As a further solution of the utility model: reinforcing ribs are arranged at the corners on the other two sides of the epoxy plastic packaging body, and the wrapping area of the copper sheet first packaging area or the copper sheet second packaging area is reduced by the reinforcing ribs.
[0014] As a further solution of the utility model: serrated strips are respectively arranged on the two side surfaces of the packaging area of the copper sheet 1, and serrated edges 1 are respectively arranged on the two side outer edges; serrated U-shaped strips are respectively arranged on the two side surfaces of the packaging area of the copper sheet 2, and serrated edges 2 are respectively arranged on the two side outer edges.
[0015] As a further solution of the utility model: the jumper is a U-shaped conductive sheet, a bent ear end on one side of the U-shaped conductive sheet is welded to the sawtooth strip on one side surface, and a bent ear end on the other side is welded to the chip.
[0016] As a further solution of the utility model: at least two copper sheet one through holes are arranged between the two side surfaces of the copper sheet one packaging area; at least three copper sheet two through holes are arranged between the two side surfaces of the copper sheet two packaging area.
[0017] As a further solution of the utility model: an end face folding groove is arranged on the edge of the copper sheet one packaging area facing the copper sheet two packaging area, and an end face protrusion matching the end face folding groove is arranged on the edge of the copper sheet two packaging area, and a heat dissipation gap is provided between the end face protrusion and the end face folding groove.
[0018] As a further solution of the utility model: the conductive copper sheet 1 and the conductive copper sheet 2 are respectively provided with tin block welding areas.
[0019] As a further solution of the utility model: the conductive copper sheet 1 and the conductive copper sheet 2 are respectively provided with positioning holes; the conductive copper sheet 1 or the conductive copper sheet 2 is provided with an anti-reverse positioning opening.
[0020] Beneficial effects of the utility model:
[0021] (1) The conductive copper sheet 1 and the conductive copper sheet 2 are encapsulated and fixed by an epoxy plastic encapsulation body, so that the copper sheet 1 encapsulation area, the copper sheet 2 encapsulation area and the jumper are encapsulated and fixed inside the epoxy plastic encapsulation body. The shape and structure of the epoxy plastic encapsulation body are improved so that the exposed area of the copper sheet 1 encapsulation area or the copper sheet 2 encapsulation area is increased through the inclined portion, which can increase the heat dissipation surface area of the power diode module when it is working, enhance the heat dissipation effect, and improve the junction temperature capacity and thermal escape capacity;
[0022] (2) Reinforcement ribs are provided at the other two corners of the epoxy plastic package. The reinforcing ribs are used to reduce the wrapping area of the copper sheet 1 packaging area or the copper sheet 2 packaging area. When the conductive copper sheet 1 and the conductive copper sheet 2 are packaged by the epoxy plastic package, the reinforcing ribs are used to change the flush edges of the epoxy plastic package to enhance the mechanical strength and thermal stress resistance of the epoxy plastic package. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] The utility model is further described below in conjunction with the accompanying drawings.
[0024] Figure 1 is a schematic diagram of a side structure of a power diode module in Example 1;
[0025] Figure 2 is another side structural diagram of the power diode module in Example 1;
[0026] Figure 3 It is a schematic diagram of the structure in which the conductive copper sheet 1 and the conductive copper sheet 2 in Example 1 are connected via a jumper wire;
[0027] Figure 4 is a schematic diagram of a side structure of a power diode module in Example 2;
[0028] Figure 5 This is another side structural diagram of the power diode module in Example 2.
[0029] In the figure: 1. Conductive copper sheet 1; 10. Copper sheet 1 packaging area; 100. Sawtooth strip; 101. Sawtooth edge 1; 102. Copper sheet 1 through hole; 103. End face folding groove; 2. Conductive copper sheet 2; 20. Copper sheet 2 packaging area; 200. Sawtooth U-shaped strip; 201. Sawtooth edge 2; 202. Copper sheet 2 through hole; 203. End face protrusion; 3. Epoxy plastic sealing body; 30. Inclined portion; 31. Reinforcement rib portion; 4. Jumper; 5. Chip; 6. Assembly hole; 7. Tin block welding area; 8. Positioning hole; 9. Anti-reverse positioning port. DETAILED DESCRIPTION
[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0031] In the description of the present invention, it should be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention; in the description of the present invention, "multiple" and "several" mean at least two, for example two, three, etc., unless otherwise clearly and specifically defined.
[0032] Example 1
[0033] See also Figures 1 to 3 As shown, the utility model is a photovoltaic protection power device module, comprising a conductive copper sheet 1, a conductive copper sheet 2, a jumper 4 and an epoxy plastic package 3, wherein a copper sheet 1 packaging area 10 is arranged at one end of the conductive copper sheet 1, a copper sheet 2 packaging area 20 is arranged at one end of the conductive copper sheet 2, a heat dissipation gap is provided between the copper sheet 2 packaging area 20 and the copper sheet 1 packaging area 10, one end of the jumper 4 is conductively welded to the copper sheet 1 packaging area 10, and the other end is conductively welded to a chip 5, the chip 5 is arranged on the copper sheet 2 packaging area 20, and the epoxy plastic package 3 internally encapsulates and fixes the copper sheet 1 packaging area 10, the copper sheet 2 packaging area 20 and the jumper 4; wherein the epoxy plastic package 3 is rectangular, and a chamfer 30 is arranged at the corner positions on both sides thereof, and the exposed area of the copper sheet 1 packaging area 10 or the copper sheet 2 packaging area 20 is increased by the chamfer 30.
[0034] In the power diode module structure of the present application, the conductive copper sheet 1 and the conductive copper sheet 2 are encapsulated and fixed by the epoxy plastic encapsulation body 3, so that the copper sheet 1 encapsulation area 10, the copper sheet 2 encapsulation area 20 and the jumper 4 are encapsulated and fixed inside the epoxy plastic encapsulation body 3. The shape and structure of the epoxy plastic encapsulation body 3 are improved so that the exposed area of the copper sheet 1 encapsulation area 10 or the copper sheet 2 encapsulation area 20 can be increased through the inclined portion 30, which can increase the heat dissipation surface area of the power diode module when it is working, enhance the heat dissipation effect, and improve the junction temperature capacity and thermal escape capability.
[0035] In this specific embodiment, assembly holes 6 are respectively opened on the conductive copper sheet 1 and the conductive copper sheet 2 2, and the side ends of the epoxy plastic sealing body 3 are set through the assembly holes 6. The set assembly holes 6 can make the epoxy plastic sealing body 3 as a whole encapsulated and fixed, thereby improving the molding quality of the epoxy plastic sealing body 3.
[0036] In this specific embodiment, serrated strips 100 are respectively provided on the surfaces of both sides of the copper sheet packaging area 10, and serrated edges 101 are respectively provided on the outer edges of both sides; serrated U-shaped strips 200 are respectively provided on the surfaces of both sides of the copper sheet packaging area 20, and serrated edges 201 are respectively provided on the outer edges of both sides. The jumper 4 is a U-shaped conductive sheet, and the bent ear end on one side of the U-shaped conductive sheet is welded and connected to the serrated strip 100 on the surface of one side, and the bent ear end on the other side is welded and connected to the chip 5, which can increase the welding contact area of the jumper 4. The serrated strip 100, serrated edge 101, serrated U-shaped strip 200 and serrated edge 201 can increase the contact area with the epoxy plastic package 3, so that the molding of the epoxy plastic package 3 is stable and the molding quality of the power diode module is ensured.
[0037] In this specific embodiment, at least two copper sheet through holes 102 are arranged between the two side surfaces of the copper sheet packaging area 10; at least three copper sheet through holes 202 are arranged between the two side surfaces of the copper sheet packaging area 20, so that the epoxy plastic sealing body 3 arranged on the two side surfaces of the copper sheet packaging area 10 and the copper sheet packaging area 20 can be penetrated and fixed. The through holes strengthen the bonding strength between the epoxy plastic sealing body 3 and the copper guide sheet by locking glue, thereby enhancing the bonding stability, thereby offsetting the pressure of the copper sheets on both sides and better protecting the main body; at the same time, it can increase the penetration ability of the curing glue during the molding of the epoxy plastic sealing body 3, and improve the appearance of the plastic sealing body such as bubbles, missing corners, incomplete filling and other undesirable problems.
[0038] In this specific embodiment, an end face folding groove 103 is provided on the edge of the copper sheet one packaging area 10 facing the copper sheet two packaging area 20, and an end face protrusion 203 matching the end face folding groove 103 is provided on the edge of the copper sheet two packaging area 20, and a heat dissipation gap is provided between the end face protrusion 203 and the end face folding groove 103; when the conductive copper sheet one 1 and the conductive copper sheet two 2 are packaged by the epoxy plastic packaging body 3, the facing end faces are designed from traditional flat ends to bent ends, which can increase the heat dissipation area of the heating ends of the conductive copper sheet one 1 and the conductive copper sheet two 2, facilitate rapid heat dissipation, and during the molding process of the epoxy plastic packaging body 3, the heat stress resistance of the epoxy plastic packaging body 3 can be enhanced.
[0039] In this specific implementation manner, a tin block welding area 7 is respectively provided on the conductive copper sheet 1 and the conductive copper sheet 2 2 .
[0040] In this specific implementation manner, a positioning hole 8 is provided on each of the conductive copper sheet 1 and the conductive copper sheet 2 2 ; and an anti-reverse positioning opening 9 is provided on the conductive copper sheet 1 or the conductive copper sheet 2 2 .
[0041] Example 2
[0042] See also Figure 3 , Figure 4 and Figure 5As shown, Example 2 is different from Example 1 in that reinforcing ribs 31 are provided at the other two side corners of the epoxy plastic packaging body 3. The reinforcing ribs 31 are used to reduce the wrapping area of the copper sheet one packaging area 10 or the copper sheet two packaging area 20. When the conductive copper sheet one 1 and the conductive copper sheet two 2 are packaged by the epoxy plastic packaging body 3, the reinforcing ribs 31 are used to change the flush edges of the regular epoxy plastic packaging body 3, thereby enhancing the thermal stress resistance of the epoxy plastic packaging body 3.
[0043] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.
Claims
1. A photovoltaic protection power device module, characterized in that: include: A conductive copper sheet (1), one end of which is provided with a copper sheet packaging area (10); A second conductive copper sheet (2), one end of which is provided with a second copper sheet packaging area (20), and a heat dissipation gap is provided between the second copper sheet packaging area (20) and the first copper sheet packaging area (10); A jumper wire (4), one end of which is conductively welded to the copper sheet first packaging area (10), and the other end of which is conductively welded to a chip (5), wherein the chip (5) is arranged on the copper sheet second packaging area (20); An epoxy plastic encapsulation body (3), the copper sheet first encapsulation area (10), the copper sheet second encapsulation area (20) and the jumper wire (4) being encapsulated and fixed therein; The epoxy plastic encapsulation body (3) is rectangular in shape, and has chamfered portions (30) at the corners on both sides thereof, and the exposed area of the copper sheet first encapsulation area (10) or the copper sheet second encapsulation area (20) is increased by the chamfered portions (30).
2. A photovoltaic protection power device module according to claim 1, characterized in that: The conductive copper sheet 1 (1) and the conductive copper sheet 2 (2) are each provided with an assembly hole (6), and the side end of the epoxy plastic sealing body (3) is arranged through the assembly hole (6).
3. A photovoltaic protection power device module according to claim 2, characterized in that: Reinforcement ribs (31) are provided at the corner positions on the other two sides of the epoxy plastic packaging body (3), and the wrapping area of the copper sheet first packaging area (10) or the copper sheet second packaging area (20) is reduced by the reinforcement ribs (31).
4. A photovoltaic protection power device module according to claim 1, characterized in that: The copper sheet one packaging area (10) is provided with sawtooth strips (100) on both side surfaces, and the outer edges on both sides are provided with sawtooth edges (101); the copper sheet two packaging area (20) is provided with sawtooth U-shaped strips (200) on both side surfaces, and the outer edges on both sides are provided with sawtooth edges (201).
5. A photovoltaic protection power device module according to claim 4, characterized in that: The jumper (4) is a U-shaped conductive sheet, one side of the U-shaped conductive sheet is bent and connected to the sawtooth strip (100) on one side surface by welding, and the other side of the U-shaped conductive sheet is bent and connected to the chip (5) by welding.
6. A photovoltaic protection power device module according to claim 4, characterized in that: At least two copper sheet one through holes (102) are arranged between the two side surfaces of the copper sheet one packaging area (10); and at least three copper sheet two through holes (202) are arranged between the two side surfaces of the copper sheet two packaging area (20).
7. A photovoltaic protection power device module according to claim 1, characterized in that: An end face folding groove (103) is arranged on the edge of the copper sheet first packaging area (10) facing the copper sheet second packaging area (20), and an end face protrusion (203) matching the end face folding groove (103) is arranged on the edge of the copper sheet second packaging area (20), and a heat dissipation gap is provided between the end face protrusion (203) and the end face folding groove (103).
8. A photovoltaic protection power device module according to claim 1, characterized in that: The conductive copper sheet one (1) and the conductive copper sheet two (2) are each provided with a tin block welding area (7).
9. A photovoltaic protection power device module according to claim 1, characterized in that: The conductive copper sheet one (1) and the conductive copper sheet two (2) are each provided with a positioning hole (8); the conductive copper sheet one (1) or the conductive copper sheet two (2) is provided with an anti-reverse positioning opening (9).