A heat dissipation structure with integrated electronic water pump

Abstract

The utility model relates to the technical field of heat dissipation of an integrated electronic water pump, and in particular to a heat dissipation structure of an integrated electronic water pump, which has higher heat dissipation efficiency and good heat dissipation effect, can be suitable for high-power integrated electronic water pumps, and has high practicality; it comprises a plastic casing, a volute and a circuit board, the volute is mounted on the upper part of the plastic casing, a chamber is arranged inside the plastic casing, and the circuit board is mounted on the lower part of the plastic casing; it also comprises a sealing mechanism, a heat dissipation block and a conveying mechanism, the heat dissipation block is mounted on the upper part of the plastic casing, the circuit board is located below the heat dissipation block, the circuit board contacts the lower part of the heat dissipation block, a coolant is arranged in the chamber of the plastic casing, the upper part of the heat dissipation block is immersed in the coolant, the conveying mechanism is mounted on the volute and the plastic casing, the conveying mechanism is used for conveying the coolant, the sealing mechanism is mounted on the lower part of the chamber of the plastic casing, the sealing mechanism is located above the circuit board, and the sealing mechanism is used for sealing the plastic casing and the heat dissipation block.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of an integrated electronic water pump, in particular to a heat dissipation structure of an integrated electronic water pump. Background Art

[0002] The circuit board is an important component of the integrated electronic water pump, which is mainly used to control the output power, flow rate and flow velocity of the electronic water pump. During the use of the integrated electronic water pump, the circuit board will generate a lot of heat due to long-term work. If the circuit board cannot be cooled in time, once the temperature of the circuit board is too high, it is very likely to burn out the electrical components in the circuit board, resulting in a reduction in the service life of the circuit board. The traditional heat dissipation mechanism generally uses metal fins to heat the bottom cover of the circuit board, so that the heat on the circuit board is transferred to the metal fins, and then the metal fins transfer the heat to the outside air for heat dissipation. The heat conduction between the air and the metal fins is not effective for the heat dissipation of the circuit board. On some high-power electronic water pumps, due to the excessive heat generation, the existing heat dissipation structure can no longer meet the heat dissipation requirements, which is very likely to cause the circuit board to overheat, resulting in the inability of the integrated electronic water pump to be used normally. Therefore, a heat dissipation structure of an integrated electronic water pump with high heat dissipation efficiency is needed. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a heat dissipation structure of an integrated electronic water pump with higher heat dissipation efficiency and better heat dissipation effect, which can be applied to high-power integrated electronic water pumps and has high practicality.

[0004] The utility model discloses a heat dissipation structure of an integrated electronic water pump, comprising a plastic casing, a volute and a circuit board, wherein the volute is mounted on the upper part of the plastic casing, a chamber is arranged inside the plastic casing, and the circuit board is mounted on the lower part of the plastic casing; the utility model also comprises a sealing mechanism, a heat dissipation block and a conveying mechanism, wherein the heat dissipation block is mounted on the upper part of the plastic casing, the circuit board is located below the heat dissipation block, the circuit board contacts the lower part of the heat dissipation block, a coolant is arranged in the chamber of the plastic casing, the upper part of the heat dissipation block is immersed in the coolant, the conveying mechanism is mounted on the volute and the plastic casing, the conveying mechanism is used for conveying the coolant, the sealing mechanism is mounted on the lower part of the chamber of the plastic casing, the sealing mechanism is located above the circuit board, and the sealing mechanism is used for sealing the plastic casing and the heat dissipation block; the circuit board is mounted On the integrated electronic water pump, the plastic casing and the heat sink are sealed by a sealing mechanism, so that the coolant in the plastic casing chamber is prevented from flowing onto the circuit board through the gap between the heat sink and the plastic casing, thereby improving reliability; when the circuit board is cooled, the heat in the circuit board is transferred to the heat sink, and since the upper part of the heat sink is immersed in the coolant, the heat on the circuit board is transferred to the coolant via the heat sink, and then the coolant is transported to the external water-cooled heat sink through the transport mechanism for heat dissipation and temperature reduction; the heat sink is cooled by directly immersing the heat sink in the coolant, and compared with the air conduction method in the prior art, the heat dissipation efficiency is higher and the heat dissipation effect is better, and it can be applied to high-power integrated electronic water pumps and has high practicality.

[0005] Preferably, the conveying mechanism includes a rotor mechanism, which is installed on the volute and the plastic casing, and the rotor mechanism is located inside the volute and the plastic casing, and an opening is provided at the upper part of the volute; when it is necessary to convey the coolant in the chamber of the plastic casing to the outside for heat dissipation and cooling, the rotor mechanism is opened, and the coolant in the chamber of the plastic casing is conveyed to the outside for heat dissipation and cooling via the volute; thus facilitating the conveying of the coolant.

[0006] Preferably, the sealing mechanism includes a sealing ring, which is installed at the lower part of the plastic casing, the sealing ring is located above the circuit board, and the lower part of the sealing ring is tightly attached to the upper part of the heat sink; the sealing effect of the heat sink is further improved by the sealing ring on the heat sink, preventing the coolant in the plastic casing from flowing onto the circuit board through the gap between the heat sink and the plastic casing, thereby ensuring the use of the circuit board and improving the service life of the circuit board.

[0007] Preferably, the heat sink block is made of aluminum; through the above arrangement, the heat sink block is not easy to rust while ensuring the heat conduction effect of the heat sink block, thereby ensuring the service life and heat dissipation effect of the heat sink block.

[0008] Preferably, a plastic layer is provided on the outer side walls of the heat sink and the plastic casing; by adopting a plastic coating method, a plastic layer is coated on the outer side walls of the heat sink and the plastic casing. When the plastic casing is installed on the heat sink, ultrasonic welding can be used. Compared with the traditional screw connection method, the assembly is simpler and the assembly efficiency is improved.

[0009] Compared with the prior art, the utility model has the following beneficial effects: higher heat dissipation efficiency, better heat dissipation effect, can be applied to high-power integrated electronic water pumps, and has high practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a cross-sectional structural schematic diagram of the utility model.

[0011] Markings in the attached figure: 1. heat sink; 2. plastic housing; 3. sealing ring; 4. rotor mechanism; 5. volute; 6. circuit board. DETAILED DESCRIPTION

[0012] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively below with reference to the relevant drawings. The utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0013] Example

[0014] like Figure 1The heat dissipation structure of the integrated electronic water pump of the utility model includes a sealing mechanism, a heat dissipation block 1, a conveying mechanism, a plastic casing 2, a volute 5 and a circuit board 6. The volute 5 is installed at the upper part of the plastic casing 2, and a chamber is arranged inside the plastic casing 2. The circuit board 6 is installed at the lower part of the plastic casing 2. The heat dissipation block 1 is installed at the upper part of the plastic casing 2. The circuit board 6 is located below the heat dissipation block 1. The circuit board 6 contacts the lower part of the heat dissipation block 1. A coolant is arranged in the chamber of the plastic casing 2. The upper part of the heat dissipation block 1 is immersed in the coolant. The conveying mechanism is installed on the volute 5 and the plastic casing 2. The conveying mechanism is used to convey the coolant. The sealing mechanism is installed at the lower part of the chamber of the plastic casing 2. The sealing mechanism is located above the circuit board 6. The sealing mechanism is used to seal the plastic casing 2 and the heat dissipation block 1. The circuit board 6 It is installed on the integrated electronic water pump, and the plastic housing 2 and the heat sink 1 are sealed by a sealing mechanism, so that the coolant in the chamber of the plastic housing 2 is prevented from flowing to the circuit board 6 through the gap between the heat sink 1 and the plastic housing 2, thereby improving reliability; when the circuit board 6 is cooled, the heat in the circuit board 6 is transferred to the heat sink 1. Since the upper part of the heat sink 1 is immersed in the coolant, the heat on the circuit board 6 will be transferred to the coolant through the heat sink 1, and then the coolant will be transported to the external water-cooled heat sink through the conveying mechanism for heat dissipation and temperature reduction; it dissipates the heat of the heat sink 1 by directly immersing the heat sink 1 in the coolant. Compared with the air conduction method in the prior art, it has higher heat dissipation efficiency and better heat dissipation effect, and can be suitable for high-power integrated electronic water pumps with high practicality.

[0015] The conveying mechanism includes a rotor mechanism 4, which is installed on the volute 5 and the plastic casing 2. The rotor mechanism 4 is located inside the volute 5 and the plastic casing 2, and an opening is provided at the upper portion of the volute 5. When it is necessary to convey the coolant in the chamber of the plastic casing 2 to the outside for heat dissipation and cooling, the rotor mechanism 4 is opened, and the coolant in the chamber of the plastic casing 2 is conveyed to the outside for heat dissipation and cooling via the volute 5, thereby facilitating the conveying of the coolant.

[0016] The sealing mechanism includes a sealing ring 3, which is installed at the lower part of the plastic housing 2. The sealing ring 3 is located above the circuit board 6, and the lower part of the sealing ring 3 is tightly attached to the upper part of the heat sink 1. The sealing effect of the heat sink 1 is further improved through the sealing effect of the sealing ring 3 on the heat sink 1, which prevents the coolant in the plastic housing 2 from flowing onto the circuit board 6 through the gap between the heat sink 1 and the plastic housing 2, thereby ensuring the use of the circuit board 6 and improving the service life of the circuit board 6.

[0017] The heat sink 1 is made of aluminum. Through the above arrangement, the heat sink 1 is not easy to rust while ensuring the heat conduction effect of the heat sink 1, thereby ensuring the service life and heat dissipation effect of the heat sink 1.

[0018] A plastic layer is provided on the outer side walls of the heat sink 1 and the plastic housing 2. By adopting a plastic coating method, a plastic layer is coated on the outer side walls of the heat sink 1 and the plastic housing 2. When the plastic housing 2 is installed on the heat sink 1, ultrasonic welding can be used. Compared with the traditional screw connection method, the assembly is simpler and the assembly efficiency is improved.

[0019] In summary, the main beneficial effects of the utility model are:

[0020] 1. Good heat dissipation effect and high heat dissipation efficiency, which can meet the heat dissipation requirements of the circuit board when the high-power water pump is running.

[0021] 2. Simple assembly, convenient production and installation.

[0022] 3. High integration, easy assembly, large amount of plastic materials, lightweight and highly economical.

[0023] The heat sink block 1, rotor mechanism 4, volute 5 and circuit board 6 of the heat dissipation structure of an integrated electronic water pump of the utility model are all purchased on the market, and technicians in the industry only need to install and operate them according to the accompanying instruction manual, without the need for technical personnel in the field to make creative labor.

[0024] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A heat dissipation structure of an integrated electronic water pump, comprising a plastic casing (2), a volute (5) and a circuit board (6), wherein the volute (5) is mounted on the upper part of the plastic casing (2), a chamber is provided inside the plastic casing (2), and the circuit board (6) is mounted on the lower part of the plastic casing (2); characterized in that: The invention also comprises a sealing mechanism, a heat sink (1) and a conveying mechanism, wherein the heat sink (1) is mounted on the upper part of the plastic casing (2), the circuit board (6) is located below the heat sink (1), the circuit board (6) is in contact with the lower part of the heat sink (1), a cooling liquid is arranged in the chamber of the plastic casing (2), the upper part of the heat sink (1) is immersed in the cooling liquid, the conveying mechanism is mounted on the volute (5) and the plastic casing (2), the conveying mechanism is used to convey the cooling liquid, the sealing mechanism is mounted on the lower part of the chamber of the plastic casing (2), the sealing mechanism is located above the circuit board (6), and the sealing mechanism is used to seal the plastic casing (2) and the heat sink (1).

2. The heat dissipation structure of an integrated electronic water pump as claimed in claim 1, characterized in that: The conveying mechanism comprises a rotor mechanism (4), the rotor mechanism (4) being mounted on a volute (5) and a plastic casing (2), the rotor mechanism (4) being located inside the volute (5) and the plastic casing (2), and an opening being arranged at the top of the volute (5).

3. The heat dissipation structure of an integrated electronic water pump according to claim 1, characterized in that: The sealing mechanism comprises a sealing ring (3), which is mounted on the lower part of the plastic housing (2), the sealing ring (3) is located above the circuit board (6), and the lower part of the sealing ring (3) is tightly attached to the upper part of the heat sink (1).

4. The heat dissipation structure of an integrated electronic water pump according to claim 1, characterized in that: The heat dissipation block (1) is made of aluminum.

5. The heat dissipation structure of an integrated electronic water pump as claimed in claim 1, characterized in that: The heat dissipation block (1) and the outer side walls of the plastic casing (2) are both provided with a plastic layer.

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