Chip processing equipment

Abstract

The utility model relates to chip processing equipment. The chip processing equipment comprises a rack, a mounting plate, a material device, an overturning module and a material moving module, the mounting plate is located in the feeding area, and a mounting groove is formed in the mounting plate; the plurality of types of material devices are detachably arranged on the mounting groove, and each type of material device bears a to-be-processed chip; the overturning module is used for overturning the chip; the material moving module comprises a suction head part, the material moving module is connected to the rack in a sliding mode, a chip to be machined is sucked into the overturning module through the suction head part, the overturned chip is taken out through the suction head part, and surface mounting is carried out on a substrate. According to the chip processing equipment provided by the utility model, various types of material devices can be disassembled and assembled on the mounting grooves, and each type of material device bears the chip to be processed, so that the material moving module adsorbs the chip to be processed in the overturning module through the suction head piece, and the chip is overturned by the overturning module and then is discharged from the material conveying module. And the overturned chip is taken out by the suction head piece and is mounted on the substrate, so that various types of chips can be inversely mounted on the substrate at one time.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a chip processing device. Background Art

[0002] In the prior art, the chip needs to be packaged by a chip mounter, but since the chip mounter can only mount a single type of chip, the chip mounter can only mount a certain type of chip. Since the process requires that the chip be light and thin after assembly while improving the heat dissipation effect of the chip, the process usually adopts flip-chip mounting. In particular, since the substrate needs to guide the mounting of different types of chips, it is very inconvenient to replace multiple types of chips when flip-chip mounting. Therefore, it is necessary to solve the problem of convenient flip-chip mounting of multiple types of chips. Utility Model Content

[0003] The utility model aims to provide a chip processing device, aiming to solve the problem of convenient flip-chip mounting of various types of chips.

[0004] In order to solve the above technical problems, a chip processing equipment is provided, including a frame, a mounting plate, a material container, a flip module and a material transfer module, the frame is provided with a loading area, a processing area and a mounting area; the mounting plate is located in the loading area, and the mounting plate is formed with a plurality of mounting grooves arranged at intervals; the material containers of various types are disassembled and assembled on the mounting grooves, and each type of the material container carries a chip to be processed; the flip module is located in the processing area and is used to flip the chip; the material transfer module includes a plurality of suction heads, the material transfer module is slidably connected to the frame, and the chip to be processed is adsorbed into the flip module by the suction head, and after the flip module flips the chip, the suction head takes out the flipped chip and mounts it on the substrate in the mounting area.

[0005] Furthermore, the mounting plate is provided with a guide portion and a socket, the guide portion is located at one end of the mounting slot, the socket is located at the other end of the mounting slot, the guide portion is formed with a step surface, one end of the material container is inserted into the mounting slot through the guide portion and is electrically connected to the socket, and the other end of the material container abuts against the step surface.

[0006] Furthermore, the material device includes a feeder and a tray box, and the feeder and the tray box are connected to the frame through the mounting groove, so that the suction head can take out the chip from the feeder or the tray and transport it to the flip module to flip the chip.

[0007] Furthermore, the material tray box is provided with a carrying area and a storage area, both of which are used to place the supply tray, and the chips are stored in the grid of the supply tray, wherein the supply tray in the storage area is used to transport materials to the carrying area, and the supply tray in the carrying area is used to provide materials to the suction head.

[0008] Furthermore, the flip module includes a bracket, a first driving source, a mounting plate and a flip assembly, the bracket is connected to the frame, the mounting plate is connected to the bracket, the first driving source is connected to the mounting plate to drive the flip assembly to rotate, and the flip assembly is used to adsorb the chip to flip.

[0009] Furthermore, the flipping assembly includes a crank plate and a plurality of adsorbents, the crank plate is connected to the first driving source, and the adsorbents are located on the crank plate and are used for adsorbing the chip for flipping.

[0010] Furthermore, the flip assembly also includes a sensor and a shielding plate, the sensor is connected to one side of the mounting plate, and the shielding plate is connected to the end of the crank rotating plate, so that the shielding plate rotates to trigger the sensor.

[0011] Furthermore, the material transfer module further comprises a camera, which is located at one side of the suction head member, and the position information of the material container is identified by the camera so that the plurality of suction head members can adsorb the chips on the material container.

[0012] Implementing the embodiments of the present utility model will have the following beneficial effects:

[0013] In the chip processing equipment of this embodiment, since various types of material containers can be disassembled and assembled on the mounting slots, and each type of material container carries the chip to be processed, the flip module is located in the processing area and is used to flip the chip, so that the material transfer module absorbs the chip to be processed into the flip module through the suction head. After the flip module flips the chip, the suction head takes out the flipped chip and mounts it on the substrate in the mounting area, so that the substrate can be flipped and mounted with various types of chips at one time, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 This is a schematic diagram of the structure of a chip processing device according to an embodiment of the present utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the material tray box according to an embodiment of the utility model;

[0017] Figure 3 for Figure 1 A partial enlarged view of the middle A;

[0018] Figure 4 for Figure 1 A partial enlarged view of point B in the middle;

[0019] Figure 5 for Figure 1 A partial enlarged view of point C in the middle;

[0020] Figure 6 for Figure 3 A partial enlarged view of point D in the middle.

[0021] Among them: 100, chip processing equipment; 110, rack; 111, loading area; 112, processing area; 113, mounting area; 120, mounting plate; 121, mounting groove; 122, guide part; 123, step surface; 124, socket; 130, material device; 131, feeder; 132, tray box; 1321, bearing area; 1322, storage area; 1323, feed tray; 140, flip module; 141, bracket; 142, first driving source; 143, connecting plate; 144, flip assembly; 1441, crank plate; 1442, adsorption part; 1443, sensor; 1444, shielding plate; 150, material transfer module; 151, suction head; 152, camera. DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the accompanying drawings. The accompanying drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0023] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0025] Please refer to Figure 1-Figure 6 The embodiment of the utility model provides a chip processing device 100, including a frame 110, a mounting plate 120, a material container 130, a flip module 140 and a material transfer module 150. The frame 110 is provided with a loading area 111, a processing area 112 and a mounting area 113; the mounting plate 120 is located in the loading area 111, and the mounting plate 120 is formed with a plurality of mounting grooves 121 arranged at intervals; various types of material containers 130 are disassembled and assembled on the mounting grooves 121, and each type of material container 130 carries a chip to be processed; the flip module 140 is located in the processing area 112 for flipping the chip; the material transfer module 150 includes a plurality of suction head members 151, and the material transfer module 150 is slidably connected to the frame 110, and the suction head member 151 adsorbs the chip to be processed into the flip module 140, and after the flip module 140 flips the chip, the suction head member 151 takes out the flipped chip and mounts it on the substrate of the mounting area 113. In specific applications, since various types of material containers 130 can be disassembled and assembled on the mounting groove 121, and each type of material container 130 carries the chip to be processed, the flip module 140 is located in the processing area 112 for flipping the chip, so that the material transfer module 150 absorbs the chip to be processed in the flip module 140 through the suction head 151. After the flip module 140 flips the chip, the suction head 151 takes out the flipped chip and mounts it on the substrate in the mounting area 113, so that the substrate can flip-chip mount multiple types of chips at one time, thereby improving the production efficiency of substrate mounting chips.

[0026] In a possible embodiment, the mounting plate 120 is provided with a guide portion 122 and a socket 124, the guide portion 122 is located at one end of the mounting groove 121, the socket 124 is located at the other end of the mounting groove 121, the guide portion 122 is formed with a step surface 123, one end of the material container 130 is inserted into the mounting groove 121 through the guide portion 122 and is electrically connected to the socket 124, and the other end of the material container 130 abuts against the step surface 123. In a specific application, since the chip device needs to be compatible with different types of chips, it is necessary to efficiently switch the material container 130 on the mounting plate 120 so that the chip processing device 100 can adapt to different chip mountings. Therefore, a guide portion 122 and a socket 124 are provided on the mounting plate 120. The guide portion 122 is located at one end of the mounting groove 121, and the socket 124 is located at the other end of the mounting groove 121. The guide portion 122 is formed with a stepped surface 123. One end of the material container 130 is inserted into the mounting groove 121 through the guide portion 122 and is electrically connected to the socket 124. The other end of the material container 130 abuts against the stepped surface 123, wherein the guide portion 122 can quickly guide the material container 130 into the installation groove 121, and the bottom of the material container 130 will abut against the stepped surface 123. In this way, it can be avoided that the material container 130 is too large for installation, causing the material container 130 to damage the socket 124. In addition, the material container 130 is electrically connected to the socket 124, so that the material container 130 can communicate with the chip processing device 100 after installation, so that the chip processing device 100 can determine the status of the material container 130.

[0027] In a possible implementation, the material container 130 includes a feeder 131 and a tray box 132, and both the feeder 131 and the tray box 132 are connected to the frame 110 through the mounting slot 121, so that the suction head 151 takes out the chip from the feeder 131 or the tray and transports it to the flip module 140 to flip the chip. In a specific application, in order to carry different material containers 130 in the mounting slot 121, the material container 130 includes a feeder 131 and a tray box 132, and both the feeder 131 and the tray box 132 are connected to the frame 110 through the mounting slot 121. In this way, the suction head 151 can take out different chips from the feeder 131 or the tray and transport them to the flip module 140 to flip the chip, so that different types of chips can be flip-chip mounted on the substrate, thereby improving the compatibility and adaptability of the chip processing device 100.

[0028] In one possible embodiment, the material tray box 132 is provided with a carrying area 1321 and a storage area 1322, both of which are used to place a supply tray 1323, and chips are stored in the grid of the supply tray 1323, wherein the supply tray 1323 in the storage area 1322 is used to transport materials to the carrying area 1321, and the supply tray 1323 in the carrying area 1321 is used to provide materials to the suction head 151. In specific applications, due to the type of chip that protects multi-pin chips, this type of chip has higher requirements for mounting performance and is generally contained in a feed tray 1323. However, the number of chips that can be loaded on the feed tray 1323 is limited. Therefore, the tray box 132 is provided with a carrying area 1321 and a storage area 1322. Both the carrying area 1321 and the storage area 1322 are used to place the feed tray 1323. Chips are stored in the grid of the feed tray 1323. The feed tray 1323 in the storage area 1322 is used to transport materials to the carrying area 1321, and the feed tray 1323 in the carrying area 1321 is used to provide materials to the suction head 151, thereby increasing the number of chips contained in the tray box 132. It is worth noting that the storage area 1322 is vertically arranged to increase the storage quantity of the feed tray 1323 and facilitate the storage and retrieval of the feed tray 1323.

[0029] In a possible implementation, the flip module 140 includes a bracket 141, a first driving source 142, a connecting plate 143 and a flip assembly 144. The bracket 141 is connected to the frame 110, the connecting plate 143 is connected to the bracket 141, and the first driving source 142 is connected to the connecting plate 143 to drive the flip assembly 144 to rotate, and the flip assembly 144 is used to adsorb the chip to flip. In a specific application, the first driving source 142 is a servo motor to drive the flip assembly 144, so that the flip assembly 144 can adsorb the chip and flip it 180°, so that the chip is flipped on the flip assembly 144, waiting for the suction head 151 to take out the flipped chip.

[0030] In a possible implementation, the flip assembly 144 includes a crank plate 1441 and a plurality of adsorbents 1442, the crank plate 1441 is connected to the first driving source 142, and the adsorbents 1442 are located on the crank plate 1441 for adsorbing the chip for flipping. In a specific application, each adsorbent 1442 adsorbs a chip, and the adsorbent 1442 is connected to the crank plate 1441, and the crank plate 1441 is connected to the first driving source 142, so that the adsorbent 1442 is located on the crank plate 1441 to adsorb the chip for flipping, thereby preventing the chip from accidentally falling off during the flipping process.

[0031] In a possible implementation, the flip assembly 144 further includes a sensor 1443 and a baffle plate 1444, wherein the sensor 1443 is connected to one side of the connecting plate 143, and the baffle plate 1444 is connected to the end of the crank rotating plate 1441, so that the baffle plate 1444 rotates to trigger the sensor 1443. In a specific application, in order to prevent the flip assembly 144 from rotating too far, the flip assembly 144 further includes a sensor 1443 and a baffle plate 1444, wherein the sensor 1443 is connected to one side of the connecting plate 143, and the baffle plate 1444 is connected to the end of the crank rotating plate 1441, wherein the baffle plate 1444 is a semicircular plate, and the sensor 1443 is a photoelectric sensor 1443, and when the baffle plate 1444 rotates 180°, the sensor 1443 can identify the in-position signal of the flip assembly 144, so that the adsorbent 1442 adsorbs the chip to accurately complete a 180° flip, thereby avoiding excessive position changes due to flipping and affecting the chip flip-chip mounting effect.

[0032] In a possible implementation, the material transfer module 150 further includes a camera 152, which is located on one side of the suction head 151. The camera 152 identifies the position information of the material container 130, so that the multiple suction heads 151 absorb the chips on the material container 130. In a specific application, in order for the multiple suction heads in the material transfer module 150 to accurately absorb the chips in the material container 130, a camera 152 is further provided in the material transfer module 150, and the camera 152 is located on one side of the suction head 151, so that the camera 152 can move and scan above the material container 130, and the camera 152 can identify the position information of the material container 130 and then make a comparison and judgment, so that the suction head 151 can accurately absorb the chips in the material container 130, thereby avoiding the empty state of the suction head 151.

[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A chip processing device, characterized in that: include: A frame, wherein the frame is provided with a loading area, a processing area and a mounting area; A mounting plate, the mounting plate is located in the loading area, and the mounting plate is formed with a plurality of mounting grooves arranged at intervals; Material containers, various types of material containers are detachably mounted on the mounting slots, and each type of material container carries a chip to be processed; A flip module, the flip module is located in the processing area and is used to flip the chip; The material moving module includes a plurality of suction heads, and the material moving module is slidably connected to the frame. The suction heads absorb the chips to be processed into the flip module. After the flip module flips the chips, the suction heads take out the flipped chips and mount them on the substrate in the mounting area.

2. The chip processing device according to claim 1, characterized in that: The mounting plate is provided with a guide portion and a socket, the guide portion is located at one end of the mounting groove, the socket is located at the other end of the mounting groove, the guide portion is formed with a step surface, one end of the material container is inserted into the mounting groove through the guide portion and is electrically connected to the socket, and the other end of the material container abuts against the step surface.

3. The chip processing device according to claim 2, characterized in that: The material device includes a feeder and a tray box, and the feeder and the tray box are connected to the frame through the mounting groove, so that the suction head can take out the chip from the feeder or the tray and transport it to the flip module to flip the chip.

4. The chip processing device according to claim 3, characterized in that: The material tray box is provided with a carrying area and a storage area, both of which are used to place a supply tray, and chips are stored in the grid of the supply tray, wherein the supply tray in the storage area is used to transport materials to the carrying area, and the supply tray in the carrying area is used to provide materials to the suction head.

5. The chip processing device according to any one of claims 1 to 4, characterized in that: The flip module includes a bracket, a first driving source, a connecting plate and a flip assembly, the bracket is connected to the frame, the connecting plate is connected to the bracket, the first driving source is connected to the connecting plate to drive the flip assembly to rotate, and the flip assembly is used to adsorb the chip and flip it.

6. The chip processing device according to claim 5, characterized in that: The flip assembly includes a crank plate and a plurality of adsorbents. The crank plate is connected to the first driving source. The adsorbents are located on the crank plate and are used for adsorbing the chip for flipping.

7. The chip processing device according to claim 6, characterized in that: The flip assembly also includes a sensor and a shielding plate. The sensor is connected to one side of the connecting plate, and the shielding plate is connected to the end of the crank rotating plate so that the shielding plate rotates to trigger the sensor.

8. The chip processing device according to claim 1, characterized in that: The material transfer module further comprises a camera, which is located at one side of the suction head member. The camera is used to identify the position information of the material container so that the plurality of suction head members can absorb the chips on the material container.

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