Laser compression system and laser cutting device
By combining the laser chipset and collimating mirror set in the sealing cavity in the laser compression system, the energy density and depth of focus problems of semiconductor lasers are solved, and efficient laser compression and cutting effects are achieved.
Patent Information
- Application Number
- CN202421563055.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-03
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-07-03
AI Technical Summary
In the prior art, the divergence angles of the fast axis and the slow axis of the semiconductor laser are different, resulting in insufficient laser energy and too small focus depth, which affects the application effect.
A laser compression system is adopted, including a laser chipset in the sealing cavity, a fast-axis collimator, a reflective element and a slow-axis collimator group outside the sealing cavity. Through the combination of a fast-axis and a slow-axis collimator, the divergence angle of the laser is reduced to achieve efficient laser compression.
It has achieved an increase in laser energy density and an increase in focus depth, and is suitable for laser cutting devices, improving the effect of industrial applications.
Smart Images
Figure CN222691093U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of laser technology, and more specifically, to a laser compression system and a laser cutting device. Background Art
[0002] Semiconductor lasers are widely used in communications, military, laser radar, medical treatment, projection, lighting, processing and other fields due to their advantages such as small size, high efficiency, good reliability and easy modulation. However, since semiconductor lasers have a certain divergence angle and there is a distinction between fast axis and slow axis (in the direction of the slow axis, the divergence performance of the laser is small and the focusing performance of the light beam is good; in the direction of the fast axis, the divergence performance of the laser is large and the focusing performance of the light beam is relatively poor), the application effect of the laser will be affected. Furthermore, in order to increase the laser energy density, the laser beam needs to be further compressed. Therefore, in practical applications, it is basically necessary to collimate and / or focus the light beam of the semiconductor laser. In the prior art, for the collimation of a semiconductor laser group, a collimating lens group is usually used to convert the light emitted from multiple lasers into parallel light or nearly parallel light. However, due to the different divergence angles of the fast axis and slow axis of the laser, in order to achieve the airtight packaging of the laser, the collimating lens is usually installed on the outside of the laser. Therefore, for a semiconductor laser group or a semiconductor laser array, the laser beam after being collimated by the collimating lens is still relatively wide, resulting in insufficient laser energy density and too small a focal depth. Utility Model Content
[0003] The utility model aims to overcome at least one defect of the above-mentioned prior art and provide a laser compression system and a laser cutting device. The laser compression system has a small volume, high laser energy density, and is convenient for industrial production. The laser cutting device has high energy density and a large focal depth.
[0004] The technical solution adopted by the utility model is as follows:
[0005] A laser compression system, comprising:
[0006] A laser chipset, comprising a plurality of light-emitting chips arranged in a linear or array manner, and configured to emit laser light in a first direction;
[0007] A fast axis collimator, arranged on the optical path of the laser, for reducing the divergence angle of the laser in the fast axis direction to achieve fast axis collimation, and the lasers emitted by the multiple light-emitting chips all pass through the fast axis collimator;
[0008] A reflective element, used for guiding the laser light passing through the fast axis collimator to a second direction;
[0009] A slow axis collimating lens group is arranged in the second direction and is used to reduce the divergence angle of the laser in the slow axis direction to achieve slow axis collimation;
[0010] A packaging structure, comprising a housing and a cover plate disposed above the housing and used to seal the housing to form a sealed cavity, wherein the cover plate has a light-transmitting area;
[0011] The laser chip group, the fast axis collimator, and the reflective element are located in the sealed cavity, and the slow axis collimator group is located outside the sealed cavity and directly facing the light-transmitting area.
[0012] Furthermore, the distance between the optical axes of adjacent light-emitting chips in the laser chipset is 1 mm to 1.5 mm.
[0013] Furthermore, the laser chipset includes 3 to 8 light-emitting chips, and the light-emitting chips are arranged linearly.
[0014] Furthermore, the fast axis collimator is a cylindrical mirror, the cylindrical mirror is a plano-convex cylindrical mirror, the surface of the plano-convex cylindrical mirror close to the laser chipset is a plane, and the surface close to the reflective element is a curved surface convex toward the reflective element.
[0015] Furthermore, the back focal length of the fast axis collimator is 60-80 μm, and the numerical aperture of the fast axis collimator is not less than 0.6.
[0016] Furthermore, the reflective element is a reflector, and the distance between the reflector and the laser chipset is less than 1 mm.
[0017] Furthermore, the slow axis collimator lens assembly includes a flat portion and a curved portion located above the flat portion, the flat portion is a light-transmitting rectangular body whose bottom surface is parallel to the plane where the light-emitting chip is located, the curved portion is composed of a number of lens units with curved upper surfaces, and the flat portion and the curved portion are an integrally formed structure.
[0018] Furthermore, the back focal length of the slow axis collimating lens group is 3-10 mm, and the numerical aperture of the slow axis collimating lens group is 0.05-0.25.
[0019] Furthermore, the fast axis divergence angle of the light emitting chip is 40° to 55°, and the slow axis divergence angle of the light emitting chip is 6° to 12°.
[0020] A laser cutting device comprises the laser compression system and a focusing element, wherein the focusing element is used to focus the laser passing through the slow axis collimating lens group to one point.
[0021] Compared with the prior art, the beneficial effects of the present invention are as follows: the laser chipset used in the laser compression system of the present invention is a combination of lasers consisting of multiple light-emitting chips in a sealed cavity, rather than a single chip packaged separately, so the spacing between adjacent light-emitting chips in the laser chipset can be relatively small, and the energy density per unit area of the laser beam initially emitted by the laser chipset is relatively high; multiple light-emitting chips share a fast-axis collimator, which reduces the number of collimators and installation steps in the fast-axis direction, and improves product consistency; the fast-axis collimator is set in the sealed cavity and between the reflective element and the laser chipset, so that the laser emitted by the light-emitting chip can be collimated within a short distance, so that the laser expansion in the fast-axis direction is very small; the slow-axis collimator group is set outside the sealed cavity, which can reduce the volume of the laser compression system, and the installation is more convenient, and is suitable for mass production. The laser compression system has a small volume and high energy density, and can be applied to a laser cutting device, so that the laser cutting device has a high energy density and a large focal depth. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 This is a simplified exploded diagram of the laser compression system structure of Example 1.
[0023] Figure 2 This is a cross-sectional view of the laser compression system structure of Example 1.
[0024] Figure 3 This is a schematic diagram of the optical path in the fast axis direction of Example 1.
[0025] Figure 4 This is a schematic diagram of the light path in the slow axis direction of Example 1.
[0026] Figure 5 This is a schematic diagram of the fast axis collimator structure of Example 1.
[0027] Figure 6 This is a schematic structural diagram of the slow axis collimating lens assembly of Example 1.
[0028] Figure 7 for Figure 6 sectional view of .
[0029] Figure 8 This is a simplified exploded diagram of the structure of a laser assembly that is collimated in one piece with a collimating lens assembly.
[0030] Fig. 9 for Figure 8 Optically simulated beam cross-section of the laser assembly shown.
[0031] Fig.10 This is a cross-sectional diagram of an optically simulated beam of the laser compression system of Example 1.
[0032] Fig.11This is a simplified structural explosion diagram of the laser compression system of Example 2.
[0033] Fig.12 This is a schematic diagram of the optical path in the fast axis direction of Example 2.
[0034] Fig.13 This is a schematic diagram of the light path in the slow axis direction of Example 2.
[0035] Fig.14 This is a schematic diagram of the structure of the slow axis collimating lens assembly of Example 2.
[0036] Fig.15 for Fig.14 sectional view of .
[0037] Fig.16 This is the optical simulation beam cross-section diagram of the laser compression system of Example 2.
[0038] Fig.17 This is a simplified structural diagram of the laser cutting device of Example 3.
[0039] Explanation of the reference numerals: 100, laser compression system; 10, laser chipset; 11, light-emitting chip; 20, fast-axis collimator; 30, reflector; 40, slow-axis collimator group; 41, flat portion; 42, curved portion; 50, packaging structure; 51, shell; 52, cover plate; 60, collimator group; 210, focusing lens; 220, lens sleeve; 300, optical path turning member; 410, first protective glass sheet; 420, second protective glass sheet; 600, lens pressure ring. DETAILED DESCRIPTION
[0040] The drawings of the present invention are only used for illustrative purposes and cannot be construed as limiting the present invention. In order to better illustrate the following embodiments, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.
[0041] Example 1
[0042] like Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, this embodiment discloses a laser compression system 100, comprising:
[0043] The laser chipset 10 includes a plurality of light emitting chips 11 arranged linearly or in an array, and is used to emit laser light in a first direction;
[0044] A fast axis collimator 20 is arranged on the optical path of the laser and is used to reduce the divergence angle of the laser in the fast axis direction to achieve fast axis collimation. The lasers emitted by the multiple light emitting chips 11 all pass through the fast axis collimator 20;
[0045] A reflective element, used to guide the laser light passing through the fast axis collimator 20 to a second direction;
[0046] A slow axis collimating lens group 40 is arranged in the second direction and is used to reduce the divergence angle of the laser in the slow axis direction to achieve slow axis collimation;
[0047] The packaging structure 50 comprises a housing 51 and a cover plate 52 disposed above the housing 51 and used to seal the housing 51 to form a sealed cavity, wherein the cover plate 52 has a light-transmitting area;
[0048] The laser chip set 10 , the fast axis collimator 20 , and the reflective element are located in the sealed cavity, and the slow axis collimator set 40 is located outside the sealed cavity and facing the light-transmitting area.
[0049] In this embodiment, the laser chip group 10 emits a laser with an emission direction in a first direction (the emission direction in this article being the first direction means that the main optical axis direction of the laser is the first direction), and then after the action of the fast axis collimator 20, the divergence angle of the laser in the fast axis direction is reduced to achieve a near collimation effect, that is, the laser chip group 10 is collimated and compressed in the fast axis direction through the action of the fast axis collimator 20; then after the action of the reflective element, the emission direction of the laser is changed, and the laser is emitted in the second direction; the slow axis collimator group 40 then collimates and compresses the laser after the action of the reflective element in the slow axis direction, thereby obtaining a near-collimated laser in the slow axis direction. In this embodiment, the laser chip group 10 is a combination of lasers including multiple light-emitting chips 11 in a sealed cavity, rather than a combination of lasers consisting of a single chip packaged separately, so the spacing between adjacent light-emitting chips 11 in the laser chip group 10 can be relatively small, and the energy density per unit area of the laser beam initially emitted by the laser chip group 11 is relatively high. In this embodiment, multiple light-emitting chips 11 share a fast-axis collimator 20, which reduces the number of collimators in the fast-axis direction and the installation steps, and the consistency of the product can also be improved. Furthermore, the fast-axis collimator 20 is arranged in the sealed cavity and located between the reflective element and the laser chip group 10, so that the laser emitted by the light-emitting chip 11 can be collimated within a short distance, so that the expansion of the laser in the fast-axis direction is very small. The slow-axis collimator group 40 is arranged outside the sealed cavity, which can reduce the volume of the laser compression system 100, and the installation is more convenient, which is suitable for mass production.
[0050] Furthermore, the distance between the optical axes of adjacent light emitting chips 11 in the laser chip group 10 is 1 mm to 1.5 mm. The smaller the distance between adjacent light emitting chips 11, the higher the laser energy density of the laser chip group 10.
[0051] Furthermore, the laser chipset includes 3 to 8 light emitting chips 11, and the light emitting chips 11 are arranged linearly. In this embodiment, the laser chipset 10 includes 4 light emitting chips 11 as an example, and the number of light emitting chips 11 in other implementations may also be other numbers.
[0052] Furthermore, if Figure 5 As shown, the fast axis collimator 20 is a cylindrical mirror, and the cylindrical mirror is a plano-convex cylindrical mirror. The surface of the plano-convex cylindrical mirror close to the laser chipset 10 is a flat surface, and the surface close to the reflective element is a curved surface convex toward the reflective element. Furthermore, the back focal length of the fast axis collimator 20 is 60 to 80 μm, and the numerical aperture of the fast axis collimator 20 is not less than 0.6. Such a design can make the volume of the laser compression system 100 smaller.
[0053] Further, the reflective element is a reflector 30, and the distance between the reflector 30 and the laser chipset 10 is less than 1 mm. The distance between the reflector 30 and the laser chipset 10 described in the present application refers to the minimum distance between the reflector 30 and the laser chipset 10. Specifically, the angle between the reflective surface of the reflector 30 and the first direction is 45°, and the first direction is perpendicular to the second direction.
[0054] Furthermore, the cover plate 52 in this embodiment is a transparent glass plate.
[0055] Furthermore, the slow axis collimator lens assembly 40 includes a flat portion 41 and a curved portion 42 located above the flat portion, wherein the flat portion 41 is a light-transmitting rectangular body whose bottom surface is parallel to the plane where the light-emitting chip 11 is located, and the curved portion 42 is composed of a plurality of lens units whose upper surfaces are curved surfaces, and the flat portion 41 and the curved portion 42 are an integrally formed structure. More specifically, as Figure 6 , Figure 7 As shown, in this embodiment, the lens unit of the slow axis collimator lens group 40 is a cylindrical structure, the top section line of the cross section of the lens unit in the Y-axis direction is a straight line, and the top section line of the cross section in the x-axis direction is a curved surface. More specifically, the back focal length of the slow axis collimator lens group 40 is 3 to 10 mm, and the numerical aperture of the slow axis collimator lens group 40 is 0.05 to 0.25.
[0056] Furthermore, in this embodiment, the fast-axis divergence angle of the light-emitting chip is 40° to 55°, and the slow-axis divergence angle of the light-emitting chip is 6° to 12°.
[0057] More specifically, the present embodiment uses the fast axis divergence angle of the light emitting chip 11 as 48°, the slow axis divergence angle as 8.5°, the back focal length of the fast axis collimator 20 as 70 μm, the numerical aperture of the fast axis collimator 20 as 0.75, the back focal length of the slow axis collimator group 40 as 3 mm, the numerical aperture of the slow axis collimator 40 as 0.25, and the optical axis spacing of the light emitting chip as 1.25 mm as an example to simulate the optical effect. Fig.10 The figure shows the optical simulation beam cross section of the light emitting chip group 10 after being acted upon by the fast axis collimator 20 and the slow axis collimator group 40, that is, the optical simulation beam cross section of the laser compression system 100 described in the first embodiment. Figure 8 The structure of the laser assembly that is integrally collimated by the collimating lens assembly 60 is shown as an exploded schematic diagram. Fig. 9 Shown is Figure 8 Optical simulation beam cross-section diagram of the structure shown. Fig. 9 The left figure in FIG. 1 is a cross-sectional view of the beam near the collimator lens assembly 60 (about 3.5 mm away from the collimator lens assembly 60). Fig. 9 The right figure in FIG. 1 is a cross-sectional view of the light beam at a distance from the collimator lens assembly 60 (about 250 mm from the collimator lens assembly 60). Fig.10 The left figure in FIG. 1 is a cross-sectional view of the beam near the slow axis collimator lens group 40 (about 3.5 mm away from the slow axis collimator lens group 40). Fig.10 The right figure in FIG. 4 is a cross-sectional view of the beam at a distance from the slow axis collimator lens group 40 (about 250 mm from it). Fig. 9 and Fig.10 It can be seen that, compared with the integrated collimated laser assembly, the laser compression system 100 described in this embodiment can significantly compress the laser light and improve the laser energy density.
[0058] Example 2
[0059] like Fig.11 , Fig.12 , Fig.13 , Fig.14 As shown, this embodiment discloses a laser compression system, including:
[0060] The laser chipset 10 includes a plurality of light emitting chips 11 arranged linearly or in an array, and is used to emit laser light in a first direction;
[0061] A fast axis collimator 20 is arranged on the optical path of the laser and is used to reduce the divergence angle of the laser in the fast axis direction to achieve fast axis collimation. The lasers emitted by the multiple light emitting chips 11 all pass through the fast axis collimator 20;
[0062] A reflective element, used to guide the laser light passing through the fast axis collimator 20 to a second direction;
[0063] A slow axis collimating lens group 40 is arranged in the second direction and is used to reduce the divergence angle of the laser in the slow axis direction to achieve slow axis collimation;
[0064] The packaging structure comprises a housing 51 and a cover plate 52 disposed above the housing 51 and used to seal the housing 51 to form a sealed cavity, wherein the cover plate 52 has a light-transmitting area;
[0065] The laser chip set 10 , the fast axis collimator 20 , and the reflective element are located in the sealed cavity, and the slow axis collimator set 40 is located outside the sealed cavity and facing the light-transmitting area.
[0066] like Fig.14 , Fig.15 As shown, the slow-axis collimating lens 40 of the present embodiment 2 also includes a flat portion 41 and a curved portion 42 located above the flat portion, the flat portion 41 is a light-transmitting rectangular body whose bottom surface is parallel to the plane where the light-emitting chip 11 is located, and the curved portion 42 is composed of a number of lens units whose upper surfaces are curved surfaces. The difference between the present embodiment 2 and the embodiment 1 is that the curved portion 42 of the lens unit of the present embodiment 2 is a spherical structure, and its cross-sections in the x-axis direction and the y-axis direction are both curved surfaces.
[0067] The other structures and functions of the second embodiment are the same as those of the first embodiment and will not be described again.
[0068] like Fig.16 The figure shows the optical simulation beam cross-section of the laser compression system of the second embodiment, wherein Fig.16 The left figure in FIG. 1 is a cross-sectional view of the beam near the slow axis collimator lens group 40 (about 3.5 mm away from the slow axis collimator lens group 40). Fig.16 The right picture is a comparison of the beam cross-section at a distance of 40 from the slow axis collimator group (about 250mm from it). Fig.16 and Fig. 9 It can be seen that the laser compression system described in this embodiment 2 can also significantly compress the laser, and the laser energy density is improved.
[0069] Example 3
[0070] like Fig.17 As shown, this embodiment discloses a laser cutting device, comprising the laser compression system 100 described in Example 1 and a focusing element, wherein the focusing element is used to focus the laser passing through the slow axis collimating lens group at one point. Specifically, the focusing element is a focusing lens 210. Since the laser energy density of the laser compression system is high, the laser energy is highly concentrated at one point after the focusing lens 210 acts, and the energy density is high, which can be used to achieve laser cutting.
[0071] More specifically, the laser cutting device further comprises a protective housing 500, an optical path turning element 300 arranged on the optical path of the laser compression system 100, a first protective glass sheet 410 and a second protective glass sheet 420 for airtight packaging, a lens sleeve 220 for mounting the focusing lens 210, and a lens pressing ring 600 for pressing the focusing lens 210. The laser compression system 100 and the optical path turning element 300 are arranged in the protective housing 500, a light-through hole is arranged on the side wall of the protective housing 500, the first protective glass sheet 410 is arranged in the light-through hole, the focusing lens 210 is arranged in the lens sleeve 220, and the second protective glass sheet 420 is arranged in the lens pressing ring 600. The optical path turning element 300 is used to change the direction of the laser of the laser compression system 100. In other embodiments, the optical path turning element 300 can also be specially designed to further compress the laser.
[0072] Obviously, the above embodiments of the utility model are only examples for clearly explaining the technical solution of the utility model, and are not intended to limit the specific implementation methods of the utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the claims of the utility model shall be included in the protection scope of the claims of the utility model.
Claims
1. A laser compression system, characterized in that: include: A laser chipset, comprising a plurality of light-emitting chips arranged in a linear or array manner, and configured to emit laser light in a first direction; A fast axis collimator, arranged on the optical path of the laser, for reducing the divergence angle of the laser in the fast axis direction to achieve fast axis collimation, and the lasers emitted by the multiple light-emitting chips all pass through the fast axis collimator; A reflective element, used for guiding the laser light passing through the fast axis collimator to a second direction; A slow axis collimating lens group is arranged in the second direction and is used to reduce the divergence angle of the laser in the slow axis direction to achieve slow axis collimation; a packaging structure comprises a housing and a cover plate arranged above the housing and used to seal the housing to form a sealed cavity, wherein the cover plate has a light-transmitting area; The laser chip group, the fast axis collimator, and the reflective element are located in the sealed cavity, and the slow axis collimator group is located outside the sealed cavity and directly facing the light-transmitting area.
2. The laser compression system according to claim 1, characterized in that: The distance between the optical axes of adjacent light-emitting chips in the laser chip group is 1 mm to 1.5 mm.
3. The laser compression system according to claim 2, characterized in that: The laser chip group includes 3 to 8 light-emitting chips, and the light-emitting chips are arranged linearly.
4. The laser compression system according to claim 3, characterized in that: The fast axis collimator is a cylindrical mirror, which is a plano-convex cylindrical mirror. The surface of the plano-convex cylindrical mirror close to the laser chipset is a plane, and the surface close to the reflective element is a curved surface convex toward the reflective element.
5. The laser compression system according to claim 1, characterized in that: The back focal length of the fast axis collimator is 60-80 μm, and the numerical aperture of the fast axis collimator is not less than 0.
6.
6. The laser compression system according to claim 1, characterized in that: The reflective element is a reflector, and the distance between the reflector and the laser chipset is less than 1 mm.
7. The laser compression system according to claim 1, characterized in that: The slow axis collimator lens assembly includes a flat portion and a curved portion located above the flat portion. The flat portion is a light-transmitting rectangular body whose bottom surface is parallel to the plane where the light-emitting chip is located. The curved portion is composed of a number of lens units with curved upper surfaces. The flat portion and the curved portion are an integrally formed structure.
8. The laser compression system according to claim 1, characterized in that: The back focal length of the slow axis collimating lens group is 3-10 mm, and the numerical aperture of the slow axis collimating lens group is 0.05-0.
25.
9. The laser compression system according to any one of claims 1 to 8, characterized in that: The fast axis divergence angle of the light emitting chip is 40° to 55°, and the slow axis divergence angle of the light emitting chip is 6° to 12°.
10. A laser cutting device, characterized in that: The invention comprises the laser compression system according to any one of claims 1 to 9 and a focusing element, wherein the focusing element is used to focus the laser light passing through the slow axis collimating lens group to one point.