A multi-layer hard-soft circuit board
By designing a heat dissipation device in a multi-layer soft and hard circuit board, combined with air-cooling and heat pipe exchange technology, the problem of insufficient heat dissipation effect in the existing technology is solved, and efficient heat dissipation and performance stability are achieved.
Patent Information
- Application Number
- CN202421292362.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-07
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2034-06-07
AI Technical Summary
The existing multi-layer soft and hard-core circuit boards have insufficient heat dissipation effect when the area increases, making it difficult to meet the needs of efficient heat dissipation.
A multi-layer soft and hard circuit board is designed, using a heat dissipation device combined with air-cooling and heat pipe exchange technology, absorbs heat through the upper and lower copper foil and exchanges it to the heat dissipation fin board through the heat pipe, and then air-cooling and heat dissipation is performed with a heat dissipation fan.
It effectively improves the heat dissipation efficiency of the circuit board, ensures the performance stability of the multi-layer circuit board, and improves the cleaning ability through the dust intercept network.
Smart Images
Figure CN222721669U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a circuit board, in particular to a multi-layer soft-hard combined circuit board. Background Art
[0002] A rigid-flex circuit board refers to a new type of circuit board that is a combination of a flexible circuit board and a rigid circuit board through processes such as pressing. It has the characteristics of both PCB and FPC and helps save the internal space of the product. The rigid-flex circuit boards currently used often increase the heat generated as the area of the circuit board increases, requiring a higher heat dissipation effect, so a new type of multi-layer rigid-flex circuit board with efficient heat dissipation is needed. Utility Model Content
[0003] The purpose of the utility model is to provide a multi-layer rigid-flexible circuit board to solve the above technical problems.
[0004] To achieve the above purpose, the utility model adopts the following technical solutions:
[0005] A multilayer soft-hard combination circuit board comprises a first PCB board, a second PCB board, a third PCB board, an FPC board and a heat dissipation device, wherein the second PCB board is installed at the bottom end of the first PCB board, the third PCB board is installed at the bottom end of the second PCB board, the first PCB board, the second PCB board and the third PCB board are connected by a plug-in FPC board, and the heat dissipation device is installed at the left ends of the first PCB board, the second PCB board and the third PCB board.
[0006] Based on the above technical solution, the heat dissipation device includes a supporting shell, a dust interception net, a cooling fan, a slot, and a heat sink. A dust interception net fixed with screws is installed at the front end of the supporting shell, a cooling fan fixed with screws is installed in the middle of the rear end of the supporting shell, and symmetrically distributed slots are opened at the right end of the supporting shell and a heat sink is installed inside.
[0007] Based on the above technical solution, the heat sink includes an upper copper foil, a lower copper foil, an embedding groove, a heat pipe, and a heat dissipation fin. The upper copper foil and the lower copper foil are split-type adhesive structures and have three groups of symmetrically distributed embedding grooves on the surface. A heat pipe with an embedded structure is installed on the inside of the embedding groove, and a heat dissipation fin is installed in the middle of the left end of the heat pipe.
[0008] Compared with the prior art, the utility model has the following advantages: the circuit board of the utility model effectively improves the heat dissipation efficiency through air cooling inside the heat dissipation device, heat pipes and copper foil covering the surface of the circuit board, thereby ensuring the stability of the performance of the multi-layer circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1 This is a schematic diagram of the appearance structure of the utility model.
[0010] Figure 2 This is a schematic diagram of the structure of the heat dissipation device of the utility model.
[0011] Figure 3 This is a schematic diagram of the heat sink structure of the utility model.
[0012] In the figure: 1. first PCB board, 2. second PCB board, 3. third PCB board, 4. FPC board, 5. heat dissipation device, 6. supporting shell, 7. dust interception net, 8. cooling fan, 9. slot, 10. heat sink, 11. upper copper foil, 12. lower copper foil, 13. embedded groove, 14. heat pipe, 15. cooling fin. DETAILED DESCRIPTION
[0013] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0014] like Figure 1-3 As shown, a multi-layer soft-hard combination circuit board includes a first PCB board 1, a second PCB board 2, a third PCB board 3, an FPC board 4, and a heat dissipation device 5. The second PCB board 2 is installed at the bottom end of the first PCB board 1, and the third PCB board 3 is installed at the bottom end of the second PCB board 2. The first PCB board 1, the second PCB board 2, and the third PCB board 3 are connected through a plug-in FPC board 4, and the first PCB board 1, the second PCB board 2, and the third PCB board 3 are installed at the left ends. The heat dissipation device 5.
[0015] The heat dissipation device 5 includes a supporting shell 6, a dust interception net 7, a cooling fan 8, a slot 9, and a heat sink 10. The front end of the supporting shell 6 is provided with a dust interception net 7 fixed with screws, the middle part of the rear end of the supporting shell 6 is provided with a cooling fan 8 fixed with screws, and the right end of the supporting shell 6 is provided with symmetrically distributed slots 9 and a heat sink 10 is installed inside.
[0016] The heat sink 10 includes an upper copper foil 11, a lower copper foil 12, an embedding groove 13, a heat pipe 14, and a heat dissipation fin 15. The upper copper foil 11 and the lower copper foil 12 are split-type adhesive structures and have three groups of symmetrically distributed embedding grooves 13 on their surfaces. An embedded heat pipe 14 is installed inside the embedding groove 13, and a heat dissipation fin 15 is installed in the middle of the left end of the heat pipe 14.
[0017] The working principle of the utility model is as follows: firstly, the heat sink is covered on the surface of the second PCB board and the third PCB board through thermal conductive silicone grease, and then the upper copper foil and the lower copper foil absorb the heat generated when the PCB board is working, and the heat of the copper foil is exchanged to the heat dissipation fins through the three groups of internal heat pipes, and then the heat dissipation fins cooperate with the heat dissipation fan to perform air cooling and heat dissipation, thereby realizing rapid cooling of the second PCB board and the third PCB board. At the same time, during the air cooling and heat dissipation process, the heat dissipation fan cooperates with the dust interception net to intercept and collect dust in the air, which is helpful for the operator's dust cleaning operation.
[0018] The above is a preferred embodiment of the present invention. For ordinary technicians in this field, according to the teachings of the present invention, without departing from the principles and spirit of the present invention, changes, modifications, substitutions and variations made to the implementation methods are still within the scope of protection of the present invention.
Claims
1. A multi-layer rigid-flexible circuit board, comprising a first PCB board (1), a second PCB board (2), a third PCB board (3), an FPC board (4), and a heat dissipation device (5), characterized in that: A second PCB board (2) is mounted on the bottom end of the first PCB board (1), a third PCB board (3) is mounted on the bottom end of the second PCB board (2), the first PCB board (1), the second PCB board (2) and the third PCB board (3) are connected via a plug-in FPC board (4), and a heat dissipation device (5) is mounted on the left ends of the first PCB board (1), the second PCB board (2) and the third PCB board (3).
2. A multi-layer rigid-flexible circuit board according to claim 1, characterized in that: The heat dissipation device (5) comprises a supporting shell (6), a dust interception net (7), a heat dissipation fan (8), a slot (9), and a heat dissipation fin (10); the front end of the supporting shell (6) is provided with a dust interception net (7) fixed by screws; the middle part of the rear end of the supporting shell (6) is provided with a heat dissipation fan (8) fixed by screws; the right end of the supporting shell (6) is provided with symmetrically distributed slots (9) and the heat dissipation fin (10) is installed inside.
3. A multi-layer rigid-flexible circuit board according to claim 2, characterized in that: The heat sink (10) comprises an upper copper foil (11), a lower copper foil (12), an embedding groove (13), a heat pipe (14), and a heat dissipation fin (15); the upper copper foil (11) and the lower copper foil (12) are split-type adhesive structures and have three groups of symmetrically distributed embedding grooves (13) on their surfaces; a heat pipe (14) of an embedded structure is installed inside the embedding groove (13); and a heat dissipation fin (15) is installed in the middle of the left end of the heat pipe (14).