Aging test equipment

Abstract

The utility model relates to an aging test device. During the aging test, a resource board in a resource cavity is docked with an aging board in a test cavity through a transfer board, so that the power supply and control signal provided by the resource board can be transmitted to the aging board through the transfer board. When the transfer board needs to be replaced, the guide cover is first removed, and then the old transfer board is pulled out of the limit groove in a direction away from the insulation board. Then, the first end of the new transfer board is inserted from the opening of the limit groove until the first end of the transfer board extends from the other side opening and passes through the insulation board, and the transfer board and the inner wall of the limit groove are sealed and matched in place. The guide cover is reinstalled on the support base to complete the replacement of the transfer board. It can be seen that the above-mentioned aging test device only needs to disassemble and assemble the guide cover and plug and unplug the transfer board during the process of replacing the transfer board, which is convenient to operate.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to an aging testing device. Background Art

[0002] Common aging test devices are provided with a resource chamber and a test chamber, and the resource chamber and the test chamber are generally separated by an insulation board. The resource chamber is used to accommodate a resource board that provides power and control signals, and the test chamber can be used to accommodate an aging board. In addition, a transfer board that passes through the insulation board is also required to transmit information between the resource board and the aging board. After multiple plugging and unplugging between the transfer board and the aging board, the transfer board may be severely worn, and the transfer board needs to be replaced regularly. However, since a reliable seal is required between the transfer board and the insulation board, the transfer board is difficult to disassemble and assemble, and replacement is inconvenient. Utility Model Content

[0003] Based on this, it is necessary to provide an aging test device that is convenient for replacing the transfer board to address the above problems.

[0004] An aging test device, comprising:

[0005] A box body is formed with a resource cavity and a test cavity separated by a heat insulation board, the test cavity is used to accommodate the aging board, and the resource cavity is used to accommodate the resource board; and

[0006] The board communication component comprises a transfer board, a support base and a guide cover, wherein the transfer board has a first end for installing a gold finger and a second end for installing a connector; the support base is installed on one side of the heat insulation board, and a limit groove with openings on both sides is formed on the support base;

[0007] Among them, the transfer plate is inserted into the limiting groove and the first end of the transfer plate passes through the limiting groove through the heat insulation plate, and the transfer plate forms a sealing fit with the inner wall of the limiting groove during the process of passing through the limiting groove; the guide cover is detachably mounted on the support base and is configured to prevent the transfer plate from withdrawing from the limiting groove.

[0008] In one embodiment, the support base is installed on a side of the heat insulation board facing the test cavity.

[0009] In one of the embodiments, a plurality of the connectors are arranged in parallel at the second end of the transfer board, and the insertion gaps of some of the connectors are smaller than the insertion gaps of the remaining connectors.

[0010] In one of the embodiments, a fool-proof structure cooperating with the transfer plate is provided in the limiting groove.

[0011] In one of the embodiments, a first sealing rubber ring is provided on the second end of the transfer plate, and the first sealing rubber ring is clamped between the transfer plate and the limiting groove so that the outer wall of the transfer plate and the inner wall of the limiting groove are sealed together.

[0012] In one embodiment, the first sealing rubber ring is bonded to the outer wall of the transfer plate.

[0013] In one of the embodiments, the board-to-card communication assembly further includes a second sealing rubber ring, which is clamped between the support base and the heat insulation board, and extends along the circumference of the transfer board.

[0014] In one of the embodiments, a sealing groove is formed on the surface of the support base facing the heat insulation board, and the second sealing rubber ring is received in the sealing groove.

[0015] In one embodiment, the guide cover and the limiting groove are arranged to form a receiving space for accommodating the connector, and a guide hole communicating with the receiving space is provided at a position corresponding to the guide cover and the connector.

[0016] In one of the embodiments, an operating notch for exposing the transfer plate is formed on an opening edge of the limiting groove toward the guide cover.

[0017] The above-mentioned aging test device connects the resource board in the resource cavity with the aging board in the test cavity through the transfer board during the aging test, so the power supply and control signal provided by the resource board can be transmitted to the aging board through the transfer board. When the transfer board needs to be replaced, first remove the guide cover, and then pull the old transfer board out of the limit groove in the direction away from the insulation board. Next, insert the first end of the new transfer board from the opening of the limit groove until the first end of the transfer board extends from the opening on the other side and passes through the insulation board, and the transfer board and the inner wall of the limit groove are sealed and matched in place. Reinstall the guide cover on the support base to complete the replacement of the transfer board. It can be seen that the above-mentioned aging test device only needs to disassemble and assemble the guide cover and plug and unplug the transfer board during the process of replacing the transfer board, which is convenient to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 This is a schematic diagram of a module of a testing device in one embodiment of the utility model;

[0020] Figure 2 for Figure 1 The test device shown includes a schematic diagram of a portion of the structure of the board communication component and the heat shield;

[0021] Figure 3 for Figure 2 A cross-sectional view of the partial structure shown along AA;

[0022] Figure 4 for Figure 3 An enlarged schematic diagram of layout B in the cross-sectional view shown;

[0023] Figure 5 An exploded view of a board communication component in a preferred embodiment of the utility model;

[0024] Figure 6 for Figure 5 The assembly diagram of the board communication component shown;

[0025] Figure 7 for Figure 6 A cross-sectional view of the communication assembly of the board shown. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0029] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0031] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0032] See also Figure 1 and Figure 2 The aging test device 10 in the preferred embodiment of the utility model includes a board communication component 100 and a box 200.

[0033] A resource chamber 201 and a test chamber 202 are formed in the box 200. The resource chamber 201 is used to accommodate the resource board 210 and other devices for testing, and the test chamber 202 can maintain the required temperature and is used to accommodate the aging board 220 to be loaded with a number of chips to be tested. The heat insulation board 230 is arranged between the resource chamber 201 and the test chamber 202 to isolate the resource chamber 201 from the test chamber 202. The heat insulation board 230 is generally arranged as a sandwich structure, and a heat insulation material layer is arranged in the middle to reduce the efficiency of heat exchange between the resource chamber 201 and the test chamber 202.

[0034] The board communication assembly 100 is mounted on the heat insulation board 230 and is used to connect the resource board 210 in the resource cavity 201 and the aging board 220 in the test cavity 202. In this way, the power supply and control signal provided by the resource board 210 can be transmitted to the aging board 220 through the board communication assembly 100 to complete the aging test procedure.

[0035] In addition, a plurality of board communication components 100 spaced apart from each other are generally provided on the heat insulation board 230. The plurality of board communication components 100 can respectively connect the plurality of resource boards 210 with the plurality of aging boards 220. Therefore, the testing device 10 can perform aging tests on the chips on the plurality of aging boards 220 at the same time.

[0036] Please also read Figure 5 , Figure 6 and Figure 7 The board-card communication assembly 100 in the preferred embodiment of the present invention includes a transfer board 110 , a support base 120 and a guide cover 130 .

[0037] The transfer board 110 is a core component of the board communication assembly 100, on which a number of integrated circuits are formed, which can play a role in signal transfer. The transfer board 110 has a first end and a second end opposite to each other, and a gold finger 111 is installed on the first end, and a connector 112 is installed on the second end. Among them, one of the gold finger 111 and the connector 112 is used to connect to the resource board 210, and the other is used to connect to the aging board 220.

[0038] Specifically, in this embodiment, the transfer board 110 is connected to the aging board 220 through the connector 112, and is connected to the resource board 210 through the gold finger 111. The gold finger 111 and the connector 112 can be quickly plugged and unplugged with the ports of the resource board 210 and the aging board 220, respectively, so it is convenient to disassemble and assemble the transfer board 110 with the resource board 210 and the aging board 220.

[0039] Obviously, when the port types of the resource board 210 and the aging board 220 are interchanged, the transfer board 110 can also be connected to the resource board 210 through the connector 112 and connected to the aging board 220 through the gold finger 111 .

[0040] The support base 120 is installed on one side of the heat insulation board 230 and supports the transfer board 110. The support base 120 can be installed on the heat insulation board 230 by screws, and can be positioned on the heat insulation board 230 by positioning pins. Further, the support base 120 is formed with a limiting groove 121 with openings on both sides. The opening on one side of the limiting groove 121 is located on the side of the support base 120 facing away from the heat insulation board 230, and the opening on the other side is located on the side of the support base 120 facing the heat insulation board 230. Moreover, the transfer board 110 is inserted into the limiting groove 121 and the first end of the transfer board 110 passes through the heat insulation board 230 through the limiting groove 121.

[0041] The heat insulation board 230 is provided with a passage for the transfer board 110 to pass through, and the first end of the transfer board 110 extending from the limit groove 121 can pass through the heat insulation board 230 through the passage. Since the connection with the resource board 210 is achieved through the gold finger 111 in this embodiment, and the connection with the aging board 220 is achieved through the connector 112, the first end provided with the gold finger 111 extends into the resource cavity 201 after passing through the heat insulation board 230, and the second end provided with the connector 112 is located in the test cavity 202. Therefore, in this embodiment, the support base 120 is installed on the side of the heat insulation board 230 facing the test cavity 202. That is, the support base 120 is located in the test cavity 202.

[0042] The gold finger 111 extending into the resource cavity 201 is connected to the resource board 210. When performing the aging test, the aging board 220 loaded with chips in the test cavity 202 can be driven to move toward the second end of the transfer board 110 until the port of the aging board 220 is docked with the connector 112; after the test is completed, the aging board 220 is driven to move in the opposite direction until the port of the aging board 220 is separated from the connector 112.

[0043] Furthermore, the transfer plate 110 forms a sealing fit with the inner wall of the limiting groove 121 during the process of passing through the limiting groove 121. When assembling the transfer plate 110, the first end of the transfer plate 110 can be inserted into the limiting groove 121 from the opening of the limiting groove 121 facing away from the heat insulation board 230, and the first end can extend from the other side opening and pass through the heat insulation board 230. A limiting structure (not shown), such as a limiting step, can be provided in the limiting groove 121. After the transfer plate 110 is assembled in place in the limiting groove 121, the limiting structure can prevent the transfer plate 110 from continuing to move toward the heat insulation board 230.

[0044] Moreover, after the transfer plate 110 is assembled in place in the limiting groove 121, the outer wall of the transfer plate 110 can form a sealing structure with the inner wall of the limiting groove 121. In this way, it is possible to avoid the gap between the transfer plate 110 and the limiting groove 121, thereby preventing the sealing performance between the resource cavity 201 and the test cavity 201 from being affected.

[0045] In this embodiment, a first sealing rubber ring 140 is sleeved on the second end of the transfer plate 110 , and the first sealing rubber ring 140 is clamped between the transfer plate 110 and the limiting groove 121 to seal the outer wall of the transfer plate 110 with the inner wall of the limiting groove 121 .

[0046] During the process of inserting the transfer plate 110 into the limiting groove 121, the inner wall of the limiting groove 121 can squeeze the first sealing rubber ring 140, thereby achieving a sealed fit with the transfer plate 110. In other words, the transfer plate 110 can be sealed by inserting the limiting groove 121 without the need for additional sealing operations. The inner contour of the limiting groove 121 can be set to a trumpet shape that shrinks toward the insulation board 230, so as the transfer plate 110 is inserted toward the insulation board 230, the inner wall of the limiting groove 121 will gradually press the first sealing rubber ring 140, thereby forming a reliable seal between the outer wall of the transfer plate 110 and the inner wall of the limiting groove 121. It should be pointed out that the first sealing rubber ring 140 can be an integrally formed annular structure, or it can be an annular structure surrounded by a strip of rubber, and the two ends of the strip of rubber can be bonded by heat-resistant glue.

[0047] Furthermore, in this embodiment, the first sealing rubber ring 140 is bonded to the outer wall of the transfer plate 110. In other words, the position of the first sealing rubber ring 140 on the surface of the transfer plate 110 is fixed. Therefore, during the process of inserting the transfer plate 110 into the limiting groove 121, the first sealing rubber ring 140 is not easily displaced, thereby ensuring the reliability of the seal between the outer wall of the transfer plate 110 and the inner wall of the limiting groove 121.

[0048] It should be pointed out that in other embodiments, an annular sealing rubber ring may also be provided along the inner wall of the limiting groove 121. When the transfer plate 110 is inserted into the limiting groove 121, the sealing rubber ring on the inner wall of the limiting groove 121 may be squeezed to achieve sealing cooperation between the transfer plate 110 and the limiting groove 121.

[0049] Please also read Figure 3 and Figure 4 In this embodiment, the board communication assembly 100 further includes a second sealing rubber ring 150, which is clamped between the support base 120 and the heat insulation board 230 and extends along the circumference of the transfer board 110. The second sealing rubber ring 150 can form a seal between the support base 120 and the heat insulation board 230, thereby preventing a gap from being generated between the support base 120 and the heat insulation board 230, thereby affecting the sealing performance between the resource cavity 201 and the test cavity 201.

[0050] Furthermore, in this embodiment, a sealing groove (not shown) extending along the circumference of the avoidance hole is provided on the surface of the support base 120 facing the heat insulation board 230, and the second sealing rubber ring 150 is received in the sealing groove. The sealing groove can provide an installation position for the second sealing rubber ring 150, which is convenient for installation. Moreover, the second sealing rubber ring 150 can also effectively prevent the second sealing rubber ring 150 from shifting, thereby ensuring the reliability of the seal between the support base 120 and the heat insulation board 230.

[0051] Please refer again Figure 5 and Figure 7 The guide cover 130 is detachably mounted on the support base 120. Specifically, the guide cover 130 can be mounted on the support base 120 by means of threaded fastening, snap-fitting, etc. The guide cover 130 is configured to prevent the transfer plate 110 from exiting the limiting groove 121. When the transfer plate 110 is assembled in the limiting groove 121, the guide cover 130 is installed to limit the transfer plate 110 to the limiting groove 121 to prevent the transfer plate 110 from exiting in the opposite direction of the assembly.

[0052] After the transfer plate 110 has been plugged in and out for many times and has become worn, the guide cover 130 is first removed, and then the old transfer plate 110 is pulled out of the limit slot 121. Next, the new transfer plate 110 is inserted from the opening of the limit slot 121 until it fits in place with the inner wall of the limit slot 121; then the guide cover 130 is reinstalled on the support base 120 to complete the replacement of the transfer plate 110. It can be seen that in the process of replacing the transfer plate 110, only the guide cover 130 needs to be disassembled and assembled and the transfer plate 110 needs to be plugged in and out, which is more convenient to operate.

[0053] Specifically, in this embodiment, a foolproof structure (not shown) is provided in the limit groove 121 to match the transfer board 110. The foolproof structure can be a foolproof chamfer, a foolproof pin, etc., which can prevent the transfer board 110 from being inserted into the limit groove 121 in the wrong direction, thereby avoiding a short circuit and burning the aging board 220 during the test process.

[0054] In this embodiment, the guide cover 130 and the limiting groove 121 are arranged to form an accommodation space for accommodating the connector 112 , and a guide hole 131 communicating with the accommodation space is formed at a position corresponding to the guide cover 130 and the connector 112 .

[0055] It can be seen that the guide cover 130 can surround the connector 112 in all directions, so the limiting effect on the transfer board 110 is better. Moreover, when performing the aging test, the port of the aging board 220 can be driven into the accommodating space through the guide hole 131 and plugged with the connector 112. That is, the guide hole 131 can guide the aging board 220, so as to facilitate the docking of the aging board 220 and the transfer board 110.

[0056] In order to achieve better guidance, the guide hole 131 gradually narrows in the direction from the opening to the accommodating space, so that the guide hole 131 is trumpet-shaped.

[0057] Furthermore, in this embodiment, the opening edge of the limiting groove 121 toward the guide cover 130 is provided with an operation notch 122 for exposing the transfer board 110. After the guide cover 130 is removed, the operation notch 122 can expose the transfer board 110, specifically part of the connector 112, providing an operating space for the operator, thereby facilitating the operator to grab the transfer board 110 and perform plugging and unplugging.

[0058] In addition, in this embodiment, a plurality of parallel connectors 112 are disposed at the second end of the transfer board 110 , and the mating gaps of some of the connectors 112 are smaller than the mating gaps of the remaining connectors 112 .

[0059] The plug-in clearance refers to the matching margin between the connector 112 and the port pin of the aging board 220 when docking with the port of the aging board 220. The smaller the plug-in clearance, the higher the required positioning accuracy; conversely, the lower the required positioning accuracy. Therefore, when the aging board 220 is docked with the transfer board 110, some connectors 112 with smaller plug-in clearances, that is, with higher positioning accuracy, can be used as targets for positioning with the aging board 220 to ensure that the connectors 112 with smaller plug-in clearances can be smoothly docked with the ports of the aging board 220. In this way, when the remaining connectors 112 with larger plug-in clearances are docked with the ports of the aging board 220, even if there is an error, due to the larger plug-in clearances, there will be no over-positioning between the aging board 220. In this way, the plug-in force between the transfer board 110 and the aging board 220 can be reduced, thereby reducing the wear of the transfer board 110 and reducing the replacement frequency.

[0060] The above-mentioned aging test device 10 docks the resource board 210 in the resource cavity 201 with the aging board 220 in the test cavity 202 through the transfer board during the aging test, so the power supply and control signal provided by the resource board 210 can be transmitted to the aging board 220 through the transfer board 110. When the transfer board 110 needs to be replaced, the guide cover 130 is first removed, and then the old transfer board 110 is pulled out from the limit groove 121 in a direction away from the insulation board 230. Then, the first end of the new transfer board 110 is inserted from the opening of the limit groove 121 until the first end of the transfer board 110 extends from the opening on the other side and passes through the insulation board 230, and the transfer board 110 and the inner wall of the limit groove 121 are in place. Then the guide cover 130 is reinstalled on the support base 120 to complete the replacement of the transfer board 110. It can be seen that, in the process of replacing the transfer plate 110 , the aging test device 10 only needs to disassemble and assemble the guide cover 130 and plug and unplug the transfer plate 110 , which is convenient to operate.

[0061] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An aging test device, characterized in that: include: The box body is formed with a resource cavity and a test cavity separated by a heat insulation board, the test cavity is used to accommodate the aging board, and the resource cavity is used to accommodate the resource board; and The board communication component comprises a transfer board, a support base and a guide cover, wherein the transfer board has a first end for installing a gold finger and a second end for installing a connector; the support base is installed on one side of the heat insulation board, and a limit groove with openings on both sides is formed on the support base; Among them, the transfer plate is inserted into the limiting groove and the first end of the transfer plate passes through the limiting groove through the heat insulation plate, and the transfer plate forms a sealing fit with the inner wall of the limiting groove during the process of passing through the limiting groove; the guide cover is detachably mounted on the support base and is configured to prevent the transfer plate from withdrawing from the limiting groove.

2. The aging test device according to claim 1, characterized in that: The support base is installed on a side of the heat insulation board facing the test cavity.

3. The aging test device according to claim 2, characterized in that: The second end of the transfer plate is provided with a plurality of the connectors arranged in parallel, and the insertion gaps of some of the connectors are smaller than the insertion gaps of the remaining connectors.

4. The aging test device according to claim 1, characterized in that: The limiting groove is provided with an anti-fool structure matched with the transfer plate.

5. The aging test device according to claim 1, characterized in that: The second end of the transfer plate is sleeved with a first sealing rubber ring, and the first sealing rubber ring is clamped between the transfer plate and the limiting groove, so that the outer wall of the transfer plate and the inner wall of the limiting groove are sealed and matched.

6. The aging test device according to claim 5, characterized in that: The first sealing rubber ring is bonded to the outer wall of the transfer plate.

7. The aging test device according to claim 1, characterized in that: The board-card communication assembly also includes a second sealing rubber ring, which is clamped between the support base and the heat insulation board, and the second sealing rubber ring extends along the circumference of the transfer board.

8. The aging test device according to claim 7, characterized in that: A sealing groove is formed on the surface of the support base facing the heat insulation board, and the second sealing rubber ring is received in the sealing groove.

9. The aging test device according to claim 1, characterized in that: The guide cover and the limiting groove are arranged to form an accommodating space for accommodating the connector, and a guide hole communicating with the accommodating space is provided at a position corresponding to the guide cover and the connector.

10. The aging test device according to claim 9, characterized in that: An operation notch for exposing the transfer plate is formed on an opening edge of the limiting groove toward the guide cover.

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