Packaging device with double-sided efficient heat dissipation and normal chip

Abstract

The utility model relates to a double-sided high-efficiency heat radiation packaging device with a normal chip, which comprises a plastic packaging body, a carrier plate, at least one chip, a conductive heat radiation piece and a heat radiator, the at least one chip is positively arranged on the pins of the carrier plate through a conducting medium respectively; in the at least one chip, at least one chip is a triode functional chip, an MOS (Metal Oxide Semiconductor) tube functional chip or an IGBT (Insulated Gate Bipolar Translator) functional chip; the front pins of the triode functional chip, the MOS tube functional chip or the IGBT functional chip are connected with the pins on the carrier plate through conductive metal wires; the conductive heat dissipation piece is mounted on the front surfaces of all the chips through a conductive medium; the radiator is attached to the upper surface of the conductive heat dissipation piece through a conductive medium, and the upper surface of the conductive heat dissipation piece is completely exposed out of the plastic package body. Under the condition of large current, the radiator can be arranged on the upper surface and the lower surface, double-channel heat dissipation is realized, and the condition of product failure caused by heating is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to a packaging device with high-efficiency double-sided heat dissipation and upright chip mounting. Background Art

[0002] With the development of industrial digitalization and intelligence, especially the development of new energy, the arrival of the era of new energy revolution will bring unprecedented development opportunities to the development of IGBT functional chip industry. For example, in energy conservation and emission reduction, in the field of clean energy, IGBT functional chips have brought broad development space. For example, in industrial intelligence, factory production, and digital production, all of these controls are controlled by the precise positioning of circuits, voltages, and currents, and these are all the credit of IGBT functional chips. IGBT functional chips of power devices are everywhere in daily necessities, such as air conditioners and ovens, which are everywhere at any time. So no matter from which angle you look at it, the future of IGBT functional chips is very broad and has a very good development prospect.

[0003] At the same time, due to technological innovation, the three-and-a-half-generation products are constantly innovating and iterating, and silicon carbide power modules are currently the key development direction of large global power electronic device companies. Silicon carbide power modules have been initially applied in some high-end fields, including high-power density power conversion, high-performance motor drives, etc., and have broad application prospects and market potential. From 2017 to 2027, the global silicon carbide market size will grow from US$1.09 billion to US$6.297 billion, with a compound annual growth rate of 34%. Among them, the silicon carbide market size has grown from US$685 million to US$4.986 billion, with an annual compound growth rate of up to 39.2%. Electric vehicles (inverter + OBC + DC-DC) are the largest downstream application of silicon carbide, accounting for 62.8% to 79.2%, and the market share continues to rise.

[0004] Regardless of the characteristics of IGBT functional chips or / SiC power module packaging materials: they need to meet the development needs of high frequency and high speed, high voltage and large current, high temperature, high heat dissipation and high reliability, especially to solve the problem of high heat dissipation. At present, there are cooling systems to assist module heat dissipation, but because the heat dissipation currently mainly relies on one side of the product, there is currently no effective heat dissipation solution on the other side of the product, and this problem needs to be solved.

[0005] The current mainstream module packaging heat dissipation structure implementation solutions and electrical connection solutions in the industry are mainly as follows:

[0006] The copper-clad ceramic plate at the bottom of the module and the heat dissipation base plate are used as the main heat dissipation channel, and the electrical terminal output / chip top silicone and air transmission are used as auxiliary heat dissipation channels;

[0007] Adopt a multi-chip series or partial series structure to achieve the connection of active and passive devices such as different diode / transistor function chips;

[0008] The above structure has the following deficiencies:

[0009] The chip's working heat area is mainly in the design circuit layer, and the overall heat dissipation channel is on the upper layer of the chip, not the bottom of the chip. In order to effectively and quickly dissipate heat when the chip is working, there are the following problems and challenges:

[0010] 1. The chip thickness needs to be as thin as possible so that the heat can be transferred to the back of the chip through the silicon base or SIC base, which increases the technical difficulty and process cost of the industry, resulting in low yield and increased equipment investment costs.

[0011] 2. The bottom of the chip must be made of high thermal conductivity solder or sintered silver and other high thermal conductivity materials to quickly transfer the heat from the back of the chip to the copper-clad ceramic plate underneath (the ceramic plate needs to be combined with the chip heat requirements and select processes with different thermal conductivity coefficients, such as DBC / AMB, which needs to be doped with high thermal conductivity metals such as zirconium oxide, etc.), resulting in an increase in the cost of special materials;

[0012] 3. A metal heat sink needs to be selectively added to the bottom of the chip to remove the internal heat to the outside of the product, which results in the need to add an additional high-cost heat sink.

[0013] As for the existing chip connection relationship, because the main body adopts a series or partial series structure, there is a problem of low quality yield or the product cannot be reworked and repaired if one is damaged, resulting in low overall product yield, as well as increased product costs and market prices, and reduced market competitiveness. Utility Model Content

[0014] In view of the current technical barriers such as low module packaging yield, high overall cost, poor heat dissipation transfer channel, and poor stress effect, the existing structure cannot effectively improve the temperature transfer of the chip itself, and the chip series-parallel or partial series-parallel structure cannot achieve board disassembly operations. In view of the above shortcomings, it is impossible to well cover the market application of silicon carbide / IGBT functional chips / gallium nitride and other chips in the entire module market.

[0015] The purpose of this utility model patent is to provide a packaging device with high efficiency heat dissipation on both sides and upright chip installation, including a plastic package, a carrier, at least one chip, a conductive heat dissipation member and a heat sink;

[0016] At least one of the chips is mounted on the pins of the carrier through a conductive medium;

[0017] In at least one of the chips, at least one chip is a triode function chip, a MOS tube function chip or an IGBT function chip;

[0018] The front pins of the triode function chip, MOS tube function chip or IGBT function chip are connected to the pins on the carrier board through conductive metal wires;

[0019] The conductive heat sink is mounted on the front side of all the chips through a conductive medium;

[0020] The heat sink is mounted on the upper surface of the conductive heat sink through a conductive medium, and the upper surface of the conductive heat sink is completely exposed outside the plastic package.

[0021] Preferably, a surface metal layer is provided on the upper surface of the conductive heat sink, and the surface metal layer extends to the upper surface of the plastic packaging layer.

[0022] Furthermore, the surface metal layer completely covers the upper surface of the plastic package body.

[0023] Optionally, when the number of the chips is ≥2, among all the chips, at least one is a triode function chip, a MOS tube function chip or an IGBT function chip.

[0024] Optionally, a plurality of protrusions are evenly arranged on the upper surface of the heat sink.

[0025] Optionally, the conductive heat sink is electrically connected to pins on the carrier board via a conductive medium.

[0026] Optionally, the conductive heat sink does not contact the pins on the carrier board.

[0027] Compared with the prior art, the double-sided efficient heat dissipation and chip-mounted packaging device of the utility model has the following advantages:

[0028] (1) It can realize dual-channel heat dissipation with heat sinks on both the upper and lower surfaces, greatly improving the situation where product failure is caused by heat;

[0029] (2) After the surface metallization is completed to form the surface metal layer, the S pole of the product can be removed by cutting. The polarity of the packaged device is as follows: the chip is mounted upright, so the G pole and D pole are at the bottom of the device, and the heat can also be dissipated through the external heat sink at the bottom; the S pole is at the top of the device, and the heat can also be dissipated through the upper part, realizing the function of double-sided heat dissipation of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 Schematic diagram of a package device with high efficiency heat dissipation on both sides and upright chip mounting according to the first embodiment of the present invention Figure 1 ;

[0031] Figure 2 Schematic diagram of a package device with high efficiency heat dissipation on both sides and upright chip mounting according to the first embodiment of the present invention Figure 2 ;

[0032] Figure 3 This is a schematic diagram of the product after the S pole of the carrier board is cut off in this embodiment 1;

[0033] Figure 4 This is a product schematic diagram of the carrier board in this embodiment 1 without an S-pole pin for connecting a conductive heat sink;

[0034] Figure 5 This is a schematic diagram of a packaging device with high-efficiency double-sided heat dissipation and upright chip mounting according to the second embodiment. DETAILED DESCRIPTION

[0035] The specific implementation of the utility model patent is further described in detail below in conjunction with the accompanying drawings.

[0036] Example 1

[0037] In this embodiment, two chips are taken as an example (a transistor function chip and a diode)

[0038] like Figure 1 As shown, a packaging device with high efficiency heat dissipation on both sides and upright chip mounting includes a plastic package 1, a carrier board, a triode functional chip 2, a diode 3, a conductive heat dissipation member 4 and a heat sink 5;

[0039] The transistor function chip 2 and the diode 3 are respectively mounted on the pins 6 of the carrier board through conductive media;

[0040] The front pin of the transistor function chip 3 is connected to the pins 8 and 9 on the carrier board through the conductive metal wire 7;

[0041] The conductive heat sink 4 is mounted on the front side of all the chips through a conductive medium, and the conductive heat sink 4 is electrically connected to the pins 10 on the carrier through the conductive medium;

[0042] The heat sink 5 is mounted on the upper surface of the conductive heat sink 4 through a conductive medium, and the upper surface of the conductive heat sink 4 is completely exposed outside the plastic package 1 .

[0043] In this embodiment, if Figure 2 As shown, the upper surface of the conductive heat sink 4 is provided with a surface metal layer 12, and the surface metal layer 12 extends to the upper surface of the plastic packaging layer 1. Furthermore, the surface metal layer 12 completely covers the upper surface of the plastic packaging body 1, maximizing the use of the upper surface of the packaged device and improving the heat dissipation efficiency.

[0044] In this embodiment, a plurality of protrusions 11 are evenly arranged on the upper surface of the heat sink 5, which effectively improves the bonding force with the plastic package body and prevents the plastic package body from falling off.

[0045] The transistor function chip 2 in this embodiment can also be replaced by a MOS tube function chip or an IGBT function chip.

[0046] Effectively design creepage distance and avoid high voltage / high current crosstalk risk by controlling device package terminal spacing

[0047] In addition, in this embodiment, Figure 3 As shown, the conductive heat sink does not contact the pins on the carrier. After the surface metallization treatment is completed, the S pole of the product can be removed by cutting. The polarity of the packaged device is as follows: the chip is mounted upright, so the G pole and D pole are at the bottom of the device, and the heat can also be dissipated through the external heat sink at the bottom; the S pole is at the top of the device, and the heat can also be dissipated through the upper part, realizing the function of double-sided heat dissipation of the product. In addition, the S pole pin for connecting the conductive heat sink can also be provided on the carrier, such as Figure 4 shown.

[0048] Function of the upper heat sink of the packaged device: Under normal circumstances, the packaged device dissipates heat by connecting to the bottom heat sink through a ceramic copper-clad laminate, and only dissipates heat on one side. The upper surface of the packaged device is metallized, and there is a heat sink as a medium. In the case of high current, both the upper and lower surfaces can have heat sinks, and dual-channel heat dissipation can be achieved, which greatly improves the situation where product failure is caused by heat.

[0049] Electrode lead-out: The S pole is on the upper surface of the device, and the upper surface is metal. The electrode can be led out using a conductive medium, or a metal conductive component can be used to connect the packaged device to the electrode and then lead out the terminal to achieve short and fast functions; the G and D poles can use a conductive medium to lead out the relevant polarities of the ceramic copper clad laminate.

[0050] Example 2

[0051] In addition, the chip in the packaged device can also be one, taking the transistor function chip as an example, Figure 5 shown.

[0052] The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the described embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all within the scope defined by the claims of this application.

Claims

1. A packaging device with high efficiency heat dissipation on both sides and upright chip mounting, comprising a plastic package, characterized in that: Also includes a carrier board, at least one chip, a conductive heat sink and a heat sink; At least one of the chips is mounted on the pins of the carrier through a conductive medium; In at least one of the chips, at least one chip is a triode function chip, a MOS tube function chip or an IGBT function chip; The front pins of the triode function chip, MOS tube function chip or IGBT function chip are connected to the pins on the carrier board through conductive metal wires; The conductive heat sink is mounted on the front side of all the chips through a conductive medium; The heat sink is mounted on the upper surface of the conductive heat sink through a conductive medium, and the upper surface of the conductive heat sink is completely exposed outside the plastic package.

2. A packaging device with high efficiency heat dissipation on both sides and upright chip mounting as claimed in claim 1, characterized in that: A surface metal layer is provided on the upper surface of the conductive heat sink, and the surface metal layer extends to the upper surface of the plastic packaging layer.

3. A packaging device with high efficiency heat dissipation on both sides and upright chip mounting as claimed in claim 2, characterized in that: The surface metal layer completely covers the upper surface of the plastic package body.

4. A packaging device with high efficiency heat dissipation on both sides and upright chip mounting as claimed in claim 1, characterized in that: When the number of the chips is ≥2, among all the chips, at least one is a triode function chip, a MOS tube function chip or an IGBT function chip.

5. A packaging device with high-efficiency double-sided heat dissipation and upright chip mounting as claimed in any one of claims 1 to 4, characterized in that: A plurality of protrusions are evenly arranged on the upper surface of the radiator.

6. A packaging device with high efficiency heat dissipation on both sides and upright chip mounting as claimed in claim 1, characterized in that: The conductive heat sink is electrically connected to the pins on the carrier board through a conductive medium.

7. A packaging device with high efficiency double-sided heat dissipation and upright chip mounting as claimed in claim 1, characterized in that: The conductive heat sink does not contact the pins on the carrier board.

Images