Auxiliary device for processing bonding pad of IC (integrated circuit) carrier plate

Abstract

The utility model discloses an IC carrier plate bonding pad processing auxiliary device which comprises a bottom plate, universal wheels are fixedly connected to the lower surface of the bottom plate, a polygonal guide rail is fixedly connected to the upper surface of the bottom plate, a fixing plate is slidably connected to the outer wall of the polygonal guide rail, a threaded hole and a bearing seat are formed in the inner wall of the fixing plate, and the bearing seat is fixedly connected to the bottom plate. The lead screw is rotationally connected to the inner wall of the bearing seat through a bearing, the lead screw is in threaded connection to the inner wall of a threaded hole of the fixing plate, a first motor is fixedly connected to the upper surface of the fixing plate, a steering adjusting mechanism is arranged at the output end of the first motor, and a baffle is arranged on the outer wall of the steering adjusting mechanism; a clamping mechanism is arranged on the outer surface of the baffle. Through the above structure, the first motor drives the steering adjusting mechanism to move and further drives the baffle to rotate, the effect of adjusting the machining angle of the IC carrier plate bonding pad body is achieved, the lead screw and sliding groove mechanism can be utilized to aggregate inwards to clamp the IC carrier plate bonding pad body, the structure is simple, and the production cost is low.

Description

Technical Field

[0001] The utility model relates to the technical field of IC carrier boards, in particular to an IC carrier board pad processing auxiliary device. Background Art

[0002] Printed circuit board (PCB), also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. IC carrier is a circuit board used to install and connect integrated circuits (IC). It is usually made of one or more layers of printed circuit boards (PCB) and has some special designs and functions to ensure the correct installation and connection of IC. IC carrier usually includes components such as IC socket, pins, power supply and signal lines, as well as some functions such as protection circuits and filters. The design and manufacture of IC carrier needs to take into account factors such as IC size, pin arrangement, electrical characteristics and environmental requirements to ensure the stability and reliability of IC. IC carrier is widely used in electronic products such as computers, mobile phones, televisions, automotive electronics and other fields.

[0003] The prior art lacks a suitable clamping structure when processing IC substrate pads. Since the traditional auxiliary processing fixtures used for welding in the processing of IC substrate pads usually require manual adjustment and the mechanism is relatively fixed, it is difficult to adapt to the processing requirements of components of different sizes. If a large-scale automated robotic arm is used for welding operations, the processing cost is high. Therefore, we propose a highly applicable IC substrate pad processing auxiliary device. Utility Model Content

[0004] The purpose of the utility model is to provide an IC carrier pad processing auxiliary device with strong applicability to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, an IC carrier pad processing auxiliary device is provided, including a base plate, a universal wheel is fixedly connected to the lower surface of the base plate, a polygonal guide rail is fixedly connected to the upper surface of the base plate, a fixed plate is slidably connected to the outer wall of the polygonal guide rail, a threaded hole and a bearing seat are opened on the inner wall of the fixed plate, the screw rod is rotatably connected to the inner wall of the bearing seat through a bearing, the screw rod is threadedly connected to the inner wall of the threaded hole of the fixed plate, a first motor is fixedly connected to the upper surface of the fixed plate, a steering adjustment mechanism is provided at the output end of the first motor, a baffle is provided on the outer wall of the steering adjustment mechanism, a clamping mechanism is provided on the outer surface of the baffle, an IC carrier pad body is provided on the inner wall of the clamping mechanism, and a manual adjustment handle is fixedly connected to one end of the screw rod, and the manual adjustment handle is composed of two parts that can rotate relative to each other.

[0006] According to the IC substrate pad processing auxiliary device, the steering adjustment mechanism includes: a first fixed bracket, a first transmission rod, a second transmission rod, a second fixed bracket, a worm, and a worm wheel. The first fixed bracket is fixedly connected to the outer surface of the first motor, the first transmission rod is rotatably connected to the inner wall of the first fixed bracket, and a bevel gear is provided at the end of the first transmission rod.

[0007] According to the IC substrate pad processing auxiliary device, the second fixed bracket is fixedly connected to the outer surface of the first motor, the second transmission rod is rotatably connected to the inner wall of the second fixed bracket, a bevel gear is provided on one end face of the second transmission rod, and a worm is provided on one end face of the second transmission rod.

[0008] According to the IC substrate pad processing auxiliary device, the second transmission rod is meshed with the first transmission rod, the worm gear is meshed with the worm, the worm gear is fixedly connected to the outer surface of the baffle, and the worm gear is rotatably connected to the inner wall of the first motor.

[0009] According to the IC carrier pad processing auxiliary device, the clamping mechanism includes a screw slide mechanism, a second motor, a slider, an electric push rod, and a rubber pad. The screw slide mechanism includes a screw, a shell, and a slide. The screw is rotatably connected to the inner wall of the shell, and the slide is arranged on the inner wall of the shell. The screw is fixedly connected to the second motor, and the second motor is fixedly connected to the outer wall of the shell.

[0010] According to the IC carrier pad processing auxiliary device, the slider is threadedly connected to the outer wall of the screw rod, and the slider is slidably connected to the inner wall of the slide groove.

[0011] According to the IC substrate pad processing auxiliary device, the electric push rod is fixedly connected to the inner wall of the slider, the rubber pad is fixedly connected to the movable end of the electric push rod, and the IC substrate pad body is movably connected to the inner wall of the electric push rod and the slider.

[0012] According to the IC substrate pad processing auxiliary device, the IC substrate pad body is provided with a copper component and a solder mask window BGA pad. The copper component and the solder mask window BGA pad are provided by changing the existing semi-on-pad design pad, and the pad design semi-on-pad design is optimized to a full-on-pad design, which can reduce the impact of the process alignment deviation on the pad size; the design optimization has no effect on the cost, and at the same time, the tinning effect on the client's SMT BGA is better.

[0013] The beneficial effects of the utility model are as follows: by arranging a first motor, a steering adjustment mechanism, a baffle, a clamping mechanism, a polygonal guide rail, a screw rod, a base plate, and a manual adjustment handle, the steering adjustment mechanism can be driven to move by the first motor, thereby driving the baffle to rotate, thereby achieving the effect of adjusting the processing angle of the IC carrier pad body; the IC carrier pad body can be clamped inwardly by the screw rod slide groove mechanism through the clamping mechanism, and the clamping stability can be improved by the contact between the rubber pad and the IC carrier pad body; the device has a simple structure and reduces the equipment processing cost.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0016] Figure 1 This is a three-dimensional diagram of an IC substrate pad processing auxiliary device of the utility model;

[0017] Figure 2 This is a top view of an IC substrate pad processing auxiliary device of the utility model;

[0018] Figure 3 This is a partial front view of an IC substrate pad processing auxiliary device of the utility model;

[0019] Figure 4 This is a partial structural exploded diagram of an IC substrate pad processing auxiliary device of the utility model;

[0020] Figure 5 This is a schematic diagram of the full on-pad structure of an IC substrate pad processing auxiliary device of the utility model;

[0021] Figure 6 It is a schematic diagram of a semi-on-pad structure in the prior art.

[0022] Legend:

[0023] 1. Universal wheel; 2. Bottom plate; 3. Polygonal guide rail; 4. Manual adjustment handle; 5. Screw rod; 6. Fixed plate; 7. First motor; 8. Steering adjustment mechanism; 81. First fixed bracket; 82. First transmission rod; 83. Second transmission rod; 84. Second fixed bracket; 85. Worm; 86. Worm wheel; 9. Baffle; 10. Clamping mechanism; 101. Screw rod slide mechanism; 102. Second motor; 103. Slider; 104. Electric push rod; 105. Rubber pad; 11. IC carrier pad body; 111. Solder mask window BGA pad; 112. Copper parts. DETAILED DESCRIPTION

[0024] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0025] Reference Figures 1 to 4 The utility model embodiment is an IC carrier pad processing auxiliary device, which includes a base plate 2, characterized in that a universal wheel 1 is fixedly connected to the lower surface of the base plate 2, a polygonal guide rail 3 is fixedly connected to the upper surface of the base plate 2, a fixed plate 6 is slidably connected to the outer wall of the polygonal guide rail 3, a threaded hole and a bearing seat are opened on the inner wall of the fixed plate 6, a screw rod 5 is rotatably connected to the inner wall of the bearing seat through a bearing, the screw rod 5 is threadedly connected to the inner wall of the threaded hole of the fixed plate 6, a first motor 7 is fixedly connected to the upper surface of the fixed plate 6, and a steering adjustment mechanism 8 is provided at the output end of the first motor 7. The steering adjustment mechanism 8 The outer wall of the baffle 9 is provided with a baffle plate 9, the outer surface of the baffle plate 9 is provided with a clamping mechanism 10, the inner wall of the clamping mechanism 10 is provided with an IC carrier pad body 11, one end of the screw rod 5 is fixedly connected to a manual adjustment handle 4, the manual adjustment handle 4 is composed of two relatively rotatable parts, the steering adjustment mechanism 8 includes: a first fixed bracket 81, a first transmission rod 82, a second transmission rod 83, a second fixed bracket 84, a worm 85, and a worm wheel 86. The first fixed bracket 81 is fixedly connected to the outer surface of the first motor 7, the first transmission rod 82 is rotatably connected to the inner wall of the first fixed bracket 81, and the first transmission rod The end of 82 is provided with a bevel gear, the second fixed bracket 84 is fixedly connected to the outer surface of the first motor 7, the second transmission rod 83 is rotatably connected to the inner wall of the second fixed bracket 84, one end face of the second transmission rod 83 is provided with a bevel gear, one end face of the second transmission rod 83 is provided with a worm 85, the second transmission rod 83 is meshed with the first transmission rod 82, the worm wheel 86 is meshed with the worm 85, the worm wheel 86 is fixedly connected to the outer surface of the baffle 9, and the worm wheel 86 is rotatably connected to the inner wall of the first motor 7, and the clamping mechanism 10 includes a screw slide mechanism 101, a second motor 102, a slider 103, and an electric The movable push rod 104, the rubber pad 105, the screw rod slide groove mechanism 101 includes a screw rod, a shell, and a slide groove. The screw rod is rotatably connected to the inner wall of the shell, the slide groove is set on the inner wall of the shell, the screw rod is fixedly connected to the second motor 102, the second motor 102 is fixedly connected to the outer wall of the shell, the slider 103 is threadedly connected to the outer wall of the screw rod, the slider 103 is slidably connected to the inner wall of the slide groove, the electric push rod 104 is fixedly connected to the inner wall of the slider 103, the rubber pad 105 is fixedly connected to the movable end of the electric push rod 104, and the IC carrier pad body 11 is movably connected to the inner walls of the electric push rod 104 and the slider 103.

[0026] like Figure 5 , Figure 6As shown, the inside of the IC substrate pad body 11 is provided with a copper component 112 and a solder mask window BGA pad 111. The existing semi-on-pad design BGA size will have an alignment deviation that affects the pad size consistency or pad deformation; the full on-pad solder mask window BGA size of this structure has no alignment deviation, and the BGA pad size consistency is excellent. The semi-on-pad design pad has two process alignment superposition factors of dry film and solder mask that affect the pad size consistency.

[0027] Working principle: When in use, first adjust the position between the fixed plates 6 according to the size of the IC carrier pad body 11, and rotate the manual adjustment handle 4 to drive the screw rod 5 to rotate. Since the surface of the screw rod 5 has two threads in opposite directions, it drives the two fixed plates 6 to move closer or farther away synchronously. Then control the second motor 102 to rotate to drive the screw rod inside the screw rod slide mechanism 101 to rotate. The surface of the screw rod has two threads in opposite directions, which drives the slider 103 to move closer or farther away synchronously, and then adjust to a position suitable for clamping the IC carrier pad body 11. The IC carrier pad body 11 is placed into the inner wall of the slider 103 and the rubber pad 105, and then the rubber pad 105 is driven by the electric push rod 104 to move and clamp. After completion, welding processing is performed. During processing, the angle of the IC carrier pad body 11 can be adjusted. The first transmission rod 82 is driven to rotate by the first motor 7, and then the second transmission rod 83 is driven to rotate. Under the engagement of the second fixed bracket 84 and the worm gear 86, the worm gear 86 is driven to rotate, and then the baffle 9 is driven to rotate. The angle of the IC carrier pad body 11 can be adjusted by controlling the forward and reverse rotation of the first motor 7.

[0028] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. An IC substrate pad processing auxiliary device, comprising a base plate (2), characterized in that: The lower surface of the base plate (2) is fixedly connected with a universal wheel (1), the upper surface of the base plate (2) is fixedly connected with a polygonal guide rail (3), the outer wall of the polygonal guide rail (3) is slidably connected with a fixed plate (6), the inner wall of the fixed plate (6) is provided with a threaded hole and a bearing seat, the screw rod (5) is rotatably connected to the inner wall of the bearing seat through a bearing, the screw rod (5) is threadedly connected to the inner wall of the threaded hole of the fixed plate (6), the upper surface of the fixed plate (6) is fixedly connected with a first motor (7), the output end of the first motor (7) is provided with a steering adjustment mechanism (8), the outer wall of the steering adjustment mechanism (8) is provided with a baffle (9), the outer surface of the baffle (9) is provided with a clamping mechanism (10), the inner wall of the clamping mechanism (10) is provided with an IC carrier pad body (11), one end of the screw rod (5) is fixedly connected with a manual adjustment handle (4), the manual adjustment handle (4) is composed of two parts that can rotate relative to each other.

2. The IC substrate pad processing auxiliary device according to claim 1, characterized in that: The steering adjustment mechanism (8) comprises: a first fixed bracket (81), a first transmission rod (82), a second transmission rod (83), a second fixed bracket (84), a worm (85), and a worm wheel (86); the first fixed bracket (81) is fixedly connected to the outer surface of the first motor (7); the first transmission rod (82) is rotatably connected to the inner wall of the first fixed bracket (81); and a bevel gear is provided at the end of the first transmission rod (82).

3. The IC substrate pad processing auxiliary device according to claim 2, characterized in that: The second fixed bracket (84) is fixedly connected to the outer surface of the first motor (7), the second transmission rod (83) is rotatably connected to the inner wall of the second fixed bracket (84), one end surface of the second transmission rod (83) is provided with a bevel gear, and one end surface of the second transmission rod (83) is provided with a worm (85).

4. The IC substrate pad processing auxiliary device according to claim 2, characterized in that: The second transmission rod (83) is meshed with the first transmission rod (82), the worm wheel (86) is meshed with the worm (85), the worm wheel (86) is fixedly connected to the outer surface of the baffle (9), and the worm wheel (86) is rotatably connected to the inner wall of the first motor (7).

5. The IC substrate pad processing auxiliary device according to claim 1, characterized in that: The clamping mechanism (10) comprises a screw rod and a slide groove mechanism (101), a second motor (102), a slider (103), an electric push rod (104), and a rubber pad (105); the screw rod and a slide groove mechanism (101) comprises a screw rod, a housing, and a slide groove; the screw rod is rotatably connected to the inner wall of the housing; the slide groove is arranged on the inner wall of the housing; the screw rod is fixedly connected to the second motor (102); and the second motor (102) is fixedly connected to the outer wall of the housing.

6. The IC substrate pad processing auxiliary device according to claim 5, characterized in that: The slider (103) is threadedly connected to the outer wall of the screw rod, and the slider (103) is slidably connected to the inner wall of the slide groove.

7. The IC substrate pad processing auxiliary device according to claim 6, characterized in that: The electric push rod (104) is fixedly connected to the inner wall of the slider (103), the rubber pad (105) is fixedly connected to the movable end of the electric push rod (104), and the IC carrier pad body (11) is movably connected to the inner wall of the electric push rod (104) and the slider (103).

8. The IC substrate pad processing auxiliary device according to claim 1, characterized in that: A copper component (112) and a solder resist window BGA pad (111) are arranged inside the IC carrier pad body (11).

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