A water cooling device

Abstract

The present application provides a water cooling device for dissipating heat in a radio frequency microwave amplifier device, the water cooling device includes a substrate; it also includes a heating component connected to the substrate, located on the surface of the substrate, and generating heat; it also includes a water cooling channel, which is opened in the substrate and absorbs heat, and when observed in the vertical direction of the substrate, the projection of the water cooling channel partially overlaps with the projection of the heating component, and the water cooling channel includes: a water cooling branch channel and a water cooling merging channel, the water cooling merging channel is connected with a plurality of the water cooling branch channels to form a parallel channel; wherein the heating component generates heat, the water cooling channel is filled with water, the heating component and the water cooling channel generate a temperature difference and the water absorbs heat, and the water flows through the plurality of the water cooling branch channels in sequence and merges at the water cooling merging channel. The above structure ensures that the heat generated by the heating component is absorbed and the temperature of the heating component remains consistent.

Description

Technical Field

[0001] The present application relates to the field of microwaves, and in particular to a water cooling device. Background Art

[0002] In high-power RF microwave amplifier equipment, the structure is complex, with multiple precision power device units working together. However, while these power units operate efficiently, they also generate significant heat dissipation power, causing the device temperature to rise sharply. To ensure stable operation of the equipment, an efficient water cooling system must be used to quickly remove the generated heat.

[0003] The current water cooling system mainly uses a common water channel to flow through each heat-generating power device unit in a specific order. However, this design has significant defects. As the water flows through each heat-generating power device unit, its temperature gradually rises. This results in the water temperature being relatively high when flowing through subsequent device units, and it is impossible to cool effectively. Therefore, as the water flows in the system, the temperature of the heat-generating components gradually rises, forming an obvious temperature unevenness phenomenon, and the temperature difference between each component is extremely large. Therefore, a water cooling device is needed that can ensure the temperature of each power device is consistent and does not affect the synthesis performance during power synthesis. Utility Model Content

[0004] In view of this, it is necessary to provide a water cooling device that can ensure that the temperature of each power device is consistent and does not affect the synthesis performance during power synthesis, so as to solve the above problems.

[0005] An embodiment of the present application provides a water cooling device for dissipating heat in a radio frequency microwave amplifier device, and the water cooling device includes: a substrate, a heat generating component and a water cooling channel. The heat generating component is connected to the substrate. The heat generating component is located on the surface of the substrate. The heat generating component generates heat. The water cooling channel is opened in the substrate. The water cooling channel absorbs heat. The water cooling channel includes: a water cooling branch channel and a water cooling merging channel, and the water cooling merging channel is connected with a plurality of the water cooling branch channels to form a parallel channel. And when observed in the vertical direction of the substrate, the projection of each of the water cooling branch channels partially overlaps with the projection of the heat generating component. Among them, the heat generating component generates heat, the water cooling channel is filled with water, the heat generating component and the water cooling channel generate a temperature difference and the water absorbs heat, and the water flows through the plurality of the water cooling branch channels in sequence and merges at the water cooling merging channel.

[0006] In at least one embodiment of the present application, the water-cooling channel includes a first water-cooling channel and a second water-cooling channel. The first water-cooling channel is connected to one end of the plurality of water-cooling branches in sequence. The second water-cooling channel is connected to the other end of the plurality of water-cooling branches in sequence, and the two ends of the water-cooling branch channels are respectively connected to the first water-cooling channel and the second water-cooling channel to form a series channel. The corresponding series channels formed by the plurality of water-cooling branches are combined to form a parallel channel, and the projection of the heat-generating component in the vertical direction overlaps with the projection of each of the water-cooling branches.

[0007] In at least one embodiment of the present application, the water cooling channel also includes a water injection port, which is opened on the base, injects water into the water injection port, and is connected to the first water cooling channel. Each of the water cooling branches is connected to the first water cooling channel in sequence according to the direction away from the water injection port.

[0008] In at least one embodiment of the present application, the water cooling channel also includes a water outlet, which is opened on the base, and the water outlet is connected to the second water cooling channel. The water outlet discharges water that absorbs heat, and each of the water cooling branches is connected to the second water cooling channel in sequence according to the direction close to the water outlet.

[0009] In at least one embodiment of the present application, the heat generating component includes a circulator and a power device. The circulator is connected to the substrate, and the circulator is located on the surface of the substrate. The power device is connected to the substrate, and the power device is located on the surface of the substrate. The circulator and the power device both generate heat.

[0010] In at least one embodiment of the present application, when observed along the vertical direction of the base, the projection of each of the circulators overlaps with the projection of one end of a water-cooling branch channel. The water flows through each water-cooling branch channel at the same temperature. The water flows through each of the circulators at the same temperature.

[0011] In at least one embodiment of the present application, when observed along the vertical direction of the substrate, the projection of each power device overlaps with the projection of the other end of a water cooling branch channel. The water flows through each water cooling branch channel at the same temperature. The power devices that the water flows through each water cooling branch channel have the same temperature.

[0012] In at least one embodiment of the present application, when viewed in a horizontal direction along a vertical direction of the base body, the circulator is located at one end of the water-cooling branch channel close to the first water-cooling junction channel.

[0013] In at least one embodiment of the present application, when viewed in a horizontal direction along a vertical direction of the substrate, the power device is located at one end of the water-cooling branch channel close to the second water-cooling junction channel.

[0014] In at least one embodiment of the present application, the substrate is configured as a heat-conducting structure.

[0015] The water cooling device provided above absorbs heat and flows through the water in the water cooling channel. Each of the water cooling branches is connected to the water cooling channel to form a corresponding series channel, and the series channels are combined to form a parallel channel. Each heating component is located at the connection position of the water cooling branch channel and the water cooling channel, ensuring that each heating element receives a similar cooling effect, thereby keeping their temperatures consistent. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A three-dimensional diagram of the water cooling device described in this application;

[0017] Figure 2 A top view of the water cooling device described in this application;

[0018] Figure 3 This is a schematic diagram of the structure of the water cooling channel described in this application;

[0019] Figure 4 for Figure 2 Sectional view of AA in the middle;

[0020] Figure 5 for Figure 2 Cross-sectional view of the middle BB;

[0021] Figure 6 A schematic diagram showing the overlapping state of the heat generating component and the water cooling channel when viewed from the vertical direction;

[0022] Figure 7 Schematic diagram of the temperature state of the heat-generating component under the water cooling effect through the water cooling channel.

[0023] Main component symbols

[0024] 100, water cooling device; 10, base; 20, heat generating component; 30, water cooling channel; 31, water cooling branch channel; 32, water cooling combined channel; 321, first water cooling combined channel; 322, second water cooling combined channel; 33, water inlet; 34, water outlet; 21, circulator; 22, power device; 50, vertical direction; 60, horizontal direction. DETAILED DESCRIPTION

[0025] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0026] It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a central component at the same time. When a component is considered to be "located on" another component, it may be directly located on the other component or there may be a central component at the same time. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "back", and similar expressions used herein are for illustrative purposes only.

[0027] An embodiment of the present application provides a water cooling device for dissipating heat in a radio frequency microwave amplifier device, and the water cooling device includes: a substrate, a heat generating component and a water cooling channel. The heat generating component is connected to the substrate. The heat generating component is located on the surface of the substrate. The heat generating component generates heat. The water cooling channel is opened in the substrate. The water cooling channel absorbs heat. The water cooling channel includes: a water cooling branch channel and a water cooling merging channel, and the water cooling merging channel is connected with a plurality of the water cooling branch channels to form a parallel channel. And when observed in the vertical direction of the substrate, the projection of each of the water cooling branch channels partially overlaps with the projection of the heat generating component. Among them, the heat generating component generates heat, the water cooling channel is filled with water, the heat generating component and the water cooling channel generate a temperature difference and the water absorbs heat, and the water flows through the plurality of the water cooling branch channels in sequence and merges at the water cooling merging channel.

[0028] The water cooling device provided above absorbs heat and flows through the water in the water cooling channel. Each of the water cooling branches is connected to the water cooling channel to form a corresponding series channel, and the series channels are combined to form a parallel channel. Each heating component is located at the connection position of the water cooling branch channel and the water cooling channel, ensuring that each heating element receives a similar cooling effect, thereby keeping their temperatures consistent.

[0029] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0030] See also Figure 1-Figure 7The embodiment of the present application provides a water cooling device 100. The embodiment of the present application provides a water cooling device 100 for heat dissipation in a radio frequency microwave amplifier device. The water cooling device 100 includes: a substrate 10, a heating component 20 and a water cooling channel 30. The heating component 20 is connected to the substrate 10. The heating component 20 is located on the surface of the substrate 10. The heating component 20 generates heat. The water cooling channel 30 is opened in the substrate 10. The water cooling channel 30 absorbs heat. And when observed along the vertical direction 50 of the substrate 10, the projection of the water cooling channel 30 partially overlaps with the projection of the heating component 20. The water cooling channel 30 includes: a water cooling branch channel 31 and a water cooling combined channel 32. The water cooling combined channel 32 is connected with the water cooling branch channel 31 to form a series channel. The water cooling combined channel 32 is connected with multiple water cooling branch channels 31 to form a series channel. One water cooling branch channel 31 is connected with the water cooling combined channel 32, corresponding to one series channel. Multiple series channels are combined to form a parallel channel. The heating component 20 generates heat, the water cooling channel 30 is filled with water, a temperature difference is generated between the heating component 20 and the water cooling channel 30 , and the water absorbs heat. The water flows through the multiple water cooling branches 31 in sequence and converges at the water cooling junction 32 .

[0031] Specifically, the base 10 is a supporting structure of the water cooling device 100, and is usually made of a metal material with good thermal conductivity, such as aluminum alloy or copper. The base 10 is used to carry and support the entire water cooling system, and at the same time, as a heat transfer medium, effectively transfers the heat generated by the heat generating component 20 to the water cooling channel 30.

[0032] Furthermore, the heating component 20 is a heat source in the water cooling device 100, and is located on the surface of the substrate 10. In the radio frequency microwave amplifier device, these heating components 20 are usually power devices 22 or other electronic components, which generate heat when working due to the flow of current. The heat generated by the heating component 20 is transferred to the water cooling channel 30 so as to dissipate heat through the circulation of water.

[0033] Furthermore, the water-cooling channel 30 is the core component of the entire heat dissipation system and is located inside the base 10. It consists of a water-cooling branch channel 31 and a water-cooling junction channel 32. The water-cooling branch channel 31 is opened along the path inside the base 10 and is responsible for guiding the cooling water to the vicinity of the heating component 20. The water-cooling junction channel 32 is where the various water-cooling branches 31 converge, and the cooling water flows in each branch channel are brought together to ensure that the water flows evenly in the system. The design of the entire water-cooling channel 30 system ensures that the cooling water can fully contact and absorb the heat generated by the heating component 20.

[0034] Furthermore, the water cooling channel 30 is arranged inside the base 10, which means that the entire heat dissipation system is embedded in the structure of the device, rather than an externally attached component. This design helps to reduce the overall size of the device, making it more compact and easy to install. The main function of the water cooling channel 30 is to absorb the heat generated by the heat generating component 20. In this way, the heat is transferred to the water and then carried away by the flow of water to achieve the purpose of heat dissipation.

[0035] Furthermore, when viewed along the vertical direction 50 of the base 10, the projection of each water-cooling branch 31 partially overlaps with the projection of the heating component 20. This emphasizes the positional relationship between the water-cooling branch 31 and the heating component 20, especially when viewed along the vertical direction 50 of the base 10.

[0036] Specifically, when you look from the top to the bottom or from the bottom to the top of the base 10, you will find that the projection of each water-cooling branch channel 31 (i.e., the projection in the vertical direction 50) partially overlaps with the projection of the heat-generating component 20. This means that the positions of the water-cooling branch channel 31 and the heat-generating component 20 are aligned, and they share the same space in the vertical direction 50.

[0037] The best contact is ensured when the heat is transferred from the heat generating component 20 to the water cooling branch 31, so that the heat can be effectively transferred to the water. Through this close position arrangement, the heat dissipation efficiency can be maximized, ensuring that the equipment can maintain a stable operating temperature under high load and long-term operation.

[0038] The heat generated by the heat generating component 20 can be directly transferred to the water cooling channel 30 without passing through an additional heat transfer medium. In this way, the cooling water can absorb the heat faster and take it away when flowing in the water cooling channel 30, thereby ensuring that the heat dissipation effect of the device is more efficient.

[0039] In summary, when the device is working, the heat generating component 20 generates heat, which is effectively transferred to the water cooling channel 30 by the base 10. The cooling water source is injected into the water cooling channel 30, and due to the temperature difference, the water cooling channel 30 absorbs the heat and dissipates it. The water flows through multiple water cooling branches 31 in sequence and converges at the water cooling junction 32, ensuring uniform water flow and uniform temperature distribution in the system. This heat dissipation process effectively keeps the temperature of the device within a safe range, thereby ensuring the performance and reliability of the device.

[0040] In a specific implementation example, the water-cooling channel 32 includes a first water-cooling channel 32132 and a second water-cooling channel 32232. The first water-cooling channel 32132 is sequentially connected to one end of the plurality of water-cooling branch channels 31. The second water-cooling channel 32232 is sequentially connected to the other end of the plurality of water-cooling branch channels 31, and the two ends of the water-cooling branch channels 31 are respectively connected to the first water-cooling channel 32132 and the second water-cooling channel 32232 to form a series channel. The corresponding series channels formed by the plurality of water-cooling branch channels 31 are combined to form a parallel channel.

[0041] Specifically, the first water-cooling channel 32132 is connected to one end of a plurality of water-cooling branch channels 31. This means that the inlets of the water-cooling branch channels 31 are sequentially connected to different ports of the first water-cooling channel 32132. In one implementation, it is assumed that there are four water-cooling branch channels 31, and their inlets are respectively connected to port 1, port 2, port 3, and port 4 of the first water-cooling channel 32132. This connection method enables each water-cooling branch channel 31 to be directly connected to the first water-cooling channel 32132.

[0042] Further, the second water-cooling channel 32232 is connected to the other ends of the plurality of water-cooling branch channels 31. This means that the outlets of the water-cooling branch channels 31 are sequentially connected to different ports of the second water-cooling channel 32232. Continuing to take the four water-cooling branch channels 31 as an example, their outlets are respectively connected to port 1, port 2, port 3 and port 4 of the second water-cooling channel 32232. This connection method forms a series structure in the opposite direction to the first water-cooling channel 32132.

[0043] Furthermore, both ends of each water-cooling branch channel 31 are respectively connected to the first water-cooling junction 32132 and the second water-cooling junction 32232, forming a series channel. For example, the inlet of the first water-cooling branch channel 31 is connected to the port 1 of the first water-cooling junction 32132, and the outlet is connected to the port 1 of the second water-cooling junction 32232, the inlet of the second water-cooling branch channel 31 is connected to the port 2 of the first water-cooling junction 32132, and the outlet is connected to the port 2 of the second water-cooling junction 32232, and so on. A parallel channel is formed between multiple such series channels, making the structure of the entire water cooling system more complex but also more flexible.

[0044] Furthermore, the overlap of the projection of the heating component 20 in the vertical direction 50 and the projection of each water-cooling branch 31 helps to optimize the performance of the heat dissipation system, wherein, since the projection of the heating component 20 overlaps the projection of each water-cooling branch 31, it means that the contact area between the heating component 20 and each water-cooling branch 31 is maximized. This close contact ensures that heat can be effectively transferred to the water, thereby improving the efficiency of heat transfer.

[0045] Each water cooling branch channel 31 is in close contact and connection with the heat generating component 20, which means that each branch channel can evenly absorb and remove heat. By ensuring that the heat is evenly distributed in the water cooling branch channel 31, the problem of local overheating or insufficient cooling can be avoided, thereby achieving even heat dissipation of the entire heat dissipation system.

[0046] It is also possible to ensure that as much heat as possible is transferred to the water by maximizing the contact area between the heat generating component 20 and each water cooling branch 31. This design can improve the heat dissipation efficiency, allowing the device to cool down more quickly and maintain a stable operating temperature under high load and long-term operation.

[0047] In summary, through such a design, the water cooling system can more effectively absorb and remove the heat generated by the heat generating component 20, ensuring that the device maintains a stable operating temperature when running under high load. At the same time, the combination of series and parallel structures also makes the heat dissipation system more flexible and can adapt to the needs of different scenarios.

[0048] In a specific implementation example, the water cooling channel 30 also includes a water injection port 33, which is opened on the base 10, and water is injected into the water injection port 33. The water injection port 33 is connected to the first water cooling channel 32132, and each of the water cooling branches 31 is connected to the first water cooling channel 32132 in sequence according to the direction away from the water injection port 33.

[0049] Specifically, the presence of the water injection port 33 allows water to be added to the water cooling channel 30 when needed to replenish the amount of water in the system that may be reduced due to evaporation or other reasons. This helps to maintain a sufficient level of water in the water cooling system and ensure the normal operation of the heat dissipation system.

[0050] Furthermore, water injection through the water injection port 33 can maintain the water level in the water cooling channel 30. The stability of the water level is crucial to the operation of the water cooling system, because too low a water level may cause the system pressure to drop, affecting the flow performance of the water and the heat dissipation efficiency.

[0051] Furthermore, the water injection port 33 is connected to the first water cooling channel 32132, which means that the added water will flow directly into the main circulation path of the heat dissipation system. This connection method ensures that the injected water can be quickly distributed to each water cooling branch channel 31, thereby effectively absorbing and taking away heat.

[0052] Furthermore, each water-cooling branch channel 31 is connected to the first water-cooling combined channel 32132 in sequence in a direction away from the water injection port 33. This connection method ensures that the flow direction of water is consistent with the direction from the water injection port 33 to the water-cooling branch channel 31, avoiding possible reverse or chaotic water flow, thereby ensuring the stability and reliability of the water cooling system.

[0053] In a specific implementation example, the water-cooling channel 30 also includes a water outlet 34, which is opened on the base 10, and the water outlet 34 is connected to the second water-cooling channel 32232. The water outlet 34 discharges water that absorbs heat, and each of the water-cooling branches 31 is connected to the second water-cooling channel 32232 in sequence according to the direction close to the water outlet 34.

[0054] Specifically, the main function of the water outlet 34 is to discharge the water that has absorbed heat from the system. Such a design is to ensure that the cooling water in the system is always in an effective working state, can continue to effectively absorb heat and keep the operating temperature of the equipment within a safe range.

[0055] Further, the water outlet 34 is arranged at a suitable position of the water cooling channel 30, usually at the bottom or side of the system. It is directly connected to the second water cooling channel 32232, so that the discharged hot water can smoothly enter the circulation path of the system and be reused or discharged.

[0056] Furthermore, each water-cooling branch channel 31 is connected to the second water-cooling combined channel 32232 in sequence according to the direction close to the water outlet 34. This flow path ensures that the discharged hot water can flow along the predetermined path without confusion or backflow. This helps to maintain the fluid dynamics of the water cooling system and ensure that water can be effectively discharged from the system.

[0057] Furthermore, the design of the water outlet 34 helps maintain the stability and efficiency of the water cooling system. By timely discharging the water that has absorbed heat, it is possible to prevent the water temperature inside the system from being too high, thereby reducing the heat dissipation efficiency and the stability of the device. Therefore, the design of the water outlet 34 is crucial to ensure that the system can continue to operate efficiently.

[0058] In a specific implementation example, the heat generating component 20 includes a circulator 21 and a power device 22. The circulator 21 is connected to the substrate 10 and is located on the surface of the substrate 10. The power device 22 is connected to the substrate 10 and is located on the surface of the substrate 10. Both the circulator 21 and the power device 22 generate heat.

[0059] Specifically, the circulator 21 is usually an annular structure, and its diameter and thickness can be designed and manufactured according to specific requirements. It is usually made of a metal material with high thermal conductivity, such as copper or aluminum, to ensure that heat can be quickly conducted to the surrounding environment.

[0060] Furthermore, the circulator 21 is directly connected to the substrate 10, usually by welding or bolts, to tightly fix it on the surface of the substrate 10 to ensure good thermal contact. The circulator 21 plays a role in heat conduction and heat dissipation around or covering the heating device. When the heating device generates heat, the circulator 21 effectively conducts the heat to the environment to ensure that the device operates within a safe temperature range.

[0061] Furthermore, the power device 22 is a type of electronic device for controlling current or voltage, and its specific types include transistors, field effect transistors, diodes, etc. The main functions of the power device 22 may include signal amplification, power supply regulation, etc. Similar to the circulator 21, the power device 22 is also directly connected to the substrate 10 and ensures a close fit with the surface of the substrate 10 for effective heat conduction.

[0062] Furthermore, when the power device 22 is in operation, a certain amount of power consumption will be generated when current passes through the device, converting electrical energy into heat energy. Therefore, the power device 22 will generate a certain amount of heat, which needs to be dissipated in time to maintain a stable operating temperature.

[0063] In a specific implementation example, when observed along the vertical direction 50 of the base 10 , the projection of each of the circulators 21 overlaps with the projection of one end of a water-cooling branch channel 31 , and the water flows through each of the water-cooling branch channels 31 with the same water flow temperature.

[0064] Specifically, ensuring that the projection of each circulator 21 overlaps with the projection of one end of the water cooling branch 31 helps ensure that each circulator 21 is cooled to the same extent. This helps eliminate temperature differences between circulators 21, ensures uniform heat distribution throughout the system, and improves system stability and reliability.

[0065] Furthermore, when the water flow temperature in each water-cooling branch channel 31 is the same, the cooling water can be evenly distributed between different circulators 21, avoiding local overheating or overcooling. This helps to improve cooling efficiency, reduce energy consumption, and improve the energy efficiency of the system.

[0066] Furthermore, when the water flow temperature in each water-cooling branch channel 31 is the same, system commissioning becomes simpler. The operator does not need to adjust the water flow or temperature of each branch channel because each branch channel provides the same cooling effect. This simplifies the system commissioning and maintenance process, saving time and cost.

[0067] Furthermore, ensuring that the temperature of each circulator 21 is the same when the water in each water-cooling branch 31 passes through each circulator 21 helps to protect the stability of the circulator 21. Temperature consistency can reduce thermal stress on the circulator 21 and reduce performance loss or failure risks caused by temperature differences.

[0068] In a specific implementation example, when observed along the vertical direction 50 of the base 10 , the projection of each of the power devices 22 overlaps with the projection of the other end of one of the water-cooling branches 31 .

[0069] Specifically, the water flows through each water cooling branch channel 31, and the water flows at the same temperature. Each power device 22 that the water flows through each water cooling branch channel 31 has the same temperature. By ensuring that the water flows at the same temperature in each water cooling branch channel 31, and that the water flows through each power device 22, the same temperature is maintained, it is possible to ensure that each power device 22 is cooled to the same degree. This helps to eliminate the temperature differences between the power devices 22, thereby ensuring the stability and reliability of the entire system.

[0070] Furthermore, the water flow temperature in each water cooling branch channel 31 is kept the same, ensuring uniform distribution of cooling water among different components and avoiding local overheating or overcooling. This helps to improve cooling efficiency, thereby reducing energy consumption and improving the energy efficiency of the system.

[0071] Furthermore, when the water flow temperature in each water-cooling branch channel 31 is the same, system debugging becomes simpler. The operator does not need to adjust the water flow or temperature of each branch channel because each branch channel provides the same cooling effect. This simplifies the debugging and maintenance process of the system, saving time and labor costs.

[0072] By maintaining a uniform temperature of the power device 22, damage to the device or degradation of performance due to overheating of a certain area can be avoided, which helps to extend the service life of the device, reduce the frequency of repair and replacement of components, and reduce maintenance costs.

[0073] In a specific implementation example, when observed in a horizontal direction 60 along a vertical direction 50 of the base 10 , the circulator 21 is located at one end of the water-cooling branch channel 31 close to the first water-cooling junction channel 32132 .

[0074] Specifically, the circulator 21 is placed at one end of the water-cooling branch channel 31 close to the first water-cooling junction 32132, so that the cooling water can first contact the circulator 21. Because the first water-cooling junction 32132 is the inlet of the water flow, the cooling water first passes through the circulator 21, effectively taking away the heat generated by the circulator 21. This design can maximize the efficiency of heat transfer, so that the circulator 21 can be cooled quickly, thereby protecting the circulator 21 from overheating.

[0075] Furthermore, the circulator 21 is placed at one end of the water cooling branch channel 31 so that the cooling water can form a uniform flow around the circulator 21. This ensures that the circulator 21 is evenly cooled, avoiding local overheating or insufficient cooling caused by uneven cooling. Keeping the temperature of the circulator 21 stable is crucial to its performance and life.

[0076] Furthermore, placing the circulator 21 at one end of the water-cooling branch channel 31 close to the first water-cooling junction 32132 can simplify the water flow path. This design allows the cooling water to flow more directly through the circulator 21, reducing the resistance and loss during the water flow process and improving the efficiency of the system. The simplified water flow path also reduces the energy consumption of the system, which is conducive to energy conservation and emission reduction.

[0077] Furthermore, placing the circulator 21 at one end of the water-cooling branch channel 31 helps save space required for the system layout. This design makes the layout of the water-cooling system more compact, reduces the length of the pipeline and connectors, and helps reduce the overall volume and cost of the system. In addition, the compact layout also helps improve the maintainability and reliability of the system.

[0078] In a specific implementation example, when observed in a horizontal direction 60 along a vertical direction 50 of the base 10 , the power device 22 is located at one end of the water-cooling branch channel 31 close to the second water-cooling junction channel 32232 .

[0079] Specifically, the power device 22 is placed at one end of the water-cooling branch channel 31 close to the second water-cooling channel 32232, ensuring that the cooling water finally contacts the power device 22 after passing through other components. Because the second water-cooling channel 32232 is usually the outlet of the cooling water, the cooling water finally passes through the power device 22, effectively taking away the heat generated by the power device 22. Such a design enables the power device 22 to be cooled to the maximum extent, which helps to protect its performance and extend its service life.

[0080] Furthermore, the power device 22 is placed at one end of the water cooling branch channel 31 to ensure that the cooling water can form a uniform flow around the power device 22. The uniform flow helps to ensure uniform temperature distribution of various parts of the power device 22, avoiding local overheating or insufficient cooling, thereby maintaining stable operation of the system.

[0081] Furthermore, placing the power device 22 at one end of the water cooling branch channel 31 close to the second water cooling channel 32232 helps to simplify the water flow path. The cooling water can flow directly through the power device 22, reducing the resistance and energy loss during the water flow process, and improving the cooling efficiency of the system. The simplified water flow path also helps to reduce the pressure loss of the system and reduce energy consumption.

[0082] Furthermore, placing the power device 22 at one end of the water cooling branch channel 31 helps save space required for system layout. Such a design makes the layout of the entire water cooling system more compact, reduces the length of pipes and connectors, and thus reduces the overall volume and cost of the system. In addition, the compact layout also helps improve the maintainability and reliability of the system.

[0083] In one implementation, water flows one by one away from the water injection port 33 toward the water cooling branch channel 31, and the temperature of the circulator 21 overlapping with the projection of each water cooling branch channel 31 in the vertical direction 50 is recorded as: C1, C2, ..., Cn;

[0084] The temperature difference between adjacent circulators 21 satisfies the relationship:

[0085] Cn-Cn-1<1°.

[0086] The water flows of each water-cooling branch channel 31 are collected one by one along the second water-cooling combined channel 32232 near the water outlet 34, and the temperature of the power device 22 overlapping with the projection of each water-cooling branch channel 31 in the vertical direction 50 is recorded as: B1, B2, ..., Bn;

[0087] The temperature difference between adjacent power devices 22 satisfies the relationship:

[0088] Bn-Bn-1<1°.

[0089] The temperature of the heating component 20 after the water flows through is recorded as A, which satisfies the relationship:

[0090] A<50°.

[0091] Specifically, taking four circulators 21 and four power devices 22 as an example, the temperatures of the four circulators 21 are: C1 = 20° C., C2 = 21° C., C3 = 20.5° C., and C4 = 20.2° C.;

[0092] The four power devices 22 are: B1 = 22°C, B2 = 22.5°C, B3 = 23°C, B4 = 22.8°C

[0093] In a specific implementation example, the substrate 10 is configured as a heat-conducting structure.

[0094] Specifically, the heat-conducting structure of the base 10 can effectively conduct heat, and quickly and evenly transfer the heat generated by the heating component 20 to the water cooling channel 30. This helps to ensure that the heat can be absorbed and taken away by the cooling water in a timely manner, thereby effectively reducing the temperature of the heating component 20 and protecting the stable operation of the equipment.

[0095] Furthermore, the heat conducting structure of the base 10 can effectively conduct heat from the heat generating component 20 to the water cooling channel 30, thereby improving the heat dissipation efficiency. By quickly transferring heat to the cooling medium, the heat can be discharged from the system more quickly, keeping the device running in a lower temperature range.

[0096] Furthermore, since the heat-conducting structure of the substrate 10 can provide efficient heat conduction, the temperature of the device can be effectively controlled and the device can be ensured to operate within a stable temperature range, which helps to reduce the impact of temperature changes on device performance and stability and improves the stability and reliability of the system.

[0097] Furthermore, the heat-conducting structure of the base 10 can quickly conduct heat to the water-cooling channel 30 to prevent heat accumulation inside the device. This helps to avoid local overheating of the device and reduces device damage or performance degradation caused by heat accumulation.

[0098] Thereby, the water cooling device 100 provided above absorbs heat and flows through the water in the water cooling channel 30, each of the water cooling branches 31 is connected with the water cooling channel 32 to form a corresponding series channel, and the series channels are combined to form a parallel channel. Each heating component 20 is located at the connection position between the water cooling branch channel 31 and the water cooling channel 32, ensuring that each heating component receives a similar cooling effect, thereby keeping their temperatures consistent.

[0099] The above is only an implementation method of the present application. It should be pointed out that a person skilled in the art can make improvements without departing from the inventive concept of the present application, but these improvements are within the scope of protection of the present application.

Claims

1. A water cooling device for dissipating heat in a radio frequency microwave amplifier device, characterized in that: include: matrix; A heat generating component is connected to the substrate, is located on the surface of the substrate, and generates heat; A water cooling channel is provided in the base body and absorbs heat, the water cooling channel comprises: a water cooling branch channel and a water cooling combined channel, the water cooling combined channel is connected with a plurality of the water cooling branch channels to form a parallel channel, and when observed in the vertical direction of the base body, the projection of each of the water cooling branch channels partially overlaps with the projection of the heat generating component; The heat generating component generates heat, the water cooling channel is filled with water, a temperature difference is generated between the heat generating component and the water cooling channel, the heat generating component transfers heat to the water cooling channel, the water absorbs the heat, and the water flows through the plurality of the water cooling branches in sequence and merges at the water cooling junction.

2. The water cooling device according to claim 1, characterized in that: The water cooling channel comprises: A first water-cooling combined channel is sequentially connected to one end of the plurality of water-cooling branch channels; The second water-cooling channel is connected to the other ends of the multiple water-cooling branches in sequence, and the two ends of the water-cooling branch channels are respectively connected to the first water-cooling channel and the second water-cooling channel to form a series channel. The corresponding series channels formed by the multiple water-cooling branches are combined to form a parallel channel, and the projection of the heat-generating component in the vertical direction overlaps with the projection of each water-cooling branch channel.

3. The water cooling device according to claim 2, characterized in that: The water cooling channel also includes a water injection port, which is opened on the base body, and water is injected into the water injection port. The water injection port is connected to the first water cooling channel, and each of the water cooling branches is connected to the first water cooling channel in sequence according to the direction away from the water injection port.

4. The water cooling device according to claim 2, characterized in that: The water cooling channel also includes a water outlet, which is opened on the base and connected to the second water cooling channel. The water outlet discharges water that absorbs heat, and each of the water cooling branches is connected to the second water cooling channel in sequence according to the direction close to the water outlet.

5. The water cooling device according to claim 3, characterized in that: The heating component comprises: A circulator, connected to the substrate and located on the surface of the substrate; The power device is connected to the substrate and is located on the surface of the substrate.

6. The water cooling device according to claim 5, characterized in that: Observing along the vertical direction of the base, the projection of each circulator overlaps with the projection of one end of a water-cooling branch, and the water flows through each water-cooling branch with the same temperature. The temperature of each circulator passed by the water flow of each water-cooling branch is the same.

7. The water cooling device according to claim 5, characterized in that: Observing along the vertical direction of the substrate, the projection of each power device overlaps with the projection of the other end of a water-cooling branch channel, and the water flows through each water-cooling branch channel with the same water flow temperature. Each power device through which the water flows in each water-cooling branch channel passes has the same temperature.

8. The water cooling device according to claim 5, characterized in that: Observing in the horizontal direction along the vertical direction of the base body, the circulator is located at one end of the water-cooling branch channel close to the first water-cooling junction channel.

9. The water cooling device according to claim 5, characterized in that: Observing in a horizontal direction along the vertical direction of the substrate, the power device is located at one end of the water-cooling branch channel close to the second water-cooling junction channel.

10. The water cooling device according to claim 1, characterized in that: The substrate is configured as a heat-conducting structure.

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