A semiconductor refrigeration sheet mechanism and temperature control device

Abstract

The present application provides a semiconductor refrigeration mechanism and a temperature control device. The semiconductor refrigeration mechanism includes heat dissipation fins, a semiconductor refrigeration fin, a heat dissipation plate, a first fan and a pipe fitting. The output end of the semiconductor refrigeration fin exchanges heat with a support portion. The heat dissipation plate contacts the heat dissipation end of the semiconductor refrigeration fin. The heat dissipation plate is located on the outside of the heat dissipation fin and conducts heat to the external environment. The first fan is arranged at one end of the heat dissipation fin and is arranged relative to the fin portion. The air outlet end of the first fan faces the fin portion and outputs air to the fin portion. The pipe fitting is arranged at the other end of the heat dissipation fin. The pipe fitting is provided with an air duct. The air duct is connected to the air outlet end of the first fan through the fin groove of the fin portion. Cold air or hot air is output based on the semiconductor refrigeration fin, the fan and the pipe fitting to facilitate subsequent cooling by cold air, or heating by hot air, thereby achieving temperature control, avoiding only the heating function to control the temperature, and improving the temperature control effect of the semiconductor refrigeration mechanism.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature control equipment, in particular to a semiconductor refrigeration sheet mechanism and temperature control equipment. Background Art

[0002] With the development of science and technology, temperature control equipment is used in industry. Temperature control equipment undergoes physical deformation inside the switch according to the temperature change of the working environment, thereby producing certain special effects, a series of automatic control elements that produce on or off actions, or electronic components provide temperature data to the circuit based on different principles of working conditions at different temperatures. In the prior art, the existing temperature control equipment includes a heater and a heat sink. The heater is connected to the heat sink, and the heat output by the heater is conducted to the electronic components through the heat sink. However, only the heating function is used to control the temperature of the electronic components, resulting in poor temperature control effect of the existing temperature control equipment. Utility Model Content

[0003] The utility model aims to provide a semiconductor refrigeration mechanism and temperature control equipment, wherein the heat dissipation fin is provided with a fin part and a support part; the support part is located above the fin part, and the support part is connected to the fin part; the semiconductor refrigeration fin is arranged on the support part; the semiconductor refrigeration fin is provided with an output end and a heat dissipation end, and the output end of the semiconductor refrigeration fin is attached to the support part and performs heat exchange with the support part; a heat dissipation plate is arranged on one side of the semiconductor refrigeration fin and contacts the heat dissipation end of the semiconductor refrigeration fin; the heat dissipation plate is located on the outside of the heat dissipation fin and conducts heat to the external environment; a first fan is arranged at one end of the heat dissipation fin and is arranged relative to the fin part The air outlet end of the first fan faces the fin part and outputs air to the fin part; the pipe fitting is arranged at the other end of the heat dissipation fin, and the pipe fitting is provided with an air duct, which is connected to the air outlet end of the first fan through the fin groove of the fin part. Based on the semiconductor refrigeration sheet, the fan and the pipe fitting, cold air or hot air is output to facilitate subsequent cooling by cold air, or heating by hot air, so as to realize temperature control, avoid only heating function to control temperature, improve the temperature control effect of the semiconductor refrigeration sheet mechanism, and at the same time, in order to ensure the service life of the semiconductor refrigeration sheet, the heat conductor is located on the outside of the heat dissipation fin and conducts heat to the external environment.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A semiconductor refrigeration sheet mechanism is applied to a temperature control device; the semiconductor refrigeration sheet mechanism comprises:

[0006] The heat dissipation fin is provided with a fin portion and a support portion; the support portion is located above the fin portion, and the support portion is connected to the fin portion;

[0007] A semiconductor refrigeration sheet is arranged on the support portion; the semiconductor refrigeration sheet is provided with an output end and a heat dissipation end, the output end of the semiconductor refrigeration sheet is attached to the support portion and performs heat exchange with the support portion;

[0008] A heat sink is arranged on one side of the semiconductor cooling sheet and contacts the heat dissipation end of the semiconductor cooling sheet; the heat sink is located outside the heat dissipation fins and conducts heat to the external environment;

[0009] A first fan is provided at one end of the heat dissipation fin and arranged relative to the fin portion, wherein an air outlet end of the first fan faces the fin portion and outputs air to the fin portion;

[0010] A pipe fitting is arranged at the other end of the heat dissipation fin, and the pipe fitting is provided with an air duct, and the air duct is connected to the air outlet end of the first fan through the fin groove of the fin part.

[0011] Optionally, the semiconductor refrigeration sheet has two states, namely a cooling state and a heating state;

[0012] When the semiconductor refrigeration chip is in a cooling state, the output end of the semiconductor refrigeration chip exchanges heat with the heat dissipation fins and reduces the temperature of the heat dissipation fins, so that the fin slots contain cold air;

[0013] When the semiconductor refrigeration chip is in a heating state, the output end of the semiconductor refrigeration chip exchanges heat with the heat dissipation fins and increases the temperature of the heat dissipation fins, so that the fin slots contain hot air.

[0014] Optionally, the output end of the semiconductor refrigeration plate serves as the lower side of the semiconductor refrigeration plate and is adhered to the surface of the support portion facing away from the fin portion through thermally conductive silicone grease.

[0015] Optionally, the semiconductor refrigeration plate mechanism further includes a plastic heat insulation plate, which is located on the peripheral side of the semiconductor refrigeration plate and fixed to the support portion.

[0016] Optionally, the plastic insulation board is arranged in a C shape, and has a receiving groove and an opening, the receiving groove receives the semiconductor cooling plate, and the opening is connected to the receiving groove and is used for the electrodes of the semiconductor cooling plate to pass through.

[0017] Optionally, the heat sink is mounted on the plastic heat insulation board and is located above the heat dissipation end of the semiconductor refrigeration sheet;

[0018] The heat sink covers the heat dissipation end of the semiconductor refrigeration plate and contacts the heat dissipation end of the semiconductor refrigeration plate, so that the heat sink performs heat exchange with the heat dissipation end of the semiconductor refrigeration plate.

[0019] Optionally, the fin portion is provided with a plurality of fin slots, which are arranged at intervals along the width direction of the fin portion and face the air outlet end of the first fan; and the air duct is connected to the plurality of fin slots.

[0020] Optionally, a support frame is provided between the first fan and the heat dissipation fins, the support frame is fixed to a support portion of the heat dissipation fins and supports the first fan;

[0021] The support frame is provided with a through hole, and the through hole is arranged relative to the air outlet end of the first fan.

[0022] Optionally, the pipes are arranged in a square shape, and the air duct is a rectangular air duct; a circuit board is supported on the upper surface of the pipe; the circuit board and the semiconductor refrigeration plate are in the same height space and are electrically connected to each other.

[0023] A temperature control device comprises the semiconductor refrigeration plate mechanism.

[0024] Compared with the prior art, the beneficial effects of the utility model are:

[0025] The utility model provides a semiconductor refrigeration mechanism and temperature control equipment, wherein the heat dissipation fin is provided with a fin part and a support part; the support part is located above the fin part, and the support part is connected to the fin part; the semiconductor refrigeration fin is arranged on the support part; the semiconductor refrigeration fin is provided with an output end and a heat dissipation end, and the output end of the semiconductor refrigeration fin is attached to the support part and performs heat exchange with the support part; a heat dissipation plate is arranged on one side of the semiconductor refrigeration fin and contacts the heat dissipation end of the semiconductor refrigeration fin; the heat dissipation plate is located on the outside of the heat dissipation fin and conducts heat to the external environment; a first fan is arranged at one end of the heat dissipation fin and is arranged relative to the fin part, and the first The air outlet end of the fan faces the fin part and outputs air to the fin part; the pipe fitting is arranged at the other end of the heat dissipation fin, and the pipe fitting is provided with an air duct, which is connected to the air outlet end of the first fan through the fin groove of the fin part. Based on the semiconductor refrigeration plate, the fan and the pipe fitting, cold air or hot air is output to facilitate subsequent cooling by cold air, or heating by hot air, so as to achieve temperature control, avoid only heating function to control the temperature, improve the temperature control effect of the semiconductor refrigeration plate mechanism, and at the same time, in order to ensure the service life of the semiconductor refrigeration plate, the heat conductor is located on the outside of the heat dissipation fin and conducts heat to the external environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0027] In order to more completely understand the present application and its beneficial effects, the following description will be made in conjunction with the accompanying drawings. In the following description, the same reference numerals represent the same parts.

[0028] Figure 1 A schematic diagram of a semiconductor refrigeration plate mechanism according to an embodiment of the present application is shown.

[0029] Figure 2 Shows Figure 1 A partial enlarged view of point A in the middle.

[0030] Figure 3 Another state schematic diagram of the semiconductor refrigeration plate mechanism of an embodiment of the present application is shown.

[0031] Figure 4 A schematic diagram of a semiconductor refrigeration plate of a semiconductor refrigeration plate mechanism according to an embodiment of the present application is shown.

[0032] Figure 5 A schematic diagram of a plastic heat insulation board of a semiconductor refrigeration plate mechanism according to an embodiment of the present application is shown.

[0033] Reference numerals

[0034] 100. Semiconductor refrigeration unit;

[0035] 10. heat dissipation fin; 11. fin portion; 11a. fin groove; 12. support portion;

[0036] 20. Semiconductor cooling chip; 21. Output end; 22. Heat dissipation end;

[0037] 30. Radiator;

[0038] 40. first fan; 41. support frame; 41a. through hole;

[0039] 50. Pipe fittings; 51. Air duct; 52. Circuit board;

[0040] 60, plastic heat insulation board; 60a, receiving groove; 60b, opening;

[0041] 70. Second fan. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0043] Figures 1 to 5 The embodiment of the present application provides a semiconductor refrigeration sheet mechanism 100. The semiconductor refrigeration sheet mechanism 100 is a part of a temperature control device. The semiconductor refrigeration sheet mechanism 100 is used for subsequent cooling by cold air, or heating by hot air, so as to achieve temperature control. The semiconductor refrigeration sheet mechanism 100 includes a heat dissipation fin 10, a semiconductor refrigeration sheet 20, a heat dissipation plate 30, a first fan 40 and a pipe 50. The semiconductor refrigeration sheet 20 is arranged on the upper side of the heat dissipation fin 10, the heat dissipation plate 30 is arranged on the upper side of the semiconductor refrigeration sheet 20, and the first fan 40 and the pipe 50 are respectively arranged on the right and left sides of the heat dissipation fin 10.

[0044] In the embodiment of the present application, the heat dissipation fin 10 is provided with a fin portion 11 and a support portion 12; the support portion 12 is located above the fin portion 11, and the support portion 12 is connected to the fin portion 11 to facilitate heat conduction between the support portion 12 and the fin portion 11, thereby facilitating the fin portion 11 to enhance air flow and improve heat exchange efficiency.

[0045] In the embodiment of the present application, the semiconductor refrigeration sheet 20 is arranged on the support portion 12; the semiconductor refrigeration sheet 20 is provided with an output end 21 and a heat dissipation end 22, the heat dissipation end 22 is located on the upper side of the output end 21, the output end 21 of the semiconductor refrigeration sheet 20 is attached to the support portion 12, and performs heat exchange with the support portion 12, so that the hot air output from the output end 21 of the semiconductor refrigeration sheet 20 is conducted to the heat dissipation fins 10 through the support portion 12, or the cold air output from the output end 21 of the semiconductor refrigeration sheet 20 is conducted to the heat dissipation fins 10 through the support portion 12.

[0046] In the embodiment of the present application, the heat sink 30 is arranged on the upper side of the semiconductor refrigeration sheet 20 and contacts the heat dissipation end 22 of the semiconductor refrigeration sheet 20; the heat sink 30 is located on the outside of the heat dissipation fins 10 and conducts heat to the external environment, so that the semiconductor refrigeration sheet 20 can dissipate heat through the heat sink 30.

[0047] In the embodiment of the present application, the first fan 40 is disposed at the right end of the heat dissipation fin 10 and is arranged relative to the fin portion 11. The air outlet end of the first fan 40 faces the fin portion 11 and outputs wind to the fin portion 11, so that the cold air or hot air in the fin portion 11 can accelerate the flow speed under the action of the first fan 40, thereby facilitating the cold air or hot air in the fin portion 11 to flow along the wind direction output by the air outlet end of the first fan 40.

[0048] In the embodiment of the present application, the pipe fitting 50 is arranged on the side of the heat dissipation fin 10 facing away from the first fan 40, and the pipe fitting 50 is provided with an air duct 51. The air duct 51 is connected to the air outlet end of the first fan 40 through the fin groove 11a of the fin part 11, so that the wind output from the air outlet end of the first fan 40 flows to the air duct 51 through the fin groove 11a of the fin part 11, thereby facilitating the cold air or hot air of the fin part 11 to flow to the air duct 51. Based on the semiconductor refrigeration plate 20, the fan and the pipe fitting 50 output cold air or hot air, so as to facilitate subsequent cooling by cold air, or heating by hot air, so as to realize temperature control, avoid only the heating function to control the temperature, and improve the temperature control effect of the semiconductor refrigeration plate mechanism 100.

[0049] The semiconductor refrigeration chip 20 has two states, namely, a cooling state and a heating state. When the semiconductor refrigeration chip 20 is in the cooling state, the output end 21 of the semiconductor refrigeration chip 20 exchanges heat with the heat dissipation fin 10 and reduces the temperature of the heat dissipation fin 10, so that the fin slot 11a contains cold air, so that the cold air at the output end 21 of the semiconductor refrigeration chip 20 is conducted to the fin slot 11a.

[0050] When the semiconductor refrigerator 20 is in a heating state, the output end 21 of the semiconductor refrigerator 20 exchanges heat with the heat sink fins 10 and increases the temperature of the heat sink fins 10, so that the fin slots 11a contain hot air, so that the hot air at the output end 21 of the semiconductor refrigerator 20 is conducted to the fin slots 11a, thereby facilitating subsequent cooling by cold air, or heating by hot air, thereby achieving temperature control, avoiding only the heating function to control the temperature, and improving the temperature control effect of the semiconductor refrigerator mechanism 100.

[0051] The output end 21 of the semiconductor refrigeration chip 20 serves as the lower side surface of the semiconductor refrigeration chip 20 and is adhered to the surface of the support portion 12 facing away from the fin portion 11 through thermal conductive silicone grease, so that the semiconductor refrigeration chip 20 can achieve heat exchange with the support portion 12 through the thermal conductive silicone grease, thereby facilitating the hot air or cold air output from the output end 21 of the semiconductor refrigeration chip 20 to be conducted to the fin portion 11 through the support portion 12.

[0052] The semiconductor refrigeration plate mechanism 100 also includes a plastic insulation board 60, which is located on the peripheral side of the semiconductor refrigeration plate 20 and is fixed to the support portion 12, so that the plastic insulation board 60 surrounds the peripheral side of the semiconductor refrigeration plate 20, thereby preventing the semiconductor refrigeration plate 20 from diffusing heat through the plastic insulation board 60 and improving energy efficiency.

[0053] The plastic insulation board 60 is arranged in a C shape and has a receiving groove 60a and an opening 60b. The inner contour of the receiving groove 60a is adapted to the outer contour of the semiconductor cooling plate 20. The receiving groove 60a receives the semiconductor cooling plate 20, and the opening 60b is connected to the receiving groove 60a to facilitate the semiconductor cooling plate 20 to enter the receiving groove 60a through the opening 60b. The opening 60b is for the electrodes of the semiconductor cooling plate 20 to pass through.

[0054] The heat sink 30 is installed on the plastic insulation board 60 and is located above the heat dissipation end 22 of the semiconductor refrigeration sheet 20, so that the heat sink 30 is fixed to the upper side of the plastic insulation board 60; the heat sink 30 covers the heat dissipation end 22 of the semiconductor refrigeration sheet 20 and contacts the heat dissipation end 22 of the semiconductor refrigeration sheet 20, so that the heat sink 30 and the heat dissipation end 22 of the semiconductor refrigeration sheet 20 can exchange heat, so that the heat of the heat dissipation end 22 of the semiconductor refrigeration sheet 20 can be transferred to the external environment through the heat sink 30, so as to realize the heat dissipation of the semiconductor refrigeration sheet 20 and ensure the performance of the semiconductor refrigeration sheet 20.

[0055] The fin portion 11 is provided with a plurality of fin slots 11a, and the plurality of fin slots 11a are arranged at intervals along the width direction of the fin portion 11 and face the air outlet end of the first fan 40; the air duct 51 is connected with the plurality of fin slots 11a, so that the wind output from the air outlet end of the first fan 40 flows to the air duct 51 through the plurality of fin slots 11a, thereby facilitating the wind to drive the hot air or cold air of the plurality of fin slots 11a to flow to the air duct 51, thereby achieving temperature control, avoiding only the heating function to control the temperature, and improving the temperature control effect of the semiconductor refrigeration plate mechanism 100.

[0056] A support frame 41 is provided between the first fan 40 and the heat dissipation fins 10. The support frame 41 is fixed to the support portion 12 of the heat dissipation fins 10 and supports the first fan 40 so that the first fan 40 can be connected to the heat dissipation fins 10 through the support frame 41. The support frame 41 is provided with a through hole 41a, and the through hole 41a is arranged relative to the air outlet end of the first fan 40. The air output from the air outlet end of the first fan 40 flows to the heat dissipation fins 10 through the hole 41a, thereby preventing the support frame 41 from blocking the air output from the output end 21 of the first fan 40. Optionally, the support frame 41 is L-shaped.

[0057] The semiconductor refrigeration fin mechanism 100 also includes a second fan 70, which is arranged on the side of the heat dissipation fin 10 facing away from the first fan 40. The second fan 70 is connected to the heat dissipation fin 10, and the output end of the second fan 70 faces the air duct 51, so that the cold air or hot air of the fin part 11 can further accelerate the flow speed under the action of the second fan 70.

[0058] The pipe fittings 50 are arranged in a square shape, and the air duct 51 is a rectangular air duct; the upper surface of the pipe fittings 50 supports a circuit board 52; the circuit board 52 and the semiconductor refrigeration sheet 20 are in the same height space and are electrically connected to each other so that the circuit board 52 and the semiconductor refrigeration sheet 20 can be powered on, and the circuit board 52 serves as a carrier for the electrical connection of the semiconductor refrigeration sheet 20.

[0059] In another embodiment, a temperature control device includes a semiconductor refrigeration plate mechanism 100. The semiconductor refrigeration plate mechanism 100 is a part of the temperature control device. The temperature control device is used to control the electronic components at different temperatures and different working states to provide temperature data to the circuit.

[0060] Compared with the prior art, the beneficial effects of the utility model are:

[0061] The utility model provides a semiconductor refrigeration sheet mechanism 100 and a temperature control device, wherein a heat dissipation fin 10 is provided with a fin portion 11 and a support portion 12; the support portion 12 is located above the fin portion 11, and the support portion 12 is connected to the fin portion 11; a semiconductor refrigeration sheet 20 is provided on the support portion 12; the semiconductor refrigeration sheet 20 is provided with an output end 21 and a heat dissipation end 22, the output end 21 of the semiconductor refrigeration sheet 20 is attached to the support portion 12, and heat is exchanged with the support portion 12; a heat dissipation plate 30 is provided on one side of the semiconductor refrigeration sheet 20, and contacts the heat dissipation end 22 of the semiconductor refrigeration sheet 20; the heat dissipation plate 30 is located on the outside of the heat dissipation fin 10, and conducts heat to the external environment; a first fan 40 is provided at one end of the heat dissipation fin 10, and is relative to the heat dissipation end 22 of the semiconductor refrigeration sheet 20. The fin portion 11 is arranged, and the air outlet end of the first fan 40 faces the fin portion 11 and outputs air to the fin portion 11; the pipe fitting 50 is arranged at the other end of the heat dissipation fin 10, and the pipe fitting 50 is provided with an air duct 51, and the air duct 51 is connected to the air outlet end of the first fan 40 through the fin groove 11a of the fin portion 11. Based on the semiconductor refrigeration plate 20, the fan and the pipe fitting 50 output cold air or hot air, so as to facilitate subsequent cooling by cold air, or warming by hot air, so as to achieve temperature control, avoid only the heating function to control the temperature, improve the temperature control effect of the semiconductor refrigeration plate mechanism 100, and at the same time, in order to ensure the service life of the semiconductor refrigeration plate 20, the heat conductor is located on the outside of the heat dissipation fin 10 and conducts heat to the external environment.

[0062] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0063] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features.

[0064] Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A semiconductor refrigeration unit, characterized in that: Applicable to temperature control equipment; the semiconductor refrigeration sheet mechanism comprises: The heat dissipation fin is provided with a fin portion and a support portion; the support portion is located above the fin portion, and the support portion is connected to the fin portion; A semiconductor refrigeration sheet is arranged on the support portion; the semiconductor refrigeration sheet is provided with an output end and a heat dissipation end, and the output end of the semiconductor refrigeration sheet is attached to the support portion and performs heat exchange with the support portion; A heat sink is arranged on one side of the semiconductor cooling sheet and contacts the heat dissipation end of the semiconductor cooling sheet; the heat sink is located outside the heat dissipation fins and conducts heat to the external environment; A first fan is provided at one end of the heat dissipation fin and arranged relative to the fin portion, wherein an air outlet end of the first fan faces the fin portion and outputs air to the fin portion; A pipe fitting is arranged at the other end of the heat dissipation fin, and the pipe fitting is provided with an air duct, and the air duct is connected to the air outlet end of the first fan through the fin groove of the fin part.

2. The semiconductor refrigeration unit according to claim 1, characterized in that: The semiconductor refrigeration sheet has two states, namely, a cooling state and a heating state; When the semiconductor refrigeration chip is in a cooling state, the output end of the semiconductor refrigeration chip exchanges heat with the heat dissipation fins and reduces the temperature of the heat dissipation fins, so that the fin slots contain cold air; When the semiconductor refrigeration chip is in a heating state, the output end of the semiconductor refrigeration chip exchanges heat with the heat dissipation fins and increases the temperature of the heat dissipation fins, so that the fin slots contain hot air.

3. The semiconductor refrigeration sheet mechanism according to claim 2, characterized in that: The output end of the semiconductor refrigeration plate serves as the lower side of the semiconductor refrigeration plate and is attached to the surface of the support portion facing away from the fin portion through thermally conductive silicone grease.

4. The semiconductor refrigeration sheet mechanism according to claim 2, characterized in that: The semiconductor refrigeration plate mechanism also includes a plastic heat insulation plate, which is located on the peripheral side of the semiconductor refrigeration plate and fixed to the supporting part.

5. The semiconductor refrigeration sheet mechanism according to claim 4, characterized in that: The plastic heat insulation board is arranged in a C shape and has a receiving groove and an opening. The receiving groove receives the semiconductor cooling plate, and the opening is connected to the receiving groove and is used for the electrodes of the semiconductor cooling plate to pass through.

6. The semiconductor refrigeration sheet mechanism according to claim 4, characterized in that: The heat sink is mounted on the plastic heat insulation board and is located above the heat dissipation end of the semiconductor refrigeration sheet; The heat sink covers the heat dissipation end of the semiconductor refrigeration plate and contacts the heat dissipation end of the semiconductor refrigeration plate, so that the heat sink performs heat exchange with the heat dissipation end of the semiconductor refrigeration plate.

7. The semiconductor refrigeration sheet mechanism according to any one of claims 1 to 6, characterized in that: The fin portion is provided with a plurality of fin slots, which are arranged at intervals along the width direction of the fin portion and face the air outlet end of the first fan; and the air duct is connected with the plurality of fin slots.

8. The semiconductor refrigeration sheet mechanism according to claim 7, characterized in that: A support frame is provided between the first fan and the heat dissipation fins, the support frame is fixed to the support portion of the heat dissipation fins and supports the first fan; The support frame is provided with a through hole, and the through hole is arranged relative to the air outlet end of the first fan.

9. The semiconductor refrigeration sheet mechanism according to claim 1, characterized in that: The pipes are arranged in a square shape, and the air duct is a rectangular air duct; a circuit board is supported on the upper surface of the pipe; the circuit board and the semiconductor refrigeration plate are in the same height space and are electrically connected to each other.

10. A temperature control device, characterized in that: It comprises a semiconductor refrigeration plate mechanism as described in any one of claims 1 to 9.

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