Power conversion module capable of being dynamically configured

Abstract

The utility model discloses a dynamically configurable power supply conversion module, which comprises a current monitoring circuit, a DC / DC power supply conversion circuit and an MCU processor, the MCU processor is provided with a plurality of analog / digital conversion interfaces, the input end of the current monitoring circuit is connected with an external power supply, the output end of the current monitoring circuit is connected with the DC / DC power supply conversion circuit and is connected with one analog / digital conversion interface, and the output end of the current monitoring circuit is connected with the DC / DC power supply conversion circuit. The DC / DC conversion circuit is connected with a general purpose input / output (GPIO) port and a serial peripheral interface (SPI) bus interface of the MCU processor, and the MCU processor is connected with an external controller through an inter-integrated circuit (I2C) bus and is respectively connected with a plurality of output ends of the DC / DC conversion circuit through a plurality of other analog / digital conversion interfaces. The power conversion module is convenient to integrate, can be directly connected with an external controller or receive configuration data input by an external user, realizes dynamic configuration of a power supply, and reports the working state monitoring of the power conversion module at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of power supply control circuits, and in particular to a dynamically configurable power supply conversion module. Background Art

[0002] With the development of embedded systems, various programmable devices such as ARM, DSP, FPGA, etc. have been widely used. In order to ensure the normal operation of these devices, multiple different working power supplies need to be provided, the common ones are 3.3V, 1.8V, 1.0V, etc. In traditional circuit design, different power conversion circuits need to be built to adapt to different devices, and this type of circuit has a fixed output voltage, a low degree of modularity, and no monitoring function, so it needs to be improved. Utility Model Content

[0003] The purpose of the utility model is to propose a dynamically configurable power conversion module to address the deficiencies of the prior art. The module is easy to integrate and can be directly connected to an external controller or accept configuration data input by an external user to achieve dynamic power configuration and report the working status of the power conversion module for monitoring.

[0004] The technical solution to achieve the purpose of this utility model is:

[0005] A dynamically configurable power conversion module comprises a current monitoring circuit, a DC / DC power conversion circuit and an MCU processor, wherein the MCU processor is provided with a plurality of analog / digital conversion interfaces, the current monitoring circuit converts current into a voltage value output, the input end is connected to an external power supply, the output end is connected to the DC / DC power conversion circuit and is connected to one of the analog / digital conversion interfaces of the MCU processor, the DC / DC conversion circuit converts a DC power input into a plurality of DC power outputs and is connected to a general GPIO port and an SPI bus interface of the MCU processor, the MCU processor is connected to an external controller via an I2C bus for receiving data and reporting status, and is respectively connected to a plurality of output ends of the DC / DC conversion circuit via a plurality of other analog / digital conversion interfaces.

[0006] Furthermore, it also includes a temperature monitoring circuit, which is connected to the MCU processor via an I2C bus.

[0007] Furthermore, the temperature monitoring circuit adopts a temperature sensor of model SD5070.

[0008] Furthermore, the current monitoring circuit includes a current sensing amplifier chip and a current sampling resistor R1, the current sampling resistor R1 is connected in series between an external power supply and a power input terminal of a DC / DC conversion circuit, and the input terminal IN+ and the input terminal IN- of the current sensing amplifier chip are respectively connected to the two ends of the current sampling resistor R1.

[0009] Furthermore, the model of the current sensing amplifier chip is WS74199B.

[0010] Furthermore, the DC / DC power conversion circuit includes a DC / DC converter chip, a voltage-dividing resistor R2 and a plurality of digital potentiometers. The DC / DC converter chip is provided with a plurality of independent and corresponding feedback voltage terminals and output control terminals, wherein one feedback voltage terminal is connected to the voltage-dividing resistor R2 and is configured as a fixed voltage output, and the output control terminal corresponding thereto is connected to an external power input terminal, and the other feedback voltage terminals are respectively connected to the W terminals of the plurality of digital potentiometers, and a plurality of variable voltage value outputs are formed by configuring the resistance values ​​of the W and L terminals of the digital potentiometers, and the corresponding plurality of output control terminals are respectively connected to the MCU processor, and the control terminal of the digital potentiometer is connected to the MCU processor via an SPI bus.

[0011] Furthermore, the model of the DC / DC converter chip is HCE4644MB, and the model of the digital potentiometer is TPL0501.

[0012] Furthermore, the MCU processor adopts an ARM processor chip with model number GD32F103.

[0013] By adopting the above technical solution, the utility model has the following beneficial effects:

[0014] (1) The utility model adopts an MCU processor as the control core to control the output of the DC / DC power conversion circuit. It can convert the input power into multiple DC power supplies and realize dynamic configuration and monitoring through the current monitoring circuit. It has the characteristics of modularization and easy integration. The module can be directly connected to an external controller or accept configuration data input by an external user. The user can configure it to different outputs according to needs to realize dynamic configuration of the power supply. At the same time, it reports the working status monitoring of the power conversion module, so it can be applied to various embedded systems.

[0015] (2) The utility model is additionally provided with a temperature monitoring circuit, which can monitor the operating temperature of the power conversion module in real time and output a protection signal in time when an abnormal situation occurs, thereby improving the safety of circuit use.

[0016] (3) The utility model uses a specific type of chip to form an integrated circuit, which has a simple structure, high circuit operation efficiency, and excellent cost performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to make the content of the utility model easier to understand, the utility model is further described in detail below according to specific embodiments and in conjunction with the accompanying drawings, wherein:

[0018] Figure 1 This is a principle block diagram of the utility model.

[0019] Figure 2 This is a circuit diagram of the utility model.

[0020] The reference numerals in the accompanying drawings are:

[0021] Current monitoring circuit 1, DC / DC power conversion circuit 2, MCU processor 3, temperature monitoring circuit 4. DETAILED DESCRIPTION

[0022] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0023] (Example 1)

[0024] like Figure 1 to Figure 2 The dynamically configurable power conversion module shown includes a current monitoring circuit 1, a DC / DC power conversion circuit 2 and an MCU processor 3, wherein the MCU processor 3 is provided with four analog / digital conversion interfaces, the current monitoring circuit 1 converts the current into a voltage value output, the input end is connected to an external power supply, the output end is connected to the DC / DC power conversion circuit 2 and is connected to one of the analog / digital conversion interfaces of the MCU processor 3, the DC / DC conversion circuit 2 converts the DC power input into multiple DC power outputs and is connected to the general GPIO port and SPI bus interface of the MCU processor 3, the MCU processor 3 is connected to an external controller via an I2C bus for receiving data and reporting status, and is respectively connected to multiple output ends of the DC / DC conversion circuit 2 via multiple other analog / digital conversion interfaces. The MCU processor 3 is used as the control core to control the output of the DC / DC power conversion circuit 2. The input power can be converted into multiple DC power supplies, and dynamic configuration and monitoring can be achieved through the current monitoring circuit 1. It has the characteristics of modularization and easy integration. The module can be directly connected to an external controller or accept configuration data input by an external user. The user can configure it to different outputs according to needs to achieve dynamic configurability of the power supply. At the same time, the working status of the power conversion module can be reported for monitoring, so it can be applied to various embedded systems.

[0025] In order to improve the safety of circuit use, this embodiment is further provided with a temperature monitoring circuit 4, and the temperature monitoring circuit 4 is connected to the MCU processor 3 via an I2C bus.

[0026] Specifically, the current monitoring circuit 1 includes a current sensing amplifier chip of model WS74199B and a current sampling resistor R1, wherein R1 is a low-resistance high-power resistor (0.1Ω / 10W). The DC / DC power conversion circuit 2 includes a DC / DC converter chip of model HCE4644MB, a voltage divider resistor R2 and three digital potentiometers of model TPL0501, the MCU processor 3 uses an ARM processor chip of model GD32F103, and the temperature monitoring circuit 4 uses a temperature sensor of model SD5070.

[0027] Among them, the current sampling resistor R1 is connected in series between the external power supply and the power input terminal of the DC / DC conversion circuit 2, the input terminal IN+ and the input terminal IN- of the current sensing amplifier chip are respectively connected to the two ends of the current sampling resistor R1, and the output terminal OUT is connected to the ADC1 of the MCU processor 3.

[0028] The DC / DC converter chip is provided with a plurality of independent and corresponding feedback voltage terminals FB1, FB2, FB3, FB4 and output control terminals RUN1, RUN2, RUN13, RUN4, wherein the feedback voltage terminal FB1 is connected to the voltage divider resistor R2, the other end of which is grounded, and is configured as a 3.3V fixed voltage output, and the corresponding output control terminal RUN1 is connected to the external power input terminal. The other feedback voltage terminals FB2, FB3, FB4 are respectively connected to the W end of the three digital potentiometers, and a plurality of variable voltage value outputs are formed by configuring the resistance values ​​of the W and L ends of the digital potentiometers, and the corresponding plurality of output control terminals RUN2, RUN13, RUN4 are respectively connected to the GP2, GP1 and GP0 ports of the MCU processor 3, and the control ends of the three digital potentiometers are respectively connected to the MCU processor 3 via the SPI bus. The analog / digital conversion interfaces ADC2, ADC3 and ADC4 of the MCU processor 3 are respectively connected to the voltage output terminals VOTT4, VOUT3 and VOUT2 of the DC / DC converter chip.

[0029] The working principle of this embodiment is as follows: the MCU processor 3 receives the configuration data input by the user or other controller through the I2C-0 interface, and then configures the output resistance of the digital potentiometer through the SPI bus interface, thereby controlling the output size of the DC / DC converter chip, as shown in formula (1), and controls the output and shutdown of the DC / DC converter chip through the I / O port:

[0030]

[0031] Where Vo is the output of the DC / DC converter chip, R FB is the resistance value connected to the FB feedback voltage terminal of the DC / DC converter chip.

[0032] The first output of the DC / DC converter chip is configured as a fixed DC 3.3V output, which is used to power other circuits of the module.

[0033] The analog / digital conversion interface ADC1 is connected to the output OUT of the current monitoring circuit 1, and the input current is calculated by sampling the voltage of OUT, as shown in formula (2):

[0034]

[0035] Where Ic is the operating current, Vout is the output of the current sensing amplifier, G is the fixed gain of the current sensing amplifier, and R1 is the resistance of the current sampling resistor;

[0036] The MCU processor 3 samples the second, third and fourth outputs of the DC / DC converter through the analog / digital conversion interfaces ADC4, ADC3 and ADC2 to monitor the output voltage value of the DC / DC converter chip. The MCU processor 3 queries the value of the temperature sensor through the I2C_1 interface to monitor the operating temperature of the module. The user or external processor can query the current working status of the module such as working current, working temperature and output voltage through the I2C bus. This embodiment uses the MCU processor 3 as the control core to control the output of the DC / DC conversion circuit 2, which can convert the input power supply into 3-way DC power supply, and can realize dynamic configuration and monitoring. It has the characteristics of modularization and easy integration, and can be configured as different outputs according to user needs, so as to be applied in various embedded systems.

[0037] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A dynamically configurable power conversion module, characterized in that: The invention comprises a current monitoring circuit, a DC / DC power conversion circuit and an MCU processor. The MCU processor is provided with a plurality of analog / digital conversion interfaces. The current monitoring circuit converts the current into a voltage value for output, the input end is connected to an external power supply, the output end is connected to the DC / DC power conversion circuit and is connected to one of the analog / digital conversion interfaces of the MCU processor. The DC / DC conversion circuit converts the DC power input into multiple DC power outputs and is connected to the general GPIO port and SPI bus interface of the MCU processor. The MCU processor is connected to an external controller via an I2C bus for receiving data and reporting status, and is respectively connected to a plurality of output ends of the DC / DC conversion circuit via a plurality of other analog / digital conversion interfaces.

2. The dynamically configurable power conversion module according to claim 1, characterized in that: It also includes a temperature monitoring circuit, which is connected to the MCU processor via an I2C bus.

3. The dynamically configurable power conversion module according to claim 2, characterized in that: The temperature monitoring circuit adopts a temperature sensor of model SD5070.

4. The dynamically configurable power conversion module according to claim 1, characterized in that: The current monitoring circuit includes a current sensing amplifier chip and a current sampling resistor R1. The current sampling resistor R1 is connected in series between an external power supply and a power input terminal of a DC / DC conversion circuit. The input terminal IN+ and the input terminal IN- of the current sensing amplifier chip are respectively connected to the two ends of the current sampling resistor R1.

5. The dynamically configurable power conversion module according to claim 4, characterized in that: The model of the current sensing amplifier chip is WS74199B.

6. The dynamically configurable power conversion module according to claim 1, characterized in that: The DC / DC power conversion circuit includes a DC / DC converter chip, a voltage-dividing resistor R2 and multiple digital potentiometers. The DC / DC converter chip is provided with multiple independent and corresponding feedback voltage terminals and output control terminals, wherein one feedback voltage terminal is connected to the voltage-dividing resistor R2 and configured as a fixed voltage output, and the corresponding output control terminal is connected to the external power input terminal, and the other feedback voltage terminals are respectively connected to the W terminals of the multiple digital potentiometers, and multiple variable voltage value outputs are formed by configuring the resistance values ​​of the W and L terminals of the digital potentiometers, and the corresponding multiple output control terminals are respectively connected to the MCU processor, and the control terminal of the digital potentiometer is connected to the MCU processor via the SPI bus.

7. The dynamically configurable power conversion module according to claim 6, characterized in that: The model of the DC / DC converter chip is HCE4644MB, and the model of the digital potentiometer is TPL0501.

8. The dynamically configurable power conversion module according to claim 1, characterized in that: The MCU processor adopts an ARM processor chip with model number GD32F103.

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