Electronic component heat dissipation device

Abstract

The utility model provides an electronic component heat dissipation device, which relates to the technical field of electronic component heat dissipation, including a base plate, a heat dissipation fan is installed on the bottom surface of the base plate, a vertical plate is fixedly installed on the top surface of the base plate, a mounting plate is fixedly installed on the top surface of the vertical plate, a side plate is fixedly installed on the side of the mounting plate, a heat conduction plate is fixedly installed on the bottom surface of the base plate, and heat dissipation fins are fixedly installed on the bottom surface of the heat conduction plate. In winter, the utility model can reduce the contact area between the radiator and the electronic components, reduce the heat dissipation, and help the electronic components to maintain a relatively warm working environment, which avoids the difficulty of starting or performance degradation of the electronic components due to too low ambient temperature, and in summer, the contact area can be increased to improve the heat dissipation efficiency, avoid the automatic frequency reduction or damage of the electronic components due to overheating, and in a high temperature environment, effective heat dissipation can ensure that the electronic components are maintained within a safe working temperature range, and the practicality is high.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component heat dissipation, in particular to an electronic component heat dissipation device. Background Art

[0002] With the development of integrated circuits, the demand for miniaturization and thinning of circuits has led to an increasing trend in the thermal density of products. Various development boards, such as Raspberry Pi, generate a lot of heat when working at high loads, so a heat sink is needed.

[0003] Publication No. CN213960596U discloses a heat dissipation device for a circuit board, including a box, a first fixed plate fixedly connected to the side of the box, a groove is provided inside the first fixed plate, a second fixed plate is movably connected inside the groove, a slide is provided inside the groove, a slider is slidably connected inside the slide, the side of the slider is fixedly connected to the side of the movable plate, a housing is fixedly connected to the surface of the second fixed plate, a micro-circulation pump is fixedly connected inside the housing, a micro-blower is fixedly connected inside the box, a connecting pipe is arranged inside the box, a chamber is provided inside the first fixed plate and the second fixed plate, an elastic pipe is arranged inside the chamber, one end of the elastic pipe is fixedly connected to the micro-circulation pump, and the other end of the elastic pipe is fixedly connected to the connecting pipe. Although this heat dissipation device can be adjusted accordingly according to the size of the circuit board, which is convenient for the later heat dissipation of the circuit board, the heat dissipation efficiency of this heat dissipation device is fixed and cannot be adjusted according to the actual temperature requirements, resulting in overheating of electronic components in a high temperature environment, affecting performance and life, and excessive heat dissipation in a low temperature environment, resulting in difficulty in starting the electronic components or performance degradation. Therefore, improvement is needed. Utility Model Content

[0004] The purpose of the utility model is to solve the technical problems raised in the above background technology.

[0005] The utility model adopts the following technical scheme: an electronic component heat dissipation device, comprising a base plate, a cooling fan is installed on the bottom surface of the base plate, a vertical plate is fixedly installed on the top surface of the base plate, a mounting plate is fixedly installed on the top surface of the vertical plate, a side plate is fixedly installed on the side of the mounting plate, a heat conduction plate is fixedly installed on the bottom surface of the base plate, a cooling fin is fixedly installed on the bottom surface of the heat conduction plate, a slot is opened on the top surface of the heat conduction plate, a conduction plate is penetrated through the top surface of the side plate, a side block is fixedly installed on the side of the conduction plate, and a screw rod is rotatably connected to the top surface of the side plate.

[0006] Preferably, a screw cap is fixedly mounted on the top of the screw rod, and the screw cap is a hexagonal structure. Here, the screw rod can be easily screwed.

[0007] Preferably, ventilation slots are provided on the surface of the mounting plate, and the ventilation slots are arranged at equal distances on the surface of the mounting plate, thereby improving the heat dissipation effect.

[0008] Preferably, the conduction plate is slidably connected to the side plate, and the heat dissipation fins are arranged at equal distances on the bottom surface of the heat conduction plate.

[0009] Preferably, a thread is provided inside the side block, and the thread is meshed with the screw rod.

[0010] Preferably, the bottom surface of the bottom plate is provided with a dust removal mechanism, the dust removal mechanism comprises a long groove, the long groove is opened on the bottom surface of the bottom plate, a sliding rod is slidably connected to the inner wall of the long groove, a long plate is fixedly installed at the bottom end of the sliding rod, a scraper is fixedly installed on the top surface of the long plate, and a push handle is fixedly installed on the bottom surface of the scraper. Here, maintenance can be conveniently performed.

[0011] Preferably, the scraper is in contact with the heat dissipation fins.

[0012] Compared with the prior art, the advantages and positive effects of the utility model are:

[0013] 1. In the utility model, when actually used, the electronic components that need heat dissipation, such as the development board, are installed on the mounting plate. The heat generated by the development board can be conducted to the side plate, and then conducted to the heat conducting plate and the heat dissipation fins through the conduction plate. At this time, the heat can be dissipated through the heat dissipation fins. At the same time, the cooling speed can be further improved by blowing the cooling fan. At the same time, when used in winter, the heat dissipation effect can be adjusted to avoid the electronic components working at a lower or higher temperature. When adjusting the heat dissipation effect, it is only necessary to turn the screw cap to rotate the screw rod. At this time, since the inside of the side block is provided with a thread, the screw rod can drive the side block to move, and the side block then drives the conduction plate to slide inside the side plate until When the conduction plate is inserted into the slot, the conduction plate and the heat conduction plate can contact and conduct heat normally. In this way, the heat conduction effect can be controlled by adjusting the amount of contact between the conduction plate and the heat conduction plate, and then the heat dissipation effect can be controlled. In winter, the utility model can reduce the contact area between the radiator and the electronic components to reduce the heat dissipation and help the electronic components to remain in a relatively warm working environment, which avoids the difficulty in starting or performance degradation of the electronic components due to too low an ambient temperature. In summer, the contact area can be increased to improve the heat dissipation efficiency and avoid automatic frequency reduction or damage of the electronic components due to overheating. In a high temperature environment, effective heat dissipation can ensure that the electronic components are maintained within a safe working temperature range, and the utility model has high practicality.

[0014] 2. In the utility model, during actual use, when dust accumulates on the surface of the heat sink fins, the staff only needs to push the long board to move through the push handle, and the long board then slides in the long groove through the sliding rod. At the same time, the long board can drive the scraper to scrape the inner wall of the heat sink fins. At this time, the dust and stains on the heat sink fins can be cleaned. The utility model can clean the heat sink fins through a simple push handle operation, eliminating the need for disassembly or use of special cleaning tools, greatly simplifying the cleaning and maintenance process, and regularly and effectively removing dust and stains on the heat sink fins can maintain the optimal working state of the heat sink fins, improve the overall heat dissipation efficiency, thereby ensuring the stable operation of electronic components and extending their service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of a heat dissipation device for electronic components proposed by the utility model;

[0016] Figure 2 This is a bottom view of an electronic component heat dissipation device proposed by the utility model;

[0017] Figure 3 A side view of a heat dissipation device for electronic components proposed by the utility model;

[0018] Figure 4 The utility model proposes an electronic component heat dissipation device Figure 3 Enlarged view of point A in the middle.

[0019] Legend:

[0020] 1. Bottom plate; 2. Cooling fan; 3. Vertical plate; 4. Mounting plate; 5. Side plate; 6. Heat conducting plate; 7. Cooling fins; 8. Slots; 9. Conductive plate; 10. Side block; 11. Screw rod; 12. Twist cap; 13. Ventilation slot; 14. Long slot; 15. Sliding rod; 16. Long plate; 17. Scraper; 18. Push handle. DETAILED DESCRIPTION

[0021] In order to more clearly understand the above-mentioned purpose, features and advantages of the utility model, the utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0022] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein. Therefore, the present invention is not limited to the specific embodiments of the following disclosure.

[0023] Embodiment 1

[0024] See also Figure 1-4The utility model provides a technical solution: an electronic component heat dissipation device, comprising a bottom plate 1, a cooling fan 2 is installed on the bottom surface of the bottom plate 1, and the cooling speed can be further improved by blowing the cooling fan 2, a vertical plate 3 is fixedly installed on the top surface of the bottom plate 1, a mounting plate 4 is fixedly installed on the top surface of the vertical plate 3, and a side plate 5 is fixedly installed on the side of the mounting plate 4, a heat conducting plate 6 is fixedly installed on the bottom surface of the bottom plate 1, and a heat dissipation fin 7 is fixedly installed on the bottom surface of the heat conducting plate 6, a slot 8 is opened on the top surface of the heat conducting plate 6, and a conduction plate 9 is penetrated on the top surface of the side plate 5. Electronic components that need heat dissipation, such as a development board, are installed on the mounting plate 4, and the heat generated by the development board can be conducted to the side plate 5, and then conducted to the heat conducting plate 6 and the heat dissipation fins 7 through the conduction plate 9. At this time, the heat can be dissipated through the heat dissipation fins 7, the conduction plate 9 is slidably connected to the side plate 5, the heat dissipation fins 7 are arranged at equal distances on the bottom surface of the heat conducting plate 6, and a side block 10 is fixedly installed on the side of the conduction plate 9.

[0025] See also Figure 1-4 The top surface of the side plate 5 is rotatably connected with a screw rod 11, and a thread is provided inside the side block 10, and the thread is meshed with the screw rod 11. A screw cap 12 is fixedly installed on the top of the screw rod 11, and the screw rod 11 can be conveniently screwed by screwing the cap 12. A ventilation groove 13 is provided on the surface of the mounting plate 4, and the screw rod 11 is rotated by screwing the cap 12. At this time, since the inside of the side block 10 is provided with a thread, the screw rod 11 can drive the side block 10 to move, and the side block 10 then drives the conduction plate 9 to slide inside the side plate 5 until the conduction plate 9 is inserted into the slot 8. At this time, the conduction plate 9 can contact with the heat conduction plate 6 to conduct heat normally. In this way, the heat conduction effect can be controlled by adjusting the number of contacts between the conduction plate 9 and the heat conduction plate 6, and then the heat dissipation effect can be controlled. The ventilation grooves 13 are arranged at equal distances on the surface of the mounting plate 4, and the screw cap 12 is a hexagonal structure.

[0026] Embodiment 2

[0027] See also Figure 2-3 The bottom surface of the bottom plate 1 is provided with a dust removal mechanism, which includes a long groove 14, which is opened on the bottom surface of the bottom plate 1, and a sliding rod 15 is slidably connected to the inner wall of the long groove 14, and a long plate 16 is fixedly installed at the bottom end of the sliding rod 15, and a scraper 17 is fixedly installed on the top surface of the long plate 16, and the scraper 17 is in contact with the heat sink fins 7. A push handle 18 is fixedly installed on the bottom surface of the scraper 17, and the long plate 16 is pushed to move by the push handle 18, and the long plate 16 then slides in the long groove 14 through the sliding rod 15. At the same time, the long plate 16 can drive the scraper 17 to scrape the inner wall of the heat sink fin 7, and the dust and stains on the heat sink fin 7 can be cleaned. The utility model can clean the heat sink fin 7 through a simple push handle 18 operation, eliminating the need for disassembly or use of special cleaning tools, and greatly simplifying the cleaning and maintenance process.

[0028] Working principle: Install the development board and other electronic components that need heat dissipation on the mounting plate 4. The heat generated by the development board can be conducted to the side plate 5, and then conducted to the heat conducting plate 6 and the heat dissipation fins 7 through the conduction plate 9. At this time, the heat can be dissipated through the heat dissipation fins 7. At the same time, the air blowing by the cooling fan 2 can further increase the cooling speed. At the same time, when used in winter, the heat dissipation effect can be adjusted to avoid the electronic components working at a lower or higher temperature. When adjusting the heat dissipation effect, it is only necessary to turn the screw rod 11 by turning the cap 12. At this time, since the inside of the side block 10 is threaded, the screw rod 11 can drive the side block 10 to move. The side block 10 then drives the conduction plate 9 to slide inside the side plate 5 until the conduction plate 9 is inserted into the slot 8. At this time, the conduction plate 9 contacts the heat conducting plate 6 to conduct heat normally. In this way, by adjusting the contact between the conduction plate 9 and the heat conducting plate 6 The number of can control the thermal conduction effect, and then control the heat dissipation effect. The utility model can reduce the contact area between the radiator and the electronic components in winter, reduce the heat dissipation, and help the electronic components to maintain a relatively warm working environment. When dust accumulates on the surface of the heat sink 7, the staff only needs to push the long plate 16 to move through the push handle 18, and the long plate 16 then slides in the long groove 14 through the sliding rod 15. At the same time, the long plate 16 can drive the scraper 17 to scrape the inner wall of the heat sink 7. At this time, the dust and stains on the heat sink 7 can be cleaned. The utility model can clean the heat sink fins 7 through a simple push handle 18 operation, eliminating the need for disassembly or use of special cleaning tools, greatly simplifying the cleaning and maintenance process. At the same time, regularly and effectively removing dust and stains on the heat sink fins 7 can maintain the optimal working state of the heat sink fins 7 and improve the overall heat dissipation efficiency.

[0029] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. An electronic component heat dissipation device, comprising a base plate (1), characterized in that: A cooling fan (2) is installed on the bottom surface of the base plate (1), a vertical plate (3) is fixedly installed on the top surface of the base plate (1), a mounting plate (4) is fixedly installed on the top surface of the vertical plate (3), and a side plate (5) is fixedly installed on the side of the mounting plate (4); A heat conducting plate (6) is fixedly mounted on the bottom surface of the base plate (1), a heat dissipation fin (7) is fixedly mounted on the bottom surface of the heat conducting plate (6), and a slot (8) is provided on the top surface of the heat conducting plate (6); A conducting plate (9) is provided through the top surface of the side plate (5), a side block (10) is fixedly mounted on the side surface of the conducting plate (9), and a screw rod (11) is rotatably connected to the top surface of the side plate (5).

2. The electronic component heat dissipation device according to claim 1, characterized in that: A screw cap (12) is fixedly mounted on the top end of the screw rod (11), and the screw cap (12) is a hexagonal structure.

3. The electronic component heat dissipation device according to claim 1, characterized in that: The surface of the mounting plate (4) is provided with ventilation slots (13), and the ventilation slots (13) are arranged at equal distances on the surface of the mounting plate (4).

4. The electronic component heat dissipation device according to claim 1, characterized in that: The conductive plate (9) is slidably connected to the side plate (5); The heat dissipation fins (7) are arranged at equal distances on the bottom surface of the heat conducting plate (6).

5. The electronic component heat dissipation device according to claim 1, characterized in that: The side block (10) is provided with a thread inside, and the thread is meshed with the screw rod (11).

6. The electronic component heat dissipation device according to claim 1, characterized in that: The bottom surface of the bottom plate (1) is provided with a dust removal mechanism, the dust removal mechanism comprising a long groove (14), and the long groove (14) is opened on the bottom surface of the bottom plate (1); The inner wall of the long groove (14) is slidably connected to a sliding rod (15), a long plate (16) is fixedly mounted on the bottom end of the sliding rod (15), a scraper (17) is fixedly mounted on the top surface of the long plate (16), and a push handle (18) is fixedly mounted on the bottom surface of the scraper (17).

7. The electronic component heat dissipation device according to claim 6, characterized in that: The scraper (17) is in contact with the heat dissipation fins (7).

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