Exhaust pipeline and etching equipment

Abstract

The embodiment of the utility model provides an exhaust pipeline and etching equipment, and the exhaust pipeline comprises a main pipeline which is suitable for enabling gas to pass through, and the gas is gas generated in the etching process; the shell and the main pipeline form a cavity, the cavity is suitable for containing a cooling medium, and the cooling medium is used for cooling the gas; wherein the shell is provided with a cooling medium inlet and a cooling medium outlet which are communicated with the cavity. By adopting the technical scheme, the exhaust capability can be improved, and the technological process capability of the etching equipment is further improved.

Description

Technical Field

[0001] The embodiments of the present specification relate to the field of semiconductor manufacturing technology, and more particularly to an exhaust duct and etching equipment. Background Art

[0002] Wet chemical etching technology (WET Clean & Etch) is widely used in the manufacture of semiconductor integrated circuits. Currently, domestic and foreign manufacturers are equipped with relevant etching equipment. According to the manufacturing process requirements of each manufacturer, the concentration (Concentration) and required temperature (Temperature) of organic solvents used in different process steps are different.

[0003] When using organic solvents, the exhaust capacity of the etching equipment is a very important indicator. Through exhaust, the gases (such as acidic gases, alkaline gases, etc.) generated by the volatilization of organic solvents in the core area of ​​the process (Tank or Chamber Area) can be extracted in time, so that the wafer (Wafer) and etching equipment are always in a good process environment during the process.

[0004] However, during the gas exhaust process, as the ambient temperature gradually decreases, the gas will slowly condense into liquid and adhere to the inner wall of the pipe, reducing the exhaust capacity of the exhaust pipe in the etching equipment, thereby affecting the process capability of the etching equipment.

[0005] In this context, how to provide a technical solution to improve the exhaust capacity of the exhaust duct has become a technical problem that technical personnel in this field urgently need to solve. Summary of the invention

[0006] In view of this, the embodiments of the present specification provide an exhaust pipe and an etching device, which can improve the exhaust capacity and thus enhance the process capability of the etching device.

[0007] First, an embodiment of the present specification provides an exhaust duct, including:

[0008] A main pipe, adapted to allow gas to pass through, wherein the gas is generated during the etching process;

[0009] A shell, wherein the shell and the main pipe form a chamber, wherein the chamber is suitable for containing a cooling medium, and the cooling medium is used to cool the gas;

[0010] Wherein, the shell is provided with a cooling medium inlet and a cooling medium outlet which are connected with the chamber.

[0011] Optionally, along the gas circulation direction, the cooling medium outlet and the cooling medium inlet are sequentially arranged on the shell.

[0012] Optionally, a cooling pipe connected to the cooling medium outlet and the cooling medium inlet is arranged in the chamber, and the cooling pipe is wound around the outer wall of the main pipeline.

[0013] Optionally, the exhaust duct further comprises:

[0014] At least one swirl baffle is disposed on the inner wall of the main pipeline and located in the connection area between the shell and the main pipeline, and is suitable for reducing the circulation speed of the gas.

[0015] Optionally, the angle formed by the at least one swirl baffle and the inner wall of the main pipeline is adjustable.

[0016] Optionally, the main pipeline has a curved portion;

[0017] The exhaust duct also includes:

[0018] At least one guide baffle is arranged at the curved portion and located on a side of the main pipeline close to the cooling medium outlet, and is suitable for guiding the flow direction of the gas.

[0019] Optionally, the exhaust duct further comprises:

[0020] The liquid discharge port is arranged at a side of the main pipeline away from the cooling medium inlet, and is suitable for discharging condensate formed by cooling the gas.

[0021] Optionally, the exhaust duct further comprises:

[0022] The collecting device is arranged on a side of the main pipeline away from the cooling medium inlet and is suitable for collecting condensate formed by cooling the gas.

[0023] Optionally, the exhaust duct further comprises:

[0024] a discharge pipe, connected to the collecting device;

[0025] The control valve is arranged on the discharge passage of the discharge pipeline and is suitable for controlling the discharge process of the condensate.

[0026] Optionally, the exhaust duct further comprises:

[0027] A liquid level sensor, disposed in the collecting device, adapted to detect the liquid level of the condensate in the collecting device and generate a height detection signal;

[0028] The controller is adapted to receive the height detection signal and, when determining that the liquid level corresponding to the height detection signal generated by the sensor is greater than a preset liquid level, output a conduction control signal to the control valve to conduct the control valve.

[0029] Optionally, the exhaust duct further comprises:

[0030] The cooling device is arranged along the circumference of the collecting device and is suitable for reducing the temperature of the condensate in the collecting device.

[0031] Accordingly, the embodiment of this specification also provides an etching device, including:

[0032] An etching device, suitable for etching a wafer;

[0033] The exhaust pipe described in any of the above embodiments is connected to the etching device and is suitable for exhausting the gas generated during the etching process of the etching device.

[0034] The exhaust duct provided in the embodiment of the present specification may include a main duct and a shell, wherein the main duct allows the gas generated during the etching process to pass through, and the shell can form a chamber with the main duct. Since the shell is provided with a cooling medium inlet and a cooling medium outlet connected to the chamber, the cooling medium can be injected into the cavity through the cooling medium inlet, thereby cooling the gas in the main duct and realizing gas-liquid separation. The gas can circulate in the main duct without being affected by the condensed liquid, thereby improving the exhaust capacity and further improving the process capability of the etching equipment.

[0035] Furthermore, along the gas flow direction, by arranging the cooling medium outlet and the cooling medium inlet in sequence on the shell, the heat exchange efficiency and the heat conduction efficiency can be improved, so that the gas can be quickly cooled and condensed into liquid, thereby improving the gas cooling effect.

[0036] Furthermore, a cooling pipe connected to the cooling medium outlet and the cooling medium inlet is arranged in the chamber, and since the cooling pipe is wound around the outer wall of the main pipeline, the flow distance of the cooling medium can be increased, the cooling time of the cooling medium and the gas can be further extended, and the gas cooling effect can be improved.

[0037] Furthermore, by arranging a swirl baffle on the inner wall of the main pipeline, and the swirl baffle can be located in the connection area between the shell and the main pipeline, the circulation speed of the gas can be reduced, the circulation time of the gas in the main pipeline can be increased, the cooling time of the cooling medium and the gas can be further extended, and the gas cooling effect can be improved.

[0038] Furthermore, by making the angle formed by at least one swirl baffle and the inner wall of the main pipe adjustable, the contact area between the swirl baffle and the gas can be changed, thereby changing the flow rate of the gas, thereby changing the cooling time between the cooling medium and the gas, and being applicable to a variety of gas emission scenarios. At the same time, the swirl baffle can increase the probability of direct contact between the gas that has not directly contacted the pipe wall and the pipe wall by changing the flow path of the gas, thereby further improving the cooling efficiency.

[0039] Furthermore, the main pipeline has a curved portion, and the exhaust pipeline also includes at least one guide baffle arranged at the curved portion. Since the at least one guide baffle can be located on the side of the main pipeline close to the cooling medium outlet, the flow direction of the gas can be guided so that the gas can flow from the air inlet end of the main pipeline to the exhaust end of the main pipeline.

[0040] Furthermore, by arranging a drain port on a side of the main pipeline away from the cooling medium inlet, condensate formed by cooling the gas can be discharged, thereby avoiding corrosion of the exhaust pipeline and increasing the service life of the exhaust pipeline.

[0041] Furthermore, by arranging a collecting device on a side of the main pipeline away from the cooling medium inlet, condensate formed by cooling the gas can be collected, and the condensate can be discharged in a centralized manner, thereby improving the discharge efficiency.

[0042] Furthermore, since the discharge pipeline can be connected to the collecting device, and a control valve is provided on the discharge passage of the discharge pipeline, the discharge process of the condensate can be controlled by switching the control valve on and off, and the implementation method is simple.

[0043] Furthermore, by arranging a cooling device along the circumference of the collecting device, the temperature of the condensate in the collecting device can be lowered, thereby avoiding safety problems caused by excessively high temperature of the condensate. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 A schematic diagram of the structure of a discharge pipe is shown;

[0045] Figure 2 A schematic diagram of the structure of a discharge pipeline in an embodiment of this specification is shown;

[0046] Figure 3 A schematic diagram of the structure of another discharge pipeline in an embodiment of this specification is shown. DETAILED DESCRIPTION

[0047] As described in the background art, during the gas exhaust process, as the ambient temperature gradually decreases, the gas will slowly condense into liquid and adhere to the inner wall of the pipe, reducing the exhaust capacity of the exhaust pipe in the etching equipment.

[0048] In order to better understand the problems of the existing solutions, the following is a detailed description with examples.

[0049] Reference Figure 1 A schematic diagram of the structure of an exhaust pipe is shown in FIG. Figure 1 As shown, the exhaust pipe 10 has an air inlet end and an exhaust end, wherein the air inlet end is connected to a pipeline 12 at a process end (referring to the side where the wafer is etched) through a first flange 11, and the exhaust end is connected to a pipeline 14 at a plant service end (referring to the side where the exhaust gas is processed) through a second flange 13.

[0050] like Figure 1 As shown, the gas enters the gas inlet end of the exhaust pipe 10 through the pipeline 12 at the process end, and flows along Figure 1 In the direction indicated by the arrow, the gas enters the pipeline 14 at the factory service end through the exhaust end of the exhaust pipe 10 to achieve gas discharge.

[0051] During the gas discharge process, the gas will slowly condense into liquid and adhere to the inner wall of the exhaust pipe 10. The liquid attached to the inner wall will corrode the wall of the exhaust pipe. At the same time, it will also adsorb solid particles in the gas, causing the solid particles to deposit in the pipe and block the pipe, thereby reducing the exhaust capacity of the exhaust pipe 10.

[0052] Understandably, Figure 1 Only part of the pipeline on the process side and part of the pipeline on the plant side are shown.

[0053] In order to solve the above technical problems, an embodiment of the present specification provides an exhaust duct, which may include a main duct and a shell, wherein the main duct can allow the gas generated during the etching process to pass through, and the shell can form a chamber with the main duct. Since the shell is provided with a cooling medium inlet and a cooling medium outlet connected to the chamber, the cooling medium can be injected into the chamber through the cooling medium inlet, so that the gas in the main duct can be cooled to achieve gas-liquid separation, and then the gas can circulate in the main duct without being affected by the condensate, thereby improving the exhaust capacity and further improving the process capability of the etching equipment.

[0054] In order to enable those skilled in the art to better understand the concept, working principle and advantages of the present invention, the exhaust duct in the embodiment of this specification is described in detail below.

[0055] See also Figure 2 The schematic diagram of the structure of an exhaust duct in the embodiment of the present specification is shown in FIG. In some embodiments of the present specification, such as Figure 2 As shown, the exhaust duct 100 may include:

[0056] The main pipe 110 is suitable for passing gas, and the gas may be gas generated during the etching process; the gas generated during the etching process is, for example, gas generated by volatilization of an organic solvent;

[0057] The housing 120 and the main pipe 110 form a chamber 130, and the chamber 130 is suitable for accommodating a cooling medium ( Figure 2 Not shown), the cooling medium can be used to cool the gas;

[0058] The housing 120 is provided with a cooling medium inlet 121 and a cooling medium outlet 122 which are connected to the chamber 130 .

[0059] Combination Figure 2 , the exhaust principle of the exhaust duct 100 is:

[0060] The main pipeline 110 allows the gas generated during the etching process to pass through. During the gas discharge process, when the gas is in the area where the chamber 130 is located, since there is a cooling medium in the chamber 130 (the cooling medium can enter the chamber through the cooling medium inlet 121 and be discharged from the cooling medium outlet 122, thereby forming a cooling medium circulation), the gas can be cooled so that part of the gas is condensed into liquid due to cooling, thereby achieving gas-liquid separation, and then the remaining gas can circulate in the main pipeline 110 without being affected by the condensed liquid, thereby improving the exhaust capacity and thus improving the process capability of the etching equipment.

[0061] It should be noted that, first, Figure 2 The shape and size of the shell shown are only examples, which are used to illustrate that the exhaust duct has a structure that can form a chamber with the main duct, and cannot be understood as a limitation of the exhaust duct, as long as the shell can be sleeved on the outer wall of the main duct; second, the location of the chamber is only an example, as long as it can accommodate the cooling medium for cooling the gas and achieve the cooling effect, the embodiment of this specification does not impose any restrictions on the location of the chamber, and it can be flexibly set according to the actual application scenario; third, Figure 2 The positions of the cooling medium inlet and the cooling medium outlet on the shell are also illustrative. It is sufficient as long as the cooling medium fills the chamber through the cooling medium inlet and the cooling medium outlet.

[0062] In order to enable technical personnel in this field to have a clearer understanding of the technical concepts, technical principles, advantages, etc. in the embodiments of this specification, the following is a detailed introduction through specific embodiments and in combination with specific application scenarios with reference to the accompanying drawings.

[0063] In some implementations of this specification, Figure 2As shown by the arrows in the figure, the gas flow direction is generally from the air inlet end to the exhaust end of the main pipeline. In order to speed up the condensation of gas into liquid, the positions of the cooling medium inlet and cooling medium outlet on the shell can be set in the following manner:

[0064] That is Figure 2 As shown, along the gas flow direction, the cooling medium outlet 122 and the cooling medium inlet 121 can be sequentially arranged on the shell 120 .

[0065] That is, the circulation path of the cooling medium is from bottom to top (this is because the cooling medium enters the chamber from the cooling medium inlet), and the flow direction of the gas is from top to bottom (in Figure 2 Taking the perspective shown as an example, the flow direction may be different for different perspectives. For example, at other perspectives, the flow direction may be from left to right), and the circulation path of the cooling medium in the chamber is opposite to the gas flow path, thereby improving the heat exchange efficiency and heat conduction efficiency, so that the gas can be quickly cooled and condensed into liquid.

[0066] In a specific implementation, the exhaust pipe is generally made of polyvinyl chloride (PVC) material. By quickly cooling the gas, the temperature of the gas can be reduced, avoiding the problem of softening of the exhaust pipe caused by high temperature, thereby extending the service life of the exhaust pipe.

[0067] It is understandable that the material of the exhaust duct is only an example, and the embodiments of this specification do not impose any restrictions on the material of the exhaust duct, as long as it can adapt to the exhaust gas. For example, if the exhaust gas is SPM steam, the material of the exhaust duct can be polyvinyl chloride, where SPM steam refers to the gas generated by the volatilization of sulfuric acid and hydrogen peroxide during the photolithography process.

[0068] In some other embodiments, along the gas flow direction, the cooling medium inlet and the cooling medium outlet may be sequentially arranged on the housing, that is, the circulation path of the cooling medium in the chamber may be the same as the gas flow path.

[0069] In specific implementations, multiple methods can be used to achieve the connection between the shell and the main pipeline.

[0070] For example, in Figure 2 In an example shown, one end of the shell 120 can be connected to the outer wall of the main pipe 110 through the third flange 171, and the other end of the shell 120 can be connected to the outer wall of the main pipe 110 by welding.

[0071] In some other examples, the two ends of the shell and the main pipeline can be connected by welding. In order to improve the condensation effect, a double sleeve form can be used during welding. That is, the spiral annular pipeline side wall is welded on the outer periphery of the corresponding main pipeline, and finally the outer sealing welding is done to form an annular sleeve loop, thereby increasing the contact area between the cooling medium and the main pipeline.

[0072] In specific implementations, a variety of methods can be used to provide cooling medium to the chamber. For example, the cooling medium can be provided to the cooling medium inlet through a main pipe of a cooling system disposed at the machine end (e.g., the etching equipment end); or, for another example, the cooling medium can be provided to the cooling medium inlet through a water pipe.

[0073] In some embodiments, the cooling medium may include at least one of cooling water and cooling liquid.

[0074] In some embodiments of this specification, in order to further extend the cooling time of the cooling medium and the gas and improve the use efficiency of the cooling medium, continue to refer to Figure 2 A cooling pipe 140 communicating with the cooling medium outlet 122 and the cooling medium inlet 121 may be disposed in the chamber 130 , and the cooling pipe 140 may be wound around the outer wall of the main pipeline 110 .

[0075] Specifically, since the cooling pipe 140 is wound around the outer wall of the main pipe 110 , the flow distance of the cooling medium in the chamber can be extended, thereby improving the use efficiency of the cooling medium.

[0076] In some other embodiments, the cooling time of the cooling medium and the gas may be extended by other means.

[0077] For example, a plurality of partitions are arranged in the cavity, each partition can divide the cavity into a plurality of cooling chambers, and each partition has a through hole, so that the cooling medium can flow in adjacent cooling chambers through the through hole, thereby increasing the flow distance of the cooling medium and improving the use efficiency of the cooling medium.

[0078] For example, the cooling medium inlet and the cooling medium outlet are arranged on opposite sides of the shell, which can also increase the flow distance of the cooling medium, so that the cooling medium can fully contact the outer surface of the main pipe and fully perform heat exchange.

[0079] In the actual exhaust process, in addition to increasing the distance of cooling medium flow as mentioned above, the cooling effect can also be improved by increasing the gas circulation time.

[0080] As a specific implementation example, the exhaust duct may further include at least one swivel baffle, which is arranged on the inner wall of the main duct and located in the connection area between the shell and the main duct, suitable for reducing the circulation speed of the gas to increase the circulation time of the gas in the main duct.

[0081] like Figure 2 As shown, the exhaust duct 100 may include swirl baffles D1 and D2, and the swirl baffles D1 and D2 are both arranged on the inner wall of the main duct 110 and located in the connection area between the shell 120 and the main duct 110. In this way, since the swirl baffles D1 and D2 are located on the flow path of the gas, the flow velocity of the gas can be reduced, thereby increasing the cooling time between the cooling medium and the gas. At the same time, the swirl baffles can increase the probability of direct contact between the gas that has not directly contacted the duct wall and the duct wall by changing the flow path of the gas, thereby further improving the cooling efficiency.

[0082] It should be noted that Figure 2 The number of rotating baffles shown is only an example, used to illustrate that the cooling effect can be improved by setting the rotating baffles, and cannot be understood as a restriction on the exhaust duct. In addition, the more the number of rotating baffles, the longer the cooling time of the gas and the cooling medium, and the better the cooling effect. The embodiments of this specification do not limit the number of rotating baffles, and the number of rotating baffles can be flexibly set according to actual needs.

[0083] In a specific implementation, the speed of gas flow can be controlled based on different requirements. For example, the angle formed by at least one swirl baffle and the inner wall of the main pipe is adjustable.

[0084] For example, Figure 2 The angle formed by the swirl baffles D1 and / or D2 and the inner wall of the main pipeline 110 is adjustable.

[0085] Specifically, by making the angle formed by the swirling baffle and the inner wall of the main pipe adjustable, the contact area between the gas and the swirling baffle can be adjusted, thereby changing the flow rate of the gas and thus changing the cooling time between the cooling medium and the gas.

[0086] For example, when the angle formed by the swirling baffle and the inner wall of the main pipeline is small, the contact area between the gas and the swirling baffle is small, the blocking effect of the swirling baffle is limited, and the gas circulation speed is still relatively fast; when the angle formed by the swirling baffle and the inner wall of the main pipeline is large, the contact area between the gas and the swirling baffle is large, which can significantly reduce the gas circulation speed.

[0087] It is understandable that the angle formed by the swirling baffle and the inner wall of the main pipe should be such that the swirling baffle can play a role in reducing the gas circulation speed. For example, when the angle formed by the swirling baffle and the inner wall of the main pipe is 0° or 180°, the gas circulation direction is parallel to the setting direction of the swirling baffle, and the swirling baffle basically does not play a role in reducing the gas circulation speed. Therefore, it is necessary to flexibly set the angle formed by the swirling baffle and the inner wall of the main pipe according to actual needs.

[0088] In some embodiments of the present specification, in order to further improve the cooling effect, the swirling baffles can be distributed in the shape of fan blades on the inner wall of the main pipe. On the one hand, it can reduce the impact on the exhaust pressure of the inner wall of the main pipe; on the other hand, it is also conducive to the convergence of condensate.

[0089] In specific implementations, the condensate generated by cooling the gas is generally corrosive. As the temperature decreases, the condensate gradually accumulates and may corrode the exhaust pipe. The exhaust pipe has a high maintenance cost, so the condensate should be discharged in time.

[0090] Based on this, continue to refer to Figure 2 The exhaust pipe in the embodiment of this specification may also include: a drain port 150, which is arranged on the side of the main pipe 110 away from the cooling medium inlet 121 (that is, the drain port 150 can be considered to be located at the exhaust end of the main pipe 110), suitable for discharging condensate formed by cooling the gas.

[0091] Specifically, the condensate formed by cooling converges at the exhaust end. By setting a drain port at the bottom of the outer side of the exhaust pipe, the condensate can be discharged in time.

[0092] In some embodiments, a drain pipe compatible with the drain port 150 may be used to discharge the condensate to a predetermined area.

[0093] In a specific implementation, in addition to adopting the method of discharging the condensate while cooling, the condensate can also be collected first and then discharged in a centralized manner.

[0094] As an optional implementation example, Figure 3 As shown, the exhaust pipe 100 in the embodiment of this specification may further include: a collecting device 160, which is arranged on a side of the main pipe 110 away from the cooling medium inlet 121 and is suitable for collecting condensate formed by cooling the gas.

[0095] Specifically, the condensate formed by cooling is collected in the collecting device, and the uncooled gas is discharged through the exhaust end of the main pipeline.

[0096] It is understandable that the material of the collecting device may be corrosion-resistant, so as to avoid the leakage of coolant due to corrosion of the collecting device.

[0097] In some embodiments, Figure 3 As shown, the collecting device 160 can be connected to the main pipeline 110 through the fourth flange 172 and the fifth flange 173 .

[0098] In a specific implementation, the volume of the collection device is limited. When a large amount of condensate is collected, the condensate needs to be discharged.

[0099] Based on this, the exhaust pipe in the embodiment of this specification may also include a discharge pipe and a control valve, wherein the discharge pipe may be connected to the collection device, and the control valve may be arranged on the discharge passage of the discharge pipe, suitable for controlling the discharge process of the condensate.

[0100] Specifically, when the condensate needs to be discharged, the control valve can be opened, and then the condensate in the collecting device can be discharged to a set area through the discharge passage of the discharge pipe.

[0101] In a specific implementation, the control valve can be opened manually or automatically at a fixed time to realize the discharge process of the condensate.

[0102] As a specific implementation example, the exhaust duct in the embodiment of the present specification may also include: a liquid level sensor and a controller, wherein the liquid level sensor may be arranged in the collecting device, suitable for detecting the liquid level of the condensate in the collecting device and generating a height detection signal; the controller may receive the height detection signal, and when it is determined that the liquid level corresponding to the height detection signal generated by the sensor is greater than a preset liquid level, output a conduction control signal to the control valve to conduct the control valve.

[0103] Specifically, the liquid level sensor can detect the change in the liquid level height of the condensate in the collection device and generate a corresponding height detection signal to the controller, so that when the controller determines that the liquid level corresponding to the height detection signal generated by the sensor is greater than the preset liquid level height, the controller can output a conduction control signal to the control valve to turn on the control valve, thereby realizing remote control of the condensate discharge process.

[0104] Furthermore, the liquid level height of the condensate detected by the liquid level sensor is more accurate, which can avoid multiple discharge processes and thus improve the discharge efficiency.

[0105] As a specific implementation example, the liquid level sensor can determine the liquid level of the condensate by measuring the pressure. Specifically, when the density and gravity parameters of the condensate remain unchanged, the greater the liquid level, the greater the corresponding pressure, and the liquid level of the condensate can be determined based on the pressure value.

[0106] In a specific implementation, the temperature of the condensate formed by cooling is still relatively high, which may cause a safety accident. Therefore, the exhaust duct in the embodiment of this specification may also include: a cooling device, which is arranged along the circumference of the collecting device and is suitable for reducing the temperature of the condensate in the collecting device.

[0107] As a specific implementation example, the structure and working principle of the cooling device can refer to the above description of cooling the gas. For example, a sealed chamber is formed between the cooling device and the collecting device, and the temperature of the condensate in the collecting device can be reduced by providing a cooling medium to the sealed chamber.

[0108] In a specific implementation, the main pipe may have a bend, and the flow direction of the gas is relatively chaotic, resulting in that not all the gas can be discharged through the main pipe. Some gas may accumulate at the intake end, thereby affecting the exhaust process.

[0109] Based on this, the exhaust duct in the embodiment of this specification may also include at least one guide baffle, which is arranged at the curved portion and located on the side of the main duct close to the cooling medium outlet, suitable for guiding the flow direction of the gas.

[0110] As an implementation example, continue to refer to Figure 3 The exhaust duct 100 may further include guide baffles Y1 and Y2, wherein the guide baffles Y1 and Y2 are both arranged at the curved portion, and may guide the flow direction of the gas so that the gas may flow from the air inlet end of the main duct 110 to the exhaust end of the main duct 110.

[0111] It should be noted that Figure 3 The number of diversion baffles shown is for illustrative purposes only, and is used to illustrate that the flow direction of gas can be guided by setting up diversion baffles. It should not be understood as a restriction on the exhaust duct. The embodiments of this specification do not limit the number of diversion baffles, and the number of diversion baffles can be flexibly set according to actual needs.

[0112] In some embodiments, in order to better guide the flow direction of the gas, the angle formed by at least one guide baffle and the inner wall of the exhaust duct is adjustable.

[0113] For example, Figure 3 The angle formed by the drainage baffle Y1 and / or the drainage baffle Y2 and the inner wall of the main pipeline 110 is adjustable.

[0114] It is understandable that the above examples are only for illustration purposes. In actual applications, those skilled in the art can adaptively select and / or deform the structure of the exhaust duct provided in the embodiments of this specification according to actual needs and application scenarios. For example, the size and material parameters of the main duct can be changed; for example, the positions of the cooling medium inlet and the cooling medium outlet on the shell can be adjusted; for example, some components in the exhaust duct can be replaced equally, etc. Based on this, more different extension schemes can be extended, and the embodiments of this specification do not limit these extension schemes.

[0115] It can be understood that the above describes multiple embodiment schemes provided by the embodiments of this specification, and the various optional methods introduced in each embodiment scheme can be combined and cross-referenced with each other without conflict, thereby extending a variety of possible embodiment schemes, which can all be considered as embodiment schemes disclosed and open in this specification.

[0116] This specification also provides an etching device corresponding to the exhaust duct described in any of the above embodiments, which is introduced below through specific examples.

[0117] It should be noted that the contents of the etching equipment described below can be referenced in correspondence with the contents of the exhaust duct described above.

[0118] The etching equipment in the embodiments of this specification may include an etching device and the exhaust pipe described in any of the aforementioned embodiments, wherein the etching device is suitable for etching a wafer, and the exhaust pipe can be connected to the etching device and is suitable for discharging the gas generated during the etching process of the etching device.

[0119] The specific structure and working principle of the exhaust duct can be found in the above examples and will not be described in detail here.

[0120] Although the embodiments of this specification are disclosed as above, the invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention, so the protection scope of the invention shall be subject to the scope defined by the claims.

Claims

1. An exhaust duct, characterized in that: include: A main pipeline, adapted to allow gas to pass through, the gas being generated during the etching process, the main pipeline having a curved portion; A shell, wherein the shell and the main pipeline form a chamber, wherein the chamber is suitable for accommodating a cooling medium, and the cooling medium is used to cool the gas; wherein the shell is provided with a cooling medium inlet and a cooling medium outlet connected to the chamber; At least one guide baffle is arranged at the curved portion and located on a side of the main pipeline close to the cooling medium outlet, and is suitable for guiding the flow direction of the gas.

2. The exhaust duct according to claim 1, characterized in that: Along the gas flow direction, the cooling medium outlet and the cooling medium inlet are sequentially arranged on the shell.

3. The exhaust duct according to claim 1 or 2, characterized in that: A cooling pipe connected to the cooling medium outlet and the cooling medium inlet is arranged in the chamber, and the cooling pipe is wound around the outer wall of the main pipeline.

4. The exhaust duct according to claim 1 or 2, characterized in that: Also includes: At least one swirl baffle is disposed on the inner wall of the main pipeline and located in the connection area between the shell and the main pipeline, and is suitable for reducing the circulation speed of the gas.

5. The exhaust duct according to claim 4, characterized in that: The angle formed by the at least one swirl baffle and the inner wall of the main pipeline is adjustable.

6. The exhaust duct according to claim 1 or 2, characterized in that: Also includes: The liquid discharge port is arranged on a side of the main pipeline away from the cooling medium inlet, and is suitable for discharging condensate formed by cooling the gas.

7. The exhaust duct according to claim 1, characterized in that: Also includes: The collecting device is arranged on a side of the main pipeline away from the cooling medium inlet and is suitable for collecting condensate formed by cooling the gas.

8. The exhaust duct according to claim 7, characterized in that: Also includes: a discharge pipe, connected to the collecting device; The control valve is arranged on the discharge passage of the discharge pipeline and is suitable for controlling the discharge process of the condensate.

9. The exhaust duct according to claim 8, characterized in that: Also includes: A liquid level sensor, disposed in the collecting device, adapted to detect the liquid level of the condensate in the collecting device and generate a height detection signal; The controller is adapted to receive the height detection signal and, when determining that the liquid level corresponding to the height detection signal generated by the sensor is greater than a preset liquid level, output a conduction control signal to the control valve to conduct the control valve.

10. The exhaust duct according to claim 8 or 9, characterized in that: Also includes: The cooling device is arranged along the circumference of the collecting device and is suitable for reducing the temperature of the condensate in the collecting device.

11. An etching device, characterized in that: include: An etching device, suitable for etching a wafer; The exhaust duct according to any one of claims 1 to 10 is connected to the etching device and is suitable for exhausting the gas generated during the etching process of the etching device.

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