A PCB copper deposition device

Abstract

The utility model discloses a copper sinking device for a PCB board, comprising a hanger and a copper sinking frame, wherein the copper sinking frame is arranged in the hanger, the upper end of the copper sinking frame is higher than the upper end of the hanger, flanges are arranged on the left and right sides of the copper sinking frame, and slide grooves are arranged on the corresponding two sides of the hanger, and the copper sinking frame slides in the slide groove through the flanges, and buffer springs I and a driving mechanism are arranged on the front and rear sides of the copper sinking frame respectively, and the buffer spring I is arranged between the copper sinking frame and the hanger, and the driving mechanism comprises a motor and a cam, and the motor is arranged at the upper end of the hanger, and the output end of the motor is connected to the cam, and the cam is driven to hit the copper sinking frame. The utility model can disperse the bubbles generated by the through holes on the board, so that the copper is better covered on the hole wall of the through hole, and the quality and effect of copper sinking are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board production, in particular to a PCB board copper deposition device. Background Art

[0002] In the production process of PCB boards, copper plating is an important step. The purpose of copper plating is to use chemical principles to deposit a uniform conductive layer in the hole wall of the through hole of the PCB board, so that the originally insulated hole wall has conductivity, which is convenient for the subsequent board surface electroplating, thereby achieving conduction between PCB board layers. At present, when copper plating is performed on the PCB board, the PCB board is placed on a copper plating rack, and then the copper plating rack is placed in a copper plating container filled with copper plating solution. When copper plating is performed, bubbles will be generated in the through holes on the PCB board. If the bubbles are not removed, the copper plating quality of the PCB board will be affected. Although ultrasonic waves are now used to disperse the bubbles, the effect is still poor, making it difficult to improve the copper plating quality. Utility Model Content

[0003] The utility model aims to provide a PCB copper deposition device to solve the technical problems existing in the background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a PCB board copper deposition device, including a hanger and a copper deposition frame, the copper deposition frame is arranged in the hanger, the upper end of the copper deposition frame is higher than the upper end of the hanger, flanges are arranged on the left and right sides of the copper deposition frame, and slide grooves are arranged on the corresponding two sides of the hanger. The copper deposition frame slides in the slide groove through the flanges, and a buffer spring I and a driving mechanism are respectively arranged on the front and back sides of the copper deposition frame. The buffer spring I is arranged between the copper deposition frame and the hanger. The driving mechanism includes a motor and a cam. The motor is arranged at the upper end of the hanger, and the output end of the motor is connected to the cam to drive the cam to hit the copper deposition frame.

[0005] As a preferred embodiment of the present technical solution, a support column is arranged at the lower end of the hanger, and a hanging plate is arranged at the upper end of the hanger.

[0006] As a preferred embodiment of the present technical solution, the copper sinking frame is provided with multiple layers of support frames above and below, the bottom support frame is provided with support clips, and the remaining support frames are provided with side clips, and the support clips and side clips are both slid on the support frames and fixed by screws.

[0007] As a preferred embodiment of the present technical solution, the side clip includes a clip seat and a movable clip, a clip slot is arranged on the clip seat, one side of the movable clip slides in the clip slot, and the other side is a clip connection portion, which protrudes out of the clip slot, and a buffer spring II is arranged between the movable clip and the bottom plate of the clip slot.

[0008] Compared with the prior art, the utility model hangs the hanger and the copper sinking frame into the copper sinking pool, and the PCB board is placed on the copper sinking frame. During operation, the motor drives the cam to hit the copper sinking frame, which can shake off the bubbles generated by the through holes on the board, so that the copper can be better covered on the through hole wall, thereby improving the quality and effect of copper sinking. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a structural schematic diagram of the utility model.

[0010] Figure 2 It is an attached view of the utility model.

[0011] Figure 3 for Figure 2 AA view of the .

[0012] Figure 4 It is a schematic diagram of the copper sinking frame structure of the utility model.

[0013] Figure 5 for Figure 4 BB view.

[0014] Figure 6 It is a schematic diagram of the side clip structure of the utility model.

[0015] Figure 7 for Figure 6 CC view of the .

[0016] In the figure: 1. hanger; 2. copper sinking frame; 2.1. flange; 3. hanger plate; 4. support column; 5. motor; 6. cam; 7. buffer spring I; 8. support clip; 9. side clip; 9.1. clip seat; 9.2. movable clip; 10. buffer spring II. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] See also Figure 1-7The utility model discloses a copper sinking device for a PCB board, comprising a hanger 1 and a copper sinking frame 2, both of which are three-dimensional frame structures, the copper sinking frame 2 is arranged in the hanger 1, the upper end of the copper sinking frame 2 is higher than the upper end of the hanger 1, the width and length of the copper sinking frame 2 are smaller than the width and length of the hanger 1, flanges 2.1 are arranged on the left and right sides of the copper sinking frame 2, and slide grooves are arranged on the corresponding two sides of the hanger 1, the copper sinking frame 2 slides in the slide groove through the flange 2.1, and buffer springs Ⅰ7 and a driving mechanism are respectively arranged on the front and back sides of the copper sinking frame 2, the buffer spring Ⅰ7 is arranged between the copper sinking frame 2 and the hanger 1, the driving mechanism comprises a motor 5 and a cam 6, the motor 5 is arranged at the upper end of the hanger 1, the output end of the motor 5 is connected to the cam 6, and the cam 6 is driven to hit the copper sinking frame 2.

[0019] In the specific implementation of the utility model, the buffer spring Ⅰ7 can be arranged at the upper, middle and lower positions between the copper sinking frame 2 and the hanger 1, the support column 4 is arranged at the lower end of the hanger 1, and the hanging plate 3 is arranged at the upper end of the hanger 1. The support column 4 supports the entire frame in the copper sinking pool, and the hanging plate 3 is used to hang the entire frame into the copper sinking pool.

[0020] In the specific implementation of the utility model, the hanger 1 and the copper sinking frame 2 are composed of multiple vertical plates and horizontal plates. The hanger 1 and the copper sinking frame 2 are three-dimensional frames with a hollow interior. The vertical plates are arranged on the periphery, and the horizontal plates are connected between the two vertical plates. One of the horizontal plates on the side can be disassembled so that the copper sinking frame 2 can slide out from it, which is convenient for maintenance and repair. The flange 2.1 and the slide groove are arranged on the horizontal plate, and the buffer spring Ⅰ7 is also pressed against the horizontal plate. The copper sinking frame 2 is provided with multiple layers of support frames above and below, and each layer of support frames is composed of two opposite horizontal plates. The bottom support frame is provided with a support clip 8, and the other support frames are provided with side clips 9. Both ends of the support clip 8 and the side clip 9 slide on the two opposite horizontal plates and are fixed by screws. This structure adopts the existing technology and will not be repeated here. The side clip 9 includes a clip seat 9.1 and a movable clip 9.2. A clip slot is arranged on the clip seat 9.1. One side of the movable clip 9.2 slides in the clip slot, and the other side is a clip connection portion, which protrudes out of the clip slot. A buffer spring II 10 is arranged between the movable clip 9.2 and the bottom plate of the clip slot, so that PCB boards of multiple sizes can be applied while reducing the movement of the clip.

[0021] When the utility model is used, the PCB board is installed on the copper sinking frame 2, fixed by the support clip 8 and the side clip 9, the whole frame is hung into the copper sinking pool by the hanger 1, the motor 5 drives the cam 6 to hit the copper sinking frame 2, which can shake off the bubbles generated by the through holes on the PCB board during the copper sinking operation, and the copper sinking operation can be well performed, thereby improving the copper sinking quality and effect.

[0022] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the utility model, which are used to illustrate the technical solution of the utility model, rather than to limit it. The protection scope of the utility model is not limited thereto. Although the utility model is described in detail with reference to the above-mentioned embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solution recorded in the above-mentioned embodiments within the technical scope disclosed by the utility model, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solution deviate from the spirit and scope of the technical solution of the embodiment of the utility model, and should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A PCB copper deposition device, characterized in that: It includes a hanger and a copper sinking frame, the copper sinking frame is arranged in the hanger, the upper end of the copper sinking frame is higher than the upper end of the hanger, flanges are arranged on the left and right sides of the copper sinking frame, and slide grooves are arranged on the corresponding two sides of the hanger. The copper sinking frame slides in the slide groove through the flanges, and buffer springs I and driving mechanisms are respectively arranged on the front and back sides of the copper sinking frame. The buffer spring I is arranged between the copper sinking frame and the hanger. The driving mechanism includes a motor and a cam. The motor is arranged at the upper end of the hanger, and the output end of the motor is connected to the cam to drive the cam to hit the copper sinking frame.

2. The PCB copper deposition device according to claim 1, characterized in that: A support column is arranged at the lower end of the hanger, and a hanging plate is arranged at the upper end of the hanger.

3. The PCB copper deposition device according to claim 1, characterized in that: The copper sinking frame is provided with multiple layers of support frames above and below, the bottom support frame is provided with support clips, and the other support frames are provided with side clips, and the support clips and side clips are both slid on the support frames and fixed by screws.

4. The PCB copper deposition device according to claim 3, characterized in that: The side clip includes a clip seat and a movable clip. The clip seat is provided with a clip slot. One side of the movable clip slides in the clip slot, and the other side is a clip connection portion, which protrudes out of the clip slot. A buffer spring II is provided between the movable clip and the bottom plate of the clip slot.

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