Heat dissipation assembly and electronic equipment

Abstract

The utility model provides a heat dissipation assembly and electronic equipment, and relates to the technical field of heat dissipation. The heat dissipation assembly comprises a shell and a plurality of heat dissipation parts; a first flow channel is formed in the shell in the length direction, a second flow channel is formed in the shell in the width direction, and the first flow channel communicates with the second flow channel; the heat dissipation parts are located at the two ends of the first flow channel and the two ends of the second flow channel respectively, each heat dissipation part comprises two piezoelectric films arranged at intervals, and a cavity between the two piezoelectric films communicates with the first flow channel or the second flow channel. When the heat dissipation assembly works, the two piezoelectric films in the heat dissipation part alternately deform under the action of current, air can be sucked into the cavity between the two piezoelectric films in sequence, and air in the cavity is exhausted, so that high-speed impact jet flow is excited in the first flow channel or the second flow channel communicated with the cavity; compared with a passive heat dissipation mode, the heat dissipation device has a better heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation component and electronic equipment. Background Art

[0002] At present, mainstream electronic devices (such as mobile terminals such as mobile phones and tablets) generally use passive heat dissipation mechanisms such as graphite sheets, heat pipes, and temperature equalizers to dissipate heat evenly to reduce the temperature of the electronic devices.

[0003] However, passive heat dissipation is limited by the size of the electronic device and has a heat dissipation limit. In addition, the heat must eventually be dissipated through natural heat dissipation methods such as convection, radiation, and conduction on the surface of the electronic device, resulting in a poor thermal experience in high-load applications. Utility Model Content

[0004] In order to solve the problem of limited heat dissipation effect of existing passive heat dissipation methods, one of the purposes of the utility model is to provide a heat dissipation component.

[0005] The utility model provides the following technical solutions:

[0006] A heat dissipation assembly comprises a housing and a plurality of heat dissipation parts;

[0007] A first flow channel is provided in the shell along the length direction, and a second flow channel is provided along the width direction, and the first flow channel is communicated with the second flow channel;

[0008] The plurality of heat dissipation parts are respectively located at both ends of the first flow channel and both ends of the second flow channel. The heat dissipation parts include two piezoelectric films arranged at intervals. The cavity between the two piezoelectric films is communicated with the first flow channel or the second flow channel.

[0009] As a further optional solution for the heat dissipation assembly, the heat dissipation assembly further includes a temperature sensor, and the temperature sensor is electrically connected to the heat dissipation part.

[0010] As a further optional solution for the heat dissipation assembly, the heat dissipation assembly further includes a state sensor, the state sensor is electrically connected to the heat dissipation part, and the state sensor is used to detect the state of the shell.

[0011] As a further optional solution for the heat dissipation assembly, the housing has a flat state, a vertical holding state and a horizontal holding state;

[0012] When the housing is in the flat state, the heat dissipation portion located at one end of the first flow channel and the heat dissipation portion located at one end of the second flow channel supply air inwardly, and the heat dissipation portion located at the other end of the first flow channel and the heat dissipation portion located at the other end of the second flow channel draw air outwardly;

[0013] When the housing is in the vertical holding state, the heat dissipation portion at one end of the first flow channel supplies air inward, the heat dissipation portion at the other end of the first flow channel draws air outward, and the heat dissipation portions at both ends of the second flow channel are closed;

[0014] When the shell is in the horizontal holding state, the heat dissipation part located at one end of the second flow channel supplies air inwardly, the heat dissipation part located at the other end of the second flow channel draws air outwardly, and the heat dissipation parts located at both ends of the first flow channel are closed.

[0015] Another object of the utility model is to provide an electronic device.

[0016] The utility model provides the following technical solutions:

[0017] An electronic device comprises a heating element and the above-mentioned heat dissipation assembly, wherein the heating element is arranged in the housing and is adjacent to the first flow channel or the second flow channel.

[0018] As a further optional solution for the electronic device, the housing includes a screen and a middle frame, the first flow channel and the second flow channel are arranged in the middle frame, and heat dissipation holes are arranged on the walls of the first flow channel and the second flow channel, and the heat dissipation holes are exposed on a side of the middle frame facing the screen;

[0019] The heating element is located on a side of the middle frame facing the screen.

[0020] As a further optional solution for the electronic device, the housing includes a middle frame, a partition and a back cover which are arranged in sequence, and the first flow channel and the second flow channel are formed between the partition and the back cover;

[0021] The heating element is located on a side of the middle frame facing the partition.

[0022] As a further optional solution for the electronic device, a heat conductive member is provided on a side of the partition facing the middle frame, the heat conductive member is aligned with the first flow channel and the second flow channel respectively, and the heating element is in contact with the heat conductive member.

[0023] As a further optional solution for the electronic device, a flow guide is provided on a side of the partition facing the back cover.

[0024] As a further optional solution for the electronic device, a light bar is provided on the air guide, and the light bar is used to indicate the flow direction and flow speed of the airflow through the brightness and shape of the light;

[0025] The back cover is a transparent cover or a translucent cover.

[0026] The embodiments of the present invention have the following beneficial effects:

[0027] When the heat dissipation assembly is working, the two piezoelectric films in the heat dissipation part are deformed alternately under the action of electric current, so that air can be sucked into the cavity between the two piezoelectric films and the air in the cavity can be discharged successively, thereby exciting a high-speed impact jet in the first flow channel or the second flow channel connected to the cavity. On this basis, the heat dissipation part located at one end of the first flow channel and / or the second flow channel supplies air into the flow channel, and the heat dissipation part located at the other end of the first flow channel and / or the second flow channel draws air outward, so that air can flow in the first flow channel and / or the second flow channel, thereby extracting the heat in the shell by forced convection, which has a better heat dissipation effect than the passive heat dissipation method.

[0028] When the electronic device is used, the heat generated by the heating element is transferred to the air in the first flow channel and / or the second flow channel by radiation or conduction, and is conducted to the outside of the housing along with the flow of air, thereby achieving better heat dissipation.

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 A schematic diagram of the overall structure of an electronic device provided by an embodiment of the utility model is shown;

[0032] Figure 2 A schematic diagram of the internal structure of an electronic device provided by an embodiment of the utility model is shown;

[0033] Figure 3 A schematic diagram showing an initial state of a heat dissipation unit in an electronic device provided by an embodiment of the utility model is shown;

[0034] Figure 4 A schematic diagram showing a state of a heat dissipation part of an electronic device provided by an embodiment of the utility model when air is sucked in;

[0035] Figure 5 A schematic diagram showing a state of a heat dissipation unit in an electronic device provided by an embodiment of the utility model when exhausting air;

[0036] Figure 6 A control logic schematic diagram of an electronic device provided by an embodiment of the utility model is shown;

[0037] Figure 7 A schematic diagram showing the overall structure of an electronic device provided by another embodiment of the utility model is shown;

[0038] Figure 8 A schematic diagram of the internal structure of an electronic device provided by another embodiment of the utility model is shown.

[0039] Description of main component symbols:

[0040] 10-heat dissipation assembly; 20-heating element; 21-small board; 22-battery; 23-main board; 24-charging management chip; 25-main chip; 100-housing; 101-first flow channel; 102-second flow channel; 110-screen; 111-screen backlight driver chip; 120-middle frame; 121-heat dissipation holes; 130-partition; 131-heat conductive part; 132-flow conductive part; 133-weather vane; 140-back cover; 200-heat dissipation part; 210-piezoelectric film; 210a-first piezoelectric film; 210b-second piezoelectric film; 220-bracket; 300-temperature sensor; 400-state sensor. DETAILED DESCRIPTION

[0041] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0042] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0043] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the template herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0046] Mainstream electronic devices (such as mobile phones, tablets and other mobile terminals) generally use passive cooling mechanisms such as graphite sheets, heat pipes, and temperature spreaders to evenly disperse heat to reduce the temperature of electronic devices. Some gaming phones use fans to actively dissipate heat from major heat-generating components.

[0047] However, passive heat dissipation is limited by the size of the electronic device and has a heat dissipation limit. In addition, the heat must eventually be dissipated through natural heat dissipation methods such as convection, radiation, and conduction on the surface of the electronic device, resulting in a poor thermal experience in high-load applications.

[0048] In addition, the passive heat dissipation mechanism is mainly used for the heat-generating components of the mainboard, including the main chip, power amplifier, charging management chip, WIFI chip, etc., but it cannot effectively dissipate the heat for other heat-generating components of the electronic device (such as batteries, cameras, charging management chips on small boards, and screen driver chips).

[0049] As for using fans for active heat dissipation, it is easy to make the electronic device thicker and noisier, and different holding postures will also make the temperature of human hands higher and the experience poor.

[0050] In view of the above problems, in some embodiments, please refer to Figure 1 and Figure 2This embodiment provides a heat dissipation assembly 10 applied to electronic equipment. The heat dissipation assembly 10 includes a housing 100 and a plurality of heat dissipation parts 200 .

[0051] Specifically, the housing 100 is in a rectangular parallelepiped shape, having a length direction and a width direction. A first flow channel 101 and a second flow channel 102 are arranged in the housing 100 , the first flow channel 101 is arranged along the length direction, the second flow channel 102 is arranged along the width direction, and the first flow channel 101 and the second flow channel 102 are connected.

[0052] It can be understood that the housing 100 of the heat dissipation assembly 10 is also the housing 100 of the electronic device, or the housing 100 of the heat dissipation assembly 10 is a part of the housing of the electronic device.

[0053] When in use, the first flow channel 101 and the second flow channel 102 in the housing 100 serve as air flow channels for air circulation, and the air is used to remove heat generated by the electronic equipment.

[0054] Correspondingly, a plurality of heat dissipation portions 200 are respectively located at both ends of the first flow channel 101 and at both ends of the second flow channel 102. That is, at least one heat dissipation portion 200 is disposed at one end of the first flow channel 101, at least one heat dissipation portion 200 is disposed at the other end of the first flow channel 101, at least one heat dissipation portion 200 is disposed at one end of the second flow channel 102, and at least one heat dissipation portion 200 is disposed at the other end of the second flow channel 102.

[0055] Please combine Figure 3 Each heat dissipation part 200 includes two piezoelectric films 210. The two piezoelectric films 210 are arranged at an interval, and a cavity is formed between the two piezoelectric films 210, and the cavity is connected to the first flow channel 101 or the second flow channel 102. That is, the cavity of the heat dissipation part 200 arranged at both ends of the first flow channel 101 is connected to the first flow channel 101, and the cavity of the heat dissipation part 200 arranged at both ends of the second flow channel 102 is connected to the second flow channel 102.

[0056] When the heat dissipation assembly 10 is working, the two piezoelectric films 210 in the heat dissipation part 200 are deformed alternately under the action of electric current, so that air can be sucked into the cavity between the two piezoelectric films 210 and the air in the cavity can be discharged successively, thereby exciting a high-speed impact jet in the first flow channel 101 or the second flow channel 102 connected to the cavity. On this basis, the heat dissipation part 200 at one end of the first flow channel 101 and / or the second flow channel 102 supplies air into the flow channel, and the heat dissipation part 200 at the other end of the first flow channel 101 and / or the second flow channel 102 draws air outward, so that air can flow in the first flow channel 101 and / or the second flow channel 102, thereby extracting the heat in the housing 100 by forced convection, which has a better heat dissipation effect than the passive heat dissipation method.

[0057] Please also read Figures 3 to 5 Taking the heat dissipation unit 200 disposed at the air inlet end of the first flow channel 101 as an example, it includes a first piezoelectric film 210a and a second piezoelectric film 210b. The first piezoelectric film 210a and the second piezoelectric film 210b are arranged along the length direction of the first flow channel 101, and the second piezoelectric film 210b is located on the side of the first piezoelectric film 210a facing the first flow channel 101.

[0058] In an initial state, the first piezoelectric film 210 a and the second piezoelectric film 210 b both remain flat.

[0059] First, the first piezoelectric film 210a bends and deforms toward the second piezoelectric film 210b under the action of the current, and the second piezoelectric film 210b has no current and remains stationary. At this time, the cavity between the first piezoelectric film 210a and the second piezoelectric film 210b forms a low-pressure area, sucking in the surrounding air. Since the second piezoelectric film 210b remains stationary and blocks the air inlet end of the first flow channel 101, the air sucked into the cavity mainly comes from the side of the first piezoelectric film 210a that is away from the second piezoelectric film 210b, that is, from the outside of the housing 100.

[0060] Subsequently, the current on the first piezoelectric film 210a is reversed, so that the first piezoelectric film 210a is bent and deformed toward the second piezoelectric film 210b under the action of the current, and the second piezoelectric film 210b is bent and deformed toward the first piezoelectric film 210a under the action of the current. At this time, the cavity between the first piezoelectric film 210a and the second piezoelectric film 210b forms a high-voltage area, and the air in the cavity is squeezed out. Since the second piezoelectric film 210b is bent and deformed toward the first piezoelectric film 210a, the air inlet end of the first flow channel 101 is exposed, so most of the air in the squeezed cavity flows into the first flow channel 101, exciting a high-speed impact jet in the first flow channel 101.

[0061] Thus, by passing an alternating current into the first piezoelectric film 210 a and a pulsed unidirectional current into the second piezoelectric film 210 b , a high-speed impact jet can be continuously excited in the first flow channel 101 , causing air to flow in the first flow channel 101 .

[0062] In some embodiments, the heat dissipation unit 200 further includes two brackets 220 . The two piezoelectric films 210 are located between the two brackets 220 , one side of the two piezoelectric films 210 is connected to one of the brackets 220 , and the other side of the two piezoelectric films 210 is connected to the other bracket 220 .

[0063] At this time, the two piezoelectric films 210 and the two brackets 220 surround and form a cavity.

[0064] Please refer again Figure 1In some embodiments, the heat dissipation component 10 further includes a temperature sensor 300 , and the temperature sensor 300 is electrically connected to the heat dissipation portion 200 .

[0065] When in use, the temperature sensor 300 detects the temperature inside the housing 100. When the temperature sensor 300 detects that the temperature inside the housing 100 exceeds a preset threshold, the heat dissipation unit 200 is turned on to dissipate the heat inside the housing 100.

[0066] In addition, as the temperature in the housing 100 further increases, the wind speed and wind volume of the heat dissipation unit 200 can be further increased.

[0067] In some embodiments, the heat dissipation assembly 10 further includes a status sensor 400 , and the status sensor 400 is electrically connected to the heat dissipation portion 200 .

[0068] When in use, the state sensor 400 detects the state of the housing 100. When the housing 100 is in different states, the heat dissipation parts 200 at different positions are turned on to achieve a better heat dissipation effect.

[0069] Please combine Figure 6 Specifically, the housing 100 has a flat state, a vertical holding state and a horizontal holding state.

[0070] The flat state refers to that the housing 100 is flatly placed on the surface of other objects and is not held by a person, for example, an electronic device is placed on a desktop to charge.

[0071] Correspondingly, when the housing 100 is in a flat state, the heat dissipation portion 200 at one end of the first flow channel 101 and the heat dissipation portion 200 at one end of the second flow channel 102 supply air inwardly, and the heat dissipation portion 200 at the other end of the first flow channel 101 and the heat dissipation portion 200 at the other end of the second flow channel 102 draw air outwardly. At this time, air flows through both the first flow channel 101 and the second flow channel 102, quickly dissipating the heat in the housing 100 to the surrounding environment.

[0072] The vertical holding state refers to the user holding the housing 100 on both sides along the width direction. For example, the user uses the electronic device to browse web pages, watch short videos, etc.

[0073] Accordingly, when the housing 100 is in the vertical grip state, the heat dissipation portion 200 at one end of the first flow channel 101 supplies air inward, the heat dissipation portion 200 at the other end of the first flow channel 101 draws air outward, and the heat dissipation portions 200 at both ends of the second flow channel 102 are closed. At this time, air only flows through the first flow channel 101, preventing hot air from blowing onto the user's hands, while quickly dissipating the heat in the housing 100 to the surrounding environment.

[0074] The horizontal holding state refers to the user holding both ends of the housing 100 along the length direction. For example, the user uses the electronic device to play horizontal screen games, watch videos, etc.

[0075] When the housing 100 is in the horizontal grip state, the heat dissipation part 200 at one end of the second flow channel 102 supplies air inwards, the heat dissipation part 200 at the other end of the second flow channel 102 draws air outwards, and the heat dissipation parts 200 at both ends of the first flow channel 101 are closed. At this time, the air only flows through the second flow channel 102, which can also prevent the hot air from blowing on the user's hands, and quickly dissipate the heat in the housing 100 to the surrounding environment.

[0076] It can be understood that in some embodiments, the heat dissipation assembly 10 is provided with a temperature sensor 300 and a state sensor 400 at the same time. When in use, first determine whether the temperature inside the housing 100 exceeds a preset threshold value based on the internal temperature information of the housing 100 collected by the temperature sensor 300. If the temperature inside the housing 100 exceeds the preset threshold value, determine whether the housing 100 is held by a human hand and the holding posture of the housing 100 when held by a human hand based on the state information of the housing 100 collected by the state sensor 400, and then select a corresponding heat dissipation strategy based on the state of the housing 100.

[0077] In summary, the above-mentioned heat dissipation component 10 utilizes the heat dissipation part 200 located at one end of the first flow channel 101 and / or the second flow channel 102 to supply air into the flow channel, and the heat dissipation part 200 located at the other end of the first flow channel 101 and / or the second flow channel 102 draws air outward, so that the air flows in the first flow channel 101 and / or the second flow channel 102, thereby extracting the heat in the shell 100 by forced convection. Compared with passive heat dissipation methods such as graphite sheets, heat pipes, and temperature equalizers, it has better heat dissipation effect and can fully release the performance of electronic equipment.

[0078] In addition, the heat dissipation component 10 can intelligently adjust the heat dissipation part 200 by detecting whether the temperature inside the housing 100 is abnormal, whether the housing 100 is held, and the holding posture, which can improve the user's heating experience on the one hand, and greatly release the performance of the electronic device on the other hand. Compared with conventional air cooling, the heat dissipation component 10 can control heat dissipation according to the usage scenario, without affecting the use of electronic devices in various postures.

[0079] Please also read Figure 1 and Figure 2 In some embodiments, this embodiment also provides an electronic device, including but not limited to mobile terminals such as mobile phones and tablet computers. This embodiment is described using a mobile phone as an example.

[0080] Specifically, the electronic device includes a heating element 20 and the heat dissipation assembly 10 . The heating element 20 is disposed in a housing 100 and is adjacent to the first flow channel 101 or the second flow channel 102 .

[0081] Exemplarily, the heating element 20 includes a small board 21, a battery 22, a main board 23, a charging management chip 24, a main chip 25 (System on Chip, SOC) and a power amplifier, etc.

[0082] The small board 21, the battery 22 and the main board 23 are arranged in sequence along the length direction of the housing 100. Two charging management chips 24 are provided, one of which is provided on the small board 21, and the other charging management chip 24 and the main chip 25 are provided on the main board 23.

[0083] In addition, the temperature sensor 300 and the state sensor 400 are both arranged on the main board 23, and are electrically connected to the heat dissipation unit 200 through the main board 23. When in use, the internal temperature information of the housing 100 collected by the temperature sensor 300 and the state information of the housing 100 collected by the state sensor 400 are transmitted to the main board 23, and the main board 23 selects the corresponding heat dissipation strategy and controls the operation of the heat dissipation unit 200.

[0084] In some embodiments, the housing 100 includes a screen 110 and a middle frame 120. The screen 110 and the middle frame 120 are arranged along the thickness direction of the housing 100, the screen 110 is fixedly connected to the middle frame 120, and a screen backlight driving chip 111 is disposed on the screen 110.

[0085] The first flow channel 101 and the second flow channel 102 are disposed in the middle frame 120 , and heat dissipation holes 121 are disposed on the walls of the first flow channel 101 and the second flow channel 102 . The heat dissipation holes 121 are exposed on a side of the middle frame 120 facing the screen 110 .

[0086] Correspondingly, each heating element 20 is located on a side of the middle frame 120 facing the screen 110 .

[0087] Please also read Figure 7 and Figure 8 In other embodiments, the housing 100 includes a screen 110, a middle frame 120, a partition 130 and a back cover 140, and the screen 110, the middle frame 120, the partition 130 and the back cover 140 are sequentially arranged along the thickness direction of the housing 100. There is an air gap between the partition 130 and the back cover 140 to form a first flow channel 101 and a second flow channel 102, and both ends of the first flow channel 101 and the second flow channel 102 are closed when not in use, or when it is detected that the external environment is seriously dirty.

[0088] Correspondingly, each heating element 20 is located on a side of the middle frame 120 facing the partition 130 .

[0089] Furthermore, a heat conducting member 131 is disposed on one side of the partition plate 130 facing the middle frame 120 . The heat conducting member 131 is aligned with the first flow channel 101 and the second flow channel 102 , respectively, and the heating element 20 is in contact with the heat conducting member 131 .

[0090] When in use, the heat generated by the heating element 20 is transferred to the heat-conducting member 131 , and the heat on the heat-conducting member 131 is carried away by the airflow in the first flow channel 101 and the second flow channel 102 , thereby achieving heat dissipation.

[0091] Exemplarily, the heat conducting member 131 is a copper plate or a VC temperature averaging plate, and the heat conducting member 131 is embedded in the partition 130. In addition, the heating element 20 is in contact with the heat conducting member 131 through an interface filling material such as a heat conducting gel or a heat conducting pad.

[0092] Furthermore, a flow guide 132 is provided on a side of the partition 130 facing the rear cover 140 .

[0093] When in use, the airflow flowing between the partition 130 and the rear cover 140 is guided by the guide member 132 and flows as much as possible through the area directly facing the heating element 20, thereby further improving the heat dissipation effect.

[0094] Furthermore, a light bar is provided on the air guide 132, and the light bar is used to indicate the flow direction and flow speed of the airflow through the brightness and shape of the light.

[0095] Accordingly, the rear cover 140 is a transparent cover or a semi-transparent cover.

[0096] When the heat dissipation part 200 is turned on, the light bar switch is turned on synchronously, and the user can observe the changes in the brightness and shape of the light-emitting area of ​​the light bar through the back cover 140, so as to know the flow direction and flow rate of the airflow in the first flow channel 101 and the second flow channel 102, which is more aesthetically pleasing.

[0097] Optionally, the back cover 140 is made of transparent glass or plastic.

[0098] Optionally, a wind vane 133 is further provided on one side of the partition 130 facing the rear cover 140 . The wind vane 133 is located in the first flow channel 101 or the second flow channel 102 , and is rotatably connected to the partition 130 .

[0099] When in use, the wind vane 133 can rotate with the airflow and also indicate the direction of the airflow.

[0100] In summary, the electronic device uses the heat dissipation part 200 located at one end of the first flow channel 101 and / or the second flow channel 102 to supply air into the flow channel, and the heat dissipation part 200 located at the other end of the first flow channel 101 and / or the second flow channel 102 to draw air outward, so that the air flows in the first flow channel 101 and / or the second flow channel 102. On this basis, the heat generated by the heating element 20 is transferred to the air in the first flow channel 101 and / or the second flow channel 102 by radiation or conduction, and is guided out of the housing 100 with the flow of air, so as to achieve better heat dissipation. Compared with passive heat dissipation methods such as graphite sheets, heat pipes, and temperature averaging plates, it has a better heat dissipation effect and can fully release the performance of the electronic device.

[0101] At the same time, the electronic device can intelligently adjust the heat dissipation unit 200 by detecting whether the internal temperature of the device is abnormal, whether the device is held, and the holding posture, which can improve the user's heating experience on the one hand, and greatly release the performance of the electronic device on the other hand. Compared with conventional air cooling, the electronic device can control the heat dissipation according to the usage scenario, without affecting the use of electronic devices in various postures.

[0102] In addition, compared with the traditional heat dissipation method, the above electronic device can dissipate heat for all the heating elements 20, and the heat dissipation effect is better.

[0103] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limiting, and thus other examples of the exemplary embodiments may have different values.

[0104] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0105] The above-mentioned embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A heat dissipation component, characterized in that: It comprises a housing (100) and a plurality of heat dissipation parts (200); A first flow channel (101) is provided in the shell (100) along the length direction, and a second flow channel (102) is provided along the width direction, and the first flow channel (101) is communicated with the second flow channel (102); The plurality of heat dissipation parts (200) are respectively located at two ends of the first flow channel (101) and two ends of the second flow channel (102), and the heat dissipation parts (200) include two piezoelectric films (210) arranged at intervals, and the cavity between the two piezoelectric films (210) is connected to the first flow channel (101) or the second flow channel (102).

2. The heat dissipation assembly according to claim 1, characterized in that: The heat dissipation component (10) further comprises a temperature sensor (300), wherein the temperature sensor (300) is electrically connected to the heat dissipation portion (200).

3. The heat dissipation assembly according to claim 1, characterized in that: The heat dissipation component (10) further comprises a state sensor (400), wherein the state sensor (400) is electrically connected to the heat dissipation portion (200), and the state sensor (400) is used to detect the state of the housing (100).

4. The heat dissipation assembly according to claim 3, characterized in that: The housing (100) has a flat state, a vertical holding state and a horizontal holding state; When the shell (100) is in the flat state, the heat dissipation portion (200) located at one end of the first flow channel (101) and the heat dissipation portion (200) located at one end of the second flow channel (102) supply air inwards, and the heat dissipation portion (200) located at the other end of the first flow channel (101) and the heat dissipation portion (200) located at the other end of the second flow channel (102) draw air outwards; When the housing (100) is in the vertical holding state, the heat dissipation portion (200) located at one end of the first flow channel (101) supplies air inwards, the heat dissipation portion (200) located at the other end of the first flow channel (101) draws air outwards, and the heat dissipation portions (200) located at both ends of the second flow channel (102) are closed; When the shell (100) is in the horizontal holding state, the heat dissipation portion (200) located at one end of the second flow channel (102) supplies air inwards, the heat dissipation portion (200) located at the other end of the second flow channel (102) draws air outwards, and the heat dissipation portions (200) located at both ends of the first flow channel (101) are closed.

5. An electronic device, characterized in that: The heat dissipation assembly (10) comprises a heating element (20) and any one of claims 1 to 4, wherein the heating element (20) is arranged in the housing (100) and is adjacent to the first flow channel (101) or the second flow channel (102).

6. The electronic device according to claim 5, characterized in that: The housing (100) comprises a screen (110) and a middle frame (120); the first flow channel (101) and the second flow channel (102) are arranged on the middle frame (120); and heat dissipation holes (121) are arranged on the walls of the first flow channel (101) and the second flow channel (102); the heat dissipation holes (121) are exposed on a side of the middle frame (120) facing the screen (110); The heating element (20) is located on a side of the middle frame (120) facing the screen (110).

7. The electronic device according to claim 5, characterized in that: The housing (100) comprises a middle frame (120), a partition (130) and a back cover (140) which are arranged in sequence, and the first flow channel (101) and the second flow channel (102) are formed between the partition (130) and the back cover (140); The heating element (20) is located on a side of the middle frame (120) facing the partition (130).

8. The electronic device according to claim 7, characterized in that: A heat conducting member (131) is provided on one side of the partition (130) facing the middle frame (120); the heat conducting member (131) is aligned with the first flow channel (101) and the second flow channel (102), respectively; and the heating element (20) is in contact with the heat conducting member (131).

9. The electronic device according to claim 7, characterized in that: A flow guide (132) is provided on a side of the partition (130) facing the rear cover (140).

10. The electronic device according to claim 9, characterized in that: The guide member (132) is provided with a light bar, and the light bar is used to indicate the flow direction and flow speed of the airflow through the brightness and shape of the light; The rear cover (140) is a transparent cover or a semi-transparent cover.

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