Stable transmission system

By designing a stable transmission system in the transmission system of the insert furnace, including a synchronously mobile transmission bracket and a connecting device, the problem of fragmentation during the loading and unloading of the silicon wafer is solved, and the precise loading and unloading of the silicon wafer is improved and the production efficiency of the silicon wafer is improved.

CN222705481UActive Publication Date: 2025-04-01SUZHOU N SINGLE INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202421381101.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-17
Publication Date
2025-04-01
Estimated Expiration
2034-06-17

AI Technical Summary

Technical Problem

In the transmission system of the insertion furnace, the silicon wafer is prone to fragment due to irregular shapes during loading and unloading, resulting in insufficient accuracy of insertion and departure.

Method used

A stable transmission system is designed, including a transmission device and a connecting device. The transmission device transports silicon wafers in a horizontal direction, and the feeding ports and discharge ports are provided on both sides. The connecting device is arranged at the feeding port and the discharge port, including a feeding mechanism corresponding to the limit space, and the precise loading and unloading of the silicon wafer is achieved through synchronously moving transmission brackets and position sensors.

Benefits of technology

Automatic loading and unloading of silicon wafers is realized, avoiding the problem of fragmentation during exchange of silicon wafers, and improving transmission rate and production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a stable transmission system which comprises a transmission device, the transmission device conveys silicon wafers along the horizontal direction, a feeding port and a discharging port are arranged on two sides of the transmission device along the transmission direction, the transmission device comprises a plurality of transmission supports which move synchronously, and each transmission support comprises at least one limiting space with an opening at one end. The connecting devices are arranged at the feeding port and the discharging port and comprise feeding mechanisms corresponding to the limiting spaces, and the conveying direction of each feeding mechanism is parallel to the conveying direction of the conveying device. When the openings of the limiting spaces horizontally face the feeding mechanism, the feeding mechanism conveys the silicon wafers in the horizontal direction, the conveying device is in a conveying state in the feeding process of the feeding mechanism, and the feeding mechanism can insert the silicon wafers into the corresponding limiting spaces or take out the silicon wafers in the corresponding limiting spaces in the moving process of the corresponding limiting spaces. The conveying system can stably convey the silicon wafers between the conveying device and the connection system, and feeding and discharging of the silicon wafers are achieved.
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Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer drying equipment, in particular to a stable transmission system. Background Art

[0002] The inserting furnace is a kind of drying equipment. It is widely used in the industry because of its high drying efficiency and huge drying output. The inserting furnace includes a transmission system, and the silicon wafers enter and exit the drying chamber through the transmission system. The transmission system includes a transmission device, and the transmission device usually adopts an inserting transmission method. The transmission device has an inlet port and an outlet port. The silicon wafer is inserted into the transmission device at the inlet port and leaves the transmission device at the outlet port. When loading and unloading at the inlet port and the outlet port, the irregular shape of the silicon wafer often leads to fragments during the loading and unloading process. Therefore, how to improve the accuracy of silicon wafer insertion and exit at the inlet port and the outlet port has become a technical problem to be solved. Utility Model Content

[0003] In order to overcome the above-mentioned shortcomings, the purpose of the utility model is to provide a stable transmission system, which can stably transmit silicon wafers between the transmission device and the docking system to achieve loading and unloading of silicon wafers.

[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is: a stable transmission system, comprising:

[0005] A transmission device, wherein the transmission device transports silicon wafers in a horizontal direction, wherein a feeding port and a discharging port are arranged on both sides of the transmission device along the transmission direction, wherein the transmission device comprises a plurality of synchronously moving transmission brackets, and each of the transmission brackets comprises at least one limiting space with an opening at one end;

[0006] A docking device, the docking device is arranged at the feed port and the discharge port, the docking device comprises a feeding mechanism corresponding to the limit space, and the transmission direction of each feeding mechanism is parallel to the transmission direction of the transmission device;

[0007] When the opening of the limiting space is horizontally facing the feeding mechanism, the feeding mechanism transmits the silicon wafer in the horizontal direction, and the transmission device is always in the transmission state during the feeding process of the feeding mechanism. The feeding mechanism can insert the silicon wafer into the corresponding limiting space or take out the silicon wafer in the corresponding limiting space during the movement of the corresponding limiting space.

[0008] The beneficial effects of the utility model are:

[0009] 1. The docking device is set at the feeding port and the discharging port to realize the automatic loading and unloading of silicon wafers.

[0010] Second, when the opening is horizontally facing the feeding mechanism, that is, the limit space and the feeding mechanism are aligned, and the limit space reaches the working range of the feeding mechanism. At this time, the feeding mechanism transports the silicon wafer in the horizontal direction to realize the switching of the silicon wafer in the feeding mechanism and the limit space. The transmission direction of the feeding mechanism and the transmission device is the same. When the silicon wafer is exchanged between the two, the moving direction will not change, and the posture will not change, which effectively protects the silicon wafer and avoids the problem of silicon wafer fragmentation during exchange.

[0011] 3. It solves the problem that the traditional insert furnace needs to stop the transmission device to collect and release materials, speeds up the transmission rate and improves production efficiency.

[0012] Furthermore, the transmission device further comprises a transmission driving member, and the transmission driving member is used to drive all transmission brackets to move synchronously;

[0013] The transmission support also includes a position sensor that moves synchronously therewith, and the position sensor is linked to the transmission drive member. When the transmission support reaches the feed port or the discharge port, the feeding mechanism starts to transmit the silicon wafer.

[0014] The position of the transmission bracket is detected by a position sensor, and the feeding mechanism starts to convey the silicon material only when it is detected that the transmission bracket reaches the feed port or the discharge port.

[0015] Furthermore, the feeding mechanism further comprises:

[0016] A silicon wafer detection member, wherein the silicon wafer detection member is used to detect the position of the silicon wafer on the feeding mechanism;

[0017] The docking drive member is used to drive the silicon wafer on the feeding mechanism to move. The docking drive member is linked with the silicon wafer detection member. When the silicon wafer detection member detects the silicon wafer, the docking drive member drives the silicon wafer thereon to move. The docking drive member starts to transport the silicon wafer only when the transport bracket reaches the feed port or the discharge port.

[0018] Only when the limit space is aligned with the feeding mechanism and there is a silicon wafer, the feeding mechanism will transport the silicon wafer to achieve accurate loading and unloading of the silicon wafer. When the docking drive stops working, the transmission bracket has not left the feed port or the discharge port, but the silicon wafer has been inserted into the limit space.

[0019] Furthermore, the feeding mechanism further comprises:

[0020] A conveyor belt, wherein at least one conveyor belt is provided, the silicon wafer is placed on the conveyor belt and moves under the drive of the conveyor belt, and the conveyor belt rotates under the drive of the connecting driving member;

[0021] A rotating seat, the conveyor belt is rotatably connected to the rotating seat.

[0022] The feeding mechanism transports silicon wafers via a conveyor belt, achieving horizontal transportation of silicon wafers. The conveyor belt does not need to be reversed and reset, but only needs to be paused and started, saving time.

[0023] Furthermore, the conveyor belt partially extends into the limiting space with an opening toward it, and a gap is left between the end of the conveyor belt along its conveying direction and the bottom of the limiting space.

[0024] The conveyor belt can transfer the silicon wafers to the limited space during its movement. However, there needs to be a gap between the end of the conveyor belt and the bottom of the limited space to prevent the silicon wafers from continuing to move forward due to inertia when the conveyor belt stops, colliding with the bottom of the limited space and causing silicon wafer fragments.

[0025] Furthermore, the transmission bracket includes at least one limiting component, each limiting component defines a limiting space, and each limiting component includes two frames;

[0026] When the transport support moves to the feed port or the discharge port, the two frames of one of the limiting components are respectively located on both sides of the feeding mechanism, and the silicon wafer enters or leaves the limiting space between the two frames.

[0027] At this time, when the transmission bracket moves, the feeding mechanism will not interfere with the limit assembly.

[0028] Furthermore, the silicon wafer extends out of the feeding mechanism in a horizontal plane perpendicular to the transmission direction of the feeding mechanism, and the portion of the silicon wafer extending out of the feeding mechanism can be plugged into the frame.

[0029] In this way, when the transmission bracket moves, it can drive the silicon wafer plugged therein to separate from the feeding mechanism to achieve loading.

[0030] Furthermore, the transmission device further comprises at least one chain of a closed-loop structure, all the transmission brackets are fixedly connected to the chain, and the chain rotates under the driving of the transmission driving member;

[0031] The travel path of the chain includes an upper horizontal section, a lower horizontal section and transition sections at both ends. The docking device is located on one side of the transition section and at a position where the opening of the limiting space is parallel to the upper horizontal section.

[0032] The upper horizontal section passes through the drying chamber and is used for drying silicon wafers. The limited space of the transition section will change in angle, so the connecting device is set here.

[0033] Furthermore, the transmission device further includes a transmission assembly arranged corresponding to the chain;

[0034] Each of the transmission components comprises a driving gear and a driven gear, and the chain is respectively meshed with the driving gear and the driven gear and is wound around the driving gear and the driven gear.

[0035] Furthermore, the transmission device further comprises a tensioning assembly corresponding to the chain, and the tensioning assembly is used to tension the corresponding chain. The tensioning assembly ensures that the chain is always in a tensioned state, thereby improving the stability of conveying silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A top view of an embodiment of the utility model;

[0037] Figure 2 A side view of an embodiment of the utility model;

[0038] Figure 3 for Figure 1 Enlarged view of point A in the middle;

[0039] Figure 4 It is a three-dimensional structural schematic diagram of an embodiment of the utility model;

[0040] Figure 5 It is a schematic diagram of the three-dimensional structure of the docking device in the embodiment of the utility model;

[0041] Figure 6 It is a schematic diagram of the three-dimensional structure of the transmission bracket in the embodiment of the utility model.

[0042] In the figure:

[0043] 100. Transmission device;

[0044] 200, a first docking device;

[0045] 300, second docking device;

[0046] 400, silicon wafer;

[0047] 1. Transmission bracket; 11. Limiting space; 111. Opening; 12. Position sensor; 13. Connecting plate; 14. Limiting assembly; 141. Fixing seat; 142. Frame; 143. Supporting protrusion;

[0048] 2. Chain; 21. Upper horizontal section; 22. Transition section;

[0049] 3. Transmission assembly; 31. Driving gear; 32. Fixed frame;

[0050] 4. Tensioning assembly; 41. Sliding block; 42. Tensioning wheel; 43. Guide rod; 44. Compression spring;

[0051] 5. Clamping assembly; 51. Shift plate; 52. Adjusting wheel;

[0052] 6. Feeding mechanism; 61. Conveyor belt; 62. Transmission seat; 63. Transmission rod; 64. Support plate; 65. Driving pulley; 66. Driven pulley. DETAILED DESCRIPTION

[0053] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0054] See attached Figure 1 and attached Figure 2 As shown, a stable transmission system of the utility model includes a transmission device 100 and two docking devices. The transmission device 100 is provided with a feed port and a discharge port on both sides along its transmission direction, and the two docking devices are respectively located at the feed port and the discharge port. The docking device is used to transport the silicon wafer 400, and the transmission direction of the docking device is parallel to the transmission direction of the transmission device 100.

[0055] In this embodiment, the docking device at the feeding port is the first docking device 200, which is used to transport the silicon wafer 400 to the transmission device 100, and the docking device at the discharging port is the second docking device 300, which is used to take out the silicon wafer 400 on the transmission device 100 and continue to transport it. The transmission direction of the docking device and the transmission direction of the transmission device 100 are both horizontal (X direction), and the transmission directions of the two are parallel to achieve horizontal insertion and horizontal departure of the silicon wafer 400. During this process, the posture of the silicon wafer 400 will not change.

[0056] See attached Figure 2 As shown, the transmission device 100 includes a plurality of synchronously moving transmission brackets 1, and each transmission bracket 1 includes at least one confining space 11 with an opening 111 at one end. The moving path of the transmission bracket 1 is a closed-loop structure, and when the transmission bracket 1 moves, the direction of the opening 111 of the confining space 11 will change. The docking device includes a feeding mechanism 6 corresponding to the confining space 11, and each feeding mechanism 6 can convey the silicon wafer 400 in the horizontal direction. When the opening 111 of the confining space 11 is horizontally toward the feeding mechanism 6, the feeding mechanism 6 conveys the silicon wafer 400 in the horizontal direction to insert the silicon wafer 400 into the corresponding confining space 11, or to take out the silicon wafer 400 in the corresponding confining space 11.

[0057] In this embodiment, when the opening 111 is horizontally oriented toward the feeding mechanism 6, that is, the limiting space 11 and the feeding mechanism 6 are aligned, and the limiting space 11 reaches the working range of the feeding mechanism 6. At this time, the feeding mechanism 6 transports the silicon wafer 400 in the horizontal direction, realizing the switching of the silicon wafer 400 in the feeding mechanism 6 and the limiting space 11. Because at this time, the extension direction of the limiting space 11 and the transmission direction of the feeding mechanism 6 are the same, both are horizontal directions, when the silicon wafer 400 is exchanged between the two, the moving direction will not change, the posture will not change, and the silicon wafer 400 will be effectively protected, and the problem of silicon wafer 400 being broken during exchange will be avoided.

[0058] In one embodiment, see the attached Figure 4 As shown, each transmission bracket 1 also includes a position sensor 12 that moves synchronously therewith, and the position sensor 12 can be sensed by the detection device to obtain the position of the transmission bracket 1 in real time. The detection device is located near the discharge port and the feed port, and can sense the transmission bracket 1 whose opening 111 of the limit space 11 is horizontally facing the feeding mechanism 6, that is, the transmission bracket 1 moved into the working range of the feeding mechanism 6. When the transmission bracket 1 moves to the working range of the feeding mechanism 6, the opening 111 of the limit space 11 is facing the feeding mechanism 6, and the transmission bracket 1 at this position can be detected by the detection device.

[0059] In one embodiment, the position sensor 12 is a sensing sheet, and the detection device is a device capable of detecting the sensing sheet. The detection device detects the sensing sheet using a position limiting technology, which will not be described in detail here.

[0060] The transmission device 100 includes a transmission drive member, which drives all transmission brackets 1 to move synchronously. The transmission drive member is always in a working state during the process of loading and unloading the silicon wafer 400, that is, the transmission device 100 always transmits the silicon wafer during the process of loading and unloading the silicon wafer 400, and the detection device and the feeding mechanism 6 are linked. When the detection device detects the position sensor 12, the feeding mechanism 6 starts to work and exchanges the silicon wafer 400 with the limiting space 11. Because the limiting space 11 has a certain space, the process of the limiting space 11 entering and leaving the working range of the feeding mechanism requires a certain amount of time. The feeding mechanism 6 completes the insertion or removal of the silicon wafer 400 during this time without stopping the transmission device 100. It solves the problem that the traditional insertion furnace needs the transmission device to stop to collect and release materials, speeds up the transmission rate, and improves production efficiency.

[0061] In one embodiment, each feeding mechanism 6 further includes a silicon wafer 400 detection member (not shown in the figure), and the silicon wafer 400 detection member is used to detect the position of the silicon wafer 400 on the feeding mechanism 6. The feeding mechanism 6 also includes a docking drive member, and the silicon wafer 400 detection member and the docking drive member are linked. When the silicon wafer 400 detection member detects the silicon wafer 400, there are already silicon wafers 400 to be transported on the feeding mechanism 6. At this time, the docking drive member drives the silicon wafer 400 thereon to move to insert or leave the limiting space 11. The docking drive member only transfers the silicon wafer 400 when the position sensor 12 is sensed, so that the feeding mechanism 6 will only transport the silicon wafer 400 when the limiting space 11 reaches the working range of the quasi-feeding mechanism 6.

[0062] In one embodiment, the silicon wafer 400 detection component may be a through-beam sensor. When the through-beam light of the through-beam sensor is blocked, it indicates that a silicon wafer 400 has arrived at the feeding mechanism 6 .

[0063] See attached Figure 6 As shown, the transmission bracket 1 includes a connecting plate 13, on which at least one limiting assembly 14 is arranged, and each limiting assembly 14 includes two fixing seats 141, two frames 142 and two supporting protrusions 143. The two frames 142 are respectively fixed on the corresponding fixing seats 141, and are used to limit the side of the silicon wafer 400 and for the silicon wafer 400 to lean on. The two frames 142 are arranged at intervals along the Y direction, and the ends of the two frames 142 away from the connecting plate 13 form an opening 111 for the silicon wafer 400 to be inserted. The supporting protrusion 143 is fixed to the fixing seat 141 and is located on one side of the frame 142, and the supporting protrusion 143 is used to carry the silicon wafer 400. A limiting space 11 is formed between the supporting protrusion 143 of a limiting assembly 14 and the frame 142.

[0064] See attached Figure 2 As shown, the frame 142 includes two connecting rods and an ear support portion, the two connecting rods are arranged at intervals along the transmission direction, one of the two connecting rods is arranged at an angle, and the other connecting rod is perpendicular to the fixing seat, and the inclined connecting rod is inclined toward the other connecting rod along the width of the support plate from the side away from the support plate to the side close to the support plate, and the silicon wafer rests on the inclined connecting rod. The inclined connecting rod is located behind the vertically arranged connecting rod in the transmission direction. The ear support portion is located on the side of the two connecting rods away from the supporting protrusion and defines an opening groove with an opening facing the supporting protrusion, and the ear support portion is used to limit the side of the silicon wafer.

[0065] At this time, the limiting space 11 formed between the supporting protrusion 143 and the frame 142 is larger than the silicon wafer 400. During the transmission of the silicon wafer 400 by the feeding mechanism 6, even if the transmission driving member drives the transmission bracket 1 to move, the limiting space 11 still does not leave the working range of the feeding mechanism 6 during the movement of the transmission bracket 1.

[0066] See attached Figure 3 and attached Figure 4 As shown, the width of the silicon wafer 400 in the Y direction is greater than the width of the feeding mechanism 6 in the Y direction, so that the silicon wafer 400 extends out of the feeding mechanism 6 in the Y direction, and when inserted into the limiting space 11, part of the silicon wafer 400 is plugged into the frame 142, so that when the frame 142 moves, it can drive the silicon wafer 400 to separate from the feeding mechanism 6. When the opening 111 of the limiting space 11 is horizontally facing the feeding mechanism 6, the two frames 142 are located on both sides of the silicon wafer 400 in the Y direction on the feeding mechanism 6.

[0067] The feeding mechanism 6 of the first docking device 200 drives the silicon wafer 400 thereon to move toward the limited space 11 along the X direction, and the silicon wafer 400 is horizontally inserted into the limited space 11 from the opening 111, and the two frames 142 play a guiding role at the same time. At the same time, the silicon wafer 400 in one limited space 11 abuts against the feeding mechanism 6 of the second docking device 300, and the feeding mechanism 6 of the second docking device 300 drives the silicon wafer 400 thereon to move toward one side of the limited space 11 along the X direction, and the silicon wafer 400 leaves the limited space 11 from the opening 111, and the two frames 142 play a guiding role at the same time.

[0068] In one embodiment, see the attached Figure 4 and attached Figure 6 As shown, each transmission bracket 1 is provided with two limiting spaces 11 along its length direction, so each docking device is also provided with two feeding mechanisms 6. The two feeding mechanisms 6 can convey corresponding silicon wafers 400 under the drive of one docking drive, or they can correspond to one docking drive respectively and convey silicon wafers 400 under the drive of the corresponding docking drive. In this embodiment, the two feeding mechanisms 6 use the same docking drive to save costs.

[0069] See attached Figure 2 and attached Figure 4 As shown, the transmission device 100 also includes two synchronously rotating chains 2, both of which are closed-loop structures, and the transmission bracket 1 is fixed between the two chains 2. The chain 2 is a travel path including an upper horizontal section 21 located at the top, a lower horizontal section located at the bottom, and a transition section 22 located between the upper horizontal section and the lower horizontal section, and the transition section 22 is connected to the upper horizontal section 21. The upper horizontal section 21 extends along the X direction, and when the transmission bracket 1 moves on the upper horizontal section 21, the limit assembly 14 moves vertically, and the opening 111 of the limit space 11 faces upward.

[0070] When the transmission bracket 1 travels in the transition section 22, the direction of the limiting assembly 14 will change. Figure 2As shown, the limit assembly 14 will experience three states in the transition section 22: a downward tilt state, a horizontal state, and an upward tilt state. The limit assembly 14 directly reaches the horizontal section after passing through the upward tilt state, or first reaches the upward tilt state after passing through the horizontal section. The opening 111 of the upper limit space 11 of the transmission bracket 1 will be in the horizontal direction in the transition section 22, so the docking device is located on one side of the transition section 22 and is located at a position where the limit assembly 14 can be in the horizontal state.

[0071] Of course, in some embodiments, the number of chains 2 may be one, three or more, as long as all chains 2 are closed loop structures and can rotate synchronously. The transmission bracket 1 is fixed on the chains 2. The more chains 2 there are, the more stable the movement of the transmission bracket 1 is, but the cost will also be high.

[0072] In one embodiment, see the attached Figure 5 As shown, each feeding mechanism 6 includes two synchronously rotating conveyor belts 61, and the silicon wafer 400 can be placed on the conveyor belts 61 and moved under the drive of the conveyor belts 61. Each conveyor belt 61 is a closed loop structure, wound around a driving pulley 65 and a driven pulley 66. One conveyor belt 61 corresponds to one transmission seat 62, and the driving pulley 65 and the driven pulley 66 are rotatably connected to the rotating seat.

[0073] In one embodiment, the side of the conveyor belt 61 that contacts the silicon wafer has a friction coefficient requirement. If the friction coefficient is too large or too small, the sliding distance of the silicon wafer 400 during the transmission process will be too large or too small, resulting in an incorrect posture of the silicon wafer 400.

[0074] In one embodiment, the transmission speed of the conveyor belt is 500 mm / s, the friction coefficient of the contact surface between the conveyor belt 61 and the silicon wafer 400 is not less than 0.6, and the friction coefficient of the contact surface between the conveyor belt 61 and the driving pulley and the driven pulley is not less than 0.2.

[0075] In one embodiment, the conveyor belt 61 partially extends into the confined space 11 with the opening facing it, and the conveyor belt 61 can transfer the silicon wafer 400 into the confined space 11 during the movement. However, a gap needs to be left between the end of the conveyor belt 61 and the bottom of the confined space 11 (supporting protrusion 143) to prevent the silicon wafer 400 from continuing to move forward due to inertia and colliding with the bottom of the confined space 11 when the conveyor belt 61 stops, thereby causing the silicon wafer 400 to be broken into pieces.

[0076] The spacing should not be too large, otherwise the silicon wafer 400 cannot be stably inserted into the limiting space 11, and the spacing should not be too small, otherwise the silicon wafer 400 will collide with the bottom of the limiting space due to inertia. The spacing is set according to the transmission speed of the conveyor belt, and the spacing only needs to meet the transmission position requirements and ensure that the silicon wafer will not collide with the bottom of the limiting space.

[0077] See attached Figure 5 As shown, the height of the upper surface of the conveyor belt 61 is higher than the height of the upper surface of the rotating seat, and part of the rotating seat extends between the cavities formed by the conveyor belt 61. At this time, the transmission seat 62 plays a role in supporting the conveyor belt 61, preventing the conveyor belt 61 from being greatly deformed under the gravity of the silicon wafer 400, and ensuring that the silicon wafer 400 can move in the horizontal direction. On the other hand, it will not interfere with the conveyor belt 61 in transmitting the silicon wafer 400, ensuring that the silicon wafer 400 is in contact with the conveyor belt 61.

[0078] In one embodiment, all the driving pulleys 65 are sleeved on a coaxially arranged transmission rod 63, the driving pulleys 65 and the transmission rod 63 rotate synchronously, the transmission rod 63 is connected to the docking drive member, and rotates along the axis under the drive of the docking drive member. At this time, all the conveyor belts 61 of the docking device can be driven to move synchronously through a docking drive member.

[0079] See attached Figure 5 As shown, a support plate 64 is fixed under all the transmission seats 62. The support plate 64 plays a supporting role and improves the strength of the docking device.

[0080] Of course, in one embodiment, a feeding mechanism 6 may have only one conveyor belt 61 or three conveyor belts 61, but it is necessary to ensure that all conveyor belts 61 can extend into the limiting space 11 at the loading port and the unloading port. The maximum distance of the feeding mechanism 6 extending into the limiting space 11 in the Y direction is less than the minimum distance of the two frames 142 in the Y direction, so that when the transmission bracket 1 moves, a pair of frames 142 can pass from both sides of the feeding mechanism 6 in the Y direction, and the feeding mechanism 6 will not interfere with the corresponding frames 142. At the same time, the maximum distance between the conveyor belts 61 in the Y direction is less than the width of the silicon wafer 400 in the Y direction. The silicon wafer 400 will always extend the corresponding feeding mechanism 6 in the Y direction, so that it can abut against the frame 142 when inserted into the limiting space 11, and can be separated from the feeding mechanism 6 when the frame 142 moves.

[0081] In one embodiment, the feeding mechanism 6 can also be a moving plate that can make linear reciprocating movements along the X direction, and the moving plate moves under the drive of the docking driving member, and the docking driving member is a cylinder. The silicon wafer 400 can be placed on the supporting moving plate and move synchronously with the moving plate. At this time, the feeding mechanism 6 can also transport the silicon wafer 400 into the limited space 11 or take out the silicon wafer 400 in the limited space 11 horizontally. However, it is also necessary to ensure that the silicon wafer 400 will always extend out of the corresponding moving plate in the Y direction.

[0082] See attached Figure 4As shown, the transmission device 100 also includes a transmission assembly 3, and the two chains 2 rotate under the drive of the corresponding rotating assembly. Each transmission assembly 3 includes a driving gear 31 and a driven gear, and the chain 2 is respectively engaged with the driving gear 31 and the driven gear and wound on the driving gear 31 and the driven gear. The driving gear 31 rotates under the drive of the transmission drive member, and the driven gear rotates synchronously under the drive of the chain 2.

[0083] In one embodiment, the driving gears 31 of the two transmission assemblies 3 rotate under the drive of the same transmission drive. A synchronization rod is connected between the driving gears 31 of the two transmission assemblies 3. The synchronization rod is coaxially arranged with the driving gear 31 and can rotate along its own axis under the drive of the transmission drive. At this time, when the transmission drive works, it can drive the two chains 2 to rotate synchronously, and the transmission bracket 1 moves under the drive of the two chains 2, thereby realizing the transmission of the silicon wafer 400.

[0084] See attached Figure 4 As shown, the driving gear 31 and the driven gear are rotatably connected to the corresponding fixing frames 32 respectively, and the fixing frames 32 are used to support the driving gear 31 and the driven gear.

[0085] See attached Figure 2 and attached Figure 4 As shown, the transmission device 100 also includes a tensioning assembly 4 corresponding to the chain 2, and the tensioning assembly 4 is used to tension the corresponding chain 2. The tensioning assembly 4 includes a slider 41, a tensioning wheel 42, a guide rod 43 and a compression spring 44. The slider 41 is sleeved on the guide rod 43 and can slide along the axial direction of the guide rod 43. The tensioning wheel 42 moves synchronously with the slider 41 and is rotationally connected to the slider 41, and the tensioning wheel 42 is engaged with the chain 2. The compression spring 44 is sleeved on the guide rod 43 and one end is against the slider 41. The compression spring 44 is always in a compressed state, providing a force for the slider 41 to move along the axial direction of the guide rod 43 toward the chain 2. And the slider 41 can move along the axial direction of the guide rod 43 toward the side away from the chain 2 under the push of the chain 2. In this process, the compression spring is continuously compressed.

[0086] In one embodiment, the tensioning assembly 4 may also be configured as other structures, such as a sensor sensing the pressure on the tensioning wheel 42, using a linear module to drive the tensioning wheel 42 to move, etc. As long as the tensioning structure can achieve the tensioning effect.

[0087] In this embodiment, the tensioning assembly 4 with the compression spring 44 is provided so that the chain 2 is always in a tensioned state.

[0088] See attached Figure 2 and attached Figure 4As shown, the transmission device 100 also includes a clamping assembly 5 corresponding to the chain 2. The clamping assembly 5 includes a shift plate 51 and an adjusting wheel 52. The shift plate 51 is provided with a plurality of adjusting holes along the vertical direction. The adjusting wheel 52 is engaged with the chain 2. The adjusting wheel 52 can be connected with the adjusting hole through a mounting block and is used to adjust the clamping of different gears.

[0089] The stable transmission system in this embodiment has a docking device at the feed port and the discharge port for loading and unloading the silicon wafer 400. The transmission direction of the docking device is horizontal to that of the transmission device 100, and the transmission directions of the two are parallel to each other, so as to achieve horizontal insertion and horizontal exit of the silicon wafer 400. It is ensured that the silicon wafer 400 is kept in a horizontal position when entering and leaving the confined space 11, and the position of the silicon wafer 400 will not change between the docking device and the transmission device 100, so as to avoid the problem of fragmentation of the silicon wafer 400 due to the change of position.

[0090] When the stable transmission system is working, the chain 2 moves under the drive of the transmission drive. When the detection device senses the position sensor 12 on the transmission support 1, it means that the transmission support 1 has reached the position of the loading port or the discharging port. At this time, the opening 111 of the upper limit space 11 of the transmission support 1 is horizontally facing the feeding mechanism 6. At the same time, when the silicon wafer detection part on the docking device detects the silicon wafer 400, it means that there is a silicon wafer 400 waiting to be transmitted on the docking device. The silicon wafer detection part sends a working command to the docking drive, and the feeding mechanism 6 starts to move the silicon wafer 400 on it along the X direction. During the movement, the feeding mechanism 6 of the first docking device 200 inserts the silicon wafer 400 into the corresponding limit space 11, and during the movement, the feeding mechanism 6 of the second docking device 300 moves the silicon wafer 400 in the limit space 11 toward the side away from the limit space 11 to leave the limit space 11. The loading of the first docking device 200 and the unloading of the second docking device 300 are performed synchronously. After completing one loading and unloading, the docking drive stops. During this process, the transmission drive is always working, and the limiting space 11 completes the connection of the silicon wafer 400 with the docking device during the process of entering and leaving the working range of the docking device. The transmission drive continues to drive the next transmission bracket 1 to the working position of the docking device.

[0091] The above implementation modes are only for illustrating the technical concept and features of the utility model, and their purpose is to allow people familiar with this technology to understand the content of the utility model and implement it. It cannot be used to limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A stable transmission system, characterized in that: include: A transmission device, wherein the transmission device transports silicon wafers in a horizontal direction, wherein a feeding port and a discharging port are arranged on both sides of the transmission device along the transmission direction, wherein the transmission device comprises a plurality of synchronously moving transmission brackets, and each of the transmission brackets comprises at least one limiting space with an opening at one end; A docking device, the docking device is arranged at the feed port and the discharge port, the docking device comprises a feeding mechanism corresponding to the limit space, and the transmission direction of each feeding mechanism is parallel to the transmission direction of the transmission device; When the opening of the limiting space is horizontally facing the feeding mechanism, the feeding mechanism transmits the silicon wafer in the horizontal direction, and the transmission device is always in the transmission state during the feeding process of the feeding mechanism. The feeding mechanism can insert the silicon wafer into the corresponding limiting space or take out the silicon wafer in the corresponding limiting space during the movement of the corresponding limiting space.

2. The stable transmission system according to claim 1, characterized in that: The transmission device further comprises a transmission driving member, and the transmission driving member is used to drive the transmission bracket to move synchronously; The transmission support also includes a position sensor that moves synchronously therewith, and the position sensor is linked to the transmission drive member. When the transmission support reaches the feed port or the discharge port, the feeding mechanism starts to transmit the silicon wafer.

3. The stable transmission system according to claim 2, characterized in that: The feeding mechanism also includes: A silicon wafer detection member, wherein the silicon wafer detection member is used to detect the position of the silicon wafer on the feeding mechanism; The docking drive member is used to drive the silicon wafer on the feeding mechanism to move. The docking drive member is linked with the silicon wafer detection member. When the silicon wafer detection member detects the silicon wafer, the docking drive member drives the silicon wafer thereon to move. The docking drive member starts to transport the silicon wafer only when the transport bracket reaches the feed port or the discharge port.

4. The stable transmission system according to claim 3, characterized in that: The feeding mechanism also includes: A conveyor belt, wherein at least one conveyor belt is provided, the silicon wafer is placed on the conveyor belt and moves under the drive of the conveyor belt, and the conveyor belt rotates under the drive of the connecting driving member; A rotating seat, the conveyor belt is rotatably connected to the rotating seat.

5. The stable transmission system according to claim 4, characterized in that: The conveyor belt partially extends into a limiting space with an opening toward it, and a distance is left between the end of the conveyor belt along the conveying direction and the bottom of the limiting space.

6. The stable transmission system according to any one of claims 1 to 5, characterized in that: The transmission bracket includes at least one limiting assembly, each limiting assembly defines a limiting space, and each limiting assembly includes two frames; When the transport support moves to the feed port or the discharge port, the two frames of one of the limiting components are respectively located on both sides of the feeding mechanism, and the silicon wafer enters or leaves the limiting space between the two frames.

7. The stable transmission system according to claim 6, characterized in that: The silicon wafer extends out of the feeding mechanism in a horizontal plane in a transmission direction of the feeding mechanism, and the portion of the silicon wafer extending out of the feeding mechanism can be plugged into the frame.

8. The stable transmission system according to claim 2, characterized in that: The transmission device further comprises at least one chain of a closed-loop structure, the transmission bracket is fixedly connected to the chain, and the chain rotates under the driving of the transmission driving member; The travel path of the chain includes an upper horizontal section, a lower horizontal section and transition sections at both ends. The docking device is located on one side of the transition section and at a position where the opening of the limiting space is parallel to the upper horizontal section.

9. The stable transmission system according to claim 8, characterized in that: The transmission device also includes a transmission assembly arranged corresponding to the chain; Each of the transmission components comprises a driving gear and a driven gear, and the chain is respectively meshed with the driving gear and the driven gear and is wound around the driving gear and the driven gear.

10. The stable transmission system according to claim 8, characterized in that: The transmission device also includes a tensioning assembly arranged corresponding to the chain, and the tensioning assembly is used to tension the corresponding chain.