Coil power panel capable of conducting large current

Abstract

The utility model discloses a coil power panel capable of conducting heavy current, which relates to the technical field of power panel design and processing, and comprises a current transmission layer and a heat dissipation layer, the current transmission layer is fixedly connected with the heat dissipation layer, the current transmission layer comprises a circuit device, and the circuit device comprises a current resistor, a coil, a lead, heat dissipation holes and a substrate; the current resistors are fixedly installed at the four corners of the substrate, a coil is fixedly installed on the substrate, the current resistors are electrically connected with the coil through the wires, a plurality of heat dissipation holes are formed in the substrate, the heat dissipation layer is made of an aluminum alloy material, heat dissipation fins are arranged on the heat dissipation layer, and the heat dissipation layer is made of an aluminum alloy material. The heat dissipation area and effect of the device can be increased, and the problem that in the prior art, when large current passes through, a large amount of heat is generated, so that resistance of a resistor and a capacitor used for decomposition is easily reduced, other components are damaged, and some application requirements needing high current output cannot be met is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of design and processing of power supply boards, in particular to a coil power supply board capable of passing large currents. Background Art

[0002] A power strip is an electronic device that converts the mains voltage into a current and voltage suitable for use by a specific device or system. It is usually used to provide the required power supply for electronic devices such as computers, mobile phones, household appliances, etc.

[0003] Traditional coil power boards can often only pass small currents. When passing large currents, a large amount of heat will be generated, which can easily reduce the resistance of the resistors and capacitors used for decomposition and damage other components, thereby affecting the normal operation of the power board and failing to meet the needs of some applications that require high current output. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a coil power board capable of passing large currents, which solves the problem that when passing large currents in the prior art, a large amount of heat is generated, which easily makes the resistance of the resistors and capacitors used for decomposition smaller and damages other components, and cannot meet the application requirements that require high current output.

[0005] To achieve the above-mentioned purpose, the utility model proposes a coil power board capable of passing large current, comprising a current transmission layer and a heat dissipation layer, wherein the current transmission layer is fixedly connected to the heat dissipation layer, the current transmission layer comprises a circuit device, and the circuit device comprises a current resistor, a coil, a wire, a heat dissipation hole, and a substrate; the current resistor is fixedly installed at the four corners of the substrate, a coil is fixedly installed on the substrate, the current resistor is electrically connected to the coil through the wire, a plurality of heat dissipation holes are opened on the substrate, the heat dissipation layer is made of aluminum alloy material, and heat dissipation fins are arranged on the heat dissipation layer.

[0006] As a further solution of the utility model: the wire is made of thick copper foil.

[0007] As a further solution of the utility model: a controller is embedded and installed on the circuit device, and a capacitor, a diode, an interface pin, an LED lamp, an electrolytic capacitor and an interface are welded on the circuit device.

[0008] As a further solution of the utility model: the capacitor is arranged on the right side of the controller, the diode is arranged below the capacitor, the LED lamp is arranged below the diode, the electrolytic capacitor is arranged on the right side of the capacitor, and the interface is arranged on the right side of the electrolytic capacitor and close to the side of the circuit device.

[0009] As a further solution of the utility model: a heat sink and a temperature sensor are fixedly mounted on the circuit device, the heat sink is arranged above the electrolytic capacitor, and the temperature sensor is arranged on the right side of the LED lamp and is electrically connected to the LED lamp.

[0010] As a further solution of the utility model: the heat dissipation fins are in a curved shape.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. By setting an electrolytic capacitor on the power board and setting a radiator near the electrolytic capacitor, the electrolytic capacitor is also used to store charge. Compared with the capacitor, the electrolytic capacitor has a higher capacitance value and a lower ESR (equivalent series resistance). At the same time, it can help smooth the pulsation of large current and provide a stable power supply voltage; the radiator can dissipate heat for the electrolytic capacitor and other devices, thereby increasing the stability and heat resistance of the power board.

[0013] 2. By adopting a double-layer structure design, including a current transmission layer and a heat dissipation layer, the heat dissipation layer is made of aluminum alloy material to improve the heat dissipation effect. The heat dissipation layer is provided with heat dissipation fins, and the heat dissipation fins are curved in shape to increase the heat dissipation area, which is more conducive to the heat dissipation of the power board.

[0014] 3. By fixing a temperature sensor on the circuit device, the temperature sensor is set on the right side of the LED lamp and electrically connected to the LED lamp. The temperature sensor is used to monitor the temperature of the power board. When the temperature exceeds the set value, the circuit connected to the LED lamp is turned on, and the LED lamp lights up, which can remind the user that the temperature is too high, thereby increasing the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a three-dimensional structural diagram of a coil power supply board capable of passing large currents according to the utility model;

[0016] Figure 2 This is a cross-sectional view of a current transmission layer of a coil power board capable of passing large currents according to the utility model;

[0017] Figure 3 The utility model is an exploded schematic diagram of a coil power supply board capable of passing large current.

[0018] In the figure: 1. controller; 2. capacitor; 3. electrolytic capacitor; 4. radiator; 5. interface pins; 6. diode; 7. current transmission layer; 8. interface; 9. temperature sensor; 10. LED lamp; 11. heat dissipation layer; 12. heat dissipation fins; 13. current resistor; 14. coil; 15. wire; 16. heat dissipation hole; 17. circuit device; 18. substrate. DETAILED DESCRIPTION

[0019] The technical solution of the utility model will be described clearly and completely in conjunction with the embodiments below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] like Figure 1-3 As shown, a coil power board capable of passing large current adopts a double-layer structure design, including a current transmission layer 7 and a heat dissipation layer 11, the current transmission layer 7 is fixedly connected to the heat dissipation layer 11, the current transmission layer 7 includes a circuit device 17, the circuit device 17 includes a current resistor 13, a coil 14, a wire 15, a heat dissipation hole 16, and a substrate 18; the current resistor 13 is fixedly installed at the four corners of the substrate 18, the coil 14 is fixedly installed on the substrate 18, the current resistor 13 and the coil 14 are electrically connected through the wire 15, a plurality of heat dissipation holes 16 are opened on the substrate 18 to increase the heat dissipation of the current transmission layer 7, and the wire 15 is made of thick copper foil to reduce resistance and voltage;

[0021] As an implementation method in this embodiment, a controller 1 is embedded and installed on the circuit device 17, and the controller 1 is used to monitor the working status of the device. A capacitor 2, an interface pin 5, an LED lamp 10, a diode 6, an electrolytic capacitor 3 and an interface 8 are welded on the circuit device 17. The capacitor 2 is arranged on the right side of the controller 1, the diode 6 is arranged below the capacitor 2, the LED lamp 10 is arranged below the diode 6, the electrolytic capacitor 3 is arranged on the right side of the capacitor 2, and the interface 8 is arranged on the right side of the electrolytic capacitor 3 and close to the side of the circuit device 17. The interface 8 is used as a connection point between the power board and an external device or circuit to provide power and data transmission. The capacitor 2 is used to store charge and can also smooth power fluctuations and reduce power noise by absorbing and releasing electrical energy. The electrolytic capacitor 3 is also used to store charge. Compared with the capacitor 2, the electrolytic capacitor 3 has a higher capacitance value and a lower ESR (equivalent series resistance), which is used to help smooth the pulsation of large currents and provide a stable power supply voltage. The interface pin 5 is used to connect the power board and other devices or circuits to transmit power signals and data;

[0022] As an implementation method in this embodiment, a heat sink 4 and a temperature sensor 9 are fixedly installed on the circuit device 17. The heat sink 4 is arranged above the electrolytic capacitor 3. The temperature sensor 9 is arranged on the right side of the LED lamp 10 and is electrically connected to the LED lamp 10. The temperature sensor 9 is used to monitor the temperature of the power board. When the temperature exceeds the set value, the circuit connected to the LED lamp 10 is turned on, and the LED lamp 10 lights up to remind the user that the temperature is too high.

[0023] As an implementation method in this embodiment, the heat dissipation layer 11 is made of aluminum alloy material to improve the heat dissipation effect. The heat dissipation layer 11 is provided with heat dissipation fins 12, and the heat dissipation fins 12 are curved to increase the heat dissipation area.

[0024] Working principle:

[0025] When in use, the current controlled by the circuit is received through the current resistor 13. When the current is too large and the circuit temperature rises, part of the heat is dissipated through the radiator 4. At the same time, a heat dissipation hole 16 is opened under the current transmission layer 7, and heat dissipation fins 12 are arranged on the heat dissipation layer 11 to increase the heat dissipation area, thereby improving the heat dissipation effect. When the temperature exceeds the set value, the circuit connecting the temperature sensor 9 and the LED lamp 10 is turned on, and the LED lamp 10 lights up to remind the user that the temperature is too high.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A coil power board capable of passing large current, characterized in that: The invention comprises a current transmission layer (7) and a heat dissipation layer (11), wherein the current transmission layer (7) is fixedly connected to the heat dissipation layer (11), the current transmission layer (7) comprises a circuit device (17), and the circuit device (17) comprises a current resistor (13), a coil (14), a wire (15), a heat dissipation hole (16), and a substrate (18); the current resistor (13) is fixedly mounted on the four corners of the substrate (18), the coil (14) is fixedly mounted on the substrate (18), the current resistor (13) and the coil (14) are electrically connected via the wire (15), a plurality of heat dissipation holes (16) are provided on the substrate (18), the heat dissipation layer (11) is made of an aluminum alloy material, and heat dissipation fins (12) are provided on the heat dissipation layer (11).

2. A coil power board capable of passing large current according to claim 1, characterized in that: The conductor (15) is made of thick copper foil.

3. A coil power board capable of passing large current according to claim 1, characterized in that: A controller (1) is embedded and installed on the circuit device (17), and a capacitor (2), a diode (6), an interface pin (5), an LED lamp (10), an electrolytic capacitor (3) and an interface (8) are welded on the circuit device (17).

4. A coil power board capable of passing large current according to claim 3, characterized in that: The capacitor (2) is arranged on the right side of the controller (1), the diode (6) is arranged below the capacitor (2), the LED lamp (10) is arranged below the diode (6), the electrolytic capacitor (3) is arranged on the right side of the capacitor (2), and the interface (8) is arranged on the right side of the electrolytic capacitor (3) and close to the side of the circuit device (17).

5. A coil power board capable of passing large current according to claim 3, characterized in that: A heat sink (4) and a temperature sensor (9) are fixedly mounted on the circuit device (17); the heat sink (4) is arranged above the electrolytic capacitor (3); and the temperature sensor (9) is arranged on the right side of the LED lamp (10) and is electrically connected to the LED lamp (10).

6. A coil power board capable of passing large current according to claim 1, characterized in that: The heat dissipation fins (12) are in a curved shape.

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