Shell structure of electronic component

Abstract

The utility model discloses an electronic component shell structure which comprises a shell body and a coil pipe, the coil pipe is arranged in the shell body, a containing cavity used for containing an electronic component is formed in the middle of the coil pipe, the shell body is provided with an inlet and an outlet, the inlet is communicated with the first end of the coil pipe, and the outlet is communicated with the second end of the coil pipe. The coil pipe is used for containing cooling liquid. During use, electronic components are arranged in the containing cavity, cooling liquid enters the coil pipe from the inlet, takes away heat generated by the electronic components while flowing in the coil pipe and flows out of the coil pipe from the outlet, the cooling liquid is flowing, so that the cooling process is stable and effective for a long time, meanwhile, the electronic components can be rapidly cooled, and the service life of the electronic components is prolonged. Therefore, the heat dissipation efficiency of the electronic component is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical storage components, in particular to an electronic component shell structure. Background Art

[0002] At present, the conventional heat dissipation method for inductors and transformers is mainly air cooling, with a metal shell plus heat dissipation fins, and a fan or natural wind to take away the heat in the shell. Its disadvantages are: the fan has a short service life, poor reliability, and requires additional power consumption. The reliability of natural wind is poor. Air cooling cannot provide long-term, stable, effective and low-cost heat dissipation for electronic components. The temperature of the inductor, transformer and other electronic components in the shell is too high during operation, which not only fails to meet their working efficiency, but also has the risk of shutdown and burning.

[0003] Therefore, how to improve the heat dissipation efficiency of electronic components is a technical problem that technical personnel in this field currently need to solve. Utility Model Content

[0004] In view of this, the purpose of the utility model is to provide an electronic component housing structure to improve the heat dissipation efficiency of the electronic components;

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] An electronic component housing structure comprises a housing body and a coil, wherein the coil is arranged inside the housing body, and a receiving cavity for receiving the electronic component is formed in the middle of the coil, and the housing body is provided with an inlet and an outlet, wherein the inlet is connected to a first end of the coil, and the outlet is connected to a second end of the coil, and the coil is used to receive a cooling liquid.

[0007] Optionally, in the above-mentioned electronic component housing structure, the electronic component housing structure also includes a water inlet and a water outlet, the water inlet is arranged at the inlet and connected to the first end of the coil, and the water outlet is arranged at the outlet and connected to the second end of the coil.

[0008] Optionally, in the above-mentioned electronic component housing structure, the coil is S-shaped and is arranged in a spiral shape inside the housing body.

[0009] Optionally, in the above-mentioned electronic component housing structure, the number of the coils is two or more, and the two or more coils are arranged in parallel.

[0010] Optionally, in the above-mentioned electronic component housing structure, the electronic component housing structure also includes a first connector and a second connector, one end of the first connector is connected to the inlet, the other end of the first connector is connected to the first ends of two or more coils, one end of the second connector is connected to the outlet, and the other end of the second connector is connected to the second ends of two or more coils.

[0011] Optionally, in the above-mentioned electronic component housing structure, the interior of the housing body is filled with a thermally conductive insulating material.

[0012] Optionally, in the above-mentioned electronic component housing structure, the housing body is made of metal material, and an insulating member is arranged inside the electronic component housing structure, and the insulating member is used to insulate the electronic component from the housing body.

[0013] Optionally, in the above-mentioned electronic component housing structure, the housing body is made of insulating material.

[0014] The electronic component housing structure provided by the utility model, when in use, the electronic components are arranged inside the accommodating cavity, the coolant enters the coil from the inlet, takes away the heat generated by the electronic components while flowing inside the coil, and flows out of the coil from the outlet. Because the coolant is flowing, the heat dissipation process is stable and effective for a long time, and the electronic components can be quickly cooled, thereby improving the heat dissipation efficiency of the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 A schematic diagram of the structure of the first shape of the electronic component housing structure disclosed in the embodiment of the utility model in conjunction with the S-shaped coil;

[0017] Figure 2 A schematic diagram of the arrangement of the water inlet and the water outlet disclosed in the embodiment of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the second shape of the electronic component housing structure disclosed in the embodiment of the utility model in conjunction with the S-shaped coil;

[0019] Figure 4 A schematic diagram of the structure of the second shape of the electronic component housing structure disclosed in the embodiment of the utility model in conjunction with the parallel coil;

[0020] Figure 5 It is a schematic diagram of another arrangement of the water inlet and the water outlet disclosed in the embodiment of the utility model;

[0021] Figure 6 This is a schematic diagram of the structure of the S-shaped coil disclosed in the embodiment of the utility model;

[0022] Figure 7 It is a schematic diagram of the structure of the parallel coils disclosed in the embodiment of the utility model;

[0023] Figure 8 It is a schematic diagram of the structure of the parallel coil and the inductor matching disclosed in the embodiment of the utility model;

[0024] Fig. 9 This is a schematic diagram of the structure of the S-shaped coil and the inductor according to the embodiment of the utility model;

[0025] in:

[0026] Shell body 100, coil 200, water inlet nozzle 300, water outlet nozzle 400, accommodating cavity 500, first connector 600, second connector 700, inductor 800. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making novel work are within the scope of protection of the utility model.

[0028] In the description of the present invention, it should be understood that the terms "upper", "lower", "top surface", "bottom surface" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the positions or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations of the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0029] like Figure 1-Figure 5 As shown, the electronic component housing structure disclosed in the utility model includes a housing body 100 and a coil 200. The coil 200 is arranged inside the housing body 100, and the middle of the coil 200 forms a receiving cavity 500 for receiving electronic components. The housing body 100 is provided with an inlet and an outlet. The inlet is connected to the first end of the coil 200, and the outlet is connected to the second end of the coil 200. The coil 200 is used to receive a cooling liquid. Specifically, as Figure 8 and Fig. 9 As shown, the electronic components include but are not limited to the inductor 800 and transformer composed of a magnetic core and windings. The cooling liquid circulates around the electronic components, which allows the electronic components to generate higher loss heat. Therefore, the electrical density can be improved by reducing the cross-sectional area of ​​the coil of the electronic components such as the inductor 800 and the transformer, while reducing the volume of the magnetic core, so that the overall volume of the product is reduced, which is conducive to the miniaturization of the product. When the electronic component housing structure provided by the utility model is used, the electronic components are arranged inside the accommodating cavity 500, and the cooling liquid enters the coil 200 from the inlet, takes away the heat generated by the electronic components while flowing inside the coil 200, and flows out of the coil 200 from the outlet. Because the cooling liquid is flowing, its heat dissipation process is long-term, stable and effective, and the electronic components can be quickly cooled, thereby improving the heat dissipation efficiency of the electronic components.

[0030] Furthermore, the electronic component housing structure can be formed into different shapes according to the production process, and the operator can change its shape according to usage requirements, which is not limited herein.

[0031] In order to optimize the above technical solution, the electronic component housing structure also includes a water inlet 300 and a water outlet 400. The water inlet 300 is arranged at the inlet and connected to the first end of the coil 200. The water outlet 400 is arranged at the outlet and connected to the second end of the coil 200. Specifically, the number of the inlet and the outlet can be one or more, and correspondingly, the number of the water inlet 300 and the water outlet 400 can be one or more to meet various heat dissipation requirements and structural requirements of the housing body 100. Specifically, the water inlet 300 and the water outlet 400 are used to connect the coil 200 and the device for supplying circulating coolant, that is, the liquid cooling circulation system. By arranging the water nozzle, the adaptability of the electronic component housing structure can be improved. At the same time, the operator can adjust the coolant flow in the coil 200 by setting the flow regulating member at the water inlet 300 and the water outlet 400, thereby meeting the stability and high efficiency of the heat dissipation process.

[0032] In order to optimize the above technical solution, the inlet is welded to the first end of the coil 200, and the outlet is welded to the second end of the coil 200. Specifically, without arranging the water inlet nozzle 300 and the water outlet nozzle 400, the inlet, the outlet and the coil 200 can be welded, and the coil 200 and the housing body 100 are designed as an integrated unit, which can realize the stable connection between the coil 200 and the housing body 100, and realize the sealing between the coil 200 and the housing body 100, prevent the coolant from leaking from the inlet or outlet, and improve the safety and reliability of the housing structure of the electronic components.

[0033] In order to optimize the above technical solution, the water inlet nozzle 300 is threadedly connected to the inlet, the water inlet nozzle 300 is welded to the first end of the coil 200, the water outlet nozzle 400 is threadedly connected to the outlet, and the water outlet nozzle 400 is welded to the second end of the coil 200. Specifically, both the threaded connection and the welded connection can ensure the sealing of the electronic component housing structure, and the positions of the water inlet nozzle 300 and the water outlet nozzle 400 can be adjusted by threading the water inlet nozzle 300 with the inlet and the water outlet nozzle 400 with the outlet, and the water inlet nozzle 300 and the water outlet nozzle 400 are easily replaced. The replaced water inlet nozzle 300 or water outlet nozzle 400 can continue to be welded to the coil 200, thereby improving the service life of the coil 200. Specifically, because the coil 200 is directly connected to the water inlet 300 and the water outlet 400, the sealing requirements of the coil 200, the water inlet 300 and the water outlet 400 are relatively high. In order to meet the use requirements, the utility model preferably welds the coil 200, the water inlet 300 and the water outlet 400. Such an arrangement can improve the safety and use flexibility of the electronic component housing structure.

[0034] Furthermore, the above connection method is a preferred solution of the utility model, and the connection between the shell body 100 and the coil 200, the connection between the water inlet nozzle 300 and the water outlet nozzle 400 and the coil 200, and the connection between the water inlet nozzle 300 and the water outlet nozzle 400 and the shell body 100 include but are not limited to welding, threaded connection and sealant bonding.

[0035] like Figure 6 As shown, in some embodiments of the present invention, the coil 200 is S-shaped and is arranged in a spiral inside the shell body 100. Specifically, the present invention preferably arranges the coil 200 close to the inductor 800. Specifically, the coil 200 is one or more, which are wound around the inside of the shell body 100 in an S shape, and form a receiving cavity 500 inside the shell body 100, that is, the S-shaped coil 200 is used to surround the electronic components, and the liquid cooling method of the inside of the coil 200 with the coolant is used to dissipate the heat of the electronic components, which safely and reliably increases the contact area between the electronic components and the coil 200, so that the coolant passes through the coil 200 with the maximum distance, and takes away the heat generated by the electronic components when working, thereby significantly improving the heat dissipation effect of the electronic component shell structure.

[0036] like Figure 7As shown, in other embodiments of the present invention, the number of the coils 200 is two or more, and the two or more coils 200 are arranged in parallel. Specifically, the two or more coils 200 can be arranged side by side on the inner wall of the housing body 100, and correspondingly, the number of inlets, outlets, water inlet nozzles 300 and water outlet nozzles 400 is adapted to the number of the coils 200. Such an arrangement can achieve local heat dissipation of the electronic component housing structure by controlling the circulation of the coolant inside a single coil 200, thereby improving the heat dissipation flexibility of the electronic component housing structure.

[0037] Furthermore, the operator may change the number of coils 200 according to factors such as the space of the electronic component housing structure and the pressure of the water pump inputting the coolant.

[0038] In order to optimize the above technical solution, the electronic component housing structure also includes a first connector 600 and a second connector 700, one end of the first connector 600 is connected to the inlet, the other end of the first connector 600 is connected to the first ends of two or more coils 200, one end of the second connector 700 is connected to the outlet, and the other end of the second connector 700 is connected to the second ends of two or more coils 200. Specifically, taking the first connector 600 and the second connector 700 as three-way connectors as an example, at this time, the first end of the first connector 600 and the first end of the second connector 700 are connected to the inlet and the outlet respectively, the number of coils 200 is two, and they are arranged in parallel, the first ends of the two coils 200 are connected to the second end of the first connector 600 and the second end of the second connector 700 respectively, and the second ends of the two coils 200 are connected to the third end of the first connector 600 and the third end of the second connector 700 respectively. It should be noted that multiple coils 200 are connected in parallel and the liquid inlet and outlet are realized through the same water inlet nozzle 300 and water outlet nozzle 400, which can reduce the pressure difference between the inlet and outlet of the liquid cooling system, reduce the power requirements of the liquid cooling circulation system, and improve the application range of the electronic component housing structure. Furthermore, the operator can change the number of parallel coils 200 by changing the number of connectors and the number of ports, thereby increasing or decreasing the cross-sectional area of ​​the coils 200, so as to further improve the flexibility of the electronic component housing structure under the premise of improving the heat dissipation efficiency of the electronic components.

[0039] In order to optimize the above technical solution, the interior of the shell body 100 is filled with a thermally conductive insulating material. Specifically, the thermally conductive insulating material is encapsulated between the inductor 800 and the coil 200 to act as a heat transfer medium, which greatly improves the heat dissipation efficiency compared to the prior art that uses air as a heat transfer medium. Specifically, the thermally conductive insulating material includes but is not limited to thermally conductive silicone, sealant and other materials. The following description takes the thermally conductive insulating material as thermally conductive silicone as an example. When in use, the operator places the electronic components in the accommodating cavity 500 surrounded by the coil 200, and then encapsulates and molds them with thermally conductive silicone. Specifically, the electronic components that heat up inside the accommodating cavity 500 are encapsulated and fixed in the shell body 100 with the coil 200 together with the thermally conductive silicone with a high thermal conductivity. Because the thermal conductivity of the thermally conductive silicone is higher than that of air, the thermally conductive silicone can maximize the heat exchange area between the coil 200 and the heat-generating electronic components, improve the heat exchange efficiency, and allow the coolant to pass around the electronic components with the maximum distance to take away the heat generated by its work, thereby improving the heat dissipation efficiency of the electronic components. Specifically, the thermally conductive silicone can further seal the first end and the second end of the coil 200 to prevent leakage of the coolant, thereby further improving the safety of the electronic component housing structure.

[0040] In some embodiments of the present invention, the shell body 100 is made of metal material, and an insulating member is arranged inside the electronic component shell structure, and the insulating member is used to insulate the electronic component and the shell body 100. Specifically, the material of the shell body 100 includes but is not limited to metal materials such as aluminum and iron, which have the advantages of high strength and high thermal conductivity and thus good heat dissipation, but need to be insulated from the electronic components. The above-mentioned insulating member includes but is not limited to insulating coatings, insulating gaskets, etc., and the components that can achieve the insulating effect are all within the protection scope of the present invention, and will not be repeated herein.

[0041] In other embodiments of the present invention, the shell body 100 is made of insulating material. Specifically, the insulating material includes but is not limited to plastic, rubber or thermally conductive ceramic, etc., as long as the shell body 100 can be insulated, and will not be described in detail herein. When the shell body 100 is made of insulating material, the electronic components inside the accommodating cavity 500 may not be provided with insulating parts with the shell body 100, thereby achieving structural simplification and improving the reliability of the electronic component shell structure.

[0042] The advantages of the utility model are:

[0043] (1) Improved heat dissipation efficiency of electronic components;

[0044] (2) High flexibility in use;

[0045] (3) High security and reliability.

[0046] It should be noted that the electronic component housing structure provided by the present invention can be used in the field of optical storage component technology or other fields. Other fields are any fields other than the field of optical storage component technology. The above is only an example and does not limit the application field of the electronic component housing structure provided by the present invention.

[0047] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0048] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

[0049] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0050] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. An electronic component housing structure, characterized in that: The invention comprises a shell body and a coil, wherein the coil is arranged inside the shell body, and a receiving cavity for receiving electronic components is formed in the middle of the coil, and the shell body is provided with an inlet and an outlet, wherein the inlet is connected to the first end of the coil, and the outlet is connected to the second end of the coil, and the coil is used to receive a cooling liquid.

2. The electronic component housing structure according to claim 1, characterized in that: The electronic component housing structure also includes a water inlet and a water outlet. The water inlet is arranged at the inlet and connected to the first end of the coil. The water outlet is arranged at the outlet and connected to the second end of the coil.

3. The electronic component housing structure according to claim 1, characterized in that: The coil is S-shaped and spirally arranged inside the shell body.

4. The electronic component housing structure according to claim 1, characterized in that: The number of the coils is two or more, and the two or more coils are arranged in parallel.

5. The electronic component housing structure according to claim 4, characterized in that: The electronic component housing structure also includes a first connector and a second connector, one end of the first connector is connected to the inlet, the other end of the first connector is connected to the first ends of two or more coils, one end of the second connector is connected to the outlet, and the other end of the second connector is connected to the second ends of two or more coils.

6. The electronic component housing structure according to claim 1, characterized in that: The interior of the shell body is filled with heat-conducting insulating material.

7. The electronic component housing structure according to claim 1, characterized in that: The shell body is made of metal material, and an insulating member is arranged inside the electronic component shell structure, and the insulating member is used to insulate the electronic component from the shell body.

8. The electronic component housing structure according to claim 1, characterized in that: The shell body is made of insulating material.

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