Silicon wafer cutting device and cutting machine

Abstract

The utility model proposes a silicon wafer cutting device and a cutting machine, which relates to the field of diamond wire cutting technology. It includes a base and two bearing brackets installed on the base, and a main guide wheel part respectively arranged on the two bearing brackets; the main guide wheel part includes a plurality of guide wheels; a plurality of guide wheels located in the same main guide wheel part are rotatably arranged on the bearing bracket, and a plurality of wire grooves are opened on the outer circumferential wall of the guide wheel; diamond wires are correspondingly sleeved between the wire grooves on any two opposite guide wheels respectively located in the two main guide wheel parts; a control component for controlling the relative distance of the plurality of guide wheels is arranged in the main guide wheel part; a driving part for driving the plurality of guide wheels to move synchronously is arranged on the bearing bracket, and the spacing between any two adjacent diamond wires can be controlled by the above structure, so as to cut silicon wafers of different thicknesses, and a single guide wheel can be replaced to ensure that when the device slices the columnar silicon ingot, the thickness of the slices is uniform, and it is not easy to cause loss, thereby improving the yield rate of silicon wafers.

Description

Technical Field

[0001] The utility model relates to the technical field of diamond wire cutting, in particular to a silicon wafer cutting device and a cutting machine. Background Art

[0002] As the demand for clean energy increases, solar photovoltaic power generation also increases. Reducing carbon emissions and increasing conversion efficiency during the preparation process is the mission of many photovoltaic companies. It is urgent to realize large-size silicon wafers in the diamond wire slicing process of single crystal silicon rods for photovoltaic power generation.

[0003] However, when the existing diamond wire cutting machine is used to cut silicon rods, its main component is a guide wheel with an annular groove on the surface. The diamond wire is wound on the surface of the guide wheel, and the guide wheel rotates to drive the diamond wire to move and cut the silicon wafer. The current mainstream structure is that the main body is a solid rigid cylinder with an axial hole in the middle, and the outer surface is coated with a polyurethane coating with an annular groove on the surface. Since the surface of the diamond wire is diamond particles with high hardness, the polyurethane coating is greatly worn during the cutting of silicon wafers. When it is worn to a certain depth, a layer of polyurethane needs to be removed and then the surface is regrooved. However, due to the large elasticity of polyurethane, in order not to affect the accuracy, the thickness of the coating can only be controlled at 10mm. The number of times each guide wheel can be regrooved is limited. When the coating thickness is too thin, the entire guide wheel needs to be removed and the coating needs to be recast. This process takes a long time and is expensive. In addition, in the existing multi-wire cutting, the distance between any two adjacent diamond wires on the guide wheel is fixed, which is not convenient for adjustment to adapt to slicing tasks with different slice thicknesses. Utility Model Content

[0004] The purpose of the utility model is to provide a silicon wafer cutting device, which can solve the problems raised by the above-mentioned background technology in view of the shortcomings of the prior art.

[0005] The technical solution of the utility model is achieved in this way:

[0006] The utility model provides a silicon wafer cutting device, comprising a base and two bearing brackets installed on the base, and also comprising a main guide wheel part respectively arranged on the two bearing brackets; the main guide wheel part comprises a plurality of guide wheels; a plurality of guide wheels located in the same main guide wheel part are rotatably arranged on the bearing brackets, and a plurality of wire grooves are opened on the outer circumferential walls of the guide wheels; diamond wires are correspondingly sleeved between the wire grooves on any two opposite guide wheels respectively located in the two main guide wheel parts; a control component for controlling the relative distances of the plurality of guide wheels is arranged in the main guide wheel part; and a driving member for driving the plurality of guide wheels to move synchronously is arranged on the bearing brackets.

[0007] In some technical schemes of the utility model, the control component includes a screw rod rotatably arranged relative to the supporting bracket, and a plurality of guide cylinders connected to the guide wheels are rotatably arranged on the screw rod; the guide cylinders are threadedly connected to the screw rod; and a guide component is arranged on the bracket to guide the guide wheels to move axially along the screw rod.

[0008] In some technical schemes of the utility model, the guide assembly includes two guide rods arranged in pairs, and two guide holes adapted to the guide rods are provided on the end faces of the guide wheels, and the guide rods and the guide holes are interference fit; two connecting frames are provided between the two guide rods; the two connecting frames are respectively located at both ends of the guide rods; the connecting frames are rotatably connected to the load-bearing bracket, and the screw rod passes through the connecting frames and is rotatably connected to the load-bearing bracket.

[0009] In some technical solutions of the present utility model, the body of the driving member is installed on the bearing bracket, and the output end of the driving member is connected to the connecting frame through a coupling.

[0010] In some technical solutions of the utility model, a guide ring is installed on the connecting frame, and extension rods are provided at both ends of the connecting frame. The extension rods are provided with guide wheels that are slidably connected to the guide ring.

[0011] In some technical solutions of the present utility model, the cross section of the guide rod is rectangular.

[0012] In some technical solutions of the utility model, a driving motor connected to the screw rod is detachably provided on the bearing bracket.

[0013] Some technical solutions of the present invention include the silicon wafer cutting device as described above.

[0014] Compared with the prior art, the embodiments of the present invention have at least the following advantages or beneficial effects:

[0015] Based on the existing technology, the technical solution designs the integrally formed guide wheel into a segmented structure. When the coating on the surface of one end of the guide wheel wears significantly, only this part needs to be replaced individually, without having to replace the entire guide wheel component; this reduces the replacement time and cost. In this technical solution, at least 8 guide wheels within one main guide wheel part are coaxially installed on one of the bearing brackets to ensure that the rotation centers of the guide wheels are coaxial. The bearing bracket is installed on the base, and the bearing bracket and the base form a "C" shape. A control component for controlling the relative distance between multiple guide wheels is provided within the main guide wheel part; it can force multiple guide wheels to move closer to or away from each other along the axis of their rotation centers, and after adjustment, the distance between any one guide wheel and its adjacent guide wheel remains constant. In this way, the distance between any two adjacent diamond wires can be controlled through the above structure, thereby cutting silicon wafers of different thicknesses from the columnar silicon ingot and improving the adaptation efficiency of this equipment. Additionally, the provided driving part can control multiple coaxial guide wheels to perform circular motion synchronously, ensuring that when this equipment slices the columnar silicon ingot, the thickness of the slices is uniform, there is less loss, and the yield rate of the silicon wafers is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other relevant drawings can also be obtained based on these drawings.

[0017] Figure 1 is a three-dimensional structural schematic diagram of the present invention;

[0018] Figure 2 is a front cross-sectional structural schematic diagram of the present invention;

[0019] Figure 3 is a partial side view schematic diagram of the present invention;

[0020] Figure 4 is Figure 3 a partial enlarged structural schematic diagram at A in

[0021] Figure 5 is Figure 3 a partial enlarged structural schematic diagram at B in

[0022] Reference numerals: 1, bearing bracket; 2, connecting frame; 3, guiding ring; 4, guiding rod; 5, guide wheel; 6, screw; 7, silicon ingot; 8, diamond wire; 9, base; 10, slide rail; 11, frame body; 12, external threaded rod; 13, guiding wheel; 14, outer flange; 15, extension rod; 16, guiding wheel; 17, limiting spring. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0023] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] Example 1

[0026] Please refer to Figure 1-Figure 5 shown.

[0027] The present application provides a silicon wafer cutting device, such as Figure 1 , Figure 2As shown in the figure, the utility model provides a silicon wafer cutting device, which includes a base 9 and two bearing brackets 1 installed on the base 9. It also includes main pulley parts 5 respectively arranged on the two bearing brackets 1; the main pulley parts 5 include a plurality of guide pulleys 5; a plurality of guide pulleys 5 located within the same main pulley part 5 are all rotatably arranged on the bearing bracket 1, and a plurality of wire grooves are opened on the outer circumferential walls of the guide pulleys 5; a diamond wire 8 is correspondingly sleeved between the wire grooves on any two opposite guide pulleys 5 respectively located in the two main pulley parts 5; a control component for controlling the relative distance between the plurality of guide pulleys 5 is arranged within the main pulley part 5; a driving member for driving the plurality of guide pulleys 5 to move synchronously is arranged on the bearing bracket 1. The silicon wafer cutting device provided by this technical solution mainly solves the problem in the prior art that in a multi-stage silicon wafer cutting device, the guide pulley 5 is an integral body. When the polyurethane coating applied on the guide pulley 5 wears greatly, grooves need to be re-carved on its surface; and due to the large elasticity of polyurethane, in order not to affect the accuracy, the thickness of the coating can only be controlled within 10 mm. Therefore, the number of times of re-carving the grooves on each guide pulley 5 is limited. When the coating thickness is too thin, the entire guide pulley 5 needs to be removed and the coating needs to be re-cast. This process takes a long time and is costly; the material loss is large; to solve the above problems, in this technical solution, the integrally formed guide pulley 5 in the prior art is designed into a segmented structure. When the coating on the surface of one end of the guide pulley 5 wears greatly, only this part needs to be replaced separately, so that the entire guide pulley 5 component does not need to be replaced as a whole; the replacement time is reduced and the cost is reduced; in this technical solution, at least 8 guide pulleys 5 within one of the main pulley parts 5 are coaxially installed on one of the bearing brackets 1 to ensure that the rotation centers of the guide pulleys 5 are coaxial; the bearing bracket 1 is installed on the base 9, and the bearing bracket 1 and the base 9 are in a "C" shape; a control component for controlling the relative distance between the plurality of guide pulleys 5 is arranged within the main pulley part 5; it can force the plurality of guide pulleys 5 to move closer to or away from each other along the axis of their rotation centers, and after adjustment, the distance between any one guide pulley 5 and its adjacent guide pulley 5 is constant; and through the above structure, the distance between any two adjacent diamond wires 8 can be controlled, so as to cut silicon wafers with different thicknesses from the columnar silicon ingot 7, improving the adaptation efficiency of this device; and the arranged driving member can control the plurality of coaxial guide pulleys 5 to make circular motions synchronously, ensuring that when this device slices the columnar silicon ingot 7, the thickness of the slices is uniform, not easy to cause loss, and improving the yield rate of the silicon wafers.

[0028] In some technical solutions of the present utility model, the specific structure of the control component includes a screw rod 6 rotatably arranged relative to the bearing bracket 1. A plurality of guide cylinders connected to the guide pulley 5 are rotatably arranged on the screw rod 6. The guide cylinder is integrally formed with the installation hole opened in the middle of the guide pulley 5; the guide cylinder is threadedly connected to the screw rod 6; a guiding component for guiding the guide pulley 5 to move along the axial direction of the screw rod 6 is arranged on the bracket.

[0029] The specific structure of the guide assembly includes two guide rods 4 arranged in pairs, and two guide holes adapted to the guide rods 4 are provided on the end faces of the guide wheels 5, so that the guide wheels 5 can be prevented from self-rotating under the drive of the screw rod 6; two connecting frames 2 are arranged between the two guide rods 4, and the connecting frames 2 are fixedly connected to the bearing bracket 1 by screws, and the screw rod 6 penetrates the connecting frame 2 and is rotatably connected to it by bearings; through the above arrangement, the screw rod 6 arranged between the two guide rods 4 and the connecting frame 2 can be rotatably rotated to drive multiple guide wheels 5 to move along the extension direction of the guide rod 4, so as to control the spacing between any two adjacent diamond wires 8, thereby cutting silicon wafers of different thicknesses from the columnar silicon ingot 7, and improving the adaptation efficiency of the device. In addition, the above structure can also use the screw rod 6 to self-lock the guide wheel 5.

[0030] In some technical solutions of the utility model, the cross section of the guide rod 4 is rectangular, and the guide rod 4 is interference fit with the guide hole. After such arrangement, the guide wheel 5 can be prevented from shaking on the guide rod 4, thereby ensuring the accuracy of the device during operation.

[0031] Furthermore, the cross section of the guide rod 4 may also be designed to be circular.

[0032] In some technical solutions of the present utility model, the body of the driving member is installed on one of the supporting brackets 1, and the output end of the driving member is connected to the connecting frame 2 through a coupling.

[0033] The specific structure of the driving member is a belt drive mechanism or a gear drive mechanism or a motor is connected to the rotating shaft of the connecting frame 2 to realize the synchronous movement of multiple guide wheels 5, so as to ensure that when the device slices the columnar silicon ingot 7, the thickness of the slices is uniform, loss is not easy to occur, and the yield of silicon wafers is improved.

[0034] In some technical solutions of the present invention, a drive motor which is detachably provided on the support bracket 1 and is transmission-connected to the screw 6 is convenient for an operator to control the movement of the screw, thereby adjusting the relative spacing of a plurality of guide wheels on the screw.

[0035] In some technical schemes of the utility model, a guide ring 3 is installed on the connecting frame, and an extension rod 15 is provided at both ends of the connecting frame 2, and a guide wheel 16 is provided on the extension rod 15 to be slidably connected to the guide ring 3. The guide ring 3 is fixed to the connecting frame by bolts, and the extension rod 15 slides in a slide groove provided on the end surface of the connecting frame 2, and a limit spring 17 is sleeved on the extension rod 15. The guide wheel 16 is rotatably arranged on the extension rod 15 through the mounting frame, and an annular guide groove adapted to the guide ring 3 is provided on the guide wheel 16; such an arrangement can ensure the stability of multiple guide wheels 5 when they rotate synchronously. It can also avoid the above structure from generating a large centrifugal force when rotating, and use the guide ring to overcome the centrifugal force generated by the guide wheel, so as to ensure that the rotation center of multiple guide wheels 5 remains consistent, which can avoid the vibration generated by the structure when cutting the silicon ingot 7 or the problem of silicon wafer breakage caused by the diamond wire jumping, which affects the normal operation of the device.

[0036] Preferably, a limit assembly for limiting the deflection of the diamond wire 8 can also be provided on the connecting frame, the limit assembly includes a frame body 11, the frame body 11 is slidably set on the connecting frame through a slide rail 10, and the two are fixed by bolts, two opposing nuts are provided on the frame body 11, and an externally threaded rod 12 threadedly connected to the nuts is rotatably provided on the nuts, a guide wheel 13 is fixedly provided on the externally threaded rod 12, and an external flange 14 is provided on the wheel surface of the guide wheel 13; the two externally threaded rods 12 are controlled to approach each other until the wheel surface of the guide wheel 13 abuts against the two sides of the diamond wire 8, and a wear-resistant layer is rotatably provided on the wheel surface of the guide wheel 13, which is not shown in the figure, to increase the service life of the guide wheel 13; the external flange 14 abuts against the non-cutting surface of the diamond wire 8, so that the rotation direction of the diamond wire 8 can be positioned, and the diamond wire 8 can be prevented from deflecting and jumping during the cutting process, which affects the silicon wafer molding accuracy.

[0037] In some technical solutions of the present invention, a cutting machine includes the silicon wafer cutting device as described above.

[0038] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A silicon wafer cutting device, comprising a base and two supporting brackets mounted on the base, characterized in that: It also includes a main guide wheel part respectively arranged on two supporting brackets; the main guide wheel part includes a plurality of guide wheels; the plurality of guide wheels located in the same main guide wheel part are rotatably arranged on the supporting bracket, and a plurality of wire grooves are opened on the outer circumferential wall of the guide wheel; diamond wires are correspondingly sleeved between the wire grooves on any two opposite guide wheels respectively located in the two main guide wheel parts; a control component for controlling the relative distance of the plurality of guide wheels is arranged in the main guide wheel part; and a driving member for driving the plurality of guide wheels to move synchronously is arranged on the supporting bracket.

2. A silicon wafer cutting device according to claim 1, characterized in that: The control component includes a screw rod rotatably arranged relative to the supporting bracket, and a plurality of guide cylinders connected to the guide wheel are rotatably arranged on the screw rod; the guide cylinders are threadedly connected to the screw rod; and a guide component for guiding the guide wheel to move along the axial direction of the screw rod is arranged on the bracket.

3. A silicon wafer cutting device according to claim 2, characterized in that: The guide assembly includes two guide rods arranged in pairs, and two guide holes adapted to the guide rods are provided on the end faces of the guide wheels, and the guide rods and the guide holes are interference fit; two connecting frames are provided between the two guide rods; the two connecting frames are respectively located at the two ends of the guide rods; the connecting frames are rotatably connected to the supporting bracket, and the screw rod passes through the connecting frames and is rotatably connected to the supporting bracket.

4. A silicon wafer cutting device according to claim 3, characterized in that: The body of the driving member is mounted on one of the supporting brackets, and the output end of the driving member is connected to the connecting frame through a coupling.

5. A silicon wafer cutting device according to claim 3 or 4, characterized in that: A guide ring is installed on the connecting frame, and extension rods are arranged at both ends of the connecting frame. Guide wheels which are slidably connected with the guide ring are arranged on the extension rods.

6. The silicon wafer cutting device according to claim 3, characterized in that: The cross section of the guide rod is rectangular.

7. The silicon wafer cutting device according to claim 2, characterized in that: The bearing bracket is detachably provided with a driving motor which is transmission-connected with the screw rod.

8. A cutting machine, characterized in that: It comprises a silicon wafer cutting device as described in any one of claims 1 to 7.

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