Stage mechanism

Abstract

The utility model discloses a carrier mechanism, including a base plate, a processing carrier, a gas homogenization block and a cover plate. The gas homogenization block is arranged on the side of the processing carrier. The gas homogenization block is provided with an air inlet and a first air outlet that are interconnected. The air inlet is used to introduce protective gas. The outlet direction of the first air outlet is toward the processing carrier. The cover plate is arranged outside the processing carrier and the gas homogenization block, and a protective gas chamber is formed between the cover plate and the processing carrier. An opening is provided on the cover plate to expose the processing carrier. During the laser processing process, the protective gas can be blown toward the processing carrier through the first air outlet on the gas homogenization block, and then the protective gas is blocked by the cover plate to reduce its overflow, so that the protective gas fills the protective gas chamber. The product is located in the protective gas chamber and is covered by the protective gas, which can reduce the contact between the wafer and the air and avoid oxidation and damage of the wafer due to high temperature.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a stage mechanism. Background Art

[0002] During the manufacturing process of semiconductor chips, the chips need to be separated from the wafers. During processing, the wafer is placed on a processing stage and a high-energy laser beam is used to irradiate the surface of the wafer. The irradiated area is partially melted and vaporized, thereby achieving wafer cutting. However, laser cutting generates a lot of heat near the chip, and high temperature can easily cause the silicon to be oxidized and damaged, thereby destroying the structure of the chip and causing the chip to be scrapped. Utility Model Content

[0003] In view of the above-mentioned deficiencies in the prior art, the present application provides a carrier mechanism that can reduce the contact between the product and the air during the laser processing process and prevent the product from being damaged by oxidation.

[0004] This embodiment adopts the following technical solutions:

[0005] A stage mechanism, comprising:

[0006] Base plate;

[0007] A processing platform is arranged on the bottom plate;

[0008] a gas homogenizing block, arranged at the side of the processing platform, the gas homogenizing block is provided with an air inlet and a first air outlet which are interconnected, the air inlet is used to introduce protective gas, and the outlet direction of the first air outlet is toward the processing platform; and

[0009] A cover plate is arranged on the bottom plate and covers the processing platform and the gas homogenization block. A protective gas chamber is formed between the cover plate and the processing platform. An opening is arranged on the cover plate to expose the processing platform.

[0010] Furthermore, in the carrier mechanism, the number of the first air outlet holes is multiple, and the gas homogenization block is provided with a first homogenization channel, a second homogenization channel and multiple gas homogenization holes, the air inlet hole is simultaneously connected to the multiple gas homogenization holes through the first homogenization channel, and the multiple gas homogenization holes are then simultaneously connected to the multiple first air outlet holes through the second homogenization channel.

[0011] Furthermore, in the carrier mechanism, the number of the air inlet holes is one or more, the number of the gas homogenization holes is greater than the number of the air inlet holes, and the number of the first air outlet holes is greater than the number of the gas homogenization holes.

[0012] Furthermore, in the stage mechanism, the diameter of the air inlet hole is larger than the diameter of the gas homogenization hole, and the diameter of the gas homogenization hole is larger than the diameter of the first air outlet hole.

[0013] Furthermore, in the carrier mechanism, the gas homogenization block is provided with a plurality of second gas outlet holes, and the plurality of gas homogenization holes are also simultaneously connected to the plurality of second gas outlet holes through the second homogenization channel.

[0014] Furthermore, in the platform mechanism, the outlet direction of the first air outlet is parallel to the surface of the processing platform.

[0015] Furthermore, in the carrier mechanism, the number of the first air outlet holes is multiple, and they form one or more rows of queues arranged in sequence along a direction perpendicular to the surface of the processing carrier. The number of the first air outlet holes in each row of queues is two or more, and they are arranged in sequence along a direction parallel to the surface of the processing carrier.

[0016] Furthermore, in the platform mechanism, a second gas outlet hole connected to the gas inlet hole is further provided on the gas homogenizing block, and a gas outlet direction of the second gas outlet hole is perpendicular to the surface of the processing platform and faces the cover plate.

[0017] Furthermore, in the platform mechanism, the number of the second air outlet holes is plural and they are arranged in sequence along a direction parallel to the surface of the processing platform.

[0018] Furthermore, in the carrier mechanism, the protective gas is argon.

[0019] Furthermore, in the platform mechanism, there are multiple gas homogenization blocks, and the multiple gas homogenization blocks are all arranged on the bottom plate and surround the processing platform.

[0020] Furthermore, in the platform mechanism, the cover plate includes a top plate and side plates, the side plates are arranged on the bottom plate and enclose the processing platform and the gas homogenization block, the height of the side plates is higher than the height of the processing platform, the top plate is arranged on the side plates, and the opening is opened on the top plate.

[0021] Furthermore, the platform mechanism also includes a lifting component, and the base plate is arranged at the driving end of the lifting component.

[0022] Furthermore, in the platform mechanism, the lifting assembly includes a mounting plate, a support plate, a first wedge block, a second wedge block and a driving assembly, the first wedge block is slidably arranged on the mounting plate along a horizontal direction, the second wedge block is slidably arranged on the support plate along a vertical direction, the bottom plate is arranged on the second wedge block, the first wedge block and the second wedge block are respectively provided with an inclined surface, the first wedge block and the second wedge block are combined with each other through two inclined surfaces, and the driving assembly is used to drive the first wedge block to move in the horizontal direction to drive the second wedge block to slide in the vertical direction.

[0023] Compared with the prior art, the stage mechanism provided in the present application can blow out protective gas toward the processing stage through the first gas outlet on the gas homogenizing block, and then block the protective gas through the cover plate to reduce its overflow, so that the protective gas fills the protective gas chamber. During the laser processing process, the product is located in the protective gas chamber and is covered by the protective gas, which can reduce the contact between the wafer and the air and prevent the wafer from being oxidized and damaged due to high temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the overall structure of a specific embodiment of the carrier mechanism provided in this application.

[0025] Figure 2 for Figure 1 Side view of the stage mechanism shown.

[0026] Figure 3 for Figure 1 A top view of the stage mechanism shown (with cover removed).

[0027] Figure 4 for Figure 3 A cross-sectional view of the stage mechanism (without removing the cover) in the AA direction is shown.

[0028] Figure 5 for Figure 1 Schematic diagram of the structure of the gas homogenization block in the carrier mechanism shown.

[0029] Figure 6 for Figure 5 Side view of the gas homogenization block shown.

[0030] Figure 7 for Figure 6 A cross-sectional view of the gas homogenization block along the BB direction is shown.

[0031] Figure 8 for Figure 1 Schematic diagram of the structure of the cover plate in the stage mechanism shown.

[0032] Fig. 9 for Figure 8A schematic diagram of the structure of the cover plate from another angle.

[0033] Among them, 10, bottom plate; 20, processing platform; 30, gas homogenization block; 31, air inlet; 32, first air outlet; 33, first homogenization channel; 34, second homogenization channel; 35, gas homogenization hole; 36, second air outlet; 40, cover plate; 41, opening; 42, top plate; 43, side plate; 50, protective gas chamber; 60, lifting assembly; 61, mounting plate; 62, support plate; 63, first wedge block; 64, second wedge block; 65, driving assembly. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and effect of the present application clearer and more specific, the present application is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application. Without further description, the elements, structures and features in one embodiment can also be beneficially combined with other embodiments.

[0035] It should be noted that when a metastructure is referred to as being "fixed to" or "set on" another metastructure, it may be directly on the other metastructure or indirectly on the other metastructure. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0036] The orientation or positional relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or positional relationship shown in the drawings and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element structure referred to must have a specific orientation, be constructed and operate in a specific orientation.

[0037] See also Figure 1 and Figure 2 The stage mechanism provided in the present application includes a base plate 10, a processing stage 20, a gas homogenization block 30 and a cover plate 40. The processing stage 20 is arranged on the base plate 10 and is used to carry the product so as to facilitate processing of the product.

[0038] Specifically, the product is a semiconductor material such as a wafer, and the processing method is laser processing. Adsorption holes can be set on the surface of the processing stage 20 to vacuum adsorb the wafer to prevent the wafer from moving and ensure the accuracy of laser processing. Preferably, the processing stage 20 is made of ceramic material, which has the advantage of high temperature resistance and can prevent the laser from damaging the processing stage 20 during processing.

[0039] The gas homogenization block 30 is used to provide protective gas, which is used to isolate the wafer from contact with oxygen in the air during processing. The gas homogenization block 30 is arranged on the bottom plate 10 or the processing platform 20 and is located on the side of the processing platform 20. The gas homogenization block 30 is provided with an air inlet 31 and a first air outlet 32 ​​that are interconnected. The air inlet 31 is used to pass the protective gas, and the outlet direction of the first air outlet 32 ​​is toward the processing platform 20.

[0040] The cover plate 40 is disposed on the bottom plate 10 and covers the processing platform 20 and the gas homogenizing block 30. Figure 3 and Figure 4 A certain gap is left between the cover plate 40 and the processing stage 20, so that a protective gas chamber 50 is formed between the cover plate 40 and the processing stage 20 to accommodate enough protective gas above the processing stage 20, effectively isolating the wafer from contact with the air and preventing the wafer from being oxidized during processing. In addition, an opening 41 is provided on the cover plate 40 to expose the processing stage 20, so as to facilitate the placement of the wafer and the passage of the laser.

[0041] Therefore, after the wafer is placed on the processing stage 20, the protective gas can be blown toward the processing stage 20 through the first gas outlet 32 ​​on the gas homogenizing block 30, and then the protective gas is blocked by the cover plate 40 to reduce its overflow, so that the protective gas fills the protective gas chamber 50. During the laser processing process, the wafer is located in the protective gas chamber 50 and is covered by the protective gas, thereby reducing the contact between the wafer and the air and preventing the wafer from being oxidized and damaged due to high temperature.

[0042] In some embodiments, see Figure 5 The gas homogenizing block 30 is provided with a plurality of first gas outlet holes 32. Figure 6 and Figure 7 The gas homogenizing block 30 is provided with a first homogenizing channel 33, a second homogenizing channel 34 and a plurality of gas homogenizing holes 35. The gas inlet 31 is simultaneously connected to the plurality of gas homogenizing holes 35 through the first homogenizing channel 33, and the plurality of gas homogenizing holes 35 are simultaneously connected to the plurality of first gas outlets 32 through the second homogenizing channel 34.

[0043] The first homogenizing channel 33 and the second homogenizing channel 34 can be pipes formed in the gas homogenizing block 30. After the protective gas is introduced into the gas inlet 31, it first enters and fills the first homogenizing channel 33, then enters and fills the second homogenizing channel 34 through the plurality of gas homogenizing holes 35, and finally flows out evenly onto the processing carrier 20 through the plurality of first gas outlets 32.

[0044] In some embodiments, the number of the air inlet holes 31 is one or more, the number of the gas homogenization holes 35 is greater than the number of the air inlet holes 31 , and the number of the first air outlet holes 32 is greater than the number of the gas homogenization holes 35 .

[0045] By increasing the number of the gas inlet holes 31 , the gas homogenizing holes 35 and the first gas outlet holes 32 in sequence, the uniform and stable outflow of the protective gas can be achieved layer by layer, so that the protective gas fills the entire protective gas chamber 50 .

[0046] Furthermore, the diameter of the air inlet hole 31 is larger than the diameter of the gas homogenizing hole 35 , and the diameter of the gas homogenizing hole 35 is larger than the diameter of the first air outlet hole 32 .

[0047] By successively reducing the diameters of the gas inlet hole 31 , the gas homogenizing hole 35 and the first gas outlet hole 32 , the uniform and stable outflow of the protective gas can be further achieved layer by layer, so that the protective gas fills the entire protective gas chamber 50 .

[0048] In some embodiments, the outlet direction of the first air outlet 32 ​​is parallel to the surface of the processing platform 20 , and the protective gas can be blown out horizontally to ensure that the protective gas covers the surface of the processing platform 20 .

[0049] Furthermore, the plurality of first air outlet holes 32 may form a row arranged in sequence along a direction parallel to the surface of the processing platform 20 (horizontal direction in this embodiment), so that the protective gas is evenly blown toward the top of the processing platform 20 at the same height.

[0050] Alternatively, a plurality of first air outlet holes 32 may form two or more rows of queues arranged sequentially along a direction perpendicular to the surface of the processing platform 20 (vertical direction in the present embodiment), and the number of first air outlet holes 32 in each row is two or more, and they are arranged sequentially along a direction parallel to the surface of the processing platform 20.

[0051] At this time, multiple layers of protective gas can be evenly blown above the processing stage 20 at different heights, thereby improving the efficiency of the protective gas covering the wafer and allowing the protective gas to quickly and evenly fill the entire protective gas chamber 50 .

[0052] In some embodiments, the gas homogenizing block 30 is further provided with a second gas outlet 36 connected to the gas inlet 31 , and the gas outlet direction of the second gas outlet 36 is perpendicular to the surface of the processing platform 20 and faces the cover plate 40 .

[0053] The density of the shielding gas is usually greater than that of air. For example, argon is used as the shielding gas, and its density is 1.784 kg / m 3 , greater than 1.29kg / m 3 When the protective gas flows out from the second gas outlet 36 , it flows downward under the obstruction of the cover plate 40 , and can better fill the entire protective gas chamber 50 .

[0054] The number of the second gas outlet holes 36 can be set to multiple, and the multiple gas homogenization holes 35 are simultaneously connected to the multiple first gas outlet holes 32 and the multiple second gas outlet holes 36 through the second homogenization channel 34, so that the multiple second gas outlet holes 36 can also realize the uniform and stable outflow of the protective gas layer by layer.

[0055] Furthermore, the plurality of second gas outlet holes 36 may be arranged in sequence along a direction parallel to the surface of the processing stage 20 , so that the protective gas is blown out evenly along the same straight line.

[0056] In some embodiments, the number of the gas homogenizing blocks 30 can be set to be multiple, and the multiple gas homogenizing blocks 30 are all disposed on the base plate 10 and surround the processing stage 20 .

[0057] like Figure 3 As shown, there are four gas homogenizing blocks 30, which are arranged at the same angle at the four corners of the processing platform 20. The multiple gas homogenizing blocks 30 can simultaneously flow out the protective gas from different directions of the processing platform 20, so that the protective gas quickly and evenly fills the entire protective gas chamber 50.

[0058] In some embodiments, see Figure 8 and Fig. 9 The cover plate 40 may include a top plate 42 and a side plate 43 . The side plate 43 is disposed on the bottom plate 10 to enclose the processing platform 20 and the gas homogenization block 30 . The top plate 42 is disposed on the side plate 43 , and the opening 41 is opened on the top plate 42 .

[0059] The number of the side panels 43 may be one or more. For example, four side panels 43 form a rectangular enclosed area to enclose the processing stage 20 and the gas homogenization block 30. The height of the side panels 43 is higher than the height of the processing stage 20, so that after the top panel 42 is set on the side panels 43, a certain gap is formed between the top panel 42 and the processing stage 20 to form a protective gas chamber 50. The shape and size of the opening 41 can be consistent with the shape and size of the processing stage 20 to avoid the existence of the top panel 42 affecting the normal processing of the wafer.

[0060] In addition, the stage mechanism also includes a lifting assembly 60, and the bottom plate 10 is arranged at the driving end of the lifting assembly 60. During processing, there is usually a laser optical path system above the stage mechanism, and the lifting assembly 60 can drive the processing stage 20 to rise and fall, so that the focus of the laser emitted by the laser optical path system accurately falls on the wafer.

[0061] In the laser optical path system, there are multiple reflectors above the lens that emits the laser. Under the same error condition, the error is amplified when the laser reaches the lens due to reflections from multiple reflectors. At the same time, when dimming, the laser beam hits the center of the lens for the best processing effect; when the lens moves, the error may cause the beam to deviate from the center of the lens, resulting in greater processing errors.

[0062] Therefore, adjusting the height of the processing platform 20 by the lifting assembly 60 instead of adjusting the height of the lens in the laser optical path system can effectively reduce the processing error and improve the processing accuracy and processing stability.

[0063] In some embodiments, please combine Figure 1 and Figure 2 The lifting assembly 60 includes a mounting plate 61, a support plate 62, a first wedge block 63, a second wedge block 64 and a driving assembly 65. The first wedge block 63 is slidably arranged on the mounting plate 61 along the horizontal direction, the second wedge block 64 is slidably arranged on the support plate 62 along the vertical direction, and the bottom plate 10 is arranged on the second wedge block 64. The first wedge block 63 and the second wedge block 64 are respectively provided with an inclined surface, and the first wedge block 63 and the second wedge block 64 are combined with each other through two inclined surfaces.

[0064] After the two inclined surfaces of the first wedge block 63 and the second wedge block 64 are relatively moved in a suitable direction, the height formed by the first wedge block 63 and the second wedge block 64 as a whole will change. Therefore, by driving the first wedge block 63 to move in a preset horizontal direction through the driving assembly 65, the second wedge block 64 can be driven to slide in a vertical direction, thereby driving the processing platform 20 to move up and down.

[0065] At this time, the driving direction of the driving component 65 is horizontal, and the driving component 65 as a whole can be horizontally arranged, thereby saving space inside the machine and making its spatial layout more flexible.

[0066] In specific implementation, the driving assembly 65 may include a servo motor and a ball screw. The servo motor is used to drive the ball screw to rotate. The ball screw is horizontally arranged on the mounting plate 61. The first wedge block 63 is threadedly sleeved outside the ball screw, so that when the ball screw rotates, it can drive the first wedge block 63 to move horizontally.

[0067] A first guide rail may be provided on the mounting plate 61, and a first wedge block 63 is provided on the first guide rail, and is restricted by the first guide rail for horizontal movement; meanwhile, a second guide rail may be provided on the support plate 62, and a second wedge block 64 is provided on the second guide rail, and is restricted by the second guide rail for vertical movement.

[0068] Of course, in other embodiments, the lifting assembly 60 may also be lifted and lowered by other means such as a cylinder, a belt drive, or a gear rack drive.

[0069] It is understandable that those skilled in the art can make equivalent substitutions or changes based on the technical solution and application concept of the present application, and all these changes or substitutions should fall within the protection scope of the claims attached to the present application.

Claims

1. A stage mechanism, characterized in that: include: Base plate; A processing platform is arranged on the bottom plate; A gas homogenizing block is arranged on the side of the processing platform, and is provided with an air inlet and a first air outlet which are interconnected, the air inlet is used to introduce protective gas, and the outlet direction of the first air outlet is toward the processing platform; as well as A cover plate is arranged on the bottom plate and covers the processing platform and the gas homogenization block. A protective gas chamber is formed between the cover plate and the processing platform. An opening is arranged on the cover plate to expose the processing platform.

2. The stage mechanism according to claim 1, characterized in that: There are multiple first gas outlet holes, and the gas homogenization block is provided with a first homogenization channel, a second homogenization channel and multiple gas homogenization holes. The gas inlet hole is simultaneously connected to the multiple gas homogenization holes through the first homogenization channel, and the multiple gas homogenization holes are then simultaneously connected to the multiple first gas outlet holes through the second homogenization channel.

3. The stage mechanism according to claim 2, characterized in that: The number of the air inlet holes is one or more, the number of the gas homogenization holes is greater than the number of the air inlet holes, and the number of the first air outlet holes is greater than the number of the gas homogenization holes.

4. The stage mechanism according to claim 2, characterized in that: The diameter of the air inlet hole is greater than the diameter of the gas homogenization hole, and the diameter of the gas homogenization hole is greater than the diameter of the first air outlet hole.

5. The stage mechanism according to claim 2, characterized in that: The gas homogenizing block is also provided with a plurality of second gas outlet holes, and the plurality of gas homogenizing holes are also simultaneously connected to the plurality of second gas outlet holes through the second homogenizing channel.

6. The stage mechanism according to claim 1, characterized in that: The gas outlet direction of the first gas outlet is parallel to the surface of the processing platform.

7. The stage mechanism according to claim 6, characterized in that: The number of the first air outlet holes is multiple, and they form one or more rows of queues arranged in sequence along a direction perpendicular to the surface of the processing carrier. The number of the first air outlet holes in each row is two or more, and they are arranged in sequence along a direction parallel to the surface of the processing carrier.

8. The stage mechanism according to claim 6, characterized in that: The gas homogenizing block is also provided with a second gas outlet hole connected to the gas inlet hole, and the gas outlet direction of the second gas outlet hole is perpendicular to the surface of the processing platform and faces the cover plate.

9. The stage mechanism according to claim 8, characterized in that: The number of the second air outlet holes is plural and they are arranged in sequence along a direction parallel to the surface of the processing carrier.

10. The stage mechanism according to claim 1, characterized in that: The protective gas is argon.

11. The stage mechanism according to claim 1, characterized in that: There are multiple gas homogenization blocks, and the multiple gas homogenization blocks are all arranged on the bottom plate and surround the processing carrier.

12. The stage mechanism according to claim 1, characterized in that: The cover plate includes a top plate and a side plate, wherein the side plate is arranged on the bottom plate and encloses the processing platform and the gas homogenization block, the height of the side plate is higher than the height of the processing platform, the top plate is arranged on the side plate, and the opening is opened on the top plate.

13. The stage mechanism according to any one of claims 1 to 12, characterized in that: It also includes a lifting component, and the base plate is arranged at the driving end of the lifting component.

14. The stage mechanism according to claim 13, characterized in that: The lifting assembly includes a mounting plate, a supporting plate, a first wedge block, a second wedge block and a driving assembly, the first wedge block is slidably arranged on the mounting plate in a horizontal direction, the second wedge block is slidably arranged on the supporting plate in a vertical direction, the bottom plate is arranged on the second wedge block, the first wedge block and the second wedge block are respectively provided with an inclined surface, the first wedge block and the second wedge block are combined with each other through two inclined surfaces, and the driving assembly is used to drive the first wedge block to move in the horizontal direction to drive the second wedge block to slide in the vertical direction.

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