Adjustable heat dissipation structure for internal circuit board of electronic product

Abstract

The utility model belongs to the field of heat dissipation structures, particularly relates to an adjustable heat dissipation structure for an internal circuit board of an electronic product, and provides the following scheme aiming at the problems that the fixing effect on the circuit board is not good enough and the heat dissipation structure is inconvenient to adjust in the prior art: the adjustable heat dissipation structure comprises a base, and the top of the base is provided with a heat dissipation plate; the heat dissipation plate is used for placing a circuit board, a plurality of through ventilation holes are formed in the top of the heat dissipation plate, and two fans are fixedly mounted at the bottom of the heat dissipation plate; according to the heat dissipation structure, the circuit board can be conveniently clamped and fixed, the operation is simple, the fixing effect is good, it can be guaranteed that the circuit board is not prone to displacement in the using process, the height of the circuit board can be adjusted through the heat dissipation structure, and the heat dissipation structure is convenient to use. The installation requirement of the circuit board can be conveniently met, meanwhile, the heat dissipation effect can be best, adjustment operation is easy, and a user can use the circuit board conveniently.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation structures, in particular to an adjustable heat dissipation structure of a circuit board inside an electronic product. Background Art

[0002] The emergence of circuit boards has miniaturized and intuitive circuits, and plays an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. At the same time, circuit boards generate a lot of heat when working, which needs to be dissipated through heat dissipation structures.

[0003] The heat dissipation device is a heat dissipation device, a heat dissipation device being used to dissipate heat, and a heat dissipation device being used to dissipate heat. The heat dissipation device is a heat dissipation device, and a heat dissipation device being used to dissipate heat.

[0004] However, the above patent still has the following problems when used:

[0005] In the above patent, the fixing effect of the circuit board is not good enough, and the circuit board is prone to displacement during use, which may cause damage to the circuit. At the same time, the device in the above patent is not convenient enough when adjusting the height of the heat dissipation structure, and the operation is not convenient enough.

[0006] In view of the above problems, the present utility model document proposes an adjustable heat dissipation structure for a circuit board inside an electronic product. Utility Model Content

[0007] The utility model provides an adjustable heat dissipation structure for a circuit board inside an electronic product, which solves the shortcomings of the prior art that the fixing effect on the circuit board is not good enough and the heat dissipation structure is inconvenient to adjust.

[0008] The utility model provides the following technical solutions:

[0009] An adjustable heat dissipation structure of a circuit board inside an electronic product, comprising:

[0010] A base, wherein a heat sink is arranged on the top of the base, the heat sink is used to place the circuit board, a plurality of through ventilation holes are opened on the top of the heat sink, and two fans are fixedly installed on the bottom of the heat sink;

[0011] A fixing component, wherein the fixing component is used to fix the circuit board;

[0012] Two sets of lifting components are located between the base and the heat sink, and are used to adjust the height of the heat sink.

[0013] In a possible design, the fixing assembly includes two clamping plates slidably connected to the top of the heat sink, a guide rod is fixedly installed on one side of the heat sink, and a first bidirectional threaded screw is rotatably connected to the other side of the heat sink, the heat sink slides through the two clamping plates, the first bidirectional threaded screw is threadedly connected to the two clamping plates, and the two clamping plates are respectively located on two opposite threads of the first bidirectional threaded screw.

[0014] In a possible design, the lifting assembly includes a plurality of first slide grooves opened on the top of the base, the top of the base is slidably connected with a first sliding bracket and a second sliding bracket through corresponding first slide grooves, the first sliding bracket and the second sliding bracket are rotatably connected with a first support rod and a second support rod inside, the centers of the first support rod and the second support rod are rotatably connected through a rotating shaft, the other end of the first support rod is rotatably connected with a third sliding bracket, the other end of the second support rod is rotatably connected with a fourth sliding bracket, and a plurality of second slide grooves are opened at the bottom of the heat dissipation plate, and the third sliding bracket and the fourth sliding bracket are both slidably connected with the corresponding second slide grooves.

[0015] In a possible design, the same first connecting plate is fixedly connected between the two first sliding brackets, the same second connecting plate is fixedly connected between the two second sliding brackets, the first connecting plate and the second connecting plate are threadedly connected to the same second bidirectional threaded screw, the first connecting plate and the second connecting plate are respectively located on two opposite threads of the second bidirectional threaded screw, and the second bidirectional threaded screw is rotatably connected to the base through a fixed bracket.

[0016] In a possible design, two fixing blocks are fixedly mounted on both sides of the base, and fixing screws are threaded through the tops of the fixing blocks.

[0017] In a possible design, a fixing slot is provided on one side of the two clamping plates that are close to each other.

[0018] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit the present invention.

[0019] In the utility model, the heat dissipation structure can conveniently clamp and fix the circuit board, is easy to operate, has a good fixing effect, can ensure that the circuit board is not easily displaced during use, and can ensure the safety of the electronic product circuit. When in use, the user can fix the structure in the electronic product box body through the fixing screws, and then the user can place the circuit board to be installed on the heat dissipation plate, and then the user can rotate the first bidirectional threaded screw to make the two clamping plates approach each other, and make the two sides of the circuit board clamped in the fixing slot, so as to fix the circuit board;

[0020] In the utility model, the heat dissipation structure can adjust the height of the circuit board, which can conveniently meet the installation requirements of the circuit board and also achieve the best heat dissipation effect. The adjustment operation is simple and convenient for users to use. According to the installation requirements of the circuit board, the user can rotate the second bidirectional threaded screw, and the first connecting plate and the second connecting plate will be close to or away from each other. The heat dissipation plate can be raised or lowered by rotating between the first support rod and the second support rod. The operation is simple and can meet the installation requirements of the circuit board and also facilitate the best heat dissipation of the circuit board. After that, the user can use the circuit board normally. When using it, the user can start the fan, which will speed up the flow of surrounding air and dissipate the heat of the circuit board through the ventilation holes, thereby ensuring the normal operation of the circuit board.

[0021] In the utility model, the heat dissipation structure can conveniently clamp and fix the circuit board, the operation is simple, and the fixing effect is good. It can ensure that the circuit board is not easily displaced during use, and the safety of the electronic product circuit can be ensured. The heat dissipation structure can also adjust the height of the circuit board, which can conveniently meet the installation requirements of the circuit board, and at the same time, it can also achieve the best heat dissipation effect, and the adjustment operation is simple, which is convenient for users to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of a three-dimensional structure of an adjustable heat dissipation structure of a circuit board inside an electronic product provided by an embodiment of the utility model;

[0023] Figure 2 A schematic structural diagram of an adjustable heat dissipation structure of a circuit board inside an electronic product provided by an embodiment of the utility model from another viewing angle;

[0024] Figure 3 A schematic diagram of the side structure of an adjustable heat dissipation structure of a circuit board inside an electronic product provided by an embodiment of the utility model.

[0025] Reference numerals:

[0026] 1. Base; 2. First slide groove; 3. First sliding bracket; 4. Second sliding bracket; 5. First support rod; 6. Second support rod; 7. Third sliding bracket; 8. Fourth sliding bracket; 9. Second slide groove; 10. Heat sink; 11. Guide rod; 12. Clamp; 13. Fixed card slot; 14. First bidirectional threaded screw; 15. Fan; 16. Second bidirectional threaded screw; 17. First connecting plate; 18. Second connecting plate; 19. Fixed block; 20. Fixed screw; 21. Ventilation hole. DETAILED DESCRIPTION

[0027] The embodiments of the present invention are described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0028] In the description of the embodiments of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms, "connection" and "installation" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. In addition, "connection" can be a direct connection or an indirect connection through an intermediate medium. Among them, "fixed" means that they are connected to each other and the relative position relationship after connection remains unchanged. The directional terms mentioned in the embodiments of the present utility model, such as "inside", "outside", "top", "bottom", etc., are only reference to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present utility model, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present utility model.

[0029] In the embodiments of the present invention, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0030] In the embodiment of the present invention, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0031] References to "one embodiment" or "some embodiments" etc. described in this specification mean that one or more embodiments of the utility model include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0032] Example 1

[0033] Reference Figure 1-3 , a heat dissipation structure, comprising:

[0034] A base 1, a heat sink 10 is disposed on the top of the base 1, the heat sink 10 is used to place the circuit board, a plurality of through ventilation holes 21 are opened on the top of the heat sink 10, and two fans 15 are fixedly installed on the bottom of the heat sink 10;

[0035] A fixing component, the fixing component is used to fix the circuit board;

[0036] Two sets of lifting components are located between the base 1 and the heat sink 10 , and are used to adjust the height of the heat sink 10 .

[0037] The above technical solution can realize an adjustable heat dissipation structure for the internal circuit board of an electronic product. The heat dissipation structure can clamp and fix the circuit board. The operation is simple and the fixing effect is good. It can ensure that the circuit board is not easily displaced during use. At the same time, the heat dissipation structure can also adjust the height of the circuit board, which can conveniently meet the installation requirements of the circuit board and also achieve the best heat dissipation effect. The adjustment operation is simple and convenient for users to use.

[0038] Reference Figure 2 , 3 In this embodiment, the fixing assembly includes two clamping plates 12 slidably connected to the top of the heat sink 10, a guide rod 11 is fixedly installed on one side of the heat sink 10, and a first bidirectional threaded screw 14 is rotatably connected to the other side of the heat sink 10. The heat sink 10 slides through the two clamping plates 12, the first bidirectional threaded screw 14 is threadedly connected to the two clamping plates 12, and the two clamping plates 12 are respectively located on two opposite threads of the first bidirectional threaded screw 14.

[0039] The above technical solution can clamp and fix the circuit board by bringing the two clamping plates 12 closer to each other, and has a simple structure, is easy to operate, and is convenient to use.

[0040] Reference Figure 1 , 2 In this embodiment, the lifting assembly includes a plurality of first slide grooves 2 opened on the top of the base 1, and the top of the base 1 is slidably connected with the first sliding bracket 3 and the second sliding bracket 4 through the corresponding first slide grooves 2, and the first sliding bracket 3 and the second sliding bracket 4 are rotatably connected with the first support rod 5 and the second support rod 6 inside, respectively. The centers of the first support rod 5 and the second support rod 6 are rotatably connected through a rotating shaft, and the other end of the first support rod 5 is rotatably connected with the third sliding bracket 7, and the other end of the second support rod 6 is rotatably connected with the fourth sliding bracket 8. A plurality of second slide grooves 9 are opened at the bottom of the heat dissipation plate 10, and the third sliding bracket 7 and the fourth sliding bracket 8 are both slidably connected with the corresponding second slide grooves 9.

[0041] The above technical solution can realize height adjustment of the heat sink 10 by cooperating with a plurality of first support rods 5 and second support rods 6, and has a simple structure and good lifting effect.

[0042] The present application can be used for internal circuit boards of electronic products, and can also be used in other fields applicable to the present application.

[0043] Example 2

[0044] Reference Figure 1-3 , an adjustable heat dissipation structure of a circuit board inside an electronic product, comprising:

[0045] A base 1, a heat sink 10 is disposed on the top of the base 1, the heat sink 10 is used to place the circuit board, a plurality of through ventilation holes 21 are opened on the top of the heat sink 10, and two fans 15 are fixedly installed on the bottom of the heat sink 10;

[0046] A fixing component, the fixing component is used to fix the circuit board;

[0047] Two sets of lifting components are located between the base 1 and the heat sink 10 , and are used to adjust the height of the heat sink 10 .

[0048] The above technical solution can realize an adjustable heat dissipation structure for the internal circuit board of an electronic product. The heat dissipation structure can clamp and fix the circuit board. The operation is simple and the fixing effect is good. It can ensure that the circuit board is not easily displaced during use. At the same time, the heat dissipation structure can also adjust the height of the circuit board, which can conveniently meet the installation requirements of the circuit board and also achieve the best heat dissipation effect. The adjustment operation is simple and convenient for users to use.

[0049] Reference Figure 2 , 3In this embodiment, the fixing assembly includes two clamping plates 12 slidably connected to the top of the heat sink 10, a guide rod 11 is fixedly installed on one side of the heat sink 10, and a first bidirectional threaded screw 14 is rotatably connected to the other side of the heat sink 10. The heat sink 10 slides through the two clamping plates 12, the first bidirectional threaded screw 14 is threadedly connected to the two clamping plates 12, and the two clamping plates 12 are respectively located on two opposite threads of the first bidirectional threaded screw 14.

[0050] The above technical solution can clamp and fix the circuit board by bringing the two clamping plates 12 closer to each other, and has a simple structure, is easy to operate, and is convenient to use.

[0051] Reference Figure 1 , 2 In this embodiment, the lifting assembly includes a plurality of first slide grooves 2 opened on the top of the base 1, and the top of the base 1 is slidably connected with the first sliding bracket 3 and the second sliding bracket 4 through the corresponding first slide grooves 2, and the first sliding bracket 3 and the second sliding bracket 4 are rotatably connected with the first support rod 5 and the second support rod 6 inside, respectively. The centers of the first support rod 5 and the second support rod 6 are rotatably connected through a rotating shaft, and the other end of the first support rod 5 is rotatably connected with the third sliding bracket 7, and the other end of the second support rod 6 is rotatably connected with the fourth sliding bracket 8. A plurality of second slide grooves 9 are opened at the bottom of the heat dissipation plate 10, and the third sliding bracket 7 and the fourth sliding bracket 8 are both slidably connected with the corresponding second slide grooves 9.

[0052] The above technical solution can realize height adjustment of the heat sink 10 by cooperating with a plurality of first support rods 5 and second support rods 6, and has a simple structure and good lifting effect.

[0053] Reference Figure 1 , 3 In this embodiment, the same first connecting plate 17 is fixedly connected between the two first sliding brackets 3, and the same second connecting plate 18 is fixedly connected between the two second sliding brackets 4. The first connecting plate 17 and the second connecting plate 18 are threadedly connected to the same second bidirectional threaded screw 16. The first connecting plate 17 and the second connecting plate 18 are respectively located on two opposite threads of the second bidirectional threaded screw 16, and the second bidirectional threaded screw 16 is rotatably connected to the base 1 through a fixed bracket.

[0054] The above technical solution can drive the first connecting plate 17 and the second connecting plate 18 to move closer and farther away through the second bidirectional threaded screw 16, so as to adjust the height of the heat sink 10, which is simple to operate and easy to use.

[0055] Reference Figure 1 In this embodiment, two fixing blocks 19 are fixedly installed on both sides of the base 1, and the tops of the fixing blocks 19 are threaded with fixing screws 20.

[0056] The above technical solution can conveniently fix the heat dissipation structure in the electronic product, with good fixing effect and not prone to deviation.

[0057] Reference Figure 3 In this embodiment, a fixing slot 13 is provided on one side of the two clamping plates 12 that are close to each other.

[0058] The above technical solution is conducive to better fixing the circuit board.

[0059] However, as is well known to those skilled in the art, the working principle and wiring method of the fan 15 are commonplace, and are conventional means or common knowledge, and are not described in detail here. Those skilled in the art may make any selections according to their needs or convenience.

[0060] The working principle and use process of the present technical solution are as follows: when in use, the user can fix the structure in the electronic product box body by fixing the screw 20, and then the user can place the circuit board to be installed on the heat sink 10, and then the user can rotate the first bidirectional threaded screw 14 to make the two clamping plates 12 approach each other, and make the two sides of the circuit board be clamped in the fixing groove 13 to fix the circuit board; according to the installation requirements of the circuit board, the user can rotate the second bidirectional threaded screw 16, at this time, the first connecting plate 17 and the second connecting plate 18 will approach or move away, and the heat sink 10 can be raised or lowered by rotating between the first support rod 5 and the second support rod 6. The operation is simple, which can meet the installation requirements of the circuit board and facilitate the optimal heat dissipation of the circuit board; after that, the user can use the circuit board normally. When in use, the user can start the fan 15, and the fan 15 will accelerate the flow of surrounding air and dissipate the heat to the circuit board through the ventilation hole 21, so as to ensure the normal operation of the circuit board.

[0061] The above are only specific implementations of the utility model, but the protection scope of the utility model is not limited to them. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model; in the absence of conflicts, the embodiments of the utility model and the features in the embodiments can be combined with each other. Therefore, the protection scope of the utility model shall be based on the protection scope of the claims.

Claims

1. An adjustable heat dissipation structure for a circuit board inside an electronic product, characterized in that: include: A base (1), wherein a heat sink (10) is arranged on the top of the base (1), the heat sink (10) is used to place a circuit board, a plurality of through ventilation holes (21) are opened on the top of the heat sink (10), and two fans (15) are fixedly installed on the bottom of the heat sink (10); A fixing component, wherein the fixing component is used to fix the circuit board; Two sets of lifting components, the two sets of lifting components are located between the base (1) and the heat sink (10), and the two sets of lifting components are used to achieve height adjustment of the heat sink (10).

2. The adjustable heat dissipation structure of the internal circuit board of an electronic product according to claim 1, characterized in that: The fixing assembly comprises two clamping plates (12) slidably connected to the top of the heat sink (10); a guide rod (11) is fixedly installed on one side of the heat sink (10); a first bidirectional threaded screw (14) is rotatably connected to the other side of the heat sink (10); the heat sink (10) slides through the two clamping plates (12); the first bidirectional threaded screw (14) is threadedly connected to the two clamping plates (12), and the two clamping plates (12) are respectively located on two opposite threads of the first bidirectional threaded screw (14).

3. The adjustable heat dissipation structure of the internal circuit board of an electronic product according to claim 1, characterized in that: The lifting assembly comprises a plurality of first slide grooves (2) provided on the top of the base (1); the top of the base (1) is slidably connected to a first sliding bracket (3) and a second sliding bracket (4) through corresponding first slide grooves (2); the first sliding bracket (3) and the second sliding bracket (4) are rotatably connected inside with a first support rod (5) and a second support rod (6); the centers of the first support rod (5) and the second support rod (6) are rotatably connected through a rotating shaft; the other end of the first support rod (5) is rotatably connected to a third sliding bracket (7); the other end of the second support rod (6) is rotatably connected to a fourth sliding bracket (8); a plurality of second slide grooves (9) are provided at the bottom of the heat dissipation plate (10); the third sliding bracket (7) and the fourth sliding bracket (8) are both slidably connected to the corresponding second slide grooves (9).

4. The adjustable heat dissipation structure of the internal circuit board of an electronic product according to claim 3, characterized in that: A same first connecting plate (17) is fixedly connected between the two first sliding brackets (3), a same second connecting plate (18) is fixedly connected between the two second sliding brackets (4), the first connecting plate (17) and the second connecting plate (18) are threadedly connected to a same second bidirectional threaded screw (16), the first connecting plate (17) and the second connecting plate (18) are respectively located on two opposite threads of the second bidirectional threaded screw (16), and the second bidirectional threaded screw (16) is rotatably connected to the base (1) via a fixed bracket.

5. The adjustable heat dissipation structure of the internal circuit board of an electronic product according to claim 1, characterized in that: Two fixing blocks (19) are fixedly mounted on both sides of the base (1), and fixing screws (20) are threadedly penetrated through the tops of the fixing blocks (19).

6. The adjustable heat dissipation structure of the internal circuit board of an electronic product according to claim 2, characterized in that: A fixing slot (13) is provided on one side of the two clamping plates (12) close to each other.

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