A solder pad conduction structure of a circuit board

Abstract

The utility model relates to the technical field of circuit board conduction, and discloses a solder pad conduction structure of a circuit board, comprising a base, a mounting groove is provided on one side of the base, a sliding groove is provided on the other side of the base, a screw rod is provided through the interior of the mounting groove, a first handle is fixedly connected to the front end of the screw rod, a first base is provided on one side of the base, a second base is provided on the other side of the base, a first fixing frame is fixedly connected to the top end of the first base, and a second fixing frame is fixedly connected to the top end of the second base. The solder pad conduction structure of the circuit board is provided with parts such as the first fixing frame, and the threaded rod can be screwed to drive the second connecting block to move outside the threaded rod and the fixing rod respectively, so that the solder pad can be pressed and fixed on the circuit board, which is convenient for subsequent conduction work, and solves the problem that the solder pad is easy to move and it is inconvenient to press and fix the solder pad on the circuit board.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board conduction, in particular to a solder pad conduction structure of a circuit board. Background Art

[0002] A circuit board is a support for connecting electronic components and circuits. It is mainly used to realize the layout design of complex circuits and the transmission of electrical signals in electrical and electronic equipment. Circuit boards usually use glass fiber as the base material. The conductive structure of the circuit board includes solder pads and conductive holes. The internal through holes facilitate the conduction part that runs through the entire circuit board.

[0003] According to the design of the existing circuit board pad conduction structure, it is not convenient to press the pad on the circuit board and fix it, resulting in instability during conduction work. The pad is easy to move, affecting the quality of the conduction work. Therefore, its structure needs to be improved.

[0004] Now, a novel pad conduction structure of a circuit board is proposed to solve the above-mentioned problem. Utility Model Content

[0005] The utility model aims to provide a cleaning device for sewage treatment pipes to solve the problem in the above background technology that the soldering pad is easy to move and it is inconvenient to press the soldering pad on the circuit board for fixing.

[0006] To achieve the above-mentioned objectives, the utility model provides the following technical solutions: a solder pad conduction structure of a circuit board, comprising a base, a mounting groove is provided on one side of the base, a slide groove is provided on the other side of the base, a screw rod is provided through the interior of the mounting groove, a first handle is fixedly connected to the front end of the screw rod, a first base is provided on one side of the base, a second base is provided on the other side of the base, a first fixing frame is fixedly connected to the top end of the first base, a threaded rod is provided longitudinally through the interior of the first fixing frame, a second handle is fixedly connected to the top end of the threaded rod, a second fixing frame is fixedly connected to the top end of the second base, a fixing rod is longitudinally fixedly connected to the interior of the second fixing frame, a positioning plate is provided on the top end of the base, and second connecting blocks are fixedly connected to both sides of the positioning plate.

[0007] Preferably, the second connecting block is sleeved on the outside of the threaded rod and the fixed rod respectively.

[0008] Preferably, the threaded rod and the fixed rod are in the same horizontal plane, and the threaded rod and the fixed rod have the same height.

[0009] Preferably, a first connecting block is fixedly connected to one side of the first base, and the first connecting block is sleeved on the outside of the screw rod.

[0010] Preferably, a fixing plate is provided at the top of the positioning plate, a welding pad body is fixedly connected to the bottom of the positioning plate, a dust plug is fixedly connected to the bottom of the fixing plate, through holes are provided inside the positioning plate and the top of the welding pad body, and an insulating layer is fixedly connected to the inner wall of the through hole.

[0011] Preferably, the dust plug is consistent with the position of the through hole, and the dust plug is detachably embedded in the through hole.

[0012] Preferably, nine groups of through holes are provided, and the through holes are evenly spaced and distributed inside the positioning plate.

[0013] Preferably, a third connecting block is fixedly connected to one side of the second base, and the third connecting block is embedded in the sliding groove and can slide.

[0014] Compared with the prior art, the utility model has the following beneficial effects: the solder pad conduction structure of the circuit board not only facilitates the solder pad to be pressed and fixed on the circuit board, realizes the adjustment of the position of the solder pad on the circuit board, but also has a dustproof effect;

[0015] (1) By providing a first fixing frame, a second connecting block, a threaded rod, a second handle, a fixing rod, and a second fixing frame, the threaded rod can be screwed to drive the second connecting block to move outside the threaded rod and the fixing rod, respectively, so that the solder pad can be pressed and fixed on the circuit board, which is convenient for subsequent conduction work;

[0016] (2) By providing a mounting groove, a first handle, a first connecting block, a first base, a second base, a third connecting block, a sliding groove, and a second connecting block, the first handle can be screwed to drive the screw rod to rotate, and the first connecting block outside can be driven to move on the screw rod, and the third connecting block can slide in the sliding groove, so that the position of the solder pad on the circuit board can be easily adjusted;

[0017] (3) By providing a positioning plate, a pad body, a fixing plate, a dust plug, an insulating layer, and a through hole, the dust plug can be embedded in the through hole when not in use to prevent dust from entering the through hole and affecting the next conduction function. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a front view cross-sectional structural schematic diagram of the utility model;

[0019] Figure 2 It is a schematic diagram of the top view of the structure of the connection between the dust plug and the through hole of the utility model;

[0020] Figure 3 This is a front view structural diagram of the connection method between the screw rod and the first base of the utility model;

[0021] Figure 4This is a front view structural schematic diagram of the connection method between the threaded rod and the connecting block of the utility model.

[0022] In the figure: 1. base; 2. mounting groove; 3. first handle; 4. first connecting block; 5. first pedestal; 6. first fixing frame; 7. second connecting block; 8. threaded rod; 9. second handle; 10. positioning plate; 11. welding pad body; 12. fixing plate; 13. dust plug; 14. insulating layer; 15. through hole; 16. fixing rod; 17. second fixing frame; 18. second pedestal; 19. third connecting block; 20. slide groove; 21. screw rod. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Example 1: Please refer to Figure 1-4 A solder pad conduction structure of a circuit board comprises a base 1, a mounting groove 2 is arranged on one side of the base 1, a slide groove 20 is arranged on the other side of the base 1, a screw rod 21 is arranged through the inside of the mounting groove 2, a first handle 3 is fixedly connected to the front end of the screw rod 21, a first base 5 is arranged on one side of the base 1, a second base 18 is arranged on the other side of the base 1, a first fixing frame 6 is fixedly connected to the top of the first base 5, a threaded rod 8 is longitudinally arranged through the inside of the first fixing frame 6, a second handle 9 is fixedly connected to the top of the threaded rod 8, a second fixing frame 17 is fixedly connected to the top of the second base 18, a fixing rod 16 is longitudinally fixedly connected between the inside of the second fixing frame 17, a positioning plate 10 is arranged on the top of the base 1, and second connecting blocks 7 are fixedly connected to both sides of the positioning plate 10;

[0025] The second connecting block 7 is sleeved on the outside of the threaded rod 8 and the fixing rod 16 respectively;

[0026] The threaded rod 8 and the fixed rod 16 are in the same horizontal plane, and the threaded rod 8 and the fixed rod 16 have the same height;

[0027] Specifically, Figure 1 and Figure 4 As shown, by screwing the threaded rod 8, the second connecting block 7 can be driven to move outside the threaded rod 8 and the fixing rod 16 respectively, so that the pad body 11 can be pressed and fixed on the circuit board to facilitate the subsequent conduction work.

[0028] Embodiment 2: A first connection block 4 is fixedly connected to one side of the first base 5, and the first connection block 4 is sleeved on the outside of the screw rod 21;

[0029] A third connecting block 19 is fixedly connected to one side of the second base 18, and the third connecting block 19 is embedded in the slide groove 20 and can slide.

[0030] Specifically, Figure 1 and Figure 3 As shown, by rotating the first handle 3, the screw rod 21 can be driven to rotate, and the external first connecting block 4 can be driven to move on the screw rod 21. At the same time, the third connecting block 19 can slide in the slide groove 20, so that the position of the pad body 11 on the circuit board can be easily adjusted.

[0031] Embodiment 3: A fixing plate 12 is disposed at the top of the positioning plate 10, a welding pad body 11 is fixedly connected to the bottom of the positioning plate 10, a dust plug 13 is fixedly connected to the bottom of the fixing plate 12, a through hole 15 is disposed inside the top of the positioning plate 10 and the welding pad body 11, and an insulating layer 14 is fixedly connected to the inner wall of the through hole 15;

[0032] The dust plug 13 is in accordance with the position of the through hole 15, and the dust plug 13 is embedded in the through hole 15 and can be removed;

[0033] Nine groups of through holes 15 are provided, and the through holes 15 are evenly spaced and distributed inside the positioning plate 10;

[0034] Specifically, Figure 1 and Figure 2 As shown, when not in use, the dust plug 13 can be embedded in the through hole 15 to prevent dust from entering the through hole 15 and affecting the next conduction function.

[0035] Working principle: When the utility model is in use, first, the first handle 3 is screwed to drive the screw rod 21 to rotate, and the external first connecting block 4 can be driven to move on the screw rod 21. At the same time, the third connecting block 19 can slide in the slide groove 20, so that the position of the pad body 11 on the circuit board can be adjusted conveniently. Afterwards, the threaded rod 8 is screwed to drive the second connecting block 7 to move outside the threaded rod 8 and the fixing rod 16 respectively, so that the pad body 11 can be pressed and fixed on the circuit board, which is convenient for the subsequent conduction work. Finally, when not in use, the dust plug 13 can be embedded in the through hole 15 to prevent dust from entering the through hole 15 and affecting the conduction function next time.

[0036] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A solder pad conduction structure of a circuit board, comprising a base (1), characterized in that: A mounting groove (2) is provided on one side of the base (1), a sliding groove (20) is provided on the other side of the base (1), a screw rod (21) is provided inside the mounting groove (2), a front end of the screw rod (21) is fixedly connected to a first handle (3), a first base (5) is provided on one side of the base (1), a second base (18) is provided on the other side of the base (1), a first fixing frame (6) is fixedly connected to the top of the first base (5), a threaded rod (8) is longitudinally provided inside the first fixing frame (6), a second handle (9) is fixedly connected to the top of the threaded rod (8), a second fixing frame (17) is fixedly connected to the top of the second base (18), a fixing rod (16) is longitudinally fixedly connected inside the second fixing frame (17), a positioning plate (10) is provided on the top of the base (1), and second connecting blocks (7) are fixedly connected to both sides of the positioning plate (10).

2. The pad conduction structure of a circuit board according to claim 1, characterized in that: The second connecting block (7) is sleeved on the outside of the threaded rod (8) and the fixed rod (16) respectively.

3. The pad conduction structure of a circuit board according to claim 1, characterized in that: The threaded rod (8) and the fixed rod (16) are on the same horizontal plane, and the threaded rod (8) and the fixed rod (16) are at the same height.

4. The pad conduction structure of a circuit board according to claim 1, characterized in that: A first connection block (4) is fixedly connected to one side of the first base (5), and the first connection block (4) is sleeved on the outside of the screw rod (21).

5. The pad conduction structure of a circuit board according to claim 1, characterized in that: A fixing plate (12) is arranged at the top of the positioning plate (10), a welding pad body (11) is fixedly connected to the bottom of the positioning plate (10), a dust plug (13) is fixedly connected to the bottom of the fixing plate (12), a through hole (15) is arranged inside the top of the positioning plate (10) and the welding pad body (11), and an insulating layer (14) is fixedly connected to the inner wall of the through hole (15).

6. The pad conduction structure of a circuit board according to claim 5, characterized in that: The dust plug (13) is aligned with the position of the through hole (15), and the dust plug (13) is embedded in the through hole (15) and is detachable.

7. The pad conduction structure of a circuit board according to claim 5, characterized in that: Nine groups of through holes (15) are provided, and the through holes (15) are distributed at equal intervals inside the positioning plate (10).

8. The pad conduction structure of a circuit board according to claim 1, characterized in that: A third connection block (19) is fixedly connected to one side of the second base (18), and the third connection block (19) is embedded in the sliding groove (20) and can slide.

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