A mixed band UV curing equipment

Abstract

The utility model discloses a mixed-band UV curing device, which relates to the field of ultraviolet curing technology, including a chassis main body and a light box main body, wherein a human-machine interaction interface is arranged on the side of the chassis main body, and a first lamp holder connecting line interface is arranged on the side of the chassis main body away from the human-machine interaction interface, and a transfer line is arranged on the side of the first lamp holder connecting line interface away from the chassis main body, and a light box main body is arranged on the side of the transfer line away from the chassis main body, and a multi-chip mixed-wavelength lamp bead is arranged on the side of the light box main body away from the connecting line. When irradiating the applied glue, the chassis main body drives the light box main body to run, so that the multi-chip mixed-wavelength lamp bead in the light box main body irradiates the glue during operation, thereby satisfying the deep curing of the glue and improving the surface drying ability of the glue.

Description

Technical Field

[0001] The utility model relates to the technical field of ultraviolet curing, in particular to mixed-band UV curing equipment. Background Art

[0002] UV-LED is a new green and environmentally friendly high-tech industry, mainly used in UV glue, ink curing and other industries: UV-LED has the advantages of being green and environmentally friendly, long life, low power consumption, and ready to use: With the increasing maturity of LED technology and the development of inks and glues for UV-LED curing equipment, the application range is more extensive, but when drying the glue, due to the display of light, the glue often cannot dry quickly. Therefore, a mixed-band UV curing equipment is needed.

[0003] The application number retrieved is: CN202210584693.8, a UV curing device that can improve the bonding effect of UV glue on the workpiece.

[0004] However, the existing UV curing equipment still has certain defects in actual use: the oxygen concentration in the surface layer is very high, and the inhibition of oxygen will cause the lower layer of UV glue to be cured after irradiation with traditional 365nm or 395nm UV lamps, but the surface is still not cured and sticky. The sticky glue will absorb dust and affect the appearance. In addition, the uncured surface will affect the gloss and scratch resistance of the glue layer after curing, and even affect the long-term stability of the glue layer. For some optical applications or fields with strict VOC control requirements, this will also affect the light transmittance of the product or cause high VOC emissions. Sometimes the sticky surface will also cause secondary pollution and failures in the process. For example, the cured products will be stacked and the sticky glue surface will contact the material to cause surface contamination, or due to mutual adhesion, errors will occur during the subsequent automatic distribution of the product. For this reason, we propose a mixed-band UV curing equipment. Utility Model Content

[0005] In order to make up for the above deficiencies, the utility model provides a mixed-band UV curing device, which aims to improve the situation in which the oxygen concentration in the surface layer is very high. The inhibition of oxygen will cause the lower layer of UV glue to be cured after irradiation with a traditional 365nm or 395nm UV lamp, but the surface is still not cured and sticky. The sticky glue will absorb dust and affect the appearance. Moreover, the uncured surface will affect the glossiness and scratch resistance of the glue layer after curing, and even affect the long-term stability of the glue layer. For some optical applications or fields with strict VOC control requirements, this will also affect the light transmittance of the product or cause high VOC emissions. Sometimes the sticky surface will also cause secondary pollution and failures in the process. For example, the cured products will be stacked and the sticky glue surface will contact the material to cause surface contamination, or errors will occur during the subsequent automatic distribution of the product due to mutual adhesion.

[0006] The utility model realizes a mixed-band UV curing device through the following technical scheme, including a chassis main body and a light box main body, a human-machine interaction interface is arranged on the side of the chassis main body, and a first lamp holder connecting wire interface is arranged on the side of the chassis main body away from the human-machine interaction interface, and a transfer wire is arranged on the side of the first lamp holder connecting wire interface away from the chassis main body, and a light box main body is arranged on the side of the transfer wire away from the chassis main body, and a multi-chip mixed-wavelength lamp bead is arranged on the side of the light box main body away from the connecting wire.

[0007] Furthermore, the light box main body includes a blocking plate, a shell, a temperature sensor, a connecting piece and a heat dissipation groove, and the shell is provided on the side of the light box main body away from the two groups of the blocking plates, and two groups of temperature sensors are provided below the multi-chip mixed wavelength lamp beads, and connecting pieces are provided on the upper and lower sides of the two groups of temperature sensors, and a detachable structure is formed between the blocking plate and the light box main body through the connecting piece, and heat dissipation grooves are provided on both sides of the shell.

[0008] Furthermore, the light box main body also includes a light box heat sink, a light box cooling fan, a second lamp holder connecting wire interface and a heat dissipation groove, and a light box cooling fan is arranged on the side of the light box heat sink away from the multi-chip mixed wavelength lamp beads, and a second lamp holder connecting wire interface is installed above the light box cooling fan.

[0009] Furthermore, a switch is provided on a side of the chassis body away from the first lamp holder connecting wire interface, and a support base is installed below the chassis body by bolts.

[0010] Furthermore, a chassis cooling fan is provided on the side of the chassis body away from the human-computer interaction interface, and an operation indicator light is provided on the side of the chassis cooling fan away from the first lamp holder connecting line interface, and a power interface is provided on the side of the operation indicator light away from the chassis cooling fan.

[0011] Furthermore, a power supply battery is arranged at the center of the human-machine interaction interface and the first lamp holder connecting line interface, and a driving board is arranged on the left side of the power supply battery.

[0012] The utility model provides a mixed-band UV curing device, which has the following beneficial effects:

[0013] The light box body is started by the human-machine interface of the chassis body. At this time, the multi-chip mixed wavelength lamp beads of the light box body are started. At this time, the lamp beads are multi-chip 275nm and 365nm mixed wavelength lamp beads. A single lamp bead adopts a two-in-two-string design, which can make the glue in the range of the multi-chip mixed wavelength lamp beads dry quickly when irradiating the glue. Due to the structure of the multi-chip mixed wavelength lamp beads themselves, ozone will not be generated to protect the environment. At this time, the temperature of the multi-chip mixed wavelength lamp beads is transmitted to the inside of the light box heat sink, and the heat is dissipated by the light box cooling fan, thereby maintaining the continuous operation of the light box body. At this time, the light box body and the chassis body are in a separated state, so that the control structure will not be affected by high temperature. The specific contents are as follows:

[0014] A human-computer interaction interface is arranged on the side of the chassis body, and a first lamp holder connecting line interface is arranged on the side of the chassis body away from the human-computer interaction interface, and a transfer line is arranged on the side of the first lamp holder connecting line interface away from the chassis body, and a light box body is arranged on the side of the transfer line away from the chassis body, and a multi-chip mixed wavelength lamp bead is arranged on the side of the light box body away from the connecting line, the light box body comprises a blocking plate, a shell, a temperature sensor, a connector and a heat dissipation groove, and a shell is arranged on the side of the light box body away from the two groups of blocking plates, and two groups of temperature sensors are arranged below the multi-chip mixed wavelength lamp bead, and connectors are arranged on the upper and lower sides of the two groups of temperature sensors, and a detachable structure is formed between the blocking plate and the light box body through the connector, and heat dissipation grooves are arranged on both sides of the shell, the light box body also comprises a light box heat sink, a light box cooling fan, a second lamp holder connecting line interface and a heat dissipation groove, and a light box cooling fan is arranged on the side of the light box heat sink away from the multi-chip mixed wavelength lamp bead, and a second lamp holder connecting line is installed above the light box cooling fan. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall structure of a mixed-band UV curing device of the utility model;

[0016] Figure 2 This is a structural schematic diagram of a light box body of a mixed-band UV curing device of the utility model;

[0017] Figure 3This is a schematic diagram of the structure of a multi-chip mixed wavelength lamp bead of a mixed band UV curing device of the utility model;

[0018] Figure 4 This is a schematic structural diagram of a driving board of a mixed-band UV curing device of the utility model.

[0019] In the figure: 1. Chassis body; 2. Human-computer interaction interface; 3. Support base; 4. Switch; 5. Power interface; 6. Chassis cooling fan; 7. First lamp holder connection line interface; 8. Operation indicator light; 9. Battery; 10. Driver board; 11. Adapter cable; 12. Light box body; 1201, blocking plate; 13. Multi-chip mixed wavelength lamp beads; 14. Housing; 15. Temperature sensor; 16. Connector; 17. Light box heat sink; 18. Light box cooling fan; 19. Second lamp holder connection line interface; 20. Heat sink. DETAILED DESCRIPTION

[0020] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0021] like Figure 1 - Figure 4 As shown, a mixed-band UV curing device includes a chassis main body 1 and a light box main body 12, a human-machine interaction interface 2 is arranged on the side of the chassis main body 1, and a first lamp holder connecting line interface 7 is arranged on the side of the chassis main body 1 away from the human-machine interaction interface 2, and a transfer line 11 is arranged on the side of the first lamp holder connecting line interface 7 away from the chassis main body 1, and a light box main body 12 is arranged on the side of the transfer line 11 away from the chassis main body 1, and a multi-chip mixed-wavelength lamp bead 13 is arranged on the side of the light box main body 12 away from the connecting line, wherein when the light box main body 12 is used for operation, the chassis main body 1 is operated, and the transfer line 11 supplies energy to the light box main body 12, at which time the multi-chip mixed-wavelength lamp bead 13 is started, and the multi-chip mixed-wavelength lamp bead 13 irradiates the outer surface of the glue, and because the lamp bead is a multi-chip 275nm and 365nm mixed wavelength lamp bead, a single lamp bead adopts a series-parallel combination design.

[0022] The light box body 12 includes a blocking plate 1201, a shell 14, a temperature sensor 15, a connector 16 and a heat dissipation groove 20, and the shell 14 is arranged on the side of the light box body 12 away from the two groups of blocking plates 1201, and two groups of temperature sensors 15 are arranged below the multi-chip mixed wavelength lamp beads 13, and the upper and lower sides of the two groups of temperature sensors 15 are arranged with connectors 16, and a detachable structure is formed between the blocking plate 1201 and the light box body 12 through the connectors 16, and heat dissipation grooves 20 are arranged on both sides of the shell 14, and the light box body 12 limits the light emission area on the upper and lower sides of the multi-chip mixed wavelength lamp beads 13 through the blocking plate 1201. At this time, the shell 14 of the light box is made of aluminum alloy or stainless steel, which has good heat dissipation performance and corrosion resistance, and the heat dissipation grooves 20 on both sides of the shell 14 are used to form a flow structure inside the shell 14, so as to facilitate the light box body 1 2 internal heat source for heat exchange, and at this time the temperature sensor 15 model: Pt100, to detect the temperature of the multi-chip mixed wavelength lamp bead 13, at this time, because the multi-chip mixed wavelength lamp bead 13 is a series-parallel combination design through the lamp bead, the driver board monitors the terminal voltage and current of the series circuit, records real-time data and uploads it to the PLC, when the LED open circuit situation loop current is zero, the PLC gives an open circuit alarm; when the LED short circuit occurs, the terminal voltage drops, the PLC monitors it and gives a short circuit alarm operation indicator 8 output device prompt sound, and the human-machine interface gives the corresponding alarm information, 275nm and 365nm match different driver boards, can realize the two bands independent switch and control, and the blocking plate 1201 is clamped on the upper and lower sides of the multi-chip mixed wavelength lamp bead 13 through the connector 16, and at this time, the blocking plate 1201 is conveniently installed and disassembled at any time through the connector 16.

[0023] The light box body 12 also includes a light box heat sink 17, a light box cooling fan 18, a second lamp holder connecting wire interface 19 and a heat dissipation groove 20, and a light box cooling fan 18 is arranged on the side of the light box heat sink 17 away from the multi-chip mixed wavelength lamp bead 13, and a second lamp holder connecting wire interface 19 is installed above the light box cooling fan 18. At this time, the light box heat sink 17 is in contact with the light box cooling fan 18. At this time, when the temperature of the multi-chip mixed wavelength lamp bead 13 is overheated, the multi-chip mixed wavelength lamp bead 13 transfers the temperature to the light box heat sink 17. At this time, during the operation of the light box cooling fan 18, the heat is driven by the wind flow, so that the heat is carried away by the wind, and the hot air flows out through the heat dissipation groove 20 of the outer shell 14, thereby completing the heat dissipation of the temperature through the light box heat sink 17 when the multi-chip mixed wavelength lamp bead 13 is overheated, so as to maintain the operation time of the multi-chip mixed wavelength lamp bead 13.

[0024] A switch 4 is provided on the side of the chassis body 1 away from the first lamp holder connecting wire interface 7, and a support base 3 is installed under the chassis body 1 by bolts. The switch 4 is used to turn the chassis body 1 on and off for startup and shutdown, and the support base 3 is lifted by lifting the chassis body 1, so that a cavity is formed between the bottom of the chassis body 1 and the ground, thereby facilitating air circulation.

[0025] A chassis cooling fan 6 is arranged on the side of the chassis main body 1 away from the human-computer interaction interface 2, and an operation indicator light 8 is arranged on the side of the chassis cooling fan 6 away from the first lamp holder connecting line interface 7, and a power interface 5 is arranged on the side of the operation indicator light 8 away from the chassis cooling fan 6. When the chassis main body 1 is running, when the temperature is generated inside the chassis main body 1, the chassis cooling fan 6 runs, and the chassis cooling fan 6 dissipates the temperature emitted by the power supply battery 9 and the driving board 10, and the power interface 5 is used to supply energy to the power supply battery 9 of the chassis main body 1.

[0026] A power supply battery 9 is arranged at the center of the human-computer interaction interface 2 and the first lamp holder connecting line interface 7, and a driving board 10 is arranged on the left side of the power supply battery 9. At this time, the power supply battery 9 is used to operate the chassis main body 1 and the light box main body 12, and the driving board 10 is used to control the operation process between the chassis main body 1 and the light box main body 12.

[0027] In summary, the utility model uses a chassis body 1 and a light box body 12. At this time, by pressing the switch 4, the chassis body 1 is started. At this time, the battery 9 drives the driving board 10 and the human-computer interaction interface 2. At this time, the chassis body 1 and the light box body 12 are controlled by the human-computer interaction interface 2. At this time, the chassis body 1 is connected to the light box body 12 through the adapter cable 11. At this time, the light box body 12 is running, and the multi-chip mixed wavelength lamp beads 13 of the light box body 12 are started. At this time, glue is placed in the illumination area of ​​the multi-chip mixed wavelength lamp beads 13. At this time, the glue is quickly cured inside the illumination area of ​​the multi-chip mixed wavelength lamp beads 13. At this time, the heat source generated by the multi-chip mixed wavelength lamp beads 13 is transmitted to the light box heat sink 17. At this time, the light box cooling fan 18 is running, so that the light box cooling fan 18 contacts The heat sink 17 of the lamp box is in contact with the wind source, so that the temperature transmitted to the heat sink 17 of the lamp box by the multi-chip mixed wavelength lamp bead 13 is carried away by the wind, and the hot air flows out through the heat dissipation groove 20, thereby forming a circulation, so as to facilitate cooling the multi-chip mixed wavelength lamp bead 13. At this time, the lamp bead is a multi-chip 275nm and 365nm mixed wavelength lamp bead, and a single lamp bead adopts a two-in-two-string design. At this time, the multi-chip mixed wavelength lamp bead 13 and the control substrate are thermally separated to ensure that the temperature between the multi-chip mixed wavelength lamp bead 13 and the driving board 10 is controllable. The light box is equipped with temperature monitoring, and at this time, the temperature sensor 15 is used to obtain the data of the temperature of the multi-chip mixed wavelength lamp bead 13 in real time, so as to facilitate real-time monitoring of the temperature of the multi-chip mixed wavelength lamp bead 13.

Claims

1. A mixed-band UV curing device, comprising a chassis body (1) and a light box body (12), characterized in that: A human-machine interaction interface (2) is arranged on the side of the chassis body (1), and a first lamp holder connecting line interface (7) is arranged on the side of the chassis body (1) away from the human-machine interaction interface (2), and a transfer line (11) is arranged on the side of the first lamp holder connecting line interface (7) away from the chassis body (1), and a light box body (12) is arranged on the side of the transfer line (11) away from the chassis body (1), and a multi-chip mixed wavelength lamp bead (13) is arranged on the side of the light box body (12) away from the connecting line.

2. A mixed band UV curing device according to claim 1, characterized in that: The light box body (12) comprises a blocking plate (1201), a shell (14), a temperature sensor (15), a connecting piece (16) and a heat dissipation groove (20), and the shell (14) is arranged on a side of the light box body (12) away from the two groups of blocking plates (1201), and two groups of temperature sensors (15) are arranged below the multi-chip mixed wavelength lamp beads (13), and connecting pieces (16) are arranged on both upper and lower sides of the two groups of temperature sensors (15), and a detachable structure is formed between the blocking plate (1201) and the light box body (12) through the connecting piece (16), and heat dissipation grooves (20) are arranged on both sides of the shell (14).

3. The mixed-band UV curing device according to claim 1, characterized in that: The light box body (12) further comprises a light box heat sink (17), a light box cooling fan (18), a second lamp holder connecting line interface (19) and a heat dissipation groove (20), and a light box cooling fan (18) is arranged on a side of the light box heat sink (17) away from the multi-chip mixed wavelength lamp beads (13), and a second lamp holder connecting line interface (19) is installed above the light box cooling fan (18).

4. The mixed-band UV curing device according to claim 1, characterized in that: A switch (4) is provided on a side of the chassis body (1) away from the first lamp holder connection line interface (7), and a support base (3) is installed below the chassis body (1) via bolts.

5. The mixed-band UV curing device according to claim 1, characterized in that: A chassis cooling fan (6) is arranged on a side of the chassis body (1) away from the human-machine interaction interface (2), and an operation indicator light (8) is arranged on a side of the chassis cooling fan (6) away from the first lamp holder connection line interface (7), and a power supply interface (5) is arranged on a side of the operation indicator light (8) away from the chassis cooling fan (6).

6. The mixed-band UV curing device according to claim 1, characterized in that: A power supply battery (9) is arranged at the center of the human-machine interaction interface (2) and the first lamp head connecting line interface (7), and a driving board (10) is arranged on the left side of the power supply battery (9).

Images