A semiconductor refrigerator

Abstract

The utility model relates to a semiconductor refrigerator, comprising a bottom plate, a refrigeration assembly is arranged outside the bottom plate, the refrigeration assembly comprises a guide rod, a heat sink fin and a refrigeration sheet, a guide rod is fixedly installed on the top of the bottom plate, a heat sink fin is movably connected to the outer surface of the guide rod, and a refrigeration sheet is fixedly installed on the top of the top plate. The semiconductor refrigerator is arranged such that the heat sink fins are sequentially sleeved on the guide rods, the top plate is sleeved on the guide rods, a heat-conducting copper tube is inserted into the heat sink fins and fixed by a first nut, two heat-dissipating fans are sleeved on eight threaded rods and fixed by a second nut, and then a DC power supply outside the refrigeration sheet is turned on, heat is transferred to the heat sink fins through the heat-conducting copper tubes and heat is dissipated through the heat-dissipating fans, and heat and cool objects through the cold-conducting blocks and cold-conducting aluminum blocks in cooperation with the cold-conducting fans, thereby achieving the purpose of easy loading and unloading maintenance and easy refrigeration and heat dissipation.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigerators, in particular to a semiconductor refrigerator. Background Art

[0002] Semiconductor refrigerator, also known as thermoelectric refrigerator, is a device that uses the thermoelectric effect of semiconductors, namely the Peltier effect, to produce cooling. Semiconductor refrigerators have the characteristics of no noise, no vibration, no need for refrigerant, small size, light weight, reliable operation and easy operation.

[0003] However, most of the existing semiconductor refrigerators are fixed structures, and most of them conduct heat and dissipate heat by installing heat sink fins. After the semiconductor refrigerator has been used for a period of time, it is necessary to maintain the internal components or clean the heat sink fins to ensure that the heat dissipation channel is unobstructed and extend the service life. However, it is difficult to maintain or clean each component individually in the fixed structure, so a semiconductor refrigerator is proposed. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a semiconductor refrigerator which has the advantages of being easy to load and unload, maintain, and cool and dissipate heat, thereby solving the problem that the fixed structure of the prior semiconductor refrigerator is inconvenient to load and unload.

[0005] To achieve the above object, the utility model provides the following technical solution: a semiconductor refrigerator, comprising a bottom plate, a top plate is arranged outside the bottom plate, and a refrigeration assembly is arranged outside the bottom plate;

[0006] The installed refrigeration assembly includes a guide rod, a heat sink fin, a refrigeration sheet, a cooling block, a cooling aluminum block, a cooling fan, a heat-conducting copper tube, a spring body, a splint and a cooling fan. The top of the base plate is fixedly installed with a guide rod, the outer surface of the guide rod is movably connected with a heat sink fin, the top of the top plate is fixedly installed with a refrigeration sheet, the top of the refrigeration sheet is fixedly installed with a cooling block, the top of the cooling block is fixedly installed with a cooling aluminum block, the inside of the cooling aluminum block is fixedly installed with a cooling fan, the bottom of the refrigeration sheet is fixedly installed with a heat-conducting copper tube, the inside of the cooling aluminum block is fixedly installed with a spring body, the outside of the spring body is fixedly installed with a splint, and the outside of the base plate is provided with a cooling fan.

[0007] Furthermore, the number of the guide rods is four, the bottoms of the four guide rods are fixedly connected to the top of the base plate, the interior of the top plate is provided with guide holes adapted to the four guide rods, and the outer surfaces of the four guide rods are threadedly connected with a first nut.

[0008] Furthermore, the number of the heat dissipation fins is several, the insides of several of the heat dissipation fins are movably connected to the outer surfaces of four guide rods respectively, and several of the heat dissipation fins are located between the bottom plate and the top plate.

[0009] Furthermore, a DC power supply is arranged outside the refrigeration plate, and there are four heat-conducting copper tubes. The bottoms of the four heat-conducting copper tubes penetrate the top of the top plate and the top of the heat dissipation fins, and fit with the top of the bottom plate.

[0010] Furthermore, a through hole is opened inside the cooling aluminum block, the outside of the cooling fan is fixedly connected to the inside of the through hole, two auxiliary rods are fixedly installed inside the cooling aluminum block, the number of the spring bodies and the number of the splints are two, the two auxiliary rods are sleeved with the two spring bodies, the outer surfaces of the two auxiliary rods are slidably connected to the inside of the two splints, and the opposite sides of the two spring bodies are fixedly connected to the left and right sides of the two splints respectively.

[0011] Furthermore, a slider is fixedly installed on the bottom of the two splints, a slide groove matched with the slider is opened on the top of the cooling aluminum block, the interior of the slide groove is slidably connected to the outside of the slider, eight support blocks are fixedly installed on the outside of the bottom plate and the outside of the top plate, threaded rods are fixedly installed on the outside of the eight support blocks, there are two cooling fans, the interiors of the two cooling fans are movably connected to the outsides of the eight threaded rods, and the outsides of the eight threaded rods are threadedly connected with second nuts.

[0012] Beneficial Effects

[0013] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0014] The semiconductor refrigerator takes out the bottom plate and then puts a plurality of heat sinks on the guide rods in sequence, then puts the top plate on the guide rods and inserts the heat conducting copper tube into the heat sink, and then fixes and installs the heat sink with the first nut, and then respectively puts the two heat sink fans on the eight threaded rods, and fixes and installs the heat sink fans with the second nut, thereby completing the assembly of the device, and then turning on the DC power supply outside the refrigeration plate, the bottom of the refrigeration plate will generate heat, and the top of the refrigeration plate will be cooled, the heat generated by the refrigeration plate will be transferred to a plurality of heat sinks through four heat conducting copper tubes for heat dissipation, and then cooperate with the two heat dissipation fans to dissipate the heat of the heat sink, thereby enhancing the heat dissipation effect, and then the cooling will be transferred to the cooling block, and then to the cooling aluminum block through the cooling block, and then the splint is pulled to compress the spring body, and the items to be cooled are placed on the cooling aluminum block, the splint is loosened to clamp and fix them through the spring body, and then the items are quickly cooled and cooled by the cooling aluminum block and the cooling fan, thereby achieving the purpose of easy loading and unloading maintenance and easy cooling and heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the front structure of the utility model;

[0016] Figure 2 This is a front sectional structural schematic diagram of the utility model;

[0017] Figure 3 It is a schematic diagram of the structure of the utility model from top view.

[0018] In the figure: 1, bottom plate; 2, top plate; 3, refrigeration component installation; 301, guide rod; 302, heat dissipation fin; 303, refrigeration plate; 304, cooling block; 305, cooling aluminum block; 306, cooling fan; 307, heat-conducting copper tube; 308, spring body; 309, clamping plate; 310, cooling fan. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-3 A semiconductor refrigerator comprises a bottom plate 1, a top plate 2 is arranged outside the bottom plate 1, and a refrigeration assembly 3 is arranged outside the bottom plate 1;

[0021] The refrigeration assembly 3 is installed to include a guide rod 301, a heat dissipation fin 302, a refrigeration sheet 303, a cooling block 304, a cooling aluminum block 305, a cooling fan 306, a thermal copper tube 307, a spring body 308, a clamp 309 and a cooling fan 310. The guide rod 301 is fixedly installed on the top of the bottom plate 1, and the outer surface of the guide rod 301 is movably connected with the heat dissipation fin 302. The refrigeration sheet 303 is fixedly installed on the top of the top plate 2, and the cooling block 304 is fixedly installed on the top of the refrigeration sheet 303. The cooling aluminum block 305 is fixedly installed on the top of the cooling block 304, and the cooling fan 306 is fixedly installed inside the cooling aluminum block 305. The thermal copper tube 307 is fixedly installed on the bottom of the refrigeration sheet 303, and the spring body 308 is fixedly installed inside the cooling aluminum block 305. The clamp 309 is fixedly installed outside the spring body 308, and the cooling fan 310 is arranged outside the bottom plate 1.

[0022] Specifically, Figure 2As shown, the function of the cooling plate 303 is to achieve cooling by utilizing the Parth effect of semiconductor materials. When direct current passes through a couple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the couple respectively, thereby achieving the purpose of cooling. By controlling the direction of the current, cooling can be achieved on one side of the chip and heat can be dissipated on the other side, thereby transferring heat from one side to the other side to achieve a cooling effect.

[0023] Specifically, Figure 2 As shown, when the device needs to be disassembled and cleaned, the second nut is rotated to remove it from the threaded rod, and the two cooling fans 310 can be removed for separate maintenance or cleaning. Then the first nut is removed to remove the top plate 2, thereby removing the heat-conducting copper tube 307 and the components on the top plate 2, and then the cooling fins 302 are taken out one by one for replacement or cleaning, so as to keep the heat dissipation channel unobstructed and extend the service life of the device.

[0024] Specifically, Figure 2 As shown, the thermally conductive copper tube 307 has excellent thermal conductivity. This is because copper is a good thermally conductive metal with high thermal conductivity. The thermal conductivity of copper is one of the highest among all common metals. High thermal conductivity means that heat can be transferred quickly and effectively through the thermally conductive copper tube 307.

[0025] Specifically, Figure 3 As shown, the cooling aluminum block 305 has the characteristics of low density, moderate heat capacity, and excellent thermal conductivity in terms of cooling. These characteristics make the cooling aluminum block 305 have unique advantages in manufacturing heat exchange equipment such as radiators and condensers. In addition, aluminum also has the advantages of good processing performance and strong corrosion resistance, which makes the cooling aluminum block 305 widely used in the cooling field.

[0026] When implementing, follow these steps:

[0027] 1) First, the heat dissipation fins 302 are sequentially placed on the guide rods 301 on the top of the bottom plate 1, and the top plate 2 is finally inserted on the guide rods 301, and the first nuts are installed to fix them;

[0028] 2) Then, the cooling fan 310 is put on the threaded rod and fixed on the support plate by a second nut;

[0029] 3) Pull the clamping plate 309 to compress the spring body 308, then place the item to be refrigerated on the cooling aluminum block 305, and loosen the clamping plate 309 to fix it through the spring body 308;

[0030] 4) Finally, turn on the DC power supply of the cooling plate 303, transfer the heat to the heat sink 302 through the heat-conducting copper tube 307 and dissipate the heat through the cooling fan 310, and cool the objects through the cooling block 304 and the cooling aluminum block 305 in cooperation with the cooling fan 306.

[0031] In summary, for the semiconductor refrigerator, take out the bottom plate 1 and then put a plurality of heat sink fins 302 on the guide rod 301 in sequence, then put the top plate 2 on the guide rod 301 and insert the heat-conducting copper tube 307 into the heat sink fin 302, and then fix it with the first nut, and then respectively put two heat sink fans 310 on the eight threaded rods, and fix the heat sink fans 310 with the second nut, thereby completing the assembly of the device, and then turn on the DC power supply outside the cooling plate 303, the bottom of the cooling plate 303 will generate heat, and the top of the cooling plate 303 will be cooled, and the heat generated by the cooling plate 303 will be passed through The four heat-conducting copper tubes 307 are transmitted to a number of heat-dissipating fins 302 for heat dissipation, and then cooperate with two heat-dissipating fans 310 to dissipate heat on the heat-dissipating fins 302 to enhance the heat dissipation effect. Then the cooling will be transmitted to the cooling block 304, and then transmitted to the cooling aluminum block 305 through the cooling block 304. Then, the clamping plate 309 is pulled to compress the spring body 308, and the objects to be refrigerated are placed on the cooling aluminum block 305. The clamping plate 309 is loosened to clamp and fix it through the spring body 308, and then the objects are quickly cooled and cooled by the cooling aluminum block 305 and the cooling fan 306, so as to achieve the purpose of facilitating loading and unloading maintenance and facilitating cooling and heat dissipation.

[0032] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor refrigerator, comprising a base plate (1), characterized in that: A top plate (2) is arranged outside the bottom plate (1), and a refrigeration assembly (3) is arranged outside the bottom plate (1); The refrigeration assembly (3) comprises a guide rod (301), a heat dissipation fin (302), a refrigeration sheet (303), a cooling block (304), a cooling aluminum block (305), a cooling fan (306), a heat-conducting copper tube (307), a spring body (308), a clamping plate (309) and a cooling fan (310); the top of the bottom plate (1) is fixedly mounted with the guide rod (301); the outer surface of the guide rod (301) is movably connected with the heat dissipation fin (302); the top of the top plate (2) is fixedly mounted with the refrigeration sheet (303); A cooling block (304) is fixedly installed on the top of the cooling plate (303), a cooling aluminum block (305) is fixedly installed on the top of the cooling block (304), a cooling fan (306) is fixedly installed inside the cooling aluminum block (305), a heat-conducting copper tube (307) is fixedly installed on the bottom of the cooling plate (303), a spring body (308) is fixedly installed inside the cooling aluminum block (305), a clamping plate (309) is fixedly installed outside the spring body (308), and a heat dissipation fan (310) is arranged outside the bottom plate (1).

2. A semiconductor refrigerator according to claim 1, characterized in that: There are four guide rods (301), the bottoms of the four guide rods (301) are fixedly connected to the top of the bottom plate (1), the top plate (2) is provided with guide holes adapted to the four guide rods (301), and the outer surfaces of the four guide rods (301) are threadedly connected with first nuts.

3. A semiconductor refrigerator according to claim 1, characterized in that: The number of the heat dissipation fins (302) is several, the interiors of several heat dissipation fins (302) are movably connected to the outer surfaces of four guide rods (301) respectively, and the several heat dissipation fins (302) are located between the bottom plate (1) and the top plate (2).

4. A semiconductor refrigerator according to claim 1, characterized in that: A DC power supply is arranged outside the refrigeration plate (303), and there are four heat-conducting copper tubes (307). The bottoms of the four heat-conducting copper tubes (307) pass through the top of the top plate (2) and the top of the heat dissipation fins (302), and are fitted with the top of the bottom plate (1).

5. A semiconductor refrigerator according to claim 1, characterized in that: A through hole is provided inside the cooling aluminum block (305), and the outside of the cooling fan (306) is fixedly connected to the inside of the through hole. Two auxiliary rods are fixedly installed inside the cooling aluminum block (305). There are two spring bodies (308) and two clamps (309). The two auxiliary rods are sleeved with the two spring bodies (308), and the outer surfaces of the two auxiliary rods are slidably connected to the inside of the two clamps (309). The opposite sides of the two spring bodies (308) are fixedly connected to the left and right sides of the two clamps (309) respectively.

6. A semiconductor refrigerator according to claim 1, characterized in that: The bottom of the two clamping plates (309) are fixedly installed with a slider, the top of the cooling aluminum block (305) is provided with a slide groove adapted to the slider, the inside of the slide groove is slidably connected to the outside of the slider, the outside of the bottom plate (1) and the outside of the top plate (2) are respectively fixedly installed with eight support blocks, the outside of the eight support blocks are respectively fixedly installed with threaded rods, the number of the cooling fans (310) is two, the inside of the two cooling fans (310) are respectively movably connected to the outside of the eight threaded rods, and the outside of the eight threaded rods are threadedly connected with second nuts.

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