Heat dissipation device

Abstract

The utility model provides a heat dissipation device, comprising a heat conduction plate and at least one heat dissipation fin; the heat conduction plate comprises a plate body and a cover body covered on the plate body; one side of the plate body is concave to form a heat conduction cavity; the cover body is covered on the heat conduction cavity; the cover body is provided with at least one first slot, the heat dissipation fin is provided with at least one first ridge, and the first ridge cooperates with the first slot; the cover body is provided with at least one first inlet and at least one first outlet; the heat dissipation fin is provided with at least one one-way cooling channel; the heat dissipation fin is also provided with at least one second inlet and at least one second outlet; the one-way cooling channel is respectively connected with the second inlet and the second outlet; the heat conduction cavity and the one-way cooling channel are both filled with cooling liquid; the cooling liquid circulates in one direction in the heat conduction cavity and the one-way cooling channel. The heat dissipation device of the utility model ensures the normal reflux of the cooling liquid, thereby improving the heat dissipation efficiency of the heat dissipation device.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation device. Background Art

[0002] With the development of technology, the performance of electronic components in electronic products has been significantly improved. However, with the significant improvement in the performance of electronic components, the speed at which electronic components generate heat during operation is also getting faster and faster. Therefore, the requirements for the heat dissipation performance of electronic products are also getting higher and higher.

[0003] In the prior art, a method for dissipating heat for electronic products is to conduct the heat generated by electronic components through a heat conducting plate, and the heat conducting plate then conducts the heat to heat dissipation fins for dissipation.

[0004] In order to further improve the heat dissipation efficiency, coolant is injected into the heat conducting plate and the heat dissipation fins. The coolant is heated and becomes gaseous near the heat generating components. Since the heat conducting plate and the fins are heated differently, a pressure difference is generated inside the heat conducting plate and the fins, and the gaseous coolant flows from the heat conducting plate to the fins under the action of the pressure difference.

[0005] However, when in use, if the level of the condensing end of the heat sink is lower than that of the evaporating end, the influence of gravity will result in poor return capacity of the coolant, or even the inability of the coolant to flow back to the evaporating end, thereby affecting the heat dissipation efficiency of the heat sink. Utility Model Content

[0006] In view of the deficiencies in the prior art, the utility model provides a heat dissipation device to ensure normal reflux of the coolant, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0007] The purpose of this utility model is achieved through the following technical solutions:

[0008] A heat dissipation device comprises a heat conducting plate and at least one heat dissipation fin; the heat conducting plate comprises a plate body and a cover body disposed on the plate body;

[0009] One side of the plate body is concave to form a heat-conducting cavity; the cover body is disposed on the heat-conducting cavity;

[0010] The cover body is provided with at least one first slot, the heat dissipation fin is provided with at least one first ridge, and the first ridge cooperates with the first slot;

[0011] The cover body is provided with at least one first inlet and at least one first outlet; the first inlet and the first outlet are both connected to the heat conduction cavity;

[0012] The heat sink fin is provided with at least one one-way cooling channel; the heat sink fin is also provided with at least one second inlet and at least one second outlet; the one-way cooling channel is communicated with the second inlet and the second outlet respectively; the second inlet is communicated with the first outlet, and the second outlet is communicated with the first inlet;

[0013] The heat-conducting cavity and the one-way cooling channel are both filled with cooling liquid; the cooling liquid circulates in one direction in the heat-conducting cavity and the one-way cooling channel.

[0014] The heat dissipation device disclosed by the utility model ensures the normal reflux of the coolant through the unidirectional fluidity of the unidirectional cooling channel, thereby improving the heat dissipation efficiency of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0016] Figure 1 It is a schematic diagram of the overall structure of the heat dissipation device of the utility model;

[0017] Figure 2 for Figure 1 Schematic diagram of the disassembled state of the heat dissipation device shown (I);

[0018] Figure 3 for Figure 1 Schematic diagram of the disassembled state of the heat dissipation device shown (II);

[0019] Figure 4 for Figure 1 A schematic structural diagram of the cover body;

[0020] Figure 5 for Figure 1 A schematic diagram of the structure of the plate shown;

[0021] Figure 6 for Figure 1 A partial schematic diagram of the heat dissipation device shown (a);

[0022] Figure 7 for Figure 1 A partial schematic diagram of the heat dissipation device shown (II). DETAILED DESCRIPTION

[0023] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively with reference to the relevant drawings below. People familiar with this technology can easily understand other advantages and effects of the utility model from the content disclosed in this specification. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions that can be implemented in the utility model, so they have no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that can be produced by the utility model and the purpose that can be achieved, should still fall within the scope of the technical content disclosed in the utility model. At the same time, the terms such as "upper", "lower", "left", "right" and "middle" quoted in this specification are only for the convenience of narration, and are not used to limit the scope of the implementation of the utility model, and the change or adjustment of their relative relationship. Without substantially changing the technical content, it should also be regarded as the scope of the implementation of the utility model.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0025] like Figure 1 As shown, the utility model discloses a heat dissipation device 1, comprising a heat conducting plate 2 and at least one heat dissipation fin 3. Figure 2 and Figure 5 As shown, the heat conducting plate 2 includes a plate body 21 and a cover body 22 covering the plate body 21; one side of the plate body 21 is concave to form a heat conducting cavity 201; and the cover body 22 covers the heat conducting cavity 201. In this embodiment, the cover body 22 is a heat conducting cover plate.

[0026] like Figure 4 and Figure 6 As shown, the cover body 22 is provided with at least one first slot 100, and the heat sink fin 3 is provided with at least one first ridge 10. After the first ridge 10 passes through the first slot 100, there is a gap (the gap size is about 0.1 mm) between the first ridge 10 and the first slot 100; by brazing the matching part of the first ridge 10 and the first slot 100, the brazing welding of the heat sink fin 3 and the cover body 22 is achieved, and the brazing welding method enables the heat sink fin 3 and the heat conducting plate 2 to achieve a stable connection.

[0027] like Figure 4 and Figure 6As shown, the cover 22 is provided with at least one first inlet 200 and at least one first outlet 300; the first inlet 200 and the first outlet 300 are both connected to the heat conduction cavity 201. Figure 3 As shown, the heat sink 3 is provided with at least one unidirectional cooling channel 20. The heat sink 3 is also provided with at least one second inlet 30 and at least one second outlet 40. The unidirectional cooling channel 20 is communicated with the second inlet 30 and the second outlet 40 respectively; the second inlet 30 is communicated with the first outlet 300, and the second outlet 40 is communicated with the first inlet 200. The heat conduction cavity 201 and the unidirectional cooling channel 20 are both filled with coolant; the coolant circulates in the heat conduction cavity 201 and the unidirectional cooling channel 20 in one direction.

[0028] like Figure 4 and Figure 6 As shown, in this embodiment, the number of heat sink fins 3 is four; four heat sink fins 3 are arranged in sequence at equal intervals and fixed on the heat conducting plate 2. Each heat sink fin 3 is provided with five first ridges 10; and the five first ridges 10 are arranged at equal intervals. Correspondingly, twenty first slots 100 corresponding to the first ridges 10 are provided on the cover 22 of the heat conducting plate 2, and the twenty first slots 100 are arranged in a matrix. Each heat sink fin 3 and the cover 22 have five brazing welds, and the connection stability is high.

[0029] like Figure 3 and Figure 6 As shown, each heat sink fin 3 is provided with two second inlets 30 and two second outlets 40; the two second inlets 30 are arranged at one end of the heat sink fin 3, and the two second outlets 40 are arranged at the other end of the heat sink fin 3; that is, the second inlets 30 and the second outlets 40 are respectively connected to the two ends of the one-way cooling channel 20. Figure 4 As shown, correspondingly, the first inlet 200 and the first outlet 300 are respectively disposed at two ends of the cover 22 ; that is, the first inlet 200 and the first outlet 300 are respectively communicated with two ends of the heat conduction cavity 201 .

[0030] like Figure 4 , Figure 6 and Figure 7 As shown, in this embodiment, the cover 22 is further provided with two second slots 400; the first inlet 200 is opened in one of the second slots 400; the first outlet 300 is opened in the other second slot 400; the heat sink 3 is provided with two second ridges 50; the second inlet 30 is opened in one of the second ridges 50; the second outlet 40 is opened in the other second ridge 50. Such a design makes the heat sink 1 structure more concise, and the connection between the cover 22 and the heat sink 3 is more stable.

[0031] In this embodiment, the one-way cooling channel 20 is a Tesla valve structure. Since the Tesla valve structure is a prior art, its structure and the technical principle that enables the internal liquid to flow in one direction are not described in detail.

[0032] The heat dissipation fins 3 of the heat dissipation device 1 of the utility model adopt a Tesla valve structure, which utilizes the Tesla valve structure to make the liquid have the characteristic of unidirectional fluidity. After the coolant is heated and becomes a gas, the coolant is caused to circulate in one direction under the action of the pressure difference to ensure the normal reflux of the coolant of the heat dissipation device 1, thereby ensuring that the heat dissipation device 1 dissipates heat efficiently.

[0033] As a preferred embodiment, the number of the one-way cooling channels 20 is three; the three one-way cooling channels 20 are arranged in parallel to improve the cooling efficiency and circulation efficiency of the coolant, thereby improving the heat dissipation efficiency of the heat dissipation device 1.

[0034] like Figure 6 and Figure 7 As shown, in this embodiment, the heat dissipation device 1 also includes a liquid replenishing member 4, and the cover body 22 is also provided with a liquid replenishing port 500, and the liquid replenishing member 4 is connected to the heat-conducting cavity 201 through the liquid replenishing port 500. Specifically, the liquid replenishing member 4 includes a connecting joint 41, a connecting pipe 42, and a fixing member 43 connected in sequence; the connecting joint 41, the connecting pipe 42, and the fixing member 43 form a circulation channel (not shown); the circulation channel is connected to the heat-conducting cavity 201 through the liquid replenishing port 500. The fixing member 43 is provided with a protrusion 44, and the protrusion 44 cooperates with the liquid replenishing port 500; and the protrusion 44 is provided with a liquid replenishing outlet 45, and the liquid replenishing outlet 45 is respectively connected to the circulation channel and the heat-conducting cavity 201. The connecting joint 41 is externally connected to a liquid replenishing device, and the cooling flow of the liquid replenishing device enters the heat-conducting cavity 201 after passing through the circulation channel, and the cooling liquid enters the one-way cooling channel 20 through the heat-conducting cavity 201.

[0035] like Figure 5 As shown, in this embodiment, a plurality of conduction support columns 202 are arranged in the heat conduction cavity 201; one end of the conduction support column 202 is connected to the bottom of the heat conduction cavity 201, and the other end is in contact with the cover 22. Moreover, the conduction support columns 202 are evenly distributed in the heat conduction cavity 201. As a preferred embodiment, the conduction support column 202 is a circular cylinder. Of course, the conduction support column 202 can also be designed in other shapes. On the one hand, the conduction support column 202 provides support for the cover 22 to prevent the cover 22 from deforming under the pressure of the heat dissipation fins 3; on the other hand, the conduction support column 202 conducts the heat absorbed by the plate 21 to the cover 22, and the cover 22 conducts the heat to the heat dissipation fins 3 for heat dissipation. The heat dissipation device 1 of the utility model adopts both the refrigerant heat dissipation method and the conduction heat dissipation method, and the heat dissipation efficiency is greatly improved, and the heat dissipation effect is stable.

[0036] The working principle of the refrigerant heat dissipation method of the heat dissipation device 1 is as follows: the plate body 21 absorbs the heat generated by the heat-generating components; after absorbing the heat, the plate body 21 heats the coolant in the heat-conducting cavity 201, and the coolant changes from liquid to gas due to the heat; and, since the heat-conducting cavity 201 increases its air pressure due to the heat, at this time, the temperature of the one-way cooling channel 20 in the heat dissipation fin 3 is lower than that of the heat-conducting cavity 201, so the air pressure of the one-way cooling channel 20 is lower than that of the heat-conducting cavity 201; the gaseous coolant in the heat-conducting cavity 201 enters the one-way cooling channel 20 through the first outlet 300 and the second inlet 30 under the action of the air pressure difference; the coolant is cooled in the one-way cooling channel 20 and becomes liquid and flows back to the heat-conducting cavity 201 through the second outlet 40 and the first inlet 200, and the coolant flowing back to the heat-conducting cavity 201 is heated again and becomes gaseous and enters the one-way cooling channel 20 of the heat-conducting fin 3, thereby forming a one-way circulation flow.

[0037] The working principle of the conduction heat dissipation method of the heat dissipation device 1 is as follows: the plate body 21 absorbs the heat generated by the heat-generating components; after absorbing the heat, the plate body 21 conducts the heat to the cover body 22 through the conduction support column 202; after absorbing the heat, the cover body 22 conducts the heat to the heat dissipation fins 3, and the heat is directly dissipated through the heat dissipation fins 3.

[0038] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A heat dissipation device, characterized in that: It includes a heat conducting plate and at least one heat dissipation fin; the heat conducting plate includes a plate body and a cover body disposed on the plate body; One side of the plate body is concave to form a heat-conducting cavity; the cover body is disposed on the heat-conducting cavity; The cover body is provided with at least one first slot, the heat dissipation fin is provided with at least one first ridge, and the first ridge cooperates with the first slot; The cover body is provided with at least one first inlet and at least one first outlet; the first inlet and the first outlet are both connected to the heat conduction cavity; The heat sink fin is provided with at least one one-way cooling channel; the heat sink fin is also provided with at least one second inlet and at least one second outlet; the one-way cooling channel is communicated with the second inlet and the second outlet respectively; the second inlet is communicated with the first outlet, and the second outlet is communicated with the first inlet; The heat-conducting cavity and the one-way cooling channel are both filled with cooling liquid; the cooling liquid circulates in one direction in the heat-conducting cavity and the one-way cooling channel.

2. The heat dissipation device according to claim 1, characterized in that: The one-way cooling channel is a Tesla valve structure.

3. The heat dissipation device according to claim 1, characterized in that: A plurality of conductive support columns are arranged in the heat-conducting cavity; one end of the conductive support column is connected to the bottom of the heat-conducting cavity, and the other end is in contact with the cover.

4. The heat dissipation device according to claim 1, characterized in that: It also includes a liquid replenishing piece, and the cover body is also provided with a liquid replenishing port, and the liquid replenishing piece is connected with the heat-conducting cavity through the liquid replenishing port.

5. The heat dissipation device according to claim 1, characterized in that: The number of the one-way cooling channels is three; the three one-way cooling channels are arranged in parallel.

6. The heat dissipation device according to claim 1, characterized in that: The cover body is further provided with two second slots; the first inlet is opened in one of the second slots; the first outlet is opened in the other second slot; The heat dissipation fin is provided with two second ridges; the second inlet is opened at one of the second ridges; the second outlet is opened at the other second ridge.

7. The heat dissipation device according to claim 1, characterized in that: The number of the heat dissipation fins is four; the four heat dissipation fins are arranged in sequence with equal intervals and fixed on the heat conduction plate.

8. The heat dissipation device according to claim 1, characterized in that: The cover body is a heat-conducting cover plate.

9. The heat dissipation device according to claim 4, characterized in that: The liquid replenisher comprises a connecting joint, a connecting pipe, and a fixing piece which are connected in sequence; the connecting joint, the connecting pipe, and the fixing piece form a circulation channel; and the circulation channel is connected to the heat-conducting cavity through the liquid replenishing port.

10. The heat dissipation device according to claim 9, characterized in that: The fixing member is provided with a protrusion, and the protrusion cooperates with the liquid replenishment port; and the protrusion is provided with a liquid replenishment outlet, and the liquid replenishment outlet is communicated with the circulation channel and the heat conduction cavity respectively.

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