Rapid heating structure of hot pressboard

Abstract

The utility model discloses a hot pressboard rapid heating structure which is characterized in that a water storage pipe is arranged at the bottom of an inner cavity of a hot pressboard body, a first heating pipe is arranged on the outer side of the water storage pipe, one end of the water storage pipe is connected with a circulating pump, a heat conduction pipe is arranged between the circulating pump and the other end of the water storage pipe, and a heat conduction plate is arranged at the top of the heat conduction pipe; according to the semiconductor hot pressing plate, through the arrangement of the heat conduction pipe and the second heating pipe, when a semiconductor welding line is heated through the heat conduction plate, heating and temperature rising can be conducted through the heat conduction pipe and the second heating pipe respectively, the heating efficiency is improved, and the semiconductor welding line can be heated through the heat conduction pipe and the second heating pipe; and through the arrangement of the semiconductor clamping mechanism, the semiconductor can be conveniently fixed, and the semiconductor can be fixed at the central position of the heat conducting plate, so that hot pressing of the semiconductor is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a hot pressing plate rapid heating structure. Background Art

[0002] At present, hot pressing plates are usually used in the production process of semiconductor bonding wires. On the one hand, the hot pressing plates can ensure the flatness of the product's external dimensions or the accuracy of special shapes. On the other hand, during the hot pressing process, the hot pressing plates have heat transfer properties and can transfer heat to the semiconductor, allowing the semiconductor to obtain the temperature and energy to cure the adhesive.

[0003] In the prior art, a hot press plate capable of quickly heating semiconductor welding wires with application number 202221700943.1 is disclosed, which discloses a hot press plate body and a heating plate arranged under the hot press plate body, wherein the heating plate comprises a first insulating layer, a heating element, a second insulating layer, a conductive adhesive layer and a heat spreader stacked in sequence, and the heat spreader is attached to the bottom of the hot press plate by a first high-temperature resistant double-sided adhesive tape; a No. 1 heating liquid hole and a No. 2 heating liquid hole are provided on one side of the hot press plate body, and a No. 1 liquid outlet hole and a No. 2 liquid outlet hole are provided on the other side of the hot press plate body; the No. 1 heating liquid hole and the No. 1 liquid outlet hole are fixedly connected A first heating tube is connected, a second heating tube is fixedly connected between the No. 2 heating liquid hole and the No. 2 liquid outlet hole, and the first heating tube and the second heating tube are both located inside the hot pressing plate body; a plurality of positioning bolts are fixedly connected to both sides of the hot pressing plate body, a heat insulation layer is fixedly connected between the positioning bolts located on the same side of the hot pressing plate body, and a plurality of mounting blocks are fixedly connected to each heat insulation layer. However, when heating is performed, the temperature rise is not uniform enough, and it is easy to cause energy loss. At the same time, when processing semiconductors, it is inconvenient to locate the position of the semiconductor and it is impossible to fix it in the center position, so that it is heated unevenly.

[0004] Currently, no effective solution has been proposed for the problems in the related technologies. Utility Model Content

[0005] In view of the problems in the related technology, the utility model proposes a hot pressing plate rapid heating structure to overcome the above technical problems existing in the existing related technology.

[0006] To this end, the specific technical solutions adopted by the utility model are as follows:

[0007] A hot press plate rapid heating structure comprises a hot press plate body, a water storage pipe is arranged at the bottom of the inner cavity of the hot press plate body, a first heating pipe is arranged on the outside of the water storage pipe, one end of the water storage pipe is connected to a circulation pump, a heat conduction pipe is arranged between the circulation pump and the other end of the water storage pipe, a heat conduction plate is arranged on the top of the heat conduction pipe, a second heating pipe is arranged between the heat conduction plate and the hot press plate body, and a semiconductor clamping mechanism is arranged on the top of the heat conduction plate.

[0008] As a further optimization, the first heating tube is arranged in a ring-shaped coil, and the first heating tube is attached to the outer side of the water storage tube.

[0009] As a further optimization, the heat conducting pipe is arranged in the middle of the heat conducting plate, and the second heating pipes are symmetrically arranged on both sides of the heat conducting pipe.

[0010] As a further optimization, a heating liquid is arranged in the water storage pipe, and the water storage pipe, the heat conduction pipe and the circulation pump are connected in a through manner.

[0011] As a further optimization, a buckle is provided at the bottom of the heat conducting plate, the second heating tube is embedded in the buckle, and the second heating tube is arranged in an S shape.

[0012] As a further optimization, the semiconductor clamping mechanism includes a connecting frame, a bidirectional screw, a rotating handle, a moving block, a first clamping plate, a guide plate, an electric telescopic rod and a second clamping plate. The connecting frame is fixed on the guide plate, the bidirectional screw is arranged in the connecting frame, one end of the rotating handle is connected to the bidirectional screw, and the moving block is symmetrically arranged on the bidirectional screw. One end of the first clamping plate passes through the connecting frame and is fixedly connected to the moving block, and the other end of the second clamping plate is slidably connected to the guide plate. The guide plate and the connecting frame are arranged in parallel, the electric telescopic rod is installed in the middle position of the guide plate, and one end of the electric telescopic rod is connected to the second clamping plate.

[0013] As a further optimization, the guide plate is provided with a sliding groove matching the first clamping plate, and the first clamping plate is slidably connected in the sliding groove.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. By providing a heat pipe and a second heating pipe, when the semiconductor welding wire is heated by the heat conducting plate, the heat pipe and the second heating pipe can be used to heat and raise the temperature respectively, thereby improving the heating efficiency and achieving the effect of rapid heating;

[0016] 2. By providing a semiconductor clamping mechanism, the semiconductor can be easily fixed, and the semiconductor can be fixed at the center of the heat conducting plate, which is convenient for hot pressing of the semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the internal structure of the utility model;

[0020] Figure 3 This is a semiconductor clamping structure diagram of the utility model;

[0021] Figure 4 It is a back structural diagram of the heat conducting plate of the utility model.

[0022] In the figure: 1. hot pressing plate body; 2. water storage pipe; 3. first heating pipe; 4. circulating pump; 5. heat conducting pipe; 6. heat conducting plate; 7. second heating pipe; 8. semiconductor clamping mechanism; 9. buckle; 10. connecting frame; 11. bidirectional screw; 12. turning handle; 13. moving block; 14. first clamping plate; 15. guide plate; 16. electric telescopic rod; 17. second clamping plate; 18. slide groove. DETAILED DESCRIPTION

[0023] To further illustrate each embodiment, the present invention provides drawings, which are part of the disclosure of the present invention and are mainly used to illustrate the embodiments. They can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, ordinary technicians in the field should be able to understand other possible implementation methods and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0024] Embodiment 1:

[0025] like Figures 1 to 4 As shown, a hot press plate rapid heating structure comprises a hot press plate body 1, a water storage pipe 2 is arranged at the bottom of the inner cavity of the hot press plate body 1, a first heating pipe 3 is arranged on the outer side of the water storage pipe 2, one end of the water storage pipe 2 is connected to a circulation pump 4, a heat conduction pipe 5 is arranged between the circulation pump 4 and the other end of the water storage pipe 2, a heat conduction plate 6 is arranged on the top of the heat conduction pipe 5, a second heating pipe 7 is arranged between the heat conduction plate 6 and the hot press plate body 1, a semiconductor clamping mechanism 8 is arranged on the top of the heat conduction plate 6, the first heating pipe 3 is arranged in an annular coil, and the first heating pipe 3 is arranged in an annular coil. Tube 3 is attached to the outer side of the water storage pipe 2, the heat conduction pipe 5 is arranged in the middle position of the heat conduction plate 6, the second heating pipe 7 is symmetrically arranged on both sides of the heat conduction pipe 5, and a heating liquid is arranged in the water storage pipe 2. The water storage pipe 2, the heat conduction pipe 5 and the circulation pump 4 are through-connected. The heating liquid in the water storage pipe 2 is heated by the first heating pipe 3, and the heating liquid is circulated by the circulation pump 4 at the same time. The semiconductor is heated by the heat conduction pipe 5 and the heat conduction plate 6. The first heating pipe 3 coiled in a ring can increase the heating speed of the heating liquid in the water storage pipe 2.

[0026] Embodiment 2:

[0027] like Figures 1 to 4 As shown, a hot pressing plate rapid heating structure is provided, wherein a buckle 9 is provided at the bottom of the heat conducting plate 6, a second heating tube 7 is embedded in the buckle 9, and the second heating tube 7 is provided in an S shape, and auxiliary heating is performed by the second heating tube 7 to improve the heating efficiency and achieve a rapid heating effect.

[0028] Embodiment 3:

[0029] like Figures 1 to 4 As shown, a hot plate rapid heating structure, wherein the semiconductor clamping mechanism 8 comprises a connecting frame 10, a bidirectional screw 11, a rotating handle 12, a moving block 13, a first clamping plate 14, a guide plate 15, an electric telescopic rod 16 and a second clamping plate 17. The connecting frame 10 is fixed on the guide plate 15, the bidirectional screw 11 is arranged in the connecting frame 10, one end of the rotating handle 12 is connected to the bidirectional screw 11, the moving block 13 is symmetrically arranged on the bidirectional screw 11, one end of the first clamping plate 14 passes through the connecting frame 10 and is fixedly connected to the moving block 13, the other end of the second clamping plate 17 is slidably connected to the guide plate 15, the guide plate 15 is arranged parallel to the connecting frame 10, the electric telescopic rod 16 is installed in the middle position of the guide plate 15, one end of the electric telescopic rod 16 is connected to the second clamping plate 17 The guide plate 15 is provided with a slide groove 18 matching the first clamping plate 14, and the first clamping plate 14 is slidably connected in the slide groove 18. A positioning frame is provided at a position corresponding to the second clamping plate 17 on the connecting frame 10. The length of the second clamping plate 17 and the positioning frame is less than the length of the semiconductor. The semiconductor is placed on the heat conducting plate 6 so that one end of the semiconductor is close to the positioning frame on the connecting frame 10. The bidirectional screw 11 is driven to rotate by turning the handle 12, so that the moving block 13 drives the first clamping plate 14 to move, and the two sides of the semiconductor are clamped and fixed by the first clamping plate 14, and then the second clamping plate 17 is driven to move by the electric telescopic rod 16, so that the second clamping plate 17 cooperates with the positioning frame to clamp and fix the semiconductor, which can facilitate the semiconductor to be fixed at the center position of the heat conducting plate 6.

[0030] In summary, with the help of the above-mentioned technical scheme of the utility model, when this device is in use, the semiconductor is placed on the heat conducting plate 6, so that one end of the semiconductor is close to the positioning frame on the connecting frame 10, and the bidirectional screw 11 is driven to rotate by turning the handle 12, so that the moving block 13 drives the first clamping plate 14 to move, and the two sides of the semiconductor are clamped and fixed by the first clamping plate 14, and then the second clamping plate 17 is driven to move by the electric telescopic rod 16, so that the second clamping plate 17 cooperates with the positioning frame to clamp and fix the semiconductor, which can facilitate the semiconductor to be fixed in the center position of the heat conducting plate 6. When the semiconductor is hot-pressed, the heating liquid in the water storage pipe 2 is heated by the first heating tube 3, and the heating liquid is circulated by the circulating pump 4, and the semiconductor is heated by the heat conducting tube 5 and the heat conducting plate 6, and at the same time, auxiliary heating can be performed by the second heating tube 7, thereby improving the heating efficiency and achieving the effect of rapid heating.

[0031] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A hot pressing plate rapid heating structure, comprising a hot pressing plate body (1), characterized in that: A water storage pipe (2) is arranged at the bottom of the inner cavity of the hot pressing plate body (1), a first heating pipe (3) is arranged on the outer side of the water storage pipe (2), one end of the water storage pipe (2) is connected to a circulation pump (4), a heat conduction pipe (5) is arranged between the circulation pump (4) and the other end of the water storage pipe (2), a heat conduction plate (6) is arranged on the top of the heat conduction pipe (5), a second heating pipe (7) is arranged between the heat conduction plate (6) and the hot pressing plate body (1), and a semiconductor clamping mechanism (8) is arranged on the top of the heat conduction plate (6).

2. A hot plate rapid heating structure according to claim 1, characterized in that: The first heating tube (3) is arranged in a ring-shaped coil, and the first heating tube (3) is attached to the outside of the water storage tube (2).

3. A hot pressing plate rapid heating structure according to claim 2, characterized in that: The heat conducting pipe (5) is arranged in the middle of the heat conducting plate (6), and the second heating pipes (7) are symmetrically arranged on both sides of the heat conducting pipe (5).

4. A hot press plate rapid heating structure according to any one of claims 1 to 3, characterized in that: A heating liquid is arranged in the water storage pipe (2), and the water storage pipe (2), the heat conducting pipe (5) and the circulation pump (4) are connected in a through-connection manner.

5. A hot press plate rapid heating structure according to claim 4, characterized in that: A buckle (9) is provided at the bottom of the heat conducting plate (6), the second heating tube (7) is embedded in the buckle (9), and the second heating tube (7) is arranged in an S shape.

6. The hot plate rapid heating structure according to claim 1, characterized in that: The semiconductor clamping mechanism (8) comprises a connecting frame (10), a bidirectional screw (11), a rotating handle (12), a moving block (13), a first clamping plate (14), a guide plate (15), an electric telescopic rod (16) and a second clamping plate (17); the connecting frame (10) is fixed on the guide plate (15); the bidirectional screw (11) is arranged in the connecting frame (10); one end of the rotating handle (12) is connected to the bidirectional screw (11); the moving block (13) is symmetrically arranged on the bidirectional screw (11); one end of the first clamping plate (14) passes through the connecting frame (10) and is fixedly connected to the moving block (13); the other end of the second clamping plate (17) is slidably connected to the guide plate (15); the guide plate (15) and the connecting frame (10) are arranged in parallel; the electric telescopic rod (16) is installed in the middle position of the guide plate (15); and one end of the electric telescopic rod (16) is connected to the second clamping plate (17).

7. A hot press plate rapid heating structure according to claim 6, characterized in that: The guide plate (15) is provided with a sliding groove (18) matching with the first clamping plate (14), and the first clamping plate (14) is slidably connected in the sliding groove (18).

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