A cabinet heat dissipation device

Abstract

The utility model provides a cabinet heat dissipation device, which includes a plurality of servers, a cold water distributor, a water supply pipe group, a plurality of cold water loops and a manifold group. The servers are stacked, and a heat exchange module is arranged in each server. The water supply pipe group includes a water inlet pipe and a distribution pipe, the water inlet pipe is passed through the distribution pipe, one end of the water inlet pipe is connected to the cold water distributor, and a plurality of water supply ports are arranged on one side of the distribution pipe. The cold water loops are respectively connected to the plurality of water supply ports, and the cold water loops are respectively connected in series to the heat exchange modules. The manifold group is connected to the cold water distributor and is respectively connected to the cold water loops.

Description

Technical Field

[0001] The utility model relates to a cabinet heat dissipation device, in particular to a cabinet heat dissipation device of an open liquid cooling system with equalized pressure and split flow. Background Art

[0002] The open liquid cooling system used in today's server cabinets generally includes a cold plate, a coolant distribution unit (CDU), and a cooling water manifold. The coolant is first pumped by the CDU, and the coolant enters each server unit in the cabinet along the cold manifold. The coolant flows into the cold plate covering the processor, and the liquid after the coolant absorbs heat then flows out from the hot manifold. The heat-absorbing coolant can be cooled by cooling, or by heat exchange with external circulating water through a heat exchanger. Therefore, the open liquid cooling system can be operated with a chilled water host to discharge waste heat into the atmosphere.

[0003] However, there is a considerable pressure difference between the upstream and downstream of the cooling water manifold, so that the water supply pressure of each branch is uneven, resulting in additional flow resistance, which in turn causes insufficient water supply to the liquid cooling plate of some branches and reduces the heat exchange efficiency. Utility Model Content

[0004] The utility model provides a cabinet heat dissipation device of an open liquid cooling system with equalized pressure and split flow.

[0005] The utility model provides a cabinet heat dissipation device, which includes a plurality of servers, a cold water distributor, a water supply pipe group, a plurality of cold water loops and a manifold group. The servers are stacked, and a heat exchange module is arranged in each server. The water supply pipe group includes a water inlet pipe and a distribution pipe, the water inlet pipe is passed through the distribution pipe, one end of the water inlet pipe is connected to the cold water distributor, and a plurality of water supply ports are arranged on one side of the distribution pipe. The cold water loops are respectively connected to the plurality of water supply ports, and the cold water loops are respectively connected in series to the heat exchange modules. The manifold group is connected to the cold water distributor and is respectively connected to the cold water loops.

[0006] In one embodiment of the utility model, a cold water distributor is arranged below the servers and the distribution pipe is arranged upright, and the lower end of the water inlet pipe is connected to the cold water distributor.

[0007] In an embodiment of the utility model, one end of the water inlet pipe is separately configured from the corresponding end of the distribution pipe.

[0008] In one embodiment of the utility model, the upper end of the water inlet pipe is lower than the uppermost water supply port.

[0009] In one embodiment of the present invention, the heat exchange module includes a plurality of heat exchangers arranged in series.

[0010] In an embodiment of the present invention, each server includes a motherboard, and the heat exchange module is attached to the motherboard.

[0011] The utility model uses the water inlet pipe that is inserted into the distribution pipe to transport the fluid to the end of the distribution pipe, so the cold water circuit far from the cold water distributor can be allocated with a larger water pressure to compensate for the pressure drop at the end of the pipe, thereby avoiding uneven water pressure between the cold water circuits caused by the pressure drop in the pipe, thereby avoiding additional flow resistance in each cold water circuit. In addition, the water inlet pipe is inserted into the distribution pipe, which can effectively utilize the limited configuration space. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The preferred implementation scheme will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of a cabinet heat dissipation device.

[0013] Figure 1 It is a three-dimensional schematic diagram of the cabinet heat dissipation device of the utility model.

[0014] Figure 2 yes Figure 1 A partial enlarged view of .

[0015] Figure 3 The utility model is a schematic diagram of the cabinet cooling device of the utility model in use in a single server.

[0016] Figure 4 yes Figure 3 A partial enlarged view of .

[0017] Figure 5 It is a schematic diagram of the cabinet heat dissipation device of the utility model in use.

[0018] Description of Figure Numbers:

[0019] 100: server, 110: motherboard, 120: heat exchange module, 121: heat exchanger, 200: cold water distributor, 300: water supply pipe group, 310: water inlet pipe, 311: upper end, 312: lower end, 320: distribution pipe, 321: water supply port, 400: cold water loop, 500: manifold group. DETAILED DESCRIPTION

[0020] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0021] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections.

[0022] In order to simplify the drawings, only the parts related to the utility model are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically drawn or marked. In this article, "one" not only means "only one", but also means "more than one".

[0023] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0024] In the description of the present invention, it needs to be understood that the terms "front side", "rear side", "left side", "right side", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", "bottom", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0025] As used herein and not otherwise defined, the terms "substantially" and "approximately" are used to describe and describe small variations. When applied to an event or circumstance, the term may include the exact moment the event or circumstance occurred, as well as the event or circumstance occurring to a close approximation. For example, when applied to a numerical value, the term may include a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0026] The detailed description and technical contents of the present invention will be described below with reference to the accompanying drawings. However, the accompanying drawings are only for illustrative purposes and are not intended to limit the present invention.

[0027] See also Figures 1 to 5As shown, the utility model provides a cabinet cooling device, which includes a plurality of servers 100 (chassis server unit), a cooling water distributor 200 (Coolant Distribution Units, CDU), a water supply pipe set 300, a plurality of cooling water loops 400 and a manifold set 500.

[0028] In this embodiment, the servers 100 are stacked, and each server 100 includes a motherboard 110. A plurality of heat sources are generally disposed on the motherboard 110. The main common heat sources are the central processing unit (CPU) and the graphics processing unit (GPU). A heat exchange module 120 is disposed in each server 100, and the heat exchange module 120 is attached to the motherboard 110. Specifically, each heat exchange module 120 includes a plurality of heat exchangers 121 arranged in series, and the heat exchangers 121 are correspondingly attached to the heat sources.

[0029] Generally speaking, the cold water distributor 200, the water supply pipe set 300, the cold water loop 400 and the manifold set 500 are connected to form an internal circulation loop. And an external loop (not shown) is thermally connected through the cold water distributor 200. Specifically, the cold water distributor 200 is arranged below the servers 100, and the cold water distributor 200 is used to evenly distribute the coolant or water filled in the internal circulation loop to the entire system, and the cold water distributor 200 can also adjust and control the flow rate of the coolant to maintain the temperature and flow rate required by the system. The cold water distributor 200 can also generally include a pump (not shown) and another heat exchanger 121 (not shown) located between the internal circulation loop and the external loop.

[0030] The water supply pipe assembly 300 includes a water inlet pipe 310 and a distribution pipe 320. The water inlet pipe 310 is a pipe body with two ends open, while the distribution pipe 320 is a straight pipe with two ends closed. A plurality of water supply ports 321 are arranged on one side of the distribution pipe 320. In this embodiment, the distribution pipe 320 is arranged upright, and the water supply ports 321 are arranged vertically. The water inlet pipe 310 has an upper end 311 and a lower end 312. The water inlet pipe 310 is inserted into the distribution pipe 320. The lower end 312 of the water inlet pipe 310 passes through the distribution pipe 320 and is connected to the cold water distributor 200. Here, the point where the water inlet pipe 310 passes through the distribution pipe 320 is still closed. The upper end 311 of the water inlet pipe 310 is separated from the corresponding end of the distribution pipe 320, and the upper end 311 of the water inlet pipe 310 is lower than the uppermost water supply port 321.

[0031] The cold water loops 400 are connected in series to the heat exchange modules 120 , and each cold water loop 400 is connected to the corresponding water supply port 321 and the manifold. The manifold set 500 is further connected to the cold water distributor 200 .

[0032] When the cabinet heat dissipation device of the utility model is working, the cold water distributor 200 first pumps the working fluid in the inner circulation loop into the water inlet pipe 310, and the working fluid is transported from the lower end 312 of the water inlet pipe 310 to the upper end 311 of the water inlet pipe 310, and the working fluid flows out of the water inlet pipe 310 through the upper end 311 of the water inlet pipe 310 and enters the distribution pipe 320, and the working fluid flows downward along the distribution pipe 320 and enters each water supply port 321 in sequence. The upper end 311 of the water inlet pipe 310 is lower than the uppermost water supply port 321 to avoid unnecessary paths and avoid generating additional flow resistance. The distributed working fluid tributaries enter each cold water circuit 400 through each water supply port 321, and each tributary is respectively collected to the manifold group 500 after passing through the heat exchange module 120 connected in series to each cold water circuit 400, and then flows back to the cold water distributor 200 for cooling.

[0033] The cabinet cooling device of the present invention uses the water inlet pipe 310 passing through the distribution pipe 320 to transport the fluid to the end of the distribution pipe 320, so that the higher cold water loop 400 can be allocated with a larger water pressure before the pressure drop, and the fluid flows downward along the distribution pipe 320 to increase and compensate for the pressure drop after the distribution of each water supply port 321, so as to avoid the uneven water pressure between the cold water loops 400 caused by the pressure drop in the pipeline, thereby avoiding additional flow resistance in each cold water loop 400. In addition, the water inlet pipe 310 is passed through the distribution pipe 320 to effectively utilize the limited configuration space.

[0034] The above is only a preferred embodiment of the invention, and is not intended to limit the patent scope of the invention. Other equivalent changes that apply the patent spirit of the invention should all fall within the patent scope of the invention. In addition, the utility model can of course have other unlisted embodiments. Without departing from the spirit and essence of the utility model, technicians familiar with the field should be able to evolve various corresponding changes and deformations based on the utility model, but these corresponding changes and deformations should all fall within the scope of protection of the patent applied for the utility model.

Claims

1. A cabinet heat dissipation device, characterized in that it comprises: Multiple servers are stacked, each server having a heat exchange module disposed therein; a cold water dispenser; a water supply pipe assembly, comprising a water inlet pipe and a distribution pipe, wherein the water inlet pipe is disposed in the distribution pipe, one end of the water inlet pipe is connected to the cold water distributor, and one side of the distribution pipe is provided with a plurality of water supply ports; a plurality of cold water circuits, wherein the cold water circuits are respectively connected to the water supply ports, and the cold water circuits are respectively connected in series to the heat exchange modules; and A manifold group is connected to the cold water distributor and is respectively connected to each of the cold water loops.

2. The cabinet heat dissipation device according to claim 1, characterized in that: The cold water distributor is arranged below the servers and the distribution pipe is arranged upright, and the lower end of the water inlet pipe is connected to the cold water distributor.

3. The cabinet heat dissipation device according to claim 1, characterized in that: One end of the water inlet pipe is separately configured from the corresponding end of the distribution pipe.

4. The cabinet heat dissipation device according to claim 1, characterized in that: The upper end of the water inlet pipe is lower than the uppermost water supply port.

5. The cabinet heat dissipation device according to claim 1, characterized in that: The heat exchange module includes a plurality of heat exchangers arranged in series.

6. The cabinet heat dissipation device according to claim 1, characterized in that: Each of the servers includes a motherboard, and the heat exchange module is attached to the motherboard.

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