Heat exchange plate and phase-change high-power water-cooling VC structural member thereof

Abstract

The utility model relates to the field of heat dissipation equipment, in particular to a heat exchange plate and a phase change high-power water-cooling VC structural member thereof, which comprise a water-cooling module and a VC module, the water-cooling module comprises a water-cooling upper cover and a heat exchange plate, the water-cooling upper cover covers the heat exchange plate, a condensation cavity is formed between the water-cooling upper cover and the heat exchange plate, the water-cooling upper cover is connected with a liquid inlet and outlet connector, and the VC module is connected with the liquid inlet and outlet connector. The bottom surface of the heat exchange plate is connected with the VC module; and the heat exchange plate adopts the design of the heat dissipation column groups which are obliquely arranged in an array, so that the heat dissipation efficiency is remarkably improved. In addition, the heat dissipation tooth piece set is composed of a plurality of parallel heat dissipation tooth pieces, and water passing gaps are formed among the heat dissipation tooth pieces. Cooling liquid is allowed to flow through the water passing gaps, so that more heat is taken away. The heat dissipation column sets and the heat dissipation tooth piece sets are arranged at intervals in a staggered mode, the surface area of the heat exchange plate can be utilized to the maximum degree through the layout, it is ensured that cooling liquid can make effective contact with the heat exchange plate, and therefore the overall heat dissipation performance is improved.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation equipment, in particular to a heat exchange plate and a phase-change high-power water-cooled VC structural component thereof. Background Art

[0002] With the development of science and technology, the thermal power of heat sources such as chips is getting higher and higher. Traditional VC radiators and water-cooled radiators can no longer meet the heat dissipation requirements. The unit heat exceeds the process limit. A new heat dissipation method is urgently needed to meet the unit heat dissipation requirements and the overall heat dissipation requirements. As we all know, especially for chips, the thermal power exceeds 1200W. The air-cooled radiators and water-cooled radiators currently used in the market can no longer meet the unit heat flow requirements. The pressure drop needs to be controlled at a relatively low standard. This technology has led to the application of new radiators.

[0003] The problem with the current usage method on the market: it cannot solve the problem of extremely high heat flux per unit area, the heat on the chip cannot be dissipated, the heat is extremely high, and it cannot work normally.

[0004] Moreover, the market generally uses separate cooling fins for heat dissipation, and the cooling fins are usually directly parallel to the water inlet and outlet. This design cannot ensure that the coolant can evenly cover each cooling fin when it flows through. Therefore, in some areas, the cooling fins may not be effectively cooled, resulting in uneven heat dissipation and affecting the heat dissipation effect. At the same time, the arrangement of the cooling fins limits the flow of the coolant, so that the coolant cannot fully contact the cooling fins, thereby limiting the cooling efficiency. Especially near high-power heat sources, due to the large amount of heat accumulation, the temperature of the cooling fins is high. If the coolant cannot effectively flow through these areas, the heat dissipation effect will be greatly reduced. Summary of the invention

[0005] In order to solve the above problems, the utility model provides a heat exchange plate and a phase-change high-power water-cooled VC structural member thereof, which adopts a heat dissipation column group design arranged in an oblique array, significantly improving the heat dissipation efficiency. By reducing the flow resistance, it is convenient for the subsequent heat dissipation water flow to be more quickly and evenly distributed to the corresponding heat dissipation cavity, effectively avoiding the problem of local overheating. In addition, this layout also enhances the structural stability of the heat exchange plate, enabling it to adapt to a variety of different heat dissipation requirements and environmental conditions.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a heat exchange plate, including a heat exchange base plate, and the surface of the heat exchange base plate is provided with a plurality of heat dissipation column groups and a plurality of heat dissipation fin groups, wherein the plurality of heat dissipation column groups and the heat dissipation fin groups are arranged alternately at intervals, the heat dissipation column group includes a plurality of heat dissipation columns, and the plurality of heat dissipation columns are arranged in an oblique array; the heat dissipation fin group includes a plurality of heat dissipation fins, the plurality of heat dissipation fins are parallel to each other, and a water flow gap is formed between the heat dissipation fins.

[0007] The specific beneficial effects are as follows: the heat exchange plate adopts a heat dissipation column group design arranged in an oblique array, which significantly improves the heat dissipation efficiency. By reducing the flow resistance, it is convenient for the subsequent heat dissipation water flow to be more quickly and evenly distributed to the corresponding heat dissipation cavity, effectively avoiding the problem of local overheating. In addition, this layout also enhances the structural stability of the heat exchange plate, enabling it to adapt to a variety of different heat dissipation requirements and environmental conditions.

[0008] In addition, the heat sink fin group is composed of several parallel heat sink fins, and the heat sink fins form a water gap. The water gap allows the coolant to flow through, thereby taking away more heat. The parallel arrangement of the heat sink fins also helps to evenly distribute the coolant on the plate and improve the heat dissipation effect. The heat sink column group and the heat sink fin group are arranged at intervals and staggered. This layout can maximize the use of the surface area of ​​the heat exchange plate, while ensuring that the coolant can effectively contact the heat exchange plate, thereby improving the overall heat dissipation performance.

[0009] Furthermore, a flow splitter cone is symmetrically arranged on both sides of the surface of the heat exchange bottom plate.

[0010] Furthermore, a plurality of water dividing areas are arranged in each heat dissipation fin group, and water dividing columns are arranged in the water dividing areas.

[0011] The present application also provides a phase-change high-power water-cooled VC structural component, including a water-cooling module and a VC module, wherein the water-cooling module includes a water-cooling upper cover and a heat exchange plate, wherein the water-cooling upper cover is covered on the heat exchange plate, and a condensation chamber is formed between the water-cooling upper cover and the heat exchange plate, and the water-cooling upper cover is connected to a liquid inlet and outlet joint, and the bottom surface of the heat exchange plate is connected to the VC module.

[0012] Furthermore, two interface holes for connecting with the inlet and outlet joints are arranged on both sides of the cold upper cover surface, and the two interface holes are respectively aligned with the diverter cone.

[0013] Furthermore, the cross section of the heat dissipation column is circular.

[0014] Furthermore, the cross section of the heat dissipation column is an ellipse, and the major axis of the ellipse is parallel to the line between the two diverter cones and a plurality of heat dissipation fins.

[0015] Furthermore, the VC module includes an evaporation base plate and a plurality of return water capillary columns. The evaporation base plate is mounted on the bottom of the heat exchange plate, and a negative pressure evaporation chamber is formed between the evaporation base plate and the heat exchange plate, and the negative pressure evaporation chamber is filled with evaporation medium. An upper capillary layer is arranged on the bottom surface of the heat exchange plate, and a lower capillary layer is arranged on the surface of the evaporation base plate, wherein one end of the return water capillary column is connected to the lower capillary layer, and the other end is connected to the upper capillary layer. A plurality of evaporation columns are also arranged on the surface of the evaporation base plate, and the plurality of evaporation columns are connected to the upper capillary layer through the evaporation capillary layer.

[0016] Furthermore, the VC module further comprises a plurality of first connecting columns, one end of which passes through the lower capillary layer to be connected to the evaporation bottom plate, and the other end of which passes through the upper capillary layer to be connected to the heat exchange plate.

[0017] Furthermore, the VC module further comprises a plurality of second connecting columns, one end of which passes through the evaporation capillary layer and is connected to the evaporation bottom plate, and the other end of which passes through the upper capillary layer and is connected to the heat exchange plate.

[0018] The beneficial effect of the utility model is that the water cooling module is composed of a water cooling cover and a heat exchange plate. The heat exchange plate adopts a heat dissipation column group design arranged in an oblique array, which significantly improves the heat dissipation efficiency. In addition, the heat dissipation fin group is composed of a plurality of heat dissipation fins parallel to each other, and a water gap is formed between the heat dissipation fins. The water gap allows the coolant to flow through, thereby taking away more heat. The parallel arrangement of the heat dissipation fins also helps to evenly distribute the coolant on the plate, thereby improving the heat dissipation effect. The heat dissipation column group and the heat dissipation fin group are arranged alternately at intervals. This layout can maximize the use of the surface area of ​​the heat exchange plate, while ensuring that the coolant can effectively contact the heat exchange plate, thereby improving the overall heat dissipation performance. The water cooling cover is tightly covered on the heat exchange plate, and a closed condensation chamber is formed between the two. Through the inlet and outlet joints on the water cooling cover, the coolant can circulate and effectively absorb and take away the heat in the condensation chamber. In addition, the bottom surface of the heat exchange plate is tightly connected to the VC module. The VC module uses its efficient heat conduction performance to quickly transfer the heat from the heat source to the heat exchange plate, and then dissipate the heat through the water cooling module. This combined design not only improves the heat dissipation efficiency, but also ensures the stability and reliability of the structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is an exploded schematic diagram of a phase-change high-power water-cooled VC structural component.

[0020] Figure 2 It is a structural schematic diagram of a phase-change high-power water-cooled VC structural component.

[0021] Figure 3 It is a structural diagram of the heat exchange plate.

[0022] Figure 4 It is a schematic diagram of the top view structure of the heat exchange plate.

[0023] Figure 5 It is a top view of a phase-change high-power water-cooled VC structure.

[0024] Figure 6 yes Figure 5 Section view along section line AA.

[0025] Figure 7 It is a performance test experiment data chart.

[0026] Description of the accompanying drawings: water-cooled upper cover 1, interface hole 11, heat exchange plate 2, heat dissipation column 21, diverter cone 22, heat dissipation tooth plate 23, water flow gap 231, water diversion area 24, water diversion column 25, upper capillary layer 3, lower capillary layer 4, evaporation bottom plate 5, evaporation column 51, evaporation capillary layer 52, liquid inlet and outlet joint 6, return water capillary column 7, first connecting column 8, second connecting column 9. DETAILED DESCRIPTION

[0027] See also Figure 1-7 As shown, the utility model relates to a heat exchange plate 2, including a heat exchange base plate, wherein a heat exchange column 21 group and a heat dissipation fin 23 group are arranged on the surface of the heat exchange base plate, wherein several heat dissipation column groups and heat dissipation fin 23 groups are arranged in an interlaced manner, wherein the heat dissipation column 21 group includes several heat dissipation columns 21, and several heat dissipation columns 21 are arranged in an oblique array. It is important to explain here that the oblique array arrangement can be understood as several heat dissipation columns 21 being arranged in several rows in an equidistant manner, but the heat dissipation columns 21 between adjacent rows are staggered, for example, a heat dissipation column 21 located in the second row is aligned with the gap between two heat dissipation columns 21 in the first row. The heat dissipation fin 23 group includes several heat dissipation fins 23, and the several heat dissipation fins 23 are parallel to each other, and a water-passing gap 231 is formed between the heat dissipation fins 23.

[0028] See also Figure 3-4 As shown, it is further explained that a diverter cone 22 is symmetrically arranged on both sides of the surface of the heat exchange bottom plate, and the effect of the diverter cone 22 is to effectively reduce the flow resistance and make the liquid flow smoothly.

[0029] The specific effect is: the heat exchange plate adopts a heat dissipation column group design arranged in an oblique array, which significantly improves the heat dissipation efficiency. By reducing the flow resistance, the subsequent heat dissipation water flow can be more quickly and evenly distributed to the corresponding heat dissipation cavity, effectively avoiding the problem of local overheating. In addition, this layout also enhances the structural stability of the heat exchange plate, enabling it to adapt to a variety of different heat dissipation requirements and environmental conditions, and effectively reducing the flow resistance.

[0030] In addition, the heat sink fins 23 group is composed of a plurality of heat sink fins 23 parallel to each other, and a water gap 231 is formed between the heat sink fins 23. The water gap 231 allows the coolant to flow through, thereby taking away more heat. The parallel arrangement of the heat sink fins 23 also helps to evenly distribute the coolant on the plate and improve the heat dissipation effect. The heat sink column group and the heat sink fins 23 group are arranged in an interlaced manner. This layout can maximize the use of the surface area of ​​the heat exchange plate, while ensuring that the coolant can effectively contact the heat exchange plate, thereby improving the overall heat dissipation performance.

[0031] See also Figure 3-4As shown, further, a plurality of water-dividing areas 24 are also provided in each heat-dissipating fin 23 group, and a water-dividing column 25 is provided in the water-dividing area 24. It is an innovative design to provide a plurality of water-dividing areas 24 in the heat-dissipating fin 23 group. These water-dividing areas 24 are intentionally left empty areas, where no heat-dissipating fins 23 are provided, but are used to accommodate and guide the flow of the coolant. Water-dividing columns 25 can be further provided in these water-dividing areas 24. The function of the water-dividing column 25 is to guide the water flow. The water-dividing column 25 can guide the flow direction of the coolant in the heat-dissipating fin 23 group, ensuring that the coolant can flow evenly through each heat-dissipating fin 23, thereby improving the heat-dissipating efficiency. In addition, the water-dividing column 25 itself can also be used as a heat-dissipating surface, increasing the contact area with the coolant, and further improving the heat exchange efficiency. At the same time, by reasonably designing the position and number of the water-dividing columns 25, the distribution of the coolant in the heat-dissipating fin 23 group can be optimized, ensuring that each area can be adequately cooled.

[0032] In this specific embodiment, a phase-change high-power water-cooled VC structural component is also provided, including a water-cooling module and a VC module, wherein the water-cooling module includes a water-cooling upper cover 1 and the heat exchange plate 2 discussed above, wherein the water-cooling upper cover 1 is covered on the heat exchange plate 2, and a condensation chamber is formed between the water-cooling upper cover 1 and the heat exchange plate 2, and the water-cooling upper cover 1 is connected to the liquid inlet and outlet joints 6, and the bottom surface of the heat exchange plate 2 is connected to the VC module.

[0033] Overall water flow direction:

[0034] The heat dissipation liquid first flows into the condensation chamber through an inlet and outlet joint 6 of the water-cooled upper cover 1. This joint is usually located at one end of the water-cooled upper cover 1. After the liquid enters the condensation chamber, it will first encounter the first row of heat dissipation columns 21. Since the heat dissipation columns 21 are arranged in an oblique array, the liquid will be naturally diverted to both sides of the heat dissipation when flowing through the first row of copper columns, rather than passing directly in a straight line. As the liquid continues to flow and pass through subsequent arrangements of heat dissipation columns 21, each crossing will cause the waterway to be further dispersed. For example, when the liquid flows from the gap between the first row of heat dissipation columns to the second row, it will encounter the second row of heat dissipation columns and be diverted again. This process will continue to occur, causing the originally concentrated waterway to become more and more dispersed. When the liquid flows out of the first heat dissipation column 21 group and is fully diverted, it enters the adjacent heat dissipation fin 23 group and enters each water gap 231, thereby taking away more heat. When the cooling liquid flows out of the water gap 231, it will enter another heat dissipation column 21 group for diversion and heat dissipation. Through this design, the heat dissipation liquid can more comprehensively cover all parts of the condensation chamber, and exchange heat with more heat dissipation columns 21 and heat dissipation fins 23, thereby improving the heat dissipation efficiency. After sufficient heat exchange, the heat dissipation liquid will flow out of the condensation chamber through the inlet and outlet joint 6 at the other end of the water-cooled upper cover 1, completing the entire cycle.

[0035] In addition, in this specific embodiment, two interface holes 11 are provided on both sides of the surface of the water-cooled upper cover 1, and the two interface holes 11 are aligned with the diverter cone 22, that is, the water falling from the inlet and outlet joints 6 directly falls on the top of the diverter cone 22, and then continues the first step of diversion through the diverter cone 22, and can effectively reduce the flow resistance. The diverter cones 22 symmetrically arranged on both sides of the surface of the heat exchange bottom plate are designed in a shape so that the heat dissipation liquid can be dispersed more smoothly when it flows into the condensation chamber. Due to the streamlined design of the cone, the liquid can be quickly dispersed when it contacts the cone, reducing the flow resistance caused by direct impact or right-angle turn. The diverter cone 22 not only reduces the flow resistance, but also plays a role in guiding the flow of the liquid. When the heat dissipation liquid enters the condensation chamber through the inlet and outlet joints 6, they will directly fall on the top of the diverter cone 22, and then quickly disperse to both sides of the condensation chamber along the surface of the cone. Through the guidance of the diverter cone 22, the heat dissipation liquid can be more evenly distributed to various parts of the condensation chamber, and fully exchange heat with the heat dissipation column 21. This uniform distribution ensures consistent heat dissipation efficiency throughout the condensing chamber, avoiding problems such as local overheating or uneven cooling.

[0036] It is an important design detail that the two interface holes 11 on the surface of the water-cooled upper cover 1 are aligned with the diverter cone 22. This alignment ensures that the heat dissipating liquid can directly fall on the top of the diverter cone 22 when entering the condensation chamber through the inlet and outlet joints 6. This not only reduces the path length of the liquid flow, but also improves the efficiency and uniformity of liquid dispersion.

[0037] See also Figure 3-4 As shown, it is further explained that the cross section of the heat dissipation column 21 is circular or elliptical. If the cross section of the heat dissipation column 21 is elliptical, the major axis of the ellipse is parallel to the line connecting the two diverter cones 22.

[0038] The cross-section of the heat dissipation column 21 can be circular or elliptical. The heat dissipation column 21 with a circular cross-section is widely used in the field of heat dissipation due to its symmetry and simplicity. When an elliptical cross-section is adopted, the design of the heat dissipation column 21 can further optimize the heat dissipation performance. At the same time, the direction of the long axis of the ellipse can be directionally designed according to actual needs. For example, in this embodiment, the long axis of the ellipse is parallel to the line connecting the two diverter cones 22 and the water gap 231. The long axis of the ellipse is parallel to the heat dissipation fins 23. This design enables the coolant to flow more smoothly and evenly into the water gap 231 in the heat dissipation fin 23 group after flowing through the heat dissipation column. At the same time, due to the synergistic effect between the heat dissipation column and the heat dissipation fins 23, the coolant will continuously change direction during the flow process, forming a more complex flow pattern, thereby increasing the efficiency and uniformity of heat exchange.

[0039] See also Figure 1-7As shown, the VC module is specifically discussed. The VC module includes an evaporation bottom plate 5 and a plurality of return water capillary columns 7. The evaporation bottom plate 5 is mounted on the bottom of the heat exchange plate 2, and a negative pressure evaporation chamber is formed between the evaporation bottom plate 5 and the heat exchange plate 2, and the negative pressure evaporation chamber is filled with evaporation medium; wherein an upper capillary layer 3 is arranged on the bottom surface of the heat exchange plate 2, and a lower capillary layer 4 is also arranged on the surface of the evaporation bottom plate 5, one end of the return water capillary column 7 is connected to the lower capillary layer 4, and the other end is connected to the upper capillary layer 3; a plurality of evaporation columns 51 are arranged on the surface of the evaporation bottom plate 5, and the plurality of evaporation columns 51 are connected to the upper capillary layer 3 through the evaporation capillary layer 52;

[0040] Working process of VC module:

[0041] Heat absorption and evaporation: When the heat source (such as a chip) generates heat, the heat is quickly transferred to the evaporation medium (such as pure water) in the negative pressure evaporation chamber through the evaporation bottom plate 5. After the evaporation medium is heated in the negative pressure evaporation chamber, it begins to evaporate and forms saturated steam. Due to the special design of the negative pressure evaporation chamber (such as the water content is about 90%), the evaporation process is more efficient.

[0042] Steam transfer and condensation: Saturated steam adheres to the bottom surface of the heat exchange plate 2. Through the heat dissipation of the heat exchange plate 2 (refer to the above for the heat dissipation of the heat exchange plate 2), the heat is quickly transferred to the condensation chamber. The saturated steam exchanges heat with the liquid in the condensation chamber, and the steam releases heat and condenses into liquid. In this process, a large amount of heat is dissipated, thereby achieving a heat dissipation effect.

[0043] Liquid reflux: Under the action of capillary function, the condensed liquid passes through the upper capillary layer 3, the return water capillary column 7 and the lower capillary layer 4, and returns to the heat source evaporation area of ​​the evaporation bottom plate 5 through a small pressure difference.

[0044] Specific details: The upper capillary layer 3 (thickness of about 0.7) and the lower capillary layer 4 (thickness of about 0.6) as well as the evaporation capillary layer 52 (thickness of about 0.4) and the return capillary column 7 (diameter of about 6.0) together constitute the circulation loop of the liquid, ensuring that the liquid can be evenly distributed and effectively refluxed. As heat is continuously generated, the above process will continue to form a stable heat dissipation cycle. The VC module can dissipate a thermal power of no less than 1350W, meeting the heat dissipation requirements of high-performance electronic equipment.

[0045] To further discuss, the VC module further includes a plurality of first connecting columns 8 , one end of which passes through the lower capillary layer 4 to be connected to the evaporation bottom plate 5 , and the other end of which passes through the upper capillary layer 3 to be connected to the heat exchange plate 2 .

[0046] The primary function of the first connecting column 8 is to provide a stable connection to ensure a tight fit between the evaporation base plate 5 and the heat exchange plate 2, and to prevent loosening or deformation caused by temperature changes or external impacts during long-term operation. Through this stable connection, the module can maintain a stable negative pressure evaporation chamber to ensure efficient evaporation and condensation processes. In addition, since the first connecting column 8 directly connects the evaporation base plate 5 and the heat exchange plate 2, they also become one of the channels for heat conduction. In the process of heat transfer from the heat source to the condensation area, the connecting column can assist in the rapid conduction of heat and improve the overall heat dissipation efficiency. Especially under high-power operation, the presence of the connecting column can effectively alleviate the problem of local overheating and ensure the stability of module performance.

[0047] To further discuss, the VC module further includes a plurality of second connecting columns 9 , one end of which passes through the evaporation capillary layer 52 and is connected to the evaporation bottom plate 5 , and the other end of which passes through the upper capillary layer 3 and is connected to the heat exchange plate 2 .

[0048] Similar to the first connecting column 8, the primary function of the second connecting column 9 is to provide a stable connection. They enhance the connection strength between the evaporation base plate 5 and the heat exchange plate 2 to prevent loosening or deformation caused by temperature changes or external impacts during long-term operation. The addition of the second connecting column 9 further stabilizes the structure of the entire VC module and ensures the stability and reliability of the negative pressure evaporation chamber.

[0049] In addition, similar to the first connecting column 8, the second connecting column 9 also plays a role in optimizing heat conduction. As one of the channels for heat conduction, they can help quickly conduct heat from the evaporation base plate 5 to the heat exchange plate 2, thereby improving the overall heat dissipation efficiency. The presence of the second connecting column 9 helps to reduce the accumulation of heat inside the module, ensuring that the heat can be quickly and evenly transferred to the condensation area and dissipated to the external environment.

[0050] See also Figure 7 Regarding the actual working conditions of a phase change high-power water-cooled VC structure in this application, the temperature of the water inlet is 40°C, the temperature of the water outlet is 46.8°C, and the inlet and outlet water temperature difference is 6.8°C; the water inlet is 1L / minute, the heat source temperature is less than 68.5 degrees. The inlet and outlet liquid pressure difference is less than 1200Pa; the water inlet is 2L / minute, the heat source temperature is less than 63.5 degrees. The inlet and outlet liquid pressure difference is less than 1750Pa; the water inlet is 3L / minute, the heat source temperature is less than 68.7 degrees. The inlet and outlet liquid pressure difference is less than 2850Pa.

[0051] from Figure 7Experimental data show that water is used as the cooling liquid (its specific heat capacity cp is about 4.18 kJ / kg·K or 4180 J / kg·K), the flow rate is 3 L / min (i.e. 0.05 L / s or 0.05 kg / s, the density of water is 1 kg / L), and the inlet and outlet water temperature difference is measured to be 6.8 °C (i.e. 6.8 K). Substitute these values ​​into the formula for calculation:

[0052] P=m˙×cp×ΔT

[0053] in:

[0054] P is the thermal power (W)

[0055] m˙ is the mass flow rate (kg / s)

[0056] cp is the specific heat of the liquid (J / kg·K)

[0057] ΔT inlet and outlet water temperature difference (K)

[0058] P = 0.05 kg / s × 4180 J / kg × 6.8 K = 1421.2 W. It can be seen that the thermal efficiency in this specific embodiment reaches more than 1400 W.

[0059] The heat dissipation structure of this application has excellent heat dissipation performance, can achieve a thermal power of more than 1200W, and provides strong heat dissipation support for high heat sources such as chips. When faced with high-power chips, it can easily cope with it, ensuring that the heat source operates within a low and stable temperature range, effectively extending the service life of the device. This design not only improves the overall performance of the device, but also brings users a more reliable and lasting user experience.

[0060] The above implementation modes are merely descriptions of the preferred implementation modes of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary engineering and technical personnel in the field shall fall within the protection scope determined by the claims of the present invention.

Claims

1. A heat exchange plate, characterized in that: It includes a heat exchange base plate, and the surface of the heat exchange base plate is provided with a plurality of heat dissipation column groups and a plurality of heat dissipation fin groups, wherein the plurality of heat dissipation column groups and the heat dissipation fin groups are arranged alternately at intervals, the heat dissipation column group includes a plurality of heat dissipation columns, and the plurality of heat dissipation columns are arranged in an oblique array; the heat dissipation fin group includes a plurality of heat dissipation fins, the plurality of heat dissipation fins are parallel to each other, and water gaps are formed between the heat dissipation fins.

2. A heat exchange plate according to claim 1, characterized in that: A flow splitter cone is symmetrically arranged on both sides of the surface of the heat exchange bottom plate.

3. A heat exchange plate according to claim 2, characterized in that: A plurality of water dividing areas are also arranged in each heat dissipation fin group, and water dividing columns are arranged in the water dividing areas.

4. A phase-change high-power water-cooled VC structural component, characterized in that: It comprises a water-cooling module and a VC module, wherein the water-cooling module comprises a water-cooling upper cover and a heat exchange plate as described in claim 3 above, wherein the water-cooling upper cover is covered on the heat exchange plate, and a condensation chamber is formed between the water-cooling upper cover and the heat exchange plate, and the water-cooling upper cover is connected with a liquid inlet and outlet joint, and the bottom surface of the heat exchange plate is connected to the VC module.

5. A phase-change high-power water-cooled VC structural component according to claim 4, characterized in that: Two interface holes for connecting with the inlet and outlet joints are arranged on both sides of the surface of the water-cooled upper cover, and the two interface holes are respectively aligned with the diverter cone.

6. A phase-change high-power water-cooled VC structural component according to claim 4, characterized in that: The cross section of the heat dissipation column is circular.

7. A phase-change high-power water-cooled VC structural component according to claim 6, characterized in that: The cross section of the heat dissipation column is an ellipse, and the major axis of the ellipse is parallel to the line between the two diversion cones and a plurality of heat dissipation teeth.

8. The phase-change high-power water-cooled VC structural component according to claim 6, characterized in that: The VC module includes an evaporation base plate and a plurality of return water capillary columns. The evaporation base plate is mounted on the bottom of the heat exchange plate, and a negative pressure evaporation chamber is formed between the evaporation base plate and the heat exchange plate, and the negative pressure evaporation chamber is filled with evaporation medium. An upper capillary layer is arranged on the bottom surface of the heat exchange plate, and a lower capillary layer is arranged on the surface of the evaporation base plate, wherein one end of the return water capillary column is connected to the lower capillary layer, and the other end is connected to the upper capillary layer. A plurality of evaporation columns are also arranged on the surface of the evaporation base plate, and the plurality of evaporation columns are connected to the upper capillary layer through the evaporation capillary layer.

9. The phase-change high-power water-cooled VC structural component according to claim 6, characterized in that: The VC module also includes a plurality of first connecting columns, one end of which passes through the lower capillary layer to be connected to the evaporation bottom plate, and the other end of which passes through the upper capillary layer to be connected to the heat exchange plate.

10. The phase-change high-power water-cooled VC structural component according to claim 6, characterized in that: The VC module also includes a plurality of second connecting columns, one end of which passes through the evaporation capillary layer to be connected to the evaporation bottom plate, and the other end of which passes through the upper capillary layer to be connected to the heat exchange plate.

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