Semiconductor rapid annealing furnace

Abstract

The utility model provides a semiconductor rapid annealing furnace which structurally comprises a furnace shell, a furnace body is nested in the middle of the furnace shell, and the front end of the furnace body is movably connected with an end cover; the heat preservation covers are symmetrically arranged in the front-back direction relative to the middle of the furnace body, the opposite sides of the two heat preservation covers abut against the outer sides of the two isolation plates correspondingly, the opposite sides of the two isolation plates are fixedly connected with the front end and the rear end of the guide rod correspondingly, and the deflection motor is matched with the deflection rod to drive the isolation plates to deflect between the heat preservation covers. An auxiliary rod is matched to finish the axial deviation treatment of the isolation plate from the heat insulation cover or the furnace body, and at the moment, a worker does not need to directly face the thermal shock generated by the high-temperature environment in the furnace body to the external environment temperature, so that the worker can conveniently carry out the material taking and placing operation in the wafer annealing operation; the problem that manual operation of existing equipment in the axial direction of a furnace body is prone to thermal shock of the high-temperature environment in the furnace body is solved.

Description

Technical Field

[0001] The utility model mainly relates to the technical field of annealing furnaces, in particular to a semiconductor rapid annealing furnace. Background Art

[0002] During the production process of semiconductor wafers, annealing treatment is required to eliminate thermal history, etc. This operation process needs to be carried out in conjunction with an annealing furnace. Generally, a large-capacity annealing furnace is installed on the semiconductor annealing production line. By performing batch annealing treatment on semiconductors, the annealing efficiency of semiconductors can be improved.

[0003] The existing patent (Announcement No.: CN220400538U) discloses an annealing furnace for batch processing of semiconductor wafers, which relates to the technical field of semiconductor annealing equipment, including an annealing furnace, a water-cooling flange is fixedly installed on one side of the annealing furnace, a semicircular quartz tube is installed on one side of the water-cooling flange, two semicircular quartz tubes are rotated and connected by clamping to form a cylinder, the inner cavity of the semicircular quartz tube is hollow, and a clamping mechanism is arranged in the semicircular quartz tube, and the clamping mechanism includes a clamping component and a clamping component. The utility model is provided with a clamping mechanism, multiple groups of semiconductor wafers are clamped into the circular groove, and the clamping disc loaded with the semiconductor wafers is clamped into the clamping groove, so that the positioning block is clamped into the positioning groove, and then according to this step, multiple groups of semiconductor wafers are clamped into the clamping disc for processing, so that the annealing furnace can heat and process multiple groups of semiconductor wafers at one time, so that the semiconductor wafers can be processed in batches.

[0004] In the process of implementing this solution, the inventor found that when the equipment performs batch annealing operations on wafers, the wafers need to be placed manually into the circular grooves. Since the clamping device is kept in the same axial direction as the furnace body, the workers will still be subjected to thermal shock from the high ambient temperature inside the furnace body when taking and placing the wafers. Utility Model Content

[0005] 1. Technical problems solved by the utility model:

[0006] The utility model provides a semiconductor rapid annealing furnace, which solves the problem that manual operation on the axial direction of the furnace body of the existing equipment is easily subject to thermal shock from the high temperature environment inside the furnace body.

[0007] 2. Technical solution:

[0008] In order to achieve the above-mentioned purpose, the technical solution provided by the utility model is: a semiconductor rapid annealing furnace, comprising the following structure:

[0009] A furnace shell, wherein a furnace body is nested in the middle of the furnace shell, and an end cover is movably connected to the front end of the furnace body.

[0010] The insulation cover is symmetrically arranged front and back about the middle part of the furnace body, the opposite sides of the two insulation covers respectively contact with the outer sides of the two isolation plates, and the opposite sides of the two isolation plates are respectively fixedly connected with the front and rear ends of the guide rods.

[0011] Furthermore, a driving motor is fixedly provided at the rear end of the furnace shell, a screw rod is fixedly provided at the front output end of the driving motor, and the front end of the screw rod extends to the inner side of the bottom end of the furnace body.

[0012] Furthermore, a sliding rod and a sleeve are respectively fixed on the left and right sides of the bottom of the end cover, the outer side of the sliding rod is movably connected to the inner side of the left end of the furnace body, the outer side of the sleeve is threadedly connected to the outer side of the screw rod, and the outer side of the sleeve is movably connected to the inner side of the right end of the furnace body.

[0013] Furthermore, a deflection motor is fixedly provided on the left side of the front end of the end cover, and a maintenance cover is detachably connected to the motor assembly portion of the end cover via bolts.

[0014] Furthermore, the outer side of the insulation cover located in the furnace body is movably connected to the inner side of the furnace body, the outer side of the insulation cover located at the end cover is fixedly connected to the rear side of the end cover, the left side and the middle part of the insulation cover are respectively movably connected with a deflection rod and an auxiliary rod, the bottom front side of the deflection rod is fixedly connected to the rear output end of the deflection motor, the deflection rod and the auxiliary rod have the same length, the top rear side of the deflection rod is movably connected to the outer side of the isolation plate, and the top rear side of the auxiliary rod is movably connected to the outer side of the isolation plate.

[0015] Furthermore, a plurality of trays are slidably connected to the outer sides of the guide rods, and a wafer groove is fixedly provided in the middle of the trays.

[0016] 3. Beneficial effects:

[0017] Compared with the prior art, the technical solution provided by the utility model has the following beneficial effects:

[0018] The utility model provides a semiconductor rapid annealing furnace, wherein the deflection motor and the deflection rod cooperate to drive the isolation plate to deflect between the insulation cover, and cooperate with the auxiliary rod to complete the axial deviation of the isolation plate from the insulation cover or the furnace body. At this time, the staff does not need to directly face the thermal shock caused by the high temperature environment inside the furnace body to the external environment temperature, which is convenient for the workers to carry out the material taking and placing operation in the wafer annealing operation;

[0019] The utility model provides a semiconductor rapid annealing furnace, wherein the guide rod provides installation support for the tray rack, the wafers to be annealed are placed in the wafer slots, the driving motor and the lead screw cooperate to complete the end cover to close the front of the furnace body, and at this time, the wafers in the wafer slots enter the furnace body for batch annealing operation;

[0020] The parts not involved in the device are the same as those in the prior art or can be implemented by using the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional diagram of the structure of the utility model;

[0022] Figure 2 It is a half-section stereoscopic diagram of the end cover structure of the utility model;

[0023] Figure 3 It is a half-section stereoscopic diagram of the furnace structure of the utility model;

[0024] Figure 4 It is a half-section stereoscopic diagram of the thermal insulation cover structure of the utility model.

[0025] Reference numerals:

[0026] Furnace shell-1; driving motor-11; screw rod-12;

[0027] Furnace body-2;

[0028] End cap-3; slide rod-31; sleeve-32;

[0029] Deflection motor - 4;

[0030] Insulation cover-5; deflection rod-51; auxiliary rod-52;

[0031] Isolation board - 6;

[0032] Guide rod-7; tray rack-71; wafer slot-72. DETAILED DESCRIPTION

[0033] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0034] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element; when an element is considered to be "connected to" another element, it may be directly connected to the other element or there may also be a central element; the terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present invention; the terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the term "and / or" used herein includes any and all combinations of one or more related listed items.

[0036] Refer to the attached Figure 1-4 The utility model provides a semiconductor rapid annealing furnace, comprising the following structure:

[0037] A furnace shell 1 is provided, a furnace body 2 is nested in the middle of the furnace shell 1, and an end cover 3 is movably connected to the front end of the furnace body 2.

[0038] The insulation cover 5 is symmetrically arranged front and back about the middle of the furnace body 2 , and the opposite sides of the two insulation covers 5 respectively contact the outer sides of the two isolation plates 6 , and the opposite sides of the two isolation plates 6 are fixedly connected to the front and rear ends of the guide rods 7 .

[0039] In this embodiment, Figure 2 and Figure 3 As shown, a driving motor 11 is fixedly disposed at the rear end of the furnace shell 1 , a screw rod 12 is fixedly disposed at the front output end of the driving motor 11 , and the front end of the screw rod 12 extends to the inner side of the bottom end of the furnace body 2 .

[0040] The driving motor 11 drives the screw rod 12 to rotate, and the screw rod 12 is threadedly connected to the sleeve 32 to complete the opening and closing of the end cover 3 at the front of the furnace body 2. During the process of the end cover 3 moving toward the front of the furnace body 2,

[0041] In this embodiment, Figure 2 and Figure 3 As shown, a slide rod 31 and a sleeve 32 are fixed to the left and right sides of the bottom of the end cover 3 respectively. The outer side of the slide rod 31 is movably connected to the inner side of the left end of the furnace body 2, the outer side of the sleeve 32 is threadedly connected to the outer side of the screw rod 12, and the outer side of the sleeve 32 is movably connected to the inner side of the right end of the furnace body 2.

[0042] The combination of the slide bar 31 and the sleeve 32 improves the stability of the opening and closing movement of the end cover 3 at the front of the furnace body 2, and at the same time provides stable support for the deflection rotation seat of the isolation plate 6 between the insulation cover 5.

[0043] In this embodiment, Figure 4 As shown, a deflection motor 4 is fixedly provided on the left side of the front end of the end cover 3, and a maintenance cover is detachably connected to the motor assembly position of the end cover 3 by bolts.

[0044] The deflection motor 4 drives the deflection rod 51 to deflect, and cooperates with the auxiliary rod 52 to adjust the working position of the isolation plate 6 outside the insulation cover 5, offsetting the isolation plate 6 and the tray rack 71 axially of the furnace body 2, eliminating the need for workers to take and place wafers in the axial direction of the furnace body 2.

[0045] In this embodiment, Figure 2 and Figure 4 As shown, the outer side of the insulation cover 5 located in the furnace body 2 is movably connected to the inner side of the furnace body 2, the outer side of the insulation cover 5 located at the end cover 3 is fixedly connected to the rear side of the end cover 3, the left side and the middle part of the insulation cover 5 are respectively movably connected with a deflection rod 51 and an auxiliary rod 52, the bottom front side of the deflection rod 51 is fixedly connected to the rear output end of the deflection motor 4, the deflection rod 51 and the auxiliary rod 52 have the same length, the top rear side of the deflection rod 51 is movably connected to the outer side of the isolation plate 6, and the top rear side of the auxiliary rod 52 is movably connected to the outer side of the isolation plate 6.

[0046] Since the isolation plate 6 needs to be deflected between the insulation cover 5 through the cooperation of the deflection rod 51 and the auxiliary rod 52, the insulation cover 5 close to the end cover 3 adopts a fixed connection assembly method, and the insulation cover 5 close to the inner side of the furnace body 2 and the inside of the furnace body 2 need to be provided with a groove for the insulation cover 5 to slide axially along the furnace body 2, so as to prevent the isolation plate 6 from slipping during the deflection between the insulation plates.

[0047] The deflection motor 4 and the deflection rod 51 cooperate to drive the isolation plate 6 to deflect between the insulation cover 5, and cooperate with the auxiliary rod 52 to complete the axial deviation of the isolation plate 6 from the insulation cover 5 or the furnace body 2. At this time, the staff does not need to directly face the thermal shock caused by the high temperature environment inside the furnace body 2 to the external ambient temperature.

[0048] In this embodiment, Figure 1 , Figure 2 and Figure 4 As shown, a plurality of tray racks 71 are slidably connected to the outer side of the guide rod 7 , and a wafer groove 72 is fixedly disposed in the middle of the tray rack 71 .

[0049] The guide rod 7 provides installation support for the disc rack 71. The wafers that need to be annealed are placed in the wafer slot 72. The drive motor 11 and the screw rod 12 cooperate to complete the end cover 3 to close the front of the furnace body 2. At this time, the wafers in the wafer slot 72 enter the furnace body 2 for batch annealing operations.

[0050] The above-described embodiments only express a certain implementation method of the utility model, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the patent of the utility model shall be based on the attached claims.

Claims

1. A semiconductor rapid annealing furnace, characterized in that: Includes the following structure: A furnace shell (1), wherein a furnace body (2) is nested in the middle of the furnace shell (1), and an end cover (3) is movably connected to the front end of the furnace body (2); The heat-insulating covers (5) are symmetrically arranged front and back about the middle of the furnace body (2), the opposite sides of the two heat-insulating covers (5) respectively contact the outer sides of the two isolation plates (6), and the opposite sides of the two isolation plates (6) are respectively fixedly connected to the front and rear ends of the guide rods (7).

2. A semiconductor rapid annealing furnace according to claim 1, characterized in that: A drive motor (11) is fixedly disposed at the rear end of the furnace shell (1), a screw rod (12) is fixedly disposed at the front output end of the drive motor (11), and the front end of the screw rod (12) extends to the inner side of the bottom end of the furnace body (2).

3. A semiconductor rapid annealing furnace according to claim 1, characterized in that: A slide bar (31) and a sleeve (32) are fixedly provided on the left and right sides of the bottom of the end cover (3), respectively; the outer side of the slide bar (31) is movably sleeved with the inner side of the left end of the furnace body (2); the outer side of the sleeve (32) is threadedly connected with the outer side of the screw rod (12); and the outer side of the sleeve (32) is movably sleeved with the inner side of the right end of the furnace body (2).

4. A semiconductor rapid annealing furnace according to claim 1, characterized in that: A deflection motor (4) is fixedly arranged on the left side of the front end of the end cover (3), and a maintenance cover is detachably connected to the motor assembly portion of the end cover (3) via bolts.

5. A semiconductor rapid annealing furnace according to claim 1, characterized in that: The outer side of the heat-insulating cover (5) located in the furnace body (2) is movably connected to the inner side of the furnace body (2); the outer side of the heat-insulating cover (5) located at the end cover (3) is fixedly connected to the rear side of the end cover (3); the left side and the middle part of the heat-insulating cover (5) are respectively movably connected to a deflection rod (51) and an auxiliary rod (52); the bottom front side of the deflection rod (51) is fixedly connected to the rear output end of the deflection motor (4); the deflection rod (51) and the auxiliary rod (52) have the same length; the top rear side of the deflection rod (51) is movably connected to the outer side of the isolation plate (6); and the top rear side of the auxiliary rod (52) is movably connected to the outer side of the isolation plate (6).

6. A semiconductor rapid annealing furnace according to claim 1, characterized in that: A plurality of tray racks (71) are slidably connected to the outer side of the guide rod (7), and a wafer groove (72) is fixedly provided in the middle of the tray rack (71).

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