A stamping die for electronic components

Abstract

The utility model belongs to the technical field of electronic component production and processing equipment, and specifically relates to a stamping die for electronic components, comprising an upper die body and a lower die body, the upper die body comprising an upper die seat, an upper pad, an upper clamping plate, a stripping back plate and an upper stripping plate; the lower die body comprising a lower die seat, a lower pad and a lower template; a flap assembly is arranged between the lower pad and the upper pad, and comprises a first flip part, a second flip part, a fixing plate and a flip punch; the stamping die can concentrate the continuous cutting, punching, shaping, bending and other processes in the production process of electronic components in one die, is convenient for assembly line production, is conducive to fixing and installing the die, is easy and simple to operate, greatly reduces the labor intensity, and effectively reduces the subsequent production and maintenance costs of the die; at the same time, the flap assembly can eliminate the abrasions caused by other die structures, avoids the situation of unstable processing dimensions, and effectively improves the stamping quality of electronic components.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic component production and processing devices, and specifically relates to a stamping die for electronic components. Background Art

[0002] Electronic components are at the upstream of the electronic information industry chain. They are the basic parts for the development of terminal products in communication, computer, various network, digital audio and video system industries, and play a vital role in the development of the electronic information industry. Electronic components include inductors, resistors, electronic connectors and other products. Today, society has entered the knowledge economy era, and competition among enterprises has become more globalized and knowledge-based.

[0003] As a cold stamping processing method, stamping dies are process equipment that processes metal materials or non-metallic materials into finished or semi-finished products. The products processed by them are formed quickly, without the risk of burns, and the mold is prevented from being blocked by residual materials inside. Metal plates can be quickly squeezed into the desired shape only by up and down stamping, with a high degree of precision.

[0004] The stamping principle of stamping dies is a pressure processing method that uses a stamping die installed on a press to apply pressure to the material at room temperature to cause it to separate or plastically deform, thereby obtaining the required parts.

[0005] With the development of modern industry, stamping technology has developed rapidly, and customers have higher and higher requirements for the surface quality of products; however, in the actual production process, due to the existence of other molds and the friction between the side of the workpiece and the R angle of the bending die, electronic components are often scratched and dimensional instability occurs during the production process. Utility Model Content

[0006] In view of the above-mentioned deficiencies in the prior art, the utility model provides a stamping die for electronic components, which solves the problem that the existing electronic components are unstable in size and are easily scratched by other dies, resulting in wear of the electronic components, thereby affecting the quality of the workpiece.

[0007] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is as follows: providing a stamping die for electronic components, comprising an upper die body and a lower die body, an outer guide column assembly and an inner guide column assembly are arranged between the upper die body and the lower die body; the upper die body comprises an upper die seat, an upper pad, an upper clamping plate, a stripping back plate and an upper stripping plate arranged in sequence from top to bottom; the lower die body comprises a lower die seat, a lower pad and a lower template arranged in sequence from bottom to top;

[0008] The upper pad is provided with a cutting punch, a punching punch, a bending punch and a shaping punch, and the cutting punch, the punching punch, the bending punch and the shaping punch all extend out of the upper stripping plate;

[0009] The lower pad is provided with a cutting die, a punching die, a bending die and a shaping die corresponding to the cutting convex die, the punching convex die, the bending convex die and the shaping convex die;

[0010] A flap assembly is arranged between the lower pad and the upper pad, and the flap assembly is arranged between the bending die and the shaping die, and includes a first flip part, a second flip part, a fixed plate and a flip punch, and the flip punch is arranged on the upper clamping plate; the fixed plate is arranged on the upper stripping plate; the first flip part is arranged on one side of the shaping die, and is connected to the second flip part through a rotating shaft, and the second flip part is fixed to the fixed plate through a tension spring.

[0011] The beneficial effects of adopting the above technical scheme are as follows: the mold for stamping electronic components can concentrate the continuous cutting, punching, shaping, bending and other processes in the production process of electronic components in one mold through the cutting punch, punching punch, bending punch, shaping punch and cutting die, punching die, bending die and shaping die, which is convenient for assembly line production and conducive to fixing and installing the mold. The operation is convenient and simple, which greatly reduces the labor intensity; at the same time, the upper mold body and the lower mold body can be accurately aligned through the outer guide column assembly and the inner guide column assembly, effectively ensuring the processing accuracy; in addition, the flap assembly arranged between the lower pad and the upper pad can eliminate the scratches caused by other mold structures under the cooperation of the tension spring and the rotating shaft, avoids the instability of the processing size, and effectively improves the stamping quality of electronic components.

[0012] Furthermore, hooks are provided on one side of the upper mold body and the lower mold body, and the hooks are fixed on the upper pad, the upper clamping plate, the backing plate, the upper stripping plate and the lower mold plate.

[0013] Furthermore, a first snap-in is provided on one side of the upper pad, and a second snap-in is provided on one side of the lower template, and both the first snap-in and the second snap-in are fixed to two ends of the hook.

[0014] The beneficial effects of adopting the above technical solution are: the hook can fix the upper pad, upper clamp, backing plate, upper stripping plate and lower template together, and the hook is detachable, which can improve the connection reliability and stability between the mold structures, realize the disassembly and replacement efficiency of the mold, and ensure the stamping production efficiency and accuracy.

[0015] Furthermore, a side push assembly is arranged on the side of the lower mold plate, and the side push assembly includes a side pressure die, a side pressure punch and a fixed plate, and a knife inserting die corresponding to the inserting knife is arranged on the fixed plate, and the side pressure die is arranged on one side of the shaping die.

[0016] The beneficial effects of adopting the above technical solution are: the synchronization of workpiece processing can be ensured by the side push assembly, and the side push bending of the workpiece can be achieved by the coordinated use of the insert cutter and the side push assembly, while also improving the processing efficiency and accuracy.

[0017] Furthermore, a nitrogen spring is arranged on the upper die seat, and the nitrogen spring comprises a cylinder body and a piston rod arranged on the cylinder body.

[0018] The beneficial effects of adopting the above technical solution are as follows: during the process of stamping electronic components, the nitrogen spring can keep the processed workpiece in a stressed state at all times, which can reduce the difference in surface flatness of the workpiece during the discharge and stripping process, thereby improving the workpiece processing quality; in addition, the nitrogen spring can provide a restoring elastic force when opening the mold, has better force stability, can prevent the mold from shaking left and right during the stamping process, and ensure processing stability.

[0019] Furthermore, a floating material assembly is arranged above the lower die seat, and the floating material assembly includes a floating material spring and a floating material pin arranged above the floating material spring. A guide needle is arranged correspondingly above the floating material pin, and the guide needle is arranged on the upper stripping plate.

[0020] The beneficial effects of adopting the above technical solution are: the guide needle has a positioning and guiding function through cooperation with the floating material component, which can ensure the accurate positioning of the mold during assembly and use, and ensure the processing accuracy and processing stability of the mold.

[0021] Furthermore, the outer guide pin assembly includes a first guide sleeve arranged on the upper die seat and an outer guide pin arranged corresponding to the first guide sleeve, the outer guide pin is arranged on the lower die seat, and the lower die seat and the upper die seat are movably connected through the outer guide pin and the first guide sleeve.

[0022] The beneficial effects of adopting the above technical solution are: the position between the upper die base and the lower die base can be limited by the outer guide column assembly, and the stamping die can be guided to move along a fixed direction during processing, thereby ensuring the processing accuracy and quality of the die.

[0023] Furthermore, the inner guide column assembly includes an inner guide column and a guide groove. The guide groove is arranged above the lower template and passes through the upper stripping plate. The inner guide column is arranged on the upper pad, and a second guide sleeve is arranged on the outside thereof.

[0024] The beneficial effects of adopting the above technical solution are: the inner guide pin assembly can ensure the accurate relative position of the upper die body and the lower die body during the stamping process, thereby ensuring the processing accuracy of the workpiece. At the same time, through the coordinated use of the guide groove and the inner guide pin, the mold can be prevented from shifting during the processing process, ensuring the stable operation of the stamping mold.

[0025] In summary, the punching die for electronic components provided by the utility model has the following beneficial effects:

[0026] (1) The stamping die in the utility model can integrate the continuous cutting, punching, shaping, bending and other processes in the production process of electronic components into one die, which is convenient for assembly line production and is conducive to fixing and installing the die. The operation is convenient and simple, which greatly reduces the labor intensity and effectively reduces the subsequent production and maintenance costs of the die.

[0027] (2) The stamping die in the utility model is provided with a flap assembly, which can eliminate the scratches caused by other die structures during the processing, avoid the instability of the workpiece processing size, and effectively improve the stamping quality of electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a top view of the lower mold body of the utility model;

[0029] Figure 2 It is a structural schematic diagram of a stamping die containing an outer guide column assembly in the utility model;

[0030] Figure 3 It is a structural schematic diagram of a stamping die containing an inner guide pillar assembly in the utility model;

[0031] Figure 4 It is a structural schematic diagram of a stamping die containing a flap assembly in the utility model;

[0032] Figure 5 This is a schematic diagram of the structure of the flap assembly in the utility model;

[0033] Figure 6 It is a structural schematic diagram of the side thrust assembly in the utility model;

[0034] Figure 7 It is a structural schematic diagram of the floating material assembly in the utility model.

[0035] Among them, 1. upper die body; 11. upper die seat; 12. upper pad; 13. upper clamp; 14. backing plate; 15. upper stripping plate; 16. cutting punch; 17. punching punch; 18. shaping punch; 2. lower die body; 21. lower die seat; 22. lower pad; 23. lower template; 24. cutting die; 25. punching die; 26. bending die; 27. shaping die; 28. hook; 29. ​​first bayonet; 210. second bayonet; 211. guide plate; 212. guide plate pad; 3. outer guide column assembly; 31. first guide sleeve ; 32. Outer guide pin; 4. Inner guide pin assembly; 41. Guide groove; 42. Inner guide pin; 43. Second guide sleeve; 5. Flap assembly; 51. First flip part; 52. Second flip part; 53. Fixed plate; 54. Flip punch; 55. Rotating shaft; 56. Tension spring; 6. Side thrust assembly; 61. Side pressure die; 62. Side pressure punch; 63. Fixed plate; 64. Insert knife; 65. Insert knife die; 7. Nitrogen spring; 71. Cylinder body; 72. Piston rod; 8. Float assembly; 81. Float spring; 82. Float pin; 83. Guide needle. DETAILED DESCRIPTION

[0036] The specific implementation methods of the utility model are described below to facilitate technical personnel in this technical field to understand the utility model, but it should be clear that the utility model is not limited to the scope of the specific implementation methods. For ordinary technical personnel in this technical field, as long as various changes are within the spirit and scope of the utility model defined and determined by the attached claims, these changes are obvious, and all utility model creations using the concept of the utility model are protected.

[0037] like Figure 1 to Figure 7 As shown, the stamping die for electronic components provided by the utility model comprises an upper die body 1 and a lower die body 2, an outer guide column assembly 3 and an inner guide column assembly 4 are arranged between the upper die body 1 and the lower die body 2; the upper die body 1 comprises an upper die seat 11, an upper pad 12, an upper clamping plate 13, a backing plate 14 and an upper stripping plate 15 arranged in sequence from top to bottom; the lower die body 2 comprises a lower die seat 21, a lower pad 22 and a lower template 23 arranged in sequence from bottom to top; a cutting punch 16, a punching punch 17, a bending punch and The shaping punch 18, the cutting punch 16, the punching punch 17, the bending punch and the shaping punch 18 all extend out of the upper stripping plate 15; the lower pad 22 is provided with a cutting die 24, a punching die 25, a bending die 26 and a shaping die 27 corresponding to the cutting punch 16, the punching punch 17, the bending punch and the shaping punch 18; the lower die seat 21 is provided with a material guide plate 211 and a material guide plate pad 212 arranged below the material guide plate 211, and the material guide plate pad 212 is arranged above the lower die seat 21 and on one side of the lower template 23 and the lower pad 22.

[0038] When in use, through the coordinated use of the guide plate 211 and the guide plate pad 212, the material can be guided before entering the mold, so that the workpiece and the mold are parallel, ensuring the accuracy and precision of the processing, and the stamping mold can realize continuous cutting, punching, shaping, bending and other processes in the production process of electronic components through the cutting punch 16, the punching punch 17, the bending punch, the shaping punch 18 and the cutting die 24, the punching die 25, the bending die 26 and the shaping die 27, and all processing processes are concentrated in one mold, which is convenient for assembly line production, conducive to fixing and installing the mold, easy and simple to operate, and greatly reduces the labor intensity of manual labor; at the same time, the upper mold body 1 and the lower mold body 2 can be accurately aligned through the outer guide column assembly 3 and the inner guide column assembly 4, effectively ensuring the processing accuracy.

[0039] like Figure 4 and Figure 5 As shown, a flap assembly 5 is arranged between the lower pad 22 and the upper pad 12, and the flap assembly 5 is arranged between the bending die 26 and the shaping die 27, and includes a first flip part 51, a second flip part 52, a fixed plate 53 and a flip punch 54, and the flip punch 54 is arranged on the upper clamping plate 13; the fixed plate 53 is arranged on the upper stripping plate 15; the first flip part 51 is arranged on one side of the shaping die 27, and is connected to the second flip part 52 through a rotating shaft 55, and the second flip part 52 is fixed to the fixed plate 53 through a tension spring 56; the flap assembly 5 arranged between the lower pad 22 and the upper pad 12 can eliminate the scratches caused by other mold structures under the cooperation of the tension spring 56 and the rotating shaft 55, avoids the instability of the processing size, and effectively improves the stamping quality of electronic components.

[0040] like Figure 2 As shown, the outer guide column assembly 3 includes a first guide sleeve 31 arranged on the upper die base 11 and an outer guide column 32 arranged corresponding to the first guide sleeve 31, the outer guide column 32 is arranged on the lower die base 21, and the lower die base 21 and the upper die base 11 are movably connected through the outer guide column 32 and the first guide sleeve 31; the position between the upper die base 11 and the lower die base 21 can be limited by the outer guide column assembly 3, and the stamping die can be guided to move along a fixed direction during processing, thereby ensuring the processing accuracy and processing quality of the die.

[0041] like Figure 3 As shown, the inner guide column assembly 4 includes an inner guide column 42 and a guide groove 41. The guide groove 41 is arranged above the lower mold plate 23 and passes through the upper stripping plate 15. The inner guide column 42 is arranged on the upper pad 12, and a second guide sleeve 43 is arranged on the outside thereof. The inner guide column assembly 4 can ensure the accurate relative position of the upper mold body 1 and the lower mold body 2 during the stamping process, thereby ensuring the processing accuracy of the workpiece. At the same time, through the coordinated use of the guide groove 41 and the inner guide column 42, the mold can be prevented from being offset during the processing process, thereby ensuring the stable operation of the stamping mold.

[0042] like Figure 3 As shown, a hook 28 is provided on one side of the upper mold body 1 and the lower mold body 2, and the hook 28 is fixed on the upper pad 12, the upper clamping plate 13, the backing plate 14, the upper stripping plate 15 and the lower template 23; a first snap-in 29 is provided on one side of the upper pad 12, and a second snap-in 210 is provided on one side of the lower template 23, and the first snap-in 29 and the second snap-in 210 are both fixed to the two ends of the hook 28; the hook 28 can fix the upper pad 12, the upper clamping plate 13, the backing plate 14, the upper stripping plate 15 and the lower template 23 together, and the hook is detachable, which can improve the connection reliability and stability between the mold structures, can realize the efficiency of disassembly and replacement of the mold, and ensure the stamping production efficiency and accuracy.

[0043] like Figure 6 As shown, a side push assembly 6 is provided on the side of the lower template 23, and the side push assembly 6 includes a side pressure die 61, a side pressure punch 62 and a fixed plate 53, and a plunger die 65 corresponding to the plunger 64 is provided on the fixed plate 53, and the side pressure die 61 is arranged on one side of the shaping die 27; the side push assembly 6 can ensure the synchronization during workpiece processing, and the side push bending of the workpiece can be realized by the coordinated use of the plunger 64 and the side push assembly 6, while the processing efficiency and accuracy can be improved.

[0044] like Figure 7 As shown, a nitrogen spring 7 is arranged on the die base, and the nitrogen spring 7 includes a cylinder body 71 and a piston rod 72 arranged on the cylinder body 71; in the process of stamping electronic components, the nitrogen spring 7 can keep the processed workpiece in a stressed state at all times, which can reduce the difference in surface flatness of the workpiece during the process of discharging and stripping, thereby improving the workpiece processing quality; in addition, the nitrogen spring 7 can provide a restoring elastic force when the mold is opened, has better force stability, can prevent the mold from shaking left and right during the stamping process, and ensures processing stability.

[0045] like Figure 7 As shown, a floating material assembly 8 is arranged above the lower mold base 21, and the floating material assembly 8 includes a floating material spring 81 and a floating material pin 82 arranged above the floating material spring 81, and a guide needle 83 is correspondingly arranged above the floating material pin 82, and the guide needle 83 is arranged on the upper stripping plate 15; the guide needle 83 cooperates with the floating material assembly 8 to have a positioning and guiding function, which can ensure the accurate positioning of the mold during assembly and use, and ensure the processing accuracy and processing stability of the mold.

[0046] The working process of the utility model is as follows: when the upper die body 1 and the lower die body 2 are in an open and closed state, the strip material is automatically fed into the die from the left side of the die through the material guide plate 211 to start processing, the strip material is firstly guided by the outer guide column assembly 3, and the strip material is divided into workpieces of the same size to be processed by the cooperation of the cutting punch 16 and the cutting die 24, and then the workpiece is punched by the punching punch 17 and the punching die 25. After punching, the workpiece is bent twice by the cooperation of the bending punch and the bending die 26, and the electronic components after stamping are sent out from the right side of the die to complete the entire stamping process.

[0047] In summary, the stamping die for electronic components provided by the utility model is easy to operate, and concentrates the continuous cutting, punching, shaping, bending and other processes in the production process of electronic components in one die, which is convenient for assembly line production and conducive to fixing and installing the die. The operation is convenient and simple, which greatly reduces the intensity of manual labor. The flap assembly 5 can eliminate scratches caused by other die structures, avoid the instability of processing dimensions, and effectively improve the stamping quality of electronic components.

Claims

1. A stamping die for electronic components, comprising an upper die body (1) and a lower die body (2), an outer guide pillar assembly (3) and an inner guide pillar assembly (4) being arranged between the upper die body (1) and the lower die body (2), characterized in that: The upper die body (1) comprises an upper die base (11), an upper pad (12), an upper clamping plate (13), a stripping back plate (14) and an upper stripping plate (15) which are arranged in sequence from top to bottom; the lower die body (2) comprises a lower die base (21), a lower pad (22) and a lower mold plate (23) which are arranged in sequence from bottom to top; The upper pad (12) is provided with a cutting punch (16), a punching punch (17), a bending punch and a shaping punch (18), and the cutting punch (16), the punching punch (17), the bending punch and the shaping punch (18) all extend out of the upper stripping plate (15); The lower pad (22) is provided with a cutting die (24), a punching die (25), a bending die (26) and a shaping die (27) corresponding to the cutting die (16), the punching die (17), the bending die and the shaping die (18); A flap assembly (5) is arranged between the lower pad (22) and the upper pad (12); the flap assembly (5) is arranged between the bending die (26) and the shaping die (27), and comprises a first flip part (51), a second flip part (52), a fixing plate (53) and a flip punch (54); the flip punch (54) is arranged on the upper clamping plate (13); the fixing plate (53) is arranged on the upper stripping plate (15); the first flip part (51) is arranged on one side of the shaping die (27), and is connected to the second flip part (52) via a rotating shaft (55); the second flip part (52) and the fixing plate (53) are fixed via a tension spring (56).

2. The stamping die for electronic components according to claim 1, characterized in that: A hook (28) is provided on one side of the upper mold body (1) and the lower mold body (2), and the hook (28) is fixed on the upper pad (12), the upper clamping plate (13), the backing plate (14), the upper stripping plate (15) and the lower mold plate (23).

3. The stamping die for electronic components according to claim 2, characterized in that: A first bayonet (29) is provided on one side of the upper pad (12), and a second bayonet (210) is provided on one side of the lower template (23), wherein the first bayonet (29) and the second bayonet (210) are both fixed to two ends of the hook (28).

4. The stamping die for electronic components according to claim 1, characterized in that: A side push assembly (6) is provided on the side of the lower mold plate (23), the side push assembly (6) comprising a side pressure die (61), a side pressure punch (62) and a fixed plate (53), a knife inserting die (65) corresponding to the inserting knife (64) is provided on the fixed plate (53), and the side pressure die (61) is provided on one side of the shaping die (27).

5. The stamping die for electronic components according to claim 1, characterized in that: A nitrogen spring (7) is arranged on the upper die seat (11), and the nitrogen spring (7) comprises a cylinder body (71) and a piston rod (72) arranged on the cylinder body (71).

6. The stamping die for electronic components according to claim 1, characterized in that: A floating material assembly (8) is arranged above the lower die seat (21), and the floating material assembly (8) comprises a floating material spring (81) and a floating material pin (82) arranged above the floating material spring (81), and a guide needle (83) is arranged above the floating material pin (82), and the guide needle (83) is arranged on the upper stripping plate (15).

7. The stamping die for electronic components according to claim 1, characterized in that: The outer guide pillar assembly (3) comprises a first guide sleeve (31) arranged on the upper die seat (11) and an outer guide pillar (32) arranged corresponding to the first guide sleeve (31); the outer guide pillar (32) is arranged on the lower die seat (21); the lower die seat (21) and the upper die seat (11) are movably connected via the outer guide pillar (32) and the first guide sleeve (31).

8. The stamping die for electronic components according to claim 1, characterized in that: The inner guide column assembly (4) comprises an inner guide column (42) and a guide groove (41), wherein the guide groove (41) is arranged above the lower template (23) and penetrates the upper stripping plate (15), and the inner guide column (42) is arranged on the upper pad (12), and a second guide sleeve (43) is arranged outside the inner guide column (42).

Images