Composite adhesive substrate copper foil

Abstract

The utility model discloses a composite copper foil with adhesive substrate, comprising a copper foil layer and a PI layer, wherein the copper foil layer is provided with a double layer, a plurality of reinforcing ribs are provided between the double copper foil layers, the PI layer is laminated on the lower surface of the lower copper foil layer, and a protective layer is laminated on the upper surface of the upper copper foil layer; the utility model has reasonable structural design and is convenient to use, and the double copper foil composite design can enhance the electrical conductivity of the copper foil; the arrangement of the reinforcing ribs can enhance the overall flexibility of the copper foil; the use of an environmentally friendly adhesive can reduce the emission of harmful gases and enhance the environmental protection of the copper foil.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a composite adhesive-containing substrate clad with copper foil. Background Art

[0002] With the development of science and technology, the demand for increasingly miniaturized production of electronic equipment is gradually increasing, which has led to the gradual development of circuit boards in the direction of lightweight and miniaturization. Flexible circuit boards are usually covered with a layer of adhesive substrate copper foil to facilitate electrical conduction. Traditional adhesive substrate copper foil is usually a layer of copper foil plus a layer of AD glue plus a layer of PI. On the one hand, this form of single-layer copper foil makes the overall flexibility of the copper foil poor and the electricity that can be conducted by the single-layer copper foil is limited, and its electrical conductivity is poor. On the other hand, AD glue has poor high temperature resistance. After exceeding 105 degrees, AD glue will emit toxic gases, which is not conducive to the environmental protection and practicality of the copper foil, so it still needs to be improved. Utility Model Content

[0003] In order to solve the above-mentioned problems, the utility model provides a composite adhesive-based copper foil, including a copper foil layer and a PI layer, wherein the copper foil layer is provided with a double layer, and a plurality of reinforcing ribs are provided between the double copper foil layers, the PI layer is coated on the lower surface of the lower copper foil layer, and a protective layer is coated on the upper surface of the upper copper foil layer, and an adhesive layer is provided between the copper foil layer, the PI layer and the protective layer and bonded through the adhesive layer.

[0004] Preferably, a plurality of wire grooves are arranged on the lower surface of the protective layer, the front and back surfaces of the copper foil layer, and the upper surface of the PI layer. The wire grooves can be arranged in a cross shape, a corrugated shape, or a tic-tac-toe shape.

[0005] Preferably, the upper surface of the protective layer is configured as a frosted surface.

[0006] Preferably, the reinforcing ribs are aluminum alloy wires.

[0007] Preferably, the adhesive layer is silicone sealant.

[0008] The beneficial effects of the utility model are: the utility model has a reasonable structural design and is easy to use. The double copper foil composite design can enhance the electrical conductivity of the copper foil; the setting of the reinforcing ribs can enhance the overall flexibility of the copper foil; the use of the environmentally friendly adhesive can reduce the emission of harmful gases and enhance the environmental friendliness of the copper foil. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The present invention will be described by way of examples with reference to the accompanying drawings, in which:

[0010] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0011] Figure 2 It is a schematic diagram of the copper foil layer structure of the utility model;

[0012] In the figure: 1. PI layer; 2. Copper foil layer; 3. Reinforcement ribs; 4. Adhesive layer; 5. Protective layer; 6. Wire duct.

[0013] PI: refers to a material, namely polyimide resin, which is a high-temperature resistant thermosetting engineering plastic. DETAILED DESCRIPTION

[0014] All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and / or steps, can be combined in any manner.

[0015] Any feature of this specification, unless otherwise stated, can be replaced by other equivalent or alternative features with similar purposes. That is, unless otherwise stated, each feature is only an example of a series of equivalent or similar features.

[0016] like Figure 1 , 2 A composite adhesive-based copper foil is shown, comprising a copper foil layer 2 and a PI layer 1, wherein the copper foil layer 2 is provided with a double layer, and a plurality of reinforcing ribs 3 are provided between the double copper foil layers 2, the PI layer 1 is laminated on the lower surface of the lower copper foil layer 2, and a protective layer 5 is laminated on the upper surface of the upper copper foil layer 2, and an adhesive layer 4 is provided between the copper foil layer 2, the PI layer 1 and the protective layer 5 and bonded by the adhesive layer 4.

[0017] A plurality of wire grooves 6 are arranged on the lower surface of the protective layer 5, the front and back surfaces of the copper foil layer 2, and the upper surface of the PI layer 1. The wire grooves 6 can be arranged in a cross shape, a corrugated shape, or a tic-tac-toe shape.

[0018] The upper surface of the protective layer 5 is configured as a frosted surface.

[0019] The reinforcing ribs 3 are made of aluminum alloy wires.

[0020] The adhesive layer 4 is organic silicon sealant.

[0021] During use, the double-layer copper foil layer 2 can make the overall electrical conductivity of the copper foil better; the reinforcement ribs 3 can improve the overall flexibility of the copper foil, and the reinforcement ribs 3 are aluminum alloy wires. Since aluminum alloy has the advantages of high strength, light weight, and good electrical conductivity, the overall weight of the composite copper foil can be reduced, and the electrical conductivity of the copper foil can be further improved; the adhesive layer 4 is silicone sealant. Since silicone sealant has the advantages of good adhesion, high and low temperature resistance, excellent electrical properties, moisture resistance, and environmental protection, the copper foil will not emit toxic gases due to high temperature when it is used, and the layers of the copper foil can be more tightly compounded and not easily peeled off.

[0022] A plurality of wire grooves 6 are arranged on the lower surface of the protective layer 5, the front and back surfaces of the copper foil layer 2, and the upper surface of the PI layer 1. The wire grooves 6 can be arranged in a cross shape, a corrugated shape, or a well shape, which can increase the surface roughness, make the adhesion between the layers stronger, and reduce the discharge of excess glue during compounding.

[0023] The beneficial effects of the utility model are: the utility model has a reasonable structural design and is easy to use. The double copper foil composite design can enhance the electrical conductivity of the copper foil; the setting of the reinforcing ribs can enhance the overall flexibility of the copper foil; the use of the environmentally friendly adhesive can reduce the emission of harmful gases and enhance the environmental friendliness of the copper foil.

[0024] The present invention is not limited to the above-mentioned specific implementation modes, but extends to any new features or any new combination disclosed in this specification, as well as any new method or process steps or any new combination disclosed.

Claims

1. A composite adhesive-coated copper foil, comprising a copper foil layer (2) and a PI layer (1), characterized in that: The copper foil layer (2) is provided with a double layer, a plurality of reinforcing ribs (3) are provided between the double copper foil layers (2), the PI layer (1) is laminated on the lower surface of the lower copper foil layer (2), and a protective layer (5) is laminated on the upper surface of the upper copper foil layer (2), and an adhesive layer (4) is provided between the copper foil layer (2), the PI layer (1) and the protective layer (5) and bonded via the adhesive layer (4).

2. The composite adhesive-coated copper foil according to claim 1, characterized in that: A plurality of wire grooves (6) are arranged on the lower surface of the protective layer (5), the front and back surfaces of the copper foil layer (2), and the upper surface of the PI layer (1); the wire grooves (6) can be arranged in a cross shape, a corrugated shape, or a tic-tac-toe shape.

3. The composite adhesive-coated copper foil according to claim 1, characterized in that: The upper surface of the protective layer (5) is configured as a frosted surface.

4. The composite adhesive-coated copper foil according to claim 1, characterized in that: The reinforcing ribs (3) are aluminum alloy wires.

5. The composite adhesive-coated copper foil according to claim 1, characterized in that: The adhesive layer (4) is an organic silicone sealant.

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