Chip turning mechanism, chip turning device and chip sorting equipment
By designing a chip flip mechanism including a base, a first open and close cover and a second open and close cover, the problems of unreliable and inefficient chip flips in the prior art are solved, and the chip is efficient and reliable flips are achieved, and the capacity utilization rate is improved.
Patent Information
- Application Number
- CN202421558249.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-03
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2034-07-03
AI Technical Summary
Existing chip sorting equipment cannot guarantee reliability when turning over the chip, resulting in frequent chip drops and damage, and requires repeated identification of the chip, which is inefficient and wastes production capacity.
A chip flip mechanism is designed, including a base, a first opening and closing cover and a second opening and closing cover. By rotating the base about a set axis, the opening and closing cover and the chip are driven to rotate simultaneously to realize the flip of the chip. The mechanism does not need to send the chip back to the vibration bowl, avoiding the chip falling and damage, and solves the problem of the target surface not facing up by turning it in one go, improving efficiency.
It effectively improves the problem of chip damage due to repeated falls, improves the efficiency of chip flip process, reduces unnecessary identification and processing steps, and improves capacity utilization.
Smart Images

Figure CN222714479U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, and in particular to a chip flipping mechanism, a chip flipping device and a chip sorting device. Background Art
[0002] The chip sorting equipment provided by the related technology needs to identify whether the target surface of the chip (for example, the front side of the chip) is facing upward when sorting chips. If it is identified that the target surface of the chip is not facing upward, the chip with the target surface not facing upward will be sent back to the vibration bowl (or vibration plate) to turn the chip over by allowing the chip to fall freely into the vibration bowl.
[0003] However, this flipping method cannot guarantee that the chip is flipped over reliably, and when the chip fails to be flipped over, the chip will be sent back to the vibration bowl for flipping again because it is recognized that the target side of the chip is not facing up. This may easily cause the chip to fall and be damaged frequently. After the chip is repeatedly sent back to the vibration bowl, it needs to be identified again, which is inefficient and easily causes waste of production capacity. Utility Model Content
[0004] The purpose of the utility model is to provide a chip flipping mechanism, a chip flipping device and a chip sorting device. The chip flipping mechanism can improve the problem of chip damage due to repeated falling, and does not need to repeatedly identify the same chip, which can improve efficiency and increase production capacity.
[0005] The embodiment of the utility model is achieved as follows:
[0006] In a first aspect, the utility model provides a chip flipping mechanism, comprising:
[0007] A base, wherein the base is provided with a placement hole, the placement hole is used to accommodate the chip, the base has a first surface and a second surface that are arranged opposite to each other, and the placement hole runs through the first surface and the second surface;
[0008] a first opening and closing cover, the first opening and closing cover is movably disposed on the base, and the first opening and closing cover is configured to open or cover the placement hole from the first surface; and,
[0009] The second opening and closing cover is movably arranged on the base, and the second opening and closing cover is configured to open or cover the placement hole from the second surface; wherein,
[0010] The base can rotate around a set axis to drive the first opening and closing cover, the second opening and closing cover and the chip placed in the placement hole to rotate synchronously.
[0011] In an optional embodiment, at least one of the first opening and closing cover and the second opening and closing cover is rotatably or slidably connected to the base.
[0012] In an optional embodiment, the chip flipping mechanism further includes a first elastic member, the first elastic member is connected between the base and the first opening and closing cover, and the first elastic member is configured to enable the first opening and closing cover to have a movement tendency to cover the placement hole.
[0013] In an optional embodiment, the first end of the first opening and closing cover is rotatably connected to the base, and the second end of the first opening and closing cover is connected to the first elastic member.
[0014] In an optional embodiment, the chip flipping mechanism further includes a second elastic member, the second elastic member is connected between the base and the second opening and closing cover, and the second elastic member is configured to enable the second opening and closing cover to have a movement tendency to cover the placement hole.
[0015] In an optional embodiment, the first end of the second opening and closing cover is rotatably connected to the base, and the second end of the second opening and closing cover is connected to the second elastic member.
[0016] In an optional embodiment, the chip flipping mechanism further includes a first driving member, the first driving member is in transmission cooperation with the first opening and closing cover, and is used to drive the first opening and closing cover to open the placement hole; and / or,
[0017] The chip flipping mechanism also includes a second driving member, which is in transmission cooperation with the second opening and closing cover and is used to drive the second opening and closing cover to open the placement hole.
[0018] In an optional embodiment, the chip flipping mechanism further includes a third driving member, which is transmission-connected to the base and is used to drive the base to rotate around a set axis.
[0019] In an optional embodiment, the first opening and closing cover is attached to the first surface, or there is a gap between the first opening and closing cover and the first surface, the width of which is smaller than the thickness of the chip; and / or,
[0020] The second opening and closing cover is in contact with the second surface, or there is a gap between the second opening and closing cover and the second surface, the gap having a width smaller than the thickness of the chip.
[0021] In an optional embodiment, the chip flipping mechanism further includes a limit member, which is connected to the base and forms a limit gap between the limit member and the base, and one of the first opening and closing cover and the second opening and closing cover is configured to be movable within the limit gap.
[0022] In an optional embodiment, the chip flipping mechanism also includes a third driving member, which is transmission-connected to the base and is used to drive the base to rotate around a set axis; the first opening and closing cover is provided with a first abutting portion, and the second opening and closing cover is provided with a second abutting portion, and both the first abutting portion and the second abutting portion can be used to abut against a frame of the chip sorting device, wherein, when the third driving member drives the base to rotate around the set axis, the base drives the first opening and closing cover and the second opening and closing cover to rotate synchronously, and one of the first abutting portion and the second abutting portion can abut against the frame and move relative to the base, and make the placement hole open from the first side or the second side.
[0023] In the second aspect, the utility model provides a chip flipping device, comprising a driving mechanism and any one of the aforementioned chip flipping mechanisms, the driving mechanism being transmission-connected to the bases of the two chip flipping mechanisms, and the two chip flipping mechanisms being respectively located on both sides of the driving mechanism, the driving mechanism being used to drive the two chip flipping mechanisms to rotate around a preset axis within a preset plane to exchange positions, and the driving mechanism being also used to drive the bases of the two chip flipping mechanisms to rotate around their respective corresponding set axes.
[0024] In a third aspect, the utility model provides a chip sorting device, comprising: a frame and a chip flipping mechanism or a chip flipping device according to any one of the aforementioned embodiments arranged on the frame.
[0025] The beneficial effects of the chip flipping mechanism of the embodiment of the utility model include: the chip flipping mechanism provided by the embodiment of the utility model includes a base, a first opening and closing cover and a second opening and closing cover, wherein when one of the first opening and closing cover and the second opening and closing cover blocks the placement hole, the chip can be taken and placed in the placement hole from the side corresponding to the other of the first opening and closing cover and the chip is supported by the first opening and closing cover or the second opening and closing cover on the other side of the base, and when the first opening and closing cover and the second opening and closing cover both block the placement hole, the base is rotated around the set axis, which can drive the first opening and closing cover, the second opening and closing cover and the chip placed in the placement hole to rotate synchronously, so that the chip can be flipped. Since there is no need to return the chip to the vibration bowl, the damage problem caused by the chip falling can be effectively improved; moreover, after the chip whose target surface is not facing upward is flipped, the target surface must be facing upward, so there is no need to identify the chip again, which can improve efficiency and effectively improve the problem of waste of production capacity.
[0026] The chip flipping device of the embodiment of the utility model includes all the beneficial effects of the aforementioned chip flipping mechanism, for example: effectively improving the damage problem caused by chip falling; and improving efficiency, effectively improving the problem of waste of production capacity.
[0027] The chip sorting equipment of the embodiment of the utility model includes all the beneficial effects of the aforementioned chip flipping mechanism or chip flipping device, for example: effectively improving the damage problem caused by chip falling; and improving efficiency, effectively improving the problem of waste of production capacity. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0029] Figure 1 It is a structural schematic diagram of the chip flipping mechanism at a first viewing angle when the first opening and closing cover opens the placement hole in the embodiment of the utility model;
[0030] Figure 2 It is a structural schematic diagram of the chip flipping mechanism at a second viewing angle when the second opening and closing cover opens the placement hole in the embodiment of the utility model;
[0031] Figure 3 It is a structural schematic diagram of the chip flipping mechanism at a second viewing angle when the second opening and closing cover in the embodiment of the utility model covers the placement hole;
[0032] Figure 4 It is a side view of a chip flipping device in another embodiment of the utility model;
[0033] Figure 5 It is a top view of a chip flipping device in another embodiment of the present invention.
[0034] Icon: 010-chip flipping mechanism; 100-base; 101-placing hole; 110-first side; 120-second side; 200-first opening and closing cover; 210-first elastic member; 220-first hook; 300-second opening and closing cover; 310-second elastic member; 320-second hook; 400-limiting member; 500-chip; 600-bracket; 610-motor; 621-first bevel gear; 622-second bevel gear; 623-third bevel gear; a-set axis; b-preset axis; c-preset plane. DETAILED DESCRIPTION
[0035] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0036] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0037] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0038] In the description of the present utility model, it should be noted that the terms "upper", "lower", "inner", "outer", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0039] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "setting" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0040] This embodiment provides a chip sorting device, which can be used to classify chips according to different chip categories.
[0041] The chip sorting device includes a frame and a conveying and sorting component, a picking component, an identification component and a chip flipping mechanism 010 (such as Figure 1-3As shown in FIG. 1 , the conveying and sorting component is used to convey and sort the chips 500; the identification component is used to identify whether the target surface (e.g., front surface) of the chips 500 conveyed by the conveying and sorting component is distributed upward; the picking component is used to move the chips 500 conveyed by the conveying and sorting component to the chip flipping mechanism 010; the chip flipping mechanism 010 is used to flip the chips 500 to face the target surface upward. It should be noted that the structures and working principles of the conveying and sorting component, the picking component, and the identification component are similar to those of the related art and will not be described in detail here.
[0042] Please refer to Figure 1-3 The chip flipping mechanism 010 includes a base 100, a first opening and closing cover 200, and a second opening and closing cover 300. The base 100 is provided with a placement hole 101, and the placement hole 101 is used to accommodate the chip 500, that is, the picking component can move the chip 500 conveyed by the conveying and sorting component into the placement hole 101; the base 100 has a first surface 110 and a second surface 120 that are arranged opposite to each other, and the placement hole 101 runs through the first surface 110 and the second surface 120; the first opening and closing cover 200 It is movably arranged on the base 100, and the first opening and closing cover 200 is configured to open or cover the placement hole 101 from the first surface 110; the second opening and closing cover 300 is movably arranged on the base 100, and the second opening and closing cover 300 is configured to open or cover the placement hole 101 from the second surface 120; the base 100 can rotate around the set axis a to drive the first opening and closing cover 200, the second opening and closing cover 300 and the chip 500 placed in the placement hole 101 to rotate synchronously.
[0043] When one of the first opening and closing cover 200 and the second opening and closing cover 300 blocks the placement hole 101, the chip 500 can be taken and placed in the placement hole 101 from the corresponding side of the other of the first opening and closing cover 200 and the second opening and closing cover 300, and the chip 500 is supported by the first opening and closing cover 200 or the second opening and closing cover 300 on the other side of the base 100; when the first opening and closing cover 200 and the second opening and closing cover 300 both block the placement hole 101, the base 100 is rotated around the set axis a, which can drive the first opening and closing cover 200, the second opening and closing cover 300 and the chip 500 placed in the placement hole 101 to rotate synchronously, so that the chip 500 can be turned over. Since there is no need to return the chip 500 to the vibration bowl, the damage problem caused by the chip 500 falling can be effectively improved; moreover, after the chip 500 whose target surface is not facing upward is turned over, the target surface must be facing upward, so there is no need to repeatedly identify the chip 500, which can improve efficiency and effectively improve the problem of waste of production capacity.
[0044] It should be noted that the chip sorting equipment of the present embodiment flips the chip 500 by means of the chip 500 flipping device, and there is no need to send the chip 500 back to the vibration bowl when it is identified that the target side of the chip 500 is facing downward. Therefore, it can also improve the problem that the chip 500 is not successfully sent back to the vibration bowl and is transported to the next workstation and identified as a defective chip 500.
[0045] It should also be noted that, in the chip sorting device provided by the related technology which is not equipped with the chip flipping mechanism 010, when sorting the chips 500, the number of chips 500 sorted at one time is rated, that is, during sorting, a rated number of chips 500 to be sorted are usually placed in the vibration bowl; during sorting, if it is identified that the target surface of the chip 500 transported by the conveying and sorting component is not facing upward, the chip 500 needs to be sent back to the vibration bowl to repeat the feeding using the vibration bowl. During this process, the chip 500 with the target surface facing upward is successfully sorted, and the number of chips 500 to be sorted entering the conveying and sorting component gradually decreases. When the number of chips 500 is lower than the preset value of the conveying and sorting component, the machine will shut down. In this embodiment, the chip 500 is flipped over by the chip flipping mechanism 010, and there is no need to send the chip 500 with the target surface not facing upward back to the vibration bowl. Instead, the chip 500 is directly flipped over after being identified and delivered to the next workstation by the picking component. The chips 500 to be sorted can be continuously replenished in the vibration bowl, so that the number of chips 500 conveyed on the conveying and sorting component always meets the preset value, that is, the conveying and sorting component maintains a state of continuously conveying chips 500, and there will be no downtime problem.
[0046] It should be understood that the vibration bowl is arranged upstream of the conveying and sorting component, that is, the chips output from the outlet of the vibration bowl can enter the conveying and sorting component for transportation and sorting; optionally, in some embodiments, the outlet of the vibration bowl is provided with a detection component for detecting whether the target surface of the chip output from the outlet of the vibration bowl is facing upward, and a chip flipping mechanism can also be provided at the outlet of the vibration bowl, so that when the detection component arranged at the outlet of the vibration bowl detects that the target surface of the chip is not facing upward, the chip flipping mechanism arranged at the outlet of the vibration bowl is used to flip the chip to face the target surface upward.
[0047] Please refer to Figure 1-3 Optionally, the base 100 is configured to be able to rotate 180° around a set axis a. This configuration can ensure that the chip 500 that is flipped synchronously with the base 100 can exchange the front and back sides facing upward before and after flipping.
[0048] Furthermore, the chip flipping mechanism 010 further includes a third driving member, which is in transmission connection with the base 100 and is used to drive the base 100 to rotate around the set axis a. Exemplarily, the third driving member is a motor, and the output shaft of the motor is in transmission connection with the base 100 and is used to drive the base 100 to rotate around the set axis a, that is, the base 100 can be used to drive the chip 500 to flip synchronously, so as to realize the flipping of the chip 500.
[0049] It should be understood that in other embodiments, the chip flipping mechanism 010 may also include a transmission component, such as a worm gear assembly, a gear assembly, etc. The motor serving as the third driving member may also be connected to the base 100 through the transmission component, so that the motor drives the base 100 to flip around the set axis a through the transmission component. No specific limitation is made here.
[0050] It should be noted that the base 100 can be realized around the set axis a as follows Figure 1 Of course, in other embodiments, the base 100 can also be turned up and down around the set axis a (such as Figure 5 As shown), or flipped front to back, without specific limitation here.
[0051] It should also be noted that the picking component can be a vacuum nozzle, etc., which is not specifically limited here; the other structures and working principles of the chip sorting equipment are similar to those of the related technology and will not be repeated here.
[0052] Optionally, the axial depth of the placement hole 101 is greater than or equal to the thickness of the chip 500 . This configuration ensures that the chip 500 can be reliably embedded in the placement hole 101 , thereby reducing the risk of the chip 500 being scratched by the first opening and closing cover 200 or the second opening and closing cover 300 .
[0053] Optionally, the shape and size of the placement hole 101 are adapted to the chip 500, that is, after the chip 500 is placed in the placement hole 101, the peripheral side wall of the chip 500 fits with the hole wall of the placement hole 101. This arrangement can reduce the collision of the chip 500 with the hole wall of the placement hole 101 in the placement hole 101, thereby reducing the damage to the chip 500.
[0054] The manner in which the first opening and closing cover 200 and the second opening and closing cover 300 are movably arranged on the base 100 can be selected as needed; in this embodiment, the first opening and closing cover 200 and the second opening and closing cover 300 are both rotatably connected to the base 100 to open or cover the placement hole 101 by rotation.
[0055] Of course, in other embodiments, at least one of the first opening and closing cover 200 and the second opening and closing cover 300 can be slidably connected to the base 100, which is not specifically limited here.
[0056] It should be noted that, in this embodiment, the first opening and closing cover 200 and the second opening and closing cover 300 cover the placement hole 101, which means to close the placement hole 101. Of course, in other embodiments, the first opening and closing cover 200 and the second opening and closing cover 300 cover the placement hole 101, which may also refer to covering part of the placement hole 101, so that the chip 500 cannot pass through the first opening and closing cover 200 or the second opening and closing cover 300 and slide out of the placement hole 101.
[0057] Optionally, the first opening and closing cover 200 is attached to the first surface 110 of the base 100, and the first opening and closing cover 200 can slide on the first surface 110; the second opening and closing cover 300 is attached to the second surface 120 of the base 100, and the second opening and closing cover 300 can slide on the second surface 120. In this way, there is no gap between the first opening and closing cover 200 and the first surface 110, and there is no gap between the second opening and closing cover 300 and the second surface 120, which can effectively prevent the chip 500 from accidentally sliding off from the gap between the first opening and closing cover 200 and the first surface 110, or from the gap between the second opening and closing cover 300 and the second surface 120 when the base 100 is turned over with the chip 500.
[0058] Of course, in other embodiments, there is a gap between the first opening and closing cover 200 and the first surface 110 of the base 100, the width of which is smaller than the thickness of the chip 500, so as to improve the problem of the chip 500 accidentally sliding off from between the first opening and closing cover 200 and the first surface 110; or, in other embodiments, there is a gap between the second opening and closing cover 300 and the second surface 120 of the base 100, the width of which is smaller than the thickness of the chip 500, so as to improve the problem of the chip 500 accidentally sliding off from between the second opening and closing cover 300 and the second surface 120.
[0059] In this embodiment, the chip flipping mechanism 010 also includes a first driving member, which cooperates with the first opening and closing cover 200 to drive the first opening and closing cover 200 to open the placement hole 101; the chip flipping mechanism 010 also includes a second driving member, which cooperates with the second opening and closing cover 300 to drive the second opening and closing cover 300 to open the placement hole 101.
[0060] Optionally, both the first driving member and the second driving member are motors; the output shaft of the motor serving as the first driving member is transmission-connected to the first opening and closing cover 200 to drive the first opening and closing cover 200 to rotate and open the placement hole 101 from the first surface 110; the output shaft of the motor serving as the second driving member is transmission-connected to the second opening and closing cover 300 to drive the second opening and closing cover 300 to rotate and open the placement hole 101 from the second surface 120.
[0061] It should be understood that in other embodiments, the chip flipping mechanism 010 may also include a transmission component, such as a worm gear assembly, a gear assembly, etc. At least one of the first drive member and the second drive member may also be connected to the corresponding opening and closing cover through the transmission component, which is not specifically limited here.
[0062] In order to improve the reliability of the first opening and closing cover 200 and the second opening and closing cover 300 in shielding the placement hole 101. Figure 1-3 The chip flipping mechanism 010 of this embodiment also includes a first elastic member 210 and a second elastic member 310. The first elastic member 210 is connected between the base 100 and the first opening and closing cover 200, and the first elastic member 210 is configured to make the first opening and closing cover 200 have a movement tendency to cover the placement hole 101; the second elastic member 310 is connected between the base 100 and the second opening and closing cover 300, and the second elastic member 310 is configured to make the second opening and closing cover 300 have a movement tendency to cover the placement hole 101. In this way, when the first driving member drives the first opening and closing cover 200 to open the placement hole 101, the first opening and closing cover 200 pulls the first elastic member 210 to stretch the first elastic member 210. When the first driving member no longer drives the first opening and closing cover 200 to open the placement hole 101, that is, when the first opening and closing cover 200 is no longer subjected to the force provided by the first driving member to open the placement hole 101, the first elastic member 210 retracts and resets. The first opening and closing cover 200 can be reset to block the placement hole 101 under the elastic action of the first elastic member 210. Similarly, when the second driving member drives the second opening and closing cover 300 to open the placement hole 101, the second opening and closing cover 300 pulls the second elastic member 310 to stretch the first opening and closing cover 200. The second elastic member 310 is stretched, and when the second driving member no longer drives the second opening and closing cover 300 to open the placement hole 101, that is, when the second opening and closing cover 300 is no longer subjected to the force provided by the second driving member to open the placement hole 101, the second elastic member 310 retracts and resets, and the second opening and closing cover 300 can be reset to block the placement hole 101 under the elastic action of the second elastic member 310; moreover, under the elastic action of the first elastic member 210 and the second elastic member 310, it can ensure that the first opening and closing cover 200 and the second opening and closing cover 300 are stably blocked in the placement hole 101, so as to ensure the reliability of the chip 500 being accommodated in the placement hole 101, and to ensure that the chip 500 can be reliably turned over with the base 100.
[0063] It should be understood that in other embodiments, when the first driving member drives the first opening and closing cover 200 to open the placement hole 101, the first opening and closing cover 200 squeezes the first elastic member 210; when the first opening and closing cover 200 is no longer subjected to the force provided by the first driving member to open the placement hole 101, the first elastic member 210 stretches and resets, and the first opening and closing cover 200 can be reset to cover the placement hole 101 under the elastic action of the first elastic member 210. Alternatively, when the second driving member drives the second opening and closing cover 300 to open the placement hole 101, the second opening and closing cover 300 squeezes the second elastic member 310; when the second opening and closing cover 300 is no longer subjected to the force provided by the second driving member to open the placement hole 101, the second elastic member 310 stretches and resets, and the second opening and closing cover 300 can be reset to cover the placement hole 101 under the elastic action of the second elastic member 310.
[0064] Further, the first end of the first opening and closing cover 200 is rotatably connected to the base 100, and the second end of the first opening and closing cover 200 is connected to the first elastic member 210; the first end of the second opening and closing cover 300 is rotatably connected to the base 100, and the second end of the second opening and closing cover 300 is connected to the second elastic member 310. Such an arrangement ensures that the first opening and closing cover 200 and the second opening and closing cover 300 can be reliably reset to the shielding placement hole 101 under the action of the first elastic member 210 and the second elastic member 310, respectively.
[0065] Furthermore, the connection between the first elastic member 210 and the base 100 is located adjacent to the rotation axis of the first opening and closing cover 200, and the connection between the second elastic member 310 and the base 100 is located adjacent to the rotation axis of the second opening and closing cover 300. This arrangement can ensure the compactness of the structure and ensure that the first opening and closing cover 200 and the second opening and closing cover 300 can open or cover the placement hole 101 smoothly.
[0066] Optionally, the first elastic member 210 and the second elastic member 310 are both springs. Of course, in other embodiments, the first elastic member 210 and the second elastic member 310 can also be torsion springs or elastic rubber strips, etc., which are not specifically limited here.
[0067] Optionally, the connection method between the first elastic member 210 and the first opening and closing cover 200 and the base 100, and the connection method between the second elastic member 310 and the second opening and closing cover 300 and the base 100 include but are not limited to clamping and connection with fasteners such as bolts.
[0068] Exemplarily, the second end of the first opening and closing cover 200 is connected to the first hook 220 , and the first elastic member 210 is hung on the first hook 220 ; the second end of the second opening and closing cover 300 is connected to the second hook 320 , and the second elastic member 310 is hung on the second hook 320 .
[0069] It should be understood that in other embodiments, the chip flipping mechanism 010 may not include the first elastic member 210 and the second elastic member 310, and the first opening and closing cover 200 can be reset to the blocking placement hole 101 under the drive of the first driving member, and the second opening and closing cover 300 can be reset to the blocking placement hole 101 under the drive of the second driving member.
[0070] In other embodiments, at least one of the first driving member and the second driving member may also be an electric push rod; taking the first driving member being an electric push rod as an example, the first opening and closing cover 200 is rotatably connected to the base 100 through a rotating shaft, the electric push rod is assembled on the base 100, and the electric push rod is transmission-coordinated with the first opening and closing cover 200. When the electric push rod is extended, it can drive the first opening and closing cover 200 to rotate forward around the rotating shaft to open the placement hole 101; when the electric push rod is shortened, it can drive the first opening and closing cover 200 to rotate reversely around the rotating shaft and reset to block the placement hole 101.
[0071] Please refer to Figure 1-3 Optionally, the chip flipping mechanism 010 further includes two stoppers 400, both of which are connected to the base 100, and both of which are spaced apart from the base 100 to form a stop gap; specifically, one of the stoppers 400 is spaced apart from the first surface 110 of the base 100 to form a stop gap, and the first opening and closing cover 200 can move in the stop gap corresponding to the first surface 110, and the other stopper 400 is spaced apart from the second surface 120 of the base 100 to form another stop gap, and the second opening and closing cover 300 can move in the stop gap corresponding to the second surface 120. By setting the stoppers 400, the movable positions of the first opening and closing cover 200 and the second opening and closing cover 300 can be limited, so as to ensure that the first opening and closing cover 200 and the second opening and closing cover 300 can be reliably attached to the corresponding first surface 110 and the second surface 120, thereby ensuring the reliability of the chip 500 turning over with the base 100.
[0072] It should be understood that in other embodiments, the limiting member 400 may be provided only on the first surface 110 or the second surface 120 of the base 100 so that only the first opening and closing cover 200 or the second opening and closing cover 300 moves within the corresponding limiting gap.
[0073] The connection method between the limiting member 400 and the base 100 includes, but is not limited to, snap connection, integral molding, and connection via fasteners such as bolts, which are not specifically limited here.
[0074] In other embodiments, the chip flipping mechanism only includes the third driving member, and does not include the first driving member and the second driving member; the third driving member is transmission-connected to the base 100, and is used to drive the base 100 to rotate around a set axis; the first opening and closing cover 200 is provided with a first abutting portion, and the second opening and closing cover 300 is provided with a second abutting portion, and both the first abutting portion and the second abutting portion can be used to abut against a frame of the chip sorting device, wherein, when the third driving member drives the base 100 to rotate around the set axis, the base 100 drives the first opening and closing cover and the second opening and closing cover to rotate synchronously, and one of the first abutting portion and the second abutting portion can abut against the frame and move relative to the base 100, and make the placement hole 101 open from the first side or the second side. Exemplarily, when the first surface 110 of the base 100 faces downward, the first opening and closing cover 200 is located below the base 100, and the first opening and closing cover 200 blocks the placement hole 101 under the elastic action of the first elastic member 210. At this time, the second surface 120 of the base 100 faces upward, the second opening and closing cover 300 is located below the base 100, and the second opening and closing cover 300 blocks the placement hole 101 under the elastic action of the second elastic member 310; the third driving member drives the base 100 to rotate so that the first surface 110 and the second surface 120 are swapped up and down. When the first surface 110 rotates upward with the base 100, the first opening and closing cover 200 and the second opening and closing cover 300 are synchronously driven to be swapped up and down. At this time, the first abutting portion provided on the first opening and closing cover 200 can abut against the matching portion on the frame, and the first opening and closing cover 200 can be driven to move relative to the base 100. When the first surface 110 rotates upward with the base 100, the first opening and closing cover 200 faces upward, and the first opening and closing cover 200 moves to open the placement hole 101, and the second surface 120 and the second opening and closing cover 300 rotate downward, and the second opening and closing cover 300 keeps covering the placement hole 101. In this way, only one driving member is needed to realize the rotation of the chip flipping mechanism as a whole and the movement control of the first opening and closing cover 200 and the second opening and closing cover 300, so as to achieve the purpose of cost saving.
[0075] It should be understood that in yet another embodiment of the present disclosure, the chip sorting equipment includes a chip flipping device including a driving mechanism and two chip flipping mechanisms, the driving mechanism is transmission-connected to a base 100 of the two chip flipping mechanisms, and the two chip flipping mechanisms are respectively located on both sides of the driving mechanism, the driving mechanism is used to drive the two chip flipping mechanisms to rotate around a preset axis b in a preset plane c to exchange positions, and the driving mechanism is also used to drive the bases 100 of the two chip flipping mechanisms to rotate around their respective corresponding set axes a.
[0076] Please refer to Figure 4 and Figure 5, exemplarily, the driving mechanism includes a motor 610, a first bevel gear 621, a second bevel gear 622 and a third bevel gear 623, and the chip sorting device also includes a bracket 600; the bracket 600 is rotatably mounted on the frame, and the bases 100 of the two chip flipping mechanisms are rotatably arranged on the bracket 600; the motor 610 is mounted on the frame, and the output shaft of the motor 610 is transmission-connected to the first bevel gear 621, the second bevel gear 622 and the third bevel gear 623 are respectively connected to the bases 100 of the two chip flipping mechanisms, and The second bevel gear 622, the third bevel gear 623 and the base 100 of the two chip flipping mechanisms are coaxial, the rotation axis of the second bevel gear 622 is at an angle of 90° with the rotation axis of the first bevel gear 621, the rotation axis of the first bevel gear 621 is coaxial with the rotation axis of the bracket 600, the second bevel gear 622 and the third bevel gear 623 are both meshed with the first bevel gear 621, and the second bevel gear 622 and the third bevel gear 623 are symmetrically located on both sides of the rotation axis of the first bevel gear 621, so that the two chip flipping mechanisms are symmetrical. is located on both sides of the rotation axis of the first bevel gear 621 (i.e., the preset axis b); when the motor 610 drives the first bevel gear 621 to rotate around its own rotation axis (i.e., the preset axis b), the first bevel gear 621 drives the two chip flipping mechanisms to rotate around the preset axis b in a preset plane c perpendicular to the preset axis b through the second bevel gear 622 and the third bevel gear 623, so that the two chip flipping mechanisms can exchange positions in the preset plane c (rotate 180°, the rotation direction shown by the arc segment in the figure, the up and down directions of the first surface 110 and the second surface 120 of the base 100 of the two chip flipping mechanisms are not changed), at the same time, the first bevel gear 621 also synchronously drives the second bevel gear 622 and the third bevel gear 623 to rotate around their own rotation axes, thereby driving the bases 100 of the two chip flipping mechanisms to rotate around the set axis a (front and back flipping in the figure), so that the up and down directions of the first surface 110 and the second surface 120 of the base 100 of any chip flipping mechanism are exchanged in this way; the flipping of two chips can be achieved at the same time, thereby improving efficiency. Of course, when the chip flipping device is in use, only one chip can be flipped at a time, that is, when one of the chip flipping mechanisms is used to flip the chip, the other chip flipping mechanism is in an idle standby state.
[0077] The working principle of the chip sorting equipment of this embodiment includes: the conveying and sorting component conveys and sorts the chip 500, and moves the chip 500 to be recognized by the identification component; when the identification component recognizes that the target surface of the chip 500 is not facing upward, the picking component picks up the chip 500; the first opening and closing cover 200 opens the placement hole 101, and the second opening and closing cover 300 blocks the placement hole 101, and the picking component places the chip 500 from the first surface 110 into the placement hole 101, so that the chip 500 is supported by the second opening and closing cover 300 located on the second surface 120; the first opening and closing cover 200 blocks the placement hole 101, and then the third driving member drives the base 100 to flip 180° around the set axis a; the second opening and closing cover 300 opens the placement hole 101 to expose the flipped chip 500 (at this time, the target surface of the chip 500 faces upward), and then the flipped chip 500 is taken out by the picking component and moved to the next work station.
[0078] When the recognition component recognizes that the target surface of the chip 500 is facing upward, the chip 500 flipping device does not work, and the first opening and closing cover 200 and the second opening and closing cover 300 both cover the placement hole 101 .
[0079] In summary, the chip flipping mechanism 010 of the utility model can be used in chip sorting equipment. The chip flipping mechanism 010 can improve the problem of the chip 500 falling and being damaged due to being repeatedly sent back to the vibration bowl, and there is no need to repeatedly identify the same chip 500, which can improve efficiency and increase production capacity.
[0080] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A chip flipping mechanism, characterized in that: include: A base (100), the base (100) being provided with a placement hole (101), the placement hole (101) being used to accommodate a chip (500), the base (100) having a first surface (110) and a second surface (120) disposed opposite to each other, the placement hole (101) penetrating the first surface (110) and the second surface (120); a first opening and closing cover (200), the first opening and closing cover (200) being movably disposed on the base (100), and the first opening and closing cover (200) being configured to be able to open or cover the placement hole (101) from the first surface (110); and, A second opening and closing cover (300), the second opening and closing cover (300) is movably disposed on the base (100), and the second opening and closing cover (300) is configured to be able to open or cover the placement hole (101) from the second surface (120); wherein, The base (100) can rotate around a set axis to drive the first opening and closing cover (200), the second opening and closing cover (300) and the chip (500) placed in the placement hole (101) to rotate synchronously.
2. The chip flipping mechanism according to claim 1, characterized in that: At least one of the first opening and closing cover (200) and the second opening and closing cover (300) is rotatably or slidably connected to the base (100).
3. The chip flipping mechanism according to claim 2, characterized in that: The chip flipping mechanism further comprises a first elastic member (210), wherein the first elastic member (210) is connected between the base (100) and the first opening and closing cover (200), and the first elastic member (210) is configured to enable the first opening and closing cover (200) to have a movement tendency to cover the placement hole (101).
4. The chip flipping mechanism according to claim 3, characterized in that: The first end of the first opening and closing cover (200) is rotatably connected to the base (100), and the second end of the first opening and closing cover (200) is connected to the first elastic member (210).
5. The chip flipping mechanism according to claim 2, characterized in that: The chip flipping mechanism further comprises a second elastic member (310), wherein the second elastic member (310) is connected between the base (100) and the second opening and closing cover (300), and the second elastic member (310) is configured to enable the second opening and closing cover (300) to have a movement tendency to cover the placement hole (101).
6. The chip flipping mechanism according to claim 5, characterized in that: The first end of the second opening and closing cover (300) is rotatably connected to the base (100), and the second end of the second opening and closing cover (300) is connected to the second elastic member (310).
7. The chip flipping mechanism according to claim 1, characterized in that: The first opening and closing cover (200) is in contact with the first surface (110), or there is a gap between the first opening and closing cover (200) and the first surface (110) whose width is smaller than the thickness of the chip (500); and / or, The second opening and closing cover (300) is in contact with the second surface (120), or there is a gap between the second opening and closing cover (300) and the second surface (120) whose width is smaller than the thickness of the chip (500); and / or, The chip flipping mechanism also includes a limiting member (400), the limiting member (400) is connected to the base (100), and a limiting gap is formed between the limiting member (400) and the base (100), and one of the first opening and closing cover (200) and the second opening and closing cover (300) is configured to be movable within the limiting gap.
8. The chip flipping mechanism according to claim 1, characterized in that: The chip flipping mechanism also includes a third driving member, which is transmission-connected to the base (100) and is used to drive the base (100) to rotate around the set axis; the first opening and closing cover (200) is provided with a first abutting portion, and the second opening and closing cover (300) is provided with a second abutting portion, and both the first abutting portion and the second abutting portion can be used to abut against a frame of a chip sorting device, wherein when the third driving member drives the base (100) to rotate around the set axis, the base (100) drives the first opening and closing cover and the second opening and closing cover to rotate synchronously, and one of the first abutting portion and the second abutting portion can abut against the frame and move relative to the base (100), and enable the placement hole (101) to open from the first surface or the second surface.
9. A chip flipping device, characterized in that: include: A driving mechanism and two chip flipping mechanisms as described in any one of claims 1 to 8, wherein the driving mechanism is transmission-connected to the bases (100) of the two chip flipping mechanisms, and the two chip flipping mechanisms are respectively located on both sides of the driving mechanism, and the driving mechanism is used to drive the two chip flipping mechanisms to rotate around a preset axis within a preset plane to exchange positions, and the driving mechanism is also used to drive the bases (100) of the two chip flipping mechanisms to rotate around their respective corresponding set axes.
10. A chip sorting device, characterized in that: include: A rack and the chip flipping mechanism according to any one of claims 1 to 8 or the chip flipping device according to claim 9 arranged on the rack.