Flexible circuit board of backlight source module

By dividing the flexible circuit board of the backlight module into a multi-layer structure and adopting a system-level package, the problem of high thickness of the traditional backlight is solved, and a more compact line layout and a smaller overall thickness are achieved.

CN222691951UActive Publication Date: 2025-03-28DONGGUAN JINGWEI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202420769026.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-15
Publication Date
2025-03-28
Estimated Expiration
2034-04-15

AI Technical Summary

Technical Problem

Because the traditional backlight uses a PCB circuit board, the thickness of the backlight is relatively large, making it difficult to thin the display module.

Method used

A flexible circuit board with a backlight module is adopted. By dividing the original entire flexible circuit board into a first flexible plate, a second flexible plate and a third flexible plate structure, the flexible circuit board is in the shape of a "mountain". Combined with the system-level packaging, multiple functional modules are integrated into a SIP packaging section.

Benefits of technology

It is achieved to include more circuits and components in the same space, reduce the overall thickness of the flexible board, significantly reduce the thickness, and reduce the overall space occupied by system-level packaging.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a flexible circuit board of a backlight source module, which comprises a backlight source and a display module arranged on the light emitting side of the backlight source, and one side of the display module is electrically connected with a connector. The flexible circuit board has the advantages that the original whole flexible circuit board is divided into the first flexible board, the second flexible board and the third flexible board, and the flexible circuit board is in the shape of the Chinese character'shan ', so that the space can be utilized more effectively, and the circuit layout is more compact. According to the design, more circuits and elements can be accommodated in the same space, so that the overall thickness of the flexible board is reduced, a circuit board which originally needs to be stacked in multiple layers can be changed into a single-layer or multi-layer but more compact structure, the thickness is remarkably reduced, meanwhile, system-level packaging is adopted, and the cost is reduced. A plurality of functional modules of the flexible circuit board are integrated in one SIP packaging part, so that the overall occupied space is reduced, and the overall thickness of the flexible circuit board is reduced.
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Description

Technical Field

[0001] The utility model relates to the technical field of flexible circuit boards, in particular to a flexible circuit board of a backlight source module. Background Art

[0002] Existing displays generally include a display module and a backlight source, and the light emitted by the backlight source illuminates the display module to achieve display.

[0003] The more mainstream backlight source now adopts the edge-entry backlight source. First, the light-emitting element is set on the inner side of the side wall of the backlight frame; then the light is transmitted to the display area by the light guide plate installed on the backlight frame. The edge-entry backlight source usually includes a light guide plate, a reflective sheet arranged at the lower end of the light guide plate, an optical film arranged at the upper end of the light guide plate (light emitting surface), and a light strip arranged on the side of the light guide plate (light incident surface). The thinning of display modules is a trend, and the traditional backlight source is relatively thick because it mostly uses PCB circuit boards. Utility Model Content

[0004] The purpose of the present invention is to solve at least one of the above technical deficiencies.

[0005] Therefore, one purpose of the present invention is to provide a flexible circuit board of a backlight module to solve the problems mentioned in the background technology and overcome the deficiencies in the prior art.

[0006] In order to achieve the above-mentioned object, an embodiment of one aspect of the utility model provides a flexible circuit board of a backlight module, comprising a backlight and a display module arranged on a light emitting side of the backlight;

[0007] A connector is electrically connected to one side of the display module, a first flexible board and a second flexible board are fixedly connected to one side of the connector, and a SIP packaging part is integrated on the second flexible board;

[0008] A third flexible board is fixedly connected to one side of the connector, and a connecting portion is provided on the third flexible board;

[0009] The first flexible board, the second flexible board and the third flexible board are integrated together on a flexible circuit board, and the flexible circuit board is in the shape of a "mountain" as a whole.

[0010] Preferably, in any of the above schemes, the backlight source comprises an outer frame and an inner light source, and the display module is an LCD display module.

[0011] Adopting the above technical solution: the flexible circuit board is composed of a connector, a first flexible board, a second flexible board, a third flexible board and a connecting part.

[0012] Preferably, in any of the above solutions, the connector is in a long strip shape.

[0013] The above technical solution is adopted: the original whole flexible circuit board is divided into a first flexible board, a second flexible board and a third flexible board structure, and the flexible circuit board is in the shape of a "mountain", which can more effectively utilize the space and make the circuit layout more compact. This design allows more circuits and components to be accommodated in the same space, thereby reducing the overall thickness of the flexible board, and can change the circuit board that originally required multi-layer stacking into a single-layer or multi-layer but more compact structure, thereby significantly reducing the thickness;

[0014] At the same time, by adopting system-level packaging, multiple functional modules of the flexible circuit board are integrated into a SIP packaging part, reducing the overall occupied space and thus reducing the overall thickness of the flexible circuit board.

[0015] Preferably, any of the above schemes is that the substrate material of the first flexible board, the second flexible board and the third flexible board is polyimide, and the first flexible board and the second flexible board are located on both sides of the third flexible board.

[0016] The above technical solution is adopted: using a long strip connector, making the connector longer, thereby reducing the thickness of the connector, and thus making the overall thickness of the flexible circuit board thinner.

[0017] Preferably, any of the above solutions is that the lengths of the first flexible board and the second flexible board are shorter than the length of the third flexible board.

[0018] Using the above technical solution: the substrate material of the first flexible board, the second flexible board and the third flexible board is polyimide, which is thinner and softer.

[0019] Preferably, any of the above solutions encapsulates a functional module in the SIP encapsulation portion on the second flexible board.

[0020] Compared with the prior art, the advantages and beneficial effects of the utility model are:

[0021] The flexible circuit board of the backlight module is divided into the first flexible board, the second flexible board and the third flexible board structure by the matching arrangement of the connector, the first flexible board, the second flexible board, the third flexible board, the SIP packaging part and the connection part. The flexible circuit board is in the shape of a "mountain", which can more effectively utilize the space and make the circuit layout more compact. This design allows more circuits and components to be accommodated in the same space, thereby reducing the overall thickness of the flexible board, and can change the circuit board that originally required multi-layer stacking into a single-layer or multi-layer but more compact structure, thereby significantly reducing the thickness;

[0022] At the same time, by adopting system-level packaging, multiple functional modules of the flexible circuit board are integrated into a SIP packaging part, reducing the overall occupied space and thus reducing the overall thickness of the flexible circuit board.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description and in part will become apparent from the following description or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 It is a structural schematic diagram of the utility model from the first perspective;

[0026] Figure 2 It is a structural schematic diagram of the utility model from a second viewing angle;

[0027] Figure 3 It is a front view structural schematic diagram of the utility model.

[0028] In the figure: 1-backlight source, 2-display module, 3-connector, 4-first flexible board, 5-second flexible board, 6-SIP packaging part, 7-third flexible board, 8-connecting part. DETAILED DESCRIPTION

[0029] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0030] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] like Figure 1-3 As shown, the flexible circuit board of the backlight module includes a backlight source 1 and a display module 2 arranged on the light emitting side of the backlight source 1;

[0032] A connector 3 is electrically connected to one side of the display module 2, a first flexible board 4 and a second flexible board 5 are fixedly connected to one side of the connector 3, and a SIP packaging part 6 is integrated on the second flexible board 5;

[0033] One side of the connector 3 is fixedly connected with a third flexible board 7, and a connecting portion 8 is arranged on the third flexible board 7;

[0034] The first flexible board 4, the second flexible board 5 and the third flexible board 7 are integrally integrated on a flexible printed circuit board, and the overall shape of this flexible printed circuit board is in a "mountain" shape.

[0035] Embodiment 1: The backlight 1 includes a frame on the outside and a light source on the inside, and the display module 2 is an LCD display module. This flexible printed circuit board is composed of a connector 3, a first flexible board 4, a second flexible board 5, a third flexible board 7 and a connecting portion 8. The connector 3 is in a long strip shape. The original whole flexible printed circuit board is divided into a structure of a first flexible board 4, a second flexible board 5 and a third flexible board 7. The flexible printed circuit board is in a "mountain" shape, which can make more effective use of space and make the circuit layout more compact. This design enables more circuits and components to be accommodated in the same space, thereby reducing the overall thickness of the flexible board. The circuit board that originally needed to be stacked in multiple layers can be changed into a single layer or multiple layers but more compact structure, thus significantly reducing the thickness.

[0036] Embodiment 2: The substrate materials of the first flexible board 4, the second flexible board 5 and the third flexible board 7 are polyimide. The first flexible board 4 and the second flexible board 5 are located on both sides of the third flexible board 7. A long strip-shaped connector 3 is used, and the connector 3 is made longer, thereby reducing the thickness of the connector 3, and thus making the overall thickness of the flexible printed circuit board thinner. The lengths of the first flexible board 4 and the second flexible board 5 are less than the length of the third flexible board 7. The substrate materials of the first flexible board 4, the second flexible board 5 and the third flexible board 7 are polyimide, which is thinner and more flexible. The SIP packaging portion 6 on the second flexible board 5 packages a functional module.

[0037] The working principle of the present utility model is as follows:

[0038] The core of the display module is the LCD panel, which uses the optical properties of liquid crystal materials to display images. When current is transmitted to the LCD panel through the flexible printed circuit board, these currents will activate the pixels on the LCD panel. Each pixel is composed of one or more liquid crystal cells, and the state of the liquid crystal cell (i.e., the arrangement of liquid crystal molecules) can be controlled by an electric field. When the electric field changes, the arrangement of liquid crystal molecules will change, thereby changing the propagation direction or transmittance of light. In this way, by precisely controlling the electric field on each pixel, the required image can be formed on the LCD panel.

[0039] The flexible printed circuit board plays a crucial role in this process. It is responsible for stably transmitting signals and power from the outside to the LCD panel and related control circuits. The design of the flexible printed circuit board enables it to be bent and folded to adapt to various complex layouts and installation environments.

[0040] In addition, the conductive patterns and connectors 8 on the flexible circuit board ensure accurate transmission of current and signals. These conductive patterns are usually made of copper foil or aluminum foil, which have good conductivity and stability. The connector 8 provides a connection interface with external devices or circuits, so that the entire display module can work in conjunction with other systems or components.

[0041] Compared with the prior art, the present invention has the following beneficial effects:

[0042] The flexible circuit board of the backlight module is divided into the first flexible board 4, the second flexible board 5 and the third flexible board 7 by the matching arrangement of the connector 3, the first flexible board 4, the second flexible board 5, the third flexible board 7, the SIP packaging part 6 and the connecting part 8. The flexible circuit board is in the shape of a "mountain", which can more effectively utilize the space and make the circuit layout more compact. This design allows more circuits and components to be accommodated in the same space, thereby reducing the overall thickness of the flexible board, and can change the circuit board that originally required multi-layer stacking into a single-layer or multi-layer but more compact structure, thereby significantly reducing the thickness;

[0043] At the same time, a system-level package is adopted to integrate multiple functional modules of the flexible circuit board into a SIP package part 6, thereby reducing the overall occupied space and thus reducing the overall thickness of the flexible circuit board.

Claims

1. A flexible circuit board of a backlight module, characterized in that: It includes a backlight (1) and a display module (2) arranged on the light-emitting side of the backlight (1); One side of the display module (2) is electrically connected to a connector (3). One side of the connector (3) is fixedly connected to a first flexible board (4) and a second flexible board (5). An SIP packaging part (6) is integrated on the second flexible board (5); One side of the connector (3) is fixedly connected to a third flexible board (7). A connection part (8) is arranged on the third flexible board (7); The first flexible board (4), the second flexible board (5) and the third flexible board (7) are integrally integrated on a flexible circuit board, and the overall shape of this flexible circuit board is "mountain" shaped.

2. The flexible circuit board of the backlight module according to claim 1, characterized in that: The backlight (1) includes a frame on the outside and a light source on the inside. The display module (2) is an LCD display module.

3. The flexible circuit board of a backlight module according to claim 2, characterized in that: The connector (3) is strip-shaped.

4. The flexible circuit board of a backlight module according to claim 3, characterized in that: The substrate materials of the first flexible board (4), the second flexible board (5) and the third flexible board (7) are polyimide. The first flexible board (4) and the second flexible board (5) are located on both sides of the third flexible board (7).

5. The flexible circuit board of the backlight module according to claim 4, characterized in that: The lengths of the first flexible board (4) and the second flexible board (5) are less than the length of the third flexible board (7).

6. The flexible circuit board of a backlight module according to claim 5, characterized in that: The function module is packaged by the SIP packaging part (6) on the second flexible board (5).