Auxiliary film pasting unit

Abstract

The utility model provides an auxiliary film pasting unit which comprises a frame body, a film pasting device and a film pasting device, a cavity is formed in the frame body, and a transferring port and a circular cutting port which are both communicated with the cavity are formed in the side portion and the top of the frame body respectively; the supporting platform is arranged in the cavity in a sliding mode, has heating and adsorption functions and is used for bearing a wafer, the lifting mechanism is arranged on the frame body in the vertical direction and is used for driving the supporting platform to ascend and descend, and the diameter of the supporting platform is smaller than that of the cutting opening so that the supporting platform can slide till part of the supporting platform extends out of the cutting opening; and the auxiliary mechanism is arranged on one side of the frame body, the working end of the auxiliary mechanism can enter and exit from the cavity through the transfer port so as to move to the position above the supporting platform, and the working end is provided with an adsorption disc and a negative pressure cleaning assembly which are matched with the supporting platform. According to the auxiliary film pasting unit provided by the invention, the problem of bubbles in the film pasting process and the problem of reject ratio caused by tilting of the edge of the wafer in the film pasting process can be avoided.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor equipment, and more specifically, to an auxiliary film attaching unit. Background Art

[0002] During the wafer production process, a protective film needs to be attached to the front of the product before grinding. During the film attaching process, it is inevitable that there will be slight changes in the wafer thickness, dust adhesion during the wafer transfer to the film attaching area, and wafer edge warping, which will result in the protective film not being able to adhere well to the wafer surface and bubbles during the film attaching process. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide an auxiliary film-mounting unit to solve the technical problems of wafer thickness variation, edge warping and dust pollution existing in the prior art.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present application is to provide an auxiliary film sticking unit, which includes:

[0005] A frame body, in which a cavity is formed, and a transfer port and a circular cutting port, both of which are connected to the cavity, are respectively opened on the side and top of the frame body;

[0006] A support platform slidably disposed inside the cavity and having heating and adsorption functions for carrying wafers, and a lifting mechanism vertically disposed on the frame for driving the support platform to rise and fall, wherein the diameter of the support platform is smaller than the diameter of the cutting opening so that the support platform can be slid until a portion of the support platform extends out of the cutting opening;

[0007] An auxiliary mechanism with multi-stage telescopic function is arranged on one side of the frame and its working end can enter and exit the cavity through the transfer port to move above the support platform. The working end is provided with a suction plate and a negative pressure cleaning component compatible with the support platform.

[0008] Optionally, the lifting mechanism includes four linear motion devices which are symmetrically arranged along the center of the support platform and can operate independently.

[0009] Optionally, a plurality of adsorption holes are arranged on the top surface of the support platform, and a vacuum air passage communicating with each of the adsorption holes is arranged in the support platform.

[0010] Optionally, a movable adsorption mechanism is also arranged in the support platform along the vertical direction, and the movable adsorption mechanism includes a lifting device and a plurality of suction nozzles slidably penetrated through the support platform and connected to the lifting device; the movable adsorption mechanism can adsorb the wafer and lift it to leave the upper surface of the support platform.

[0011] Optionally, an annular adsorption groove is provided on the upper surface of the frame around the cutting opening.

[0012] Optionally, the auxiliary mechanism includes a multi-stage telescopic mechanism, and the adsorption plate and the negative pressure cleaning component are arranged on the multi-stage telescopic mechanism.

[0013] Optionally, the multi-stage telescopic mechanism includes a slide rail assembly, a slide frame and a cylinder, and the slide rail assembly and the cylinder connect two adjacent slide frames.

[0014] Optionally, a retractable negative pressure pipe is provided between each of the slides, and the adsorption plate and the negative pressure cleaning assembly share the same negative pressure pipe.

[0015] Optionally, the negative pressure cleaning component is arranged on one side of the adsorption plate, and the negative pressure cleaning component includes a negative pressure chamber connected to the negative pressure pipe and a dust suction groove connected to the negative pressure chamber, and the adsorption plate is connected to the negative pressure chamber.

[0016] Optionally, a buffer is provided on the adsorption surface of the adsorption disk.

[0017] The auxiliary film sticking unit provided in the embodiment of the present application has at least the following beneficial effects:

[0018] The support platform can be raised and lowered according to the actual thickness of the wafer so that the upper surface of wafers of different thicknesses can be flush with the upper surface of the frame, so that the protective film can be completely attached to the surface of the wafer; the auxiliary mechanism can be extended and retracted in multiple stages to move above the support platform. In this way, before the wafer is filmed, the negative pressure cleaning component on the auxiliary mechanism can absorb the dust on the wafer to avoid bubble problems during the filming process, and the adsorption plate on the auxiliary mechanism can press and level the wafer on the support platform, thereby avoiding the defective rate problem caused by the warping of the wafer edge during the filming process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0020] Figure 1 A three-dimensional diagram of an auxiliary film-sticking unit in some embodiments of the present application;

[0021] Figure 2 A three-dimensional diagram of a partial structure of an auxiliary film-sticking unit in some embodiments of the present application;

[0022] Figure 3 A three-dimensional diagram of the auxiliary mechanism in some embodiments of the present application;

[0023] Figure 4 A three-dimensional diagram of the auxiliary mechanism from another perspective in some embodiments of the present application;

[0024] Figure 5 A three-dimensional diagram of a support platform in some embodiments of the present application;

[0025] Figure 6 A three-dimensional diagram of a support platform from another perspective in some embodiments of the present application;

[0026] Figure 7 It is a cross-sectional view of the auxiliary mechanism in some embodiments of the present application. DETAILED DESCRIPTION

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0028] It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0029] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it may be directly on the other element or indirectly on the other element.

[0030] When an element is referred to as being “connected to” another element, it can be directly connected to the other element or indirectly connected to the other element.

[0031] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0033] In the description of the present application, “plurality” means two or more than two, unless otherwise clearly and specifically defined.

[0034] Please also read Figures 1 to 7 Now, the auxiliary film sticking unit provided in the embodiment of the present application is described.

[0035] It should be noted that the auxiliary film pasting unit of the present application is used to be assembled on the film pasting device, wherein the top surface of the frame 100 is also the film pasting operation area.

[0036] refer to Figure 1 to Figure 2 The auxiliary film-sticking unit described in the present application includes a frame 100, a supporting platform 200 and an auxiliary mechanism 400.

[0037] Specifically, a cavity is formed in the frame 100, and a transfer port 110 and a circular cutting port 120 are respectively provided on the side and top of the frame 100. The cutting port 120 is slightly larger than the support platform 200. When the upper surface of the support platform 200 is flush with the upper surface of the frame 100, there is a gap between the circumferential side wall of the support platform 200 and the inner circumferential wall of the cutting port 120. The gap is used for the protective film to be pressed and adhered to the surface of the wafer, and then the cutting knife of the cutting unit (not shown in the figure) cuts the protective film along the gap to cut and separate the protective film adhered to the surface of the wafer from the protective film tape.

[0038] An operating space is formed inside the cavity. The transfer port 110 is used for the auxiliary mechanism 400 to enter and exit the cavity from the side of the frame 100 to move to directly above the support platform 200. The cutting port 120 is used for the support platform 200 to be lifted until its upper surface is flush with or higher than the upper surface of the frame 100.

[0039] The support platform 200 is slidably disposed inside the cavity, and a lifting mechanism 300 is vertically disposed on the frame 100 for driving the support platform 200 to rise and fall. A heating device and an adsorption device are disposed in the support platform 200 to adsorb, fix and heat the wafer during the wafer film attaching process. The lifting mechanism 300 is used to drive the support platform 200 to rise and fall so that it can slide through the cutting opening 120 and until the upper surface is flush with or higher than the top surface of the frame 100.

[0040] The auxiliary mechanism 400 is arranged on one side of the frame 100. It can be extended and retracted in multiple stages to enter and exit the cavity through the transfer port 110, and the adsorption plate 410 and the negative pressure cleaning component 420 on its working end are moved to the top of the support platform 200, so that the adsorption plate 410 can level the wafer on the support platform 200, and the negative pressure cleaning component 420 can adsorb and clean the dust on the surface of the wafer on the support platform 200.

[0041] Specifically, the operation flow of the auxiliary film sticking unit of the present application is briefly described below.

[0042] The support platform 200 is driven by the lifting mechanism 300 to move until its upper surface is flush with the top surface of the frame 100. The external transfer mechanism (not shown in the figure) transfers the wafer to the support platform 200 and is fixed by the support platform 200. The support platform 200 absorbs the wafer and descends to enter the cavity. The auxiliary mechanism 400 is multi-stage telescopic so that the adsorption plate 410 on its working end moves to the top of the wafer. The lifting mechanism 300 drives the support platform 200 to lift so that the wafer is clamped between the support platform 200 and the adsorption plate 410, so that the wafer can be leveled and the edge of the wafer is eliminated. So that all parts of the wafer can be completely adsorbed by the support platform 200; after the wafer is leveled, the auxiliary mechanism 400 moves so that the adsorption plate 410 leaves the top of the wafer and the negative pressure cleaning component 420 moves to the top of the wafer to adsorb the dust particles on the upper surface of the wafer, so as to achieve the purpose of cleaning and leveling the wafer before film bonding.

[0043] In this way, the auxiliary film pasting unit of the present application can keep the upper surface of wafers of different thicknesses flush with the working area when pasting films. At the same time, it can also level and clean the wafers before pasting films, thereby reducing the defective rate of film pasting, which is conducive to improving the yield and operating efficiency.

[0044] refer to Figure 1 to Figure 2 In some embodiments, the lifting mechanism 300 includes four linear motion devices that are symmetrically arranged along the center of the support platform 200 and can operate independently. By symmetrically arranging four linear motion devices, each linear motion device can synchronously or separately push the support platform 200 to rise and fall. When each driving device pushes separately, it can adjust its own driving stroke according to the level of the support platform 200, so that the upper surface of the wafer can keep the same level with the surface of the working area, so as to improve the success rate of film lamination.

[0045] Specifically, the linear motion device can be a slide rail assembly and a linear motor, the driving end of the linear motor is connected to the support platform 200, and the support platform 200 is arranged on the slide rail assembly to be driven by the linear motor.

[0046] refer to Figure 5 In some embodiments, a plurality of adsorption holes 210 are provided on the top surface of the support platform 200, and a vacuum air passage connected to each adsorption hole 210 is provided in the support platform 200. Specifically, the adsorption holes 210 are arranged in a ring array on the support platform 200. By arranging the adsorption holes 210 in this way, various places on the wafer (especially near the edge of the wafer) can be adsorbed well, especially after the adsorption plate 410 on the auxiliary mechanism 400 flattens the wafer, the wafer can be completely adsorbed to the support platform 200 without edge warping.

[0047] refer to Figure 5 and Figure 6 On the basis of the above embodiments, a movable adsorption mechanism 220 is further provided in the support platform 200 along the vertical direction. The movable adsorption mechanism 220 can adsorb the wafer and lift it to leave the upper surface of the support platform 200, so that the wafer with the film attached can be conveniently grabbed and transferred by the transfer mechanism.

[0048] Specifically, the support platform 200 is provided with a sliding hole 230 along its thickness direction, and the movable adsorption mechanism 220 includes a lifting device 221 and a plurality of suction nozzles 222 that are slidably arranged in the sliding hole 230 and connected to the lifting device 221; the lifting device 221 is used to push the suction nozzle 222 up or down. It should be understood that the suction nozzle 222 can be completely lowered to a point where its adsorption end is lower than the upper surface of the support platform 200, and can also be raised to a point where its adsorption end is higher than the upper surface of the support platform 200. The lifting device 221 can be a cylinder 432.

[0049] Before and during wafer lamination, the suction nozzle 222 is hidden in the slide hole 230; when the wafer lamination is completed and needs to be transported, the lifting device 221 pushes the suction nozzle 222 up to make the lower surface of the suction nozzle 222 leave the upper surface of the support platform 200, so that the transfer device can lift and transport the wafer.

[0050] refer to Figure 1 to Figure 2 On the basis of the above embodiments, an annular adsorption groove 130 is provided on the upper surface of the frame 100 around the cutting opening 120, and the adsorption groove 130 is connected to a negative pressure generating device. It is necessary that the gap between the adsorption groove 130 and the cutting opening 120 is small, and it is used to tightly adsorb the protective film to the working area without bubbles or wrinkles when the wafer is filmed. Specifically, when the wafer is filmed, when the protective film covers the working area, the adsorption groove 130 tightly adsorbs the protective film. After the cutting unit has finished cutting the protective film and the wafer is transported, the adsorption groove 130 releases the protective film so that the excess protective film can be recovered by other equipment.

[0051] refer to Figure 1 , Figure 3 , Figure 4 and Figure 7 On the basis of the above embodiments, the auxiliary mechanism 400 includes a multi-stage telescopic mechanism, and the suction plate 410 and the negative pressure cleaning component 420 are arranged in the multi-stage telescopic mechanism.

[0052] Specifically, the multi-stage telescopic mechanism includes a plurality of slides 431 and a slide rail assembly and a cylinder 432 connecting two adjacent slides 431. The two adjacent slides 431 can be slidably embedded to save space, and the cylinder 432 is used to pull the two adjacent slides 431 to telescope. In this embodiment, the slide 431 is provided with three stages, and correspondingly, two sets of slide rail assemblies and two sets of cylinders 432 are provided.

[0053] refer to Figure 3 , Figure 4 and Figure 7 Furthermore, a retractable negative pressure pipe 440 is provided in the multi-stage telescopic mechanism, one end of the negative pressure pipe 440 is connected to an external generating device, which may be a vacuum generator, and the other end of the negative pressure pipe 440 is used to provide negative pressure for the adsorption plate 410 and the negative pressure cleaning assembly 420. Specifically, the negative pressure pipe 440 is composed of a plurality of pipes that can be nested with each other, and a sealing assembly is connected between two related nested pipes. By arranging the negative pressure pipe 440 in this way, when the slide 431 is telescoped with each other, compared with the arrangement of the negative pressure hose, the negative pressure flow of the negative pressure pipe 440 is larger and less prone to entanglement, which can effectively meet the needs of wafer leveling and cleaning.

[0054] refer to Figure 3 , Figure 4 and Figure 7 In a further specific embodiment, the negative pressure cleaning component 420 is arranged on one side of the adsorption disk 410. More specifically, the negative pressure cleaning component 420 is arranged on the front side of the adsorption disk 410 in the moving direction of the slide 431. The negative pressure cleaning component 420 includes a negative pressure chamber 422 connected to the negative pressure pipe 440 and a dust suction groove 421 connected to the negative pressure chamber 422, and the adsorption disk 410 is connected to the negative pressure chamber 422. Specifically, an adsorption chamber is arranged at the bottom of the negative pressure chamber 422 and located on one side of the adsorption disk 410, and the adsorption chamber is connected to the negative pressure chamber 422. The dust suction groove 421 is formed at the bottom of the adsorption chamber and is connected to the adsorption chamber, so that a dust collection space can be formed inside the adsorption chamber. By arranging the negative pressure cleaning component 420 in this way, its structure is simple and can share the same negative pressure source with the adsorption disk 410.

[0055] In the specific operation process, the support platform 200 carries the wafer and descends into the cavity, the multi-stage telescopic mechanism drives the adsorption plate 410 to the top of the wafer, the support platform 200 rises so that the upper surface of the wafer on it abuts against the adsorption plate 410, and then the support platform 200 continues to rise, so that the upper surface of the wafer is fully squeezed and flattened by the adsorption plate 410, so that the lower surface of the wafer can be fully adsorbed by the support platform 200 at all places, and at the same time, the negative pressure pipe 440 provides negative pressure to the adsorption plate 410, so that the adsorption plate 410 has suction to fix the wafer, thereby achieving wafer leveling; after the wafer is leveled, the support platform 200 is slightly lowered, so that the upper surface of the wafer leaves the adsorption plate 410, and then the multi-stage telescopic mechanism moves back. During the backward movement, the negative pressure cleaning component 420 maintains negative pressure adsorption, and when the dust suction groove 421 thereon passes directly above the wafer, it can adsorb the fine dust particles remaining on the surface of the wafer, thereby avoiding the bubble problem caused by impurities in the wafer film bonding process.

[0056] refer to Figure 4In some embodiments, a buffer 411 is provided on the adsorption surface of the adsorption disk 410. In the present embodiment, the buffer 411 is an annular rubber ring. Specifically, at least one annular mounting groove, for example, two or more, is provided on the adsorption surface of the adsorption disk 410, and the mounting groove is used to clamp the rubber ring. When the support platform 200 and the adsorption disk 410 jointly squeeze the wafer, the upper surface of the wafer abuts against the rubber ring, thereby preventing the upper surface of the wafer from being damaged due to squeezing.

[0057] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. An auxiliary film sticking unit, characterized in that: include: A frame body, in which a cavity is formed, and a transfer port and a circular cutting port, both of which are connected to the cavity, are respectively opened on the side and top of the frame body; A support platform slidably disposed inside the cavity and having heating and adsorption functions for carrying wafers, and a lifting mechanism vertically disposed on the frame for driving the support platform to rise and fall, wherein the diameter of the support platform is smaller than the diameter of the cutting opening so that the support platform can be slid until a portion of the support platform extends out of the cutting opening; An auxiliary mechanism with multi-stage telescopic function is arranged on one side of the frame and its working end can enter and exit the cavity through the transfer port to move above the support platform. The working end is provided with a suction plate and a negative pressure cleaning component compatible with the support platform.

2. The auxiliary film sticking unit according to claim 1, characterized in that: The lifting mechanism comprises four linear motion devices which are symmetrically arranged along the center of the supporting platform and can operate independently.

3. The auxiliary film sticking unit according to claim 1, characterized in that: A plurality of adsorption holes are arranged on the top surface of the support platform, and a vacuum air passage communicating with each of the adsorption holes is arranged in the support platform.

4. The auxiliary film sticking unit according to any one of claims 1 to 3, characterized in that: A movable adsorption mechanism is also arranged vertically in the support platform, and the movable adsorption mechanism includes a lifting device and a plurality of suction nozzles slidably arranged on the support platform and connected to the lifting device; the movable adsorption mechanism can adsorb the wafer and lift it to leave the upper surface of the support platform.

5. The auxiliary film sticking unit according to any one of claims 1 to 3, characterized in that: An annular adsorption groove is arranged on the upper surface of the frame around the cutting opening.

6. The auxiliary film sticking unit according to any one of claims 1 to 3, characterized in that: The auxiliary mechanism comprises a multi-stage telescopic mechanism, and the adsorption plate and the negative pressure cleaning component are arranged on the multi-stage telescopic mechanism.

7. The auxiliary film sticking unit according to claim 6, characterized in that: The multi-stage telescopic mechanism comprises a slide rail assembly, a slide frame and a cylinder, wherein the slide rail assembly and the cylinder connect two adjacent slide frames.

8. The auxiliary film sticking unit according to claim 7, characterized in that: A retractable negative pressure pipeline is arranged between each of the slides, and the adsorption plate and the negative pressure cleaning component share the same negative pressure pipeline.

9. The auxiliary film sticking unit according to claim 8, characterized in that: The negative pressure cleaning component is arranged on one side of the adsorption plate, and the negative pressure cleaning component includes a negative pressure chamber connected to the negative pressure pipeline and a dust suction groove connected to the negative pressure chamber, and the adsorption plate is connected to the negative pressure chamber.

10. The auxiliary film sticking unit according to claim 6, characterized in that: A buffer is arranged on the adsorption surface of the adsorption disk.

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