Raw material slicing device for semiconductor chip processing

By using the cutting saw rope and hydraulic telescopic cylinder transmission design in the raw material slicer for semiconductor chip processing, the problem of increasing the thickness of the cutting sheet and leaking air in the clamping cylinder in the prior art is solved, and the yield and production efficiency of the slice are improved.

CN222727026UActive Publication Date: 2025-04-08XIAN SHANSHENG QIHANG SOFTWARE TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421260321.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-04
Publication Date
2025-04-08
Estimated Expiration
2034-06-04

AI Technical Summary

Technical Problem

The existing semiconductor chip slicing devices have lax problems caused by increased cutting sheet thickness and leaks in the clamping cylinder during the cutting process, resulting in a decrease in silicon rod wear and yield.

Method used

A raw material slicer device for semiconductor chip processing is designed, using a cutting saw rope as a cutting tool to reduce wear on the silicon rod, and improve clamping stability and accuracy through hydraulic telescopic cylinder and screw transmission.

Benefits of technology

The wear of the silicon rod is reduced by using a cutting saw rope, the yield of the slice is improved, and unnecessary wear of the silicon rod is reduced by an improved clamping device, reducing production costs.

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Abstract

The utility model discloses a raw material slicing device for semiconductor chip processing, comprising a base plate seat, two support plates are arranged at the top of the base plate seat, a top seat is arranged on the support plate, both sides of the bottom end of the top seat are fixedly connected with hydraulic telescopic cylinders, the hydraulic telescopic cylinder is located between the support plates at both sides, the bottom end of the hydraulic telescopic cylinder is fixedly connected with a connecting plate, a cutting device is arranged on the connecting plate, a limiting block 1 is fixedly connected to the middle of the front end of the base plate seat, a limiting block 2 is arranged behind the limiting block 1, a clamping device is arranged at the rear end of the top end of the base plate seat, a silicon rod is arranged on the limiting block 1, a threaded block is arranged at the bottom end of the adjacent sides of the support plates at both sides, a screw rod is threadedly connected on the threaded block, the front ends of the screw rods at both sides are rotatably connected with a stopper, and a motor 1 is arranged at the rear end of the screw rod. Its advantages are: a cutting device is designed, and a cutting saw rope is used to reduce the loss of the silicon rod; a clamping device is designed, and the precision of the clamping device driven by the screw rod will be higher.
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Description

Technical Field

[0001] The utility model relates to the technical field of chip production, in particular to a raw material slicing device for semiconductor chip processing. Background Art

[0002] The semiconductor chip field has always been a high-tech field in the world. Powerful semiconductor chips are needed in many top industries, but the processing and manufacturing process of semiconductor chips is very troublesome and complicated. Chip processing, also known as semiconductor manufacturing or integrated circuit manufacturing, is the process of making semiconductor devices and integrated circuits. It involves multiple steps and highly specialized equipment. Among them, raw material slicing is an important link in semiconductors.

[0003] Chinese patent CN218195456U discloses a silicon carbide chip slicing device with a high yield rate, including a workbench, a sliding plate, two slide rails and a reduction motor. The upper surface of the workbench is symmetrically fixedly connected to two mounting plates, and the upper surfaces of the two mounting plates are fixedly connected to a limiting rack, and the upper surfaces of the limiting rack are meshedly connected to a limiting tooth plate. The utility model uses a clamping cylinder to push two clamping plates to clamp the silicon carbide semiconductor. Under the limitation of the arc-shaped limiting block and the limiting groove, the position of the silicon carbide semiconductor is fixed. The limiting tooth plate is pushed by the limiting cylinder to engage with the limiting rack, thereby fixing the position of the sliding plate. During slicing, the sliding plate will not drive the silicon carbide semiconductor to shift. At the same time, the reduction motor drives the screw to rotate, and the screw drives the cutting blade to move downward at a uniform speed through the mounting table, thereby avoiding damage to the silicon carbide semiconductor due to impact, thereby improving the yield rate of slicing. However, there are still defects that can be improved:

[0004] 1. The utility model uses a cutting blade as a material for cutting silicon rods. It is worth noting that the cutting blade has a certain thickness, and after multiple grindings, its edge will be blunted or curled, which will further increase the thickness of the blade, which will result in more unnecessary silicon material being cut when cutting silicon rods, causing a lot of losses to users.

[0005] 2. The utility model uses a clamping cylinder as a power part. In reality, the cylinder may leak, and since the gas has a certain degree of compressibility, if a clamping cylinder is used, it is very likely to cause loose clamping; at the same time, since the precision of the cylinder is not very high, it will further squeeze the silicon rod when clamping and fixing, causing the silicon rod to be worn. Utility Model Content

[0006] The technical problem to be solved by the utility model is to overcome the above-mentioned problem and provide a raw material slicing device for semiconductor chip processing.

[0007] In order to solve the above technical problems, the technical solution provided by the utility model is: a raw material slicing device for semiconductor chip processing, including a base plate seat, the front and rear parts of both sides of the base plate seat are fixedly connected with connecting seats, the middle parts of both sides of the top of the base plate seat are slidably connected with support plates, the top of the support plate is fixedly connected with a top seat, both sides of the bottom end of the top seat are fixedly connected with hydraulic telescopic cylinders, the hydraulic telescopic cylinders are located between the support plates on both sides, the bottom ends of the hydraulic telescopic cylinders on both sides are fixedly connected with connecting plates, the adjacent sides of the connecting plates on both sides are provided with cutting devices, a controller is provided on one side of the front part of the top of the base plate seat, and the middle of the front part of the top of the base plate seat is fixed A limit block 1 is connected, and a plurality of longitudinally arranged limit blocks 2 are arranged directly behind the limit block 1. The limit block 2 is fixedly connected to the base plate seat, and a clamping device is arranged in the middle of the rear part of the top end of the base plate seat. Silicon rods are arranged on the limit blocks 1 and 2, and the rear part of the silicon rods is located in the clamping device. The bottom ends of the sides of the support plates on both sides are fixedly connected with threaded blocks, and screw rods are threadedly connected on the threaded blocks. The front ends of the screw rods on both sides are rotatably connected with stoppers, and the stoppers are fixedly connected to the base plate seat. The rear ends of the screw rods on both sides are fixedly connected with motor 1, and the motor 1 is fixedly connected to the base plate seat by providing a motor seat 1.

[0008] As an improvement, the cutting device includes a cutting base fixedly connected to the connecting plate, a through groove 1 is opened in the middle of the upper front end of the cutting base, through grooves 2 are opened on both sides of the lower front end of the cutting base, a bearing in the through groove 1 is connected to a rotating shaft 1, and a bearing in the through groove 2 is connected to a rotating shaft 2.

[0009] As an improvement, pulley seats are fixedly connected to both sides of the lower front end of the cutting base, and the pulley seats are located between the rotating shafts 2 on both sides. Rolling wheels are provided on the pulley seats on both sides, and a cutting saw rope is provided in front of the cutting base. The cutting saw rope is wound around the rolling wheels, the rotating shaft 2 and the rotating shaft 1.

[0010] As an improvement, the rear ends of the rotating shafts 2 on both sides are fixedly connected to motor 2, and the motor 2 is fixedly connected to the cutting base by means of motor seat 2. The rear end of the rotating shaft 1 is rotatably connected to a baffle frame, and the front end of the baffle frame is fixedly connected to the cutting base.

[0011] As an improvement, the clamping device includes a fixing plate fixedly connected to the base plate seat, a light rod is arranged above the fixing plate, and one end of the light rod close to the controller is rotatably connected to a baffle, and the baffle is fixedly connected to the fixing plate.

[0012] As an improvement, one end of the light rod away from the baffle is fixedly connected to a motor three, and the motor three is fixedly connected to the fixed plate by providing a motor seat three.

[0013] As an improvement, the bare rod is provided with a threaded portion 1 and a threaded portion 2 with opposite thread rotation directions, and the threaded portion 1 and the threaded portion 2 are respectively threadedly connected with a clamping block 1 and a clamping block 2, and the clamping block 1 and the clamping block 2 are both slidably connected to the fixed plate.

[0014] The advantages of the utility model compared with the prior art are:

[0015] 1. The utility model designs a cutting device. The cutting tool is a cutting wire saw, and the thickness of the cutting wire saw is less than the thickness of the cutter. At this time, the wear on the silicon rod can be further reduced, which can increase more economic benefits for users. At the same time, two motors 2 are arranged to drive the rotating shaft 2, and a rotating shaft 1 is arranged above, so that the overall operation and cutting are more stable and the tilting during cutting is reduced.

[0016] 2. The utility model is designed with a clamping device. The clamping device uses a screw drive with a higher transmission speed, so that the clamping block can wear the silicon rod less during the clamping process. At the same time, compared with the improved utility model, the utility model only uses one motor to drive two clamping blocks, consuming less energy. In summary, it can bring more economic benefits to users. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The utility model is a three-dimensional raw material slicing device for semiconductor chip processing Figure 1 .

[0018] Figure 2 The utility model is a three-dimensional raw material slicing device for semiconductor chip processing Figure 2 .

[0019] Figure 3 The utility model is a three-dimensional cutting device in a raw material slicing device for semiconductor chip processing. Figure 1 .

[0020] Figure 4 It is an enlarged view of a raw material slicing device for semiconductor chip processing at position A of the utility model.

[0021] Figure 5 The utility model is a three-dimensional cutting device in a raw material slicing device for semiconductor chip processing. Figure 2 .

[0022] Figure 6 The utility model is a structural view of a clamping device in a raw material slicing device for semiconductor chip processing.

[0023] As shown in the figure:

[0024] 1. Bottom plate; 2. Connecting seat; 3. Support plate;

[0025] 4. Top seat; 5. Hydraulic telescopic cylinder; 6. Connecting plate;

[0026] 7. Cutting device; 701. Cutting base; 702. Through slot 1; 703. Through slot 2; 704. Rotating shaft 1; 705. Rotating shaft 2; 706. Pulley seat; 707. Rolling wheel; 708. Cutting saw rope; 709. Motor 2; 710. Motor seat 2; 711. Baffle frame;

[0027] 8. Controller; 9. Limit block 1; 10. Limit block 2;

[0028] 11. Clamping device; 1101. Fixing plate; 1102. Polished rod; 1103. Baffle; 1104. Motor 3; 1105. Motor seat 3; 1106. Threaded part 1; 1107. Threaded part 2; 1108. Clamping block 1; 1109. Clamping block 2;

[0029] 12. Silicon rod; 13. Thread block; 14. Screw rod;

[0030] 15. Block; 16. Motor 1; 17. Motor base 1. DETAILED DESCRIPTION

[0031] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0032] The working principle of the utility model is as follows Figure 1-Figure 6As shown, a raw material slicing device for semiconductor chip processing includes a base plate seat 1. First, connecting seats 2 are fixedly connected to the front and rear parts of both sides of the base plate seat 1. The connecting seats 2 enable the overall equipment to operate stably. Then, threaded blocks 13 are arranged on both sides of the top of the base plate seat 1. At the same time, screw rods 14 are threadedly connected to the threaded blocks 13. The front ends of the screw rods 14 on both sides are rotatably connected to blocks 15. It is worth noting that the blocks 15 are fixedly connected to the base plate seat 1. Finally, motors 16 are fixedly connected to the rear ends of the screw rods 14 on both sides. It is worth noting that the motors 16 are electrically connected to external power equipment. At the same time, the motors 16 serve as the driving parts of the screw rods 14. In addition, the motors 16 are fixedly connected to the base plate seat 1 by means of a motor seat 17. In addition, support plates 3 are fixedly connected to the separated sides of the threaded blocks 13 on both sides, and the support plates 3 are slidably connected to the base plate seat 1. Then, the top of the support plates 3 is fixedly connected There is a top seat 4, and both sides of the bottom end of the top seat 4 are fixedly connected with hydraulic telescopic cylinders 5, the hydraulic telescopic cylinders 5 are located between the support plates 3 on both sides, and the bottom ends of the hydraulic telescopic cylinders 5 on both sides are fixedly connected with connecting plates 6, and cutting devices 7 are arranged on the adjacent sides of the connecting plates 6 on both sides. When cutting is required, the hydraulic telescopic cylinders 5 on both sides will drive the cutting device 7 to descend. At the same time, a silicon rod 12 is arranged below the cutting device 7. In order to facilitate the fixing of the silicon rod 12, a limiting block 9 is arranged at the bottom end of the front part of the silicon rod 12, and the limiting block 9 is fixedly connected to the middle of the front part of the top end of the base plate seat 1. At the same time, a number of limiting blocks 10 are arranged directly behind the limiting block 9, and the limiting block 10 is also fixedly connected to the base plate seat 1. Finally, a clamping device 11 is arranged at the rear part of the top end of the base plate seat 1. It is worth noting that the rear part of the silicon rod 12 is located in the clamping device 11. Finally, a controller 8 for control is arranged on one side of the front part of the top end of the base plate seat 1.

[0033] The above-mentioned structures together constitute the general appearance structure of a raw material slicing device for semiconductor chip processing of the utility model.

[0034] In order to further explain the specific working principle of the raw material slicing device for semiconductor chip processing of the utility model, the cutting device 7 includes a cutting base 701 fixedly connected to the connecting plate 6, and a through groove 1 702 is opened in the middle of the upper front end of the cutting base 701. At the same time, a rotating shaft 1 704 with a groove at the front end is connected to the bearing in the through groove 1 702. Through grooves 2 703 are opened on both sides of the lower front end of the cutting base 701. The through grooves 2 703 are also connected to the rotating shaft 2 705 with a groove at the front end. In order to have better driving, the rear ends of the rotating shafts 2 705 on both sides are fixedly connected with motors 2 709. At the same time, it is worth noting that in order to enable the motor 2 709 to obtain energy, the motor 2 709 is electrically connected to the external power equipment, and the motor base 2 710 is used to fix the motor 2 709 on the On the cutting base 701, the rear end of the rotating shaft 1 704 is rotatably connected to the baffle frame 711, and the front end of the baffle frame 711 is fixedly connected to the cutting base 701. At the same time, two auxiliary wheels are installed on the cutting device 7. First, the pulley seats 706 are fixedly connected to the two sides of the lower front end of the cutting base 701, wherein the pulley seat 706 is located between the rotating shafts 2 705 on both sides, and rolling wheels 707 are arranged on the pulley seats 706 on both sides. Then, a cutting saw rope 708 is arranged in front of the cutting base 701. It is worth noting that the cutting saw rope 708 is wound around the rolling wheel 707, the groove of the rotating shaft 2 705 and the groove of the rotating shaft 1 704. In addition, when the cutting saw rope 708 rotates, it will not fall off because it is in the groove of the rotating shaft 1 705 and the groove of the rotating shaft 2 704.

[0035] The technical effect achieved by the technical solution composed of the above-mentioned technical features is: when the silicon rod 12 needs to be cut, first, the motors 2 709 on both sides each drive the corresponding rotating shaft 2 705 to rotate, and when the rotating shaft 2 705 starts to rotate, the cutting saw rope 708 starts to rotate following the rotating shaft 2 705. It is worth noting that the rotating shaft 1 704 exists as an idle shaft and only serves as a stable operating shaft. When the cutting device 7 descends to a certain distance, the cutting saw rope 708 starts to cut the silicon rod 12. At this time, the silicon rod 12 begins to cause the cutting saw rope 708 at the bottom to deform and move upward, but the previously arranged rolling wheel 707 will offset this part of the deformation.

[0036] In order to further explain the specific working principle of the raw material slicing device for semiconductor chip processing of the utility model, the clamping device 11 includes a fixed plate 1101 fixedly connected to the base plate seat 1, firstly, a baffle 1103 is fixedly connected to the top of the fixed plate 1101 close to the controller 8, and then a light rod 1102 is rotatably connected to the side of the baffle 1103 away from the controller 8, and the end of the light rod 1102 away from the baffle 1103 is fixedly connected to the motor 3 1104, and the motor 3 1104 is electrically connected to the external power source. It is worth noting that It is worth noting that here the motor three 1104 is fixedly connected to the fixed plate 1101 by the motor seat three 1105, and at the same time, the threaded portion one 1106 and the threaded portion two 1107 are respectively provided on the light rod 1102, and the spiral rotation directions of the threaded portion one 1106 and the threaded portion two 1107 are opposite, and finally the threaded portion one 1106 and the threaded portion two 1107 are respectively threadedly connected with the clamping block one 1108 and the clamping block two 1109. It should be noted that the clamping block one 1108 and the clamping block two 1109 are both slidably connected to the fixed plate 1101.

[0037] The technical effect achieved by the technical scheme composed of the above-mentioned technical features is: when clamping is required, the motor three 1104 will first drive the light rod 1102 to rotate, and at the same time, the threaded portion 1106 and the threaded portion 1107 on the light rod 1102 will rotate together with the light rod 1102. Since the rotation directions of the threaded portion 1106 and the threaded portion 1107 are opposite, the clamping block 1108 and the clamping block 1109 threadedly connected with the threaded portion 1106 and the threaded portion 1107 will slide toward or away from each other synchronously on the fixed plate 1101 when the light rod 1102 rotates. When the clamping block 1108 and the clamping block 1109 clamp the silicon rod 12 at the same time, the motor three 1104 stops rotating.

[0038] It is also worth noting that the electrical components required in this article are all electrically connected to the external main controller and 220V AC power, and the main controller can be a conventional known device that controls a computer, etc. The specific implementation method of the present disclosure omits the detailed description of known functions and known components. To ensure the compatibility of the equipment, the operating methods used are consistent with the parameters of marketed equipment.

[0039] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.

Claims

1. A raw material slicing device for semiconductor chip processing, comprising a base plate (1), characterized in that: The front and rear parts of both sides of the base plate seat (1) are fixedly connected with connecting seats (2); the middle parts of both sides of the top of the base plate seat (1) are slidably connected with support plates (3); the top of the support plate (3) is fixedly connected with a top seat (4); both sides of the bottom of the top seat (4) are fixedly connected with hydraulic telescopic cylinders (5); the hydraulic telescopic cylinders (5) are located between the support plates (3) on both sides; the bottom ends of the hydraulic telescopic cylinders (5) on both sides are fixedly connected with connecting plates (6); cutting devices (7) are arranged on the adjacent sides of the connecting plates (6) on both sides; a controller (8) is arranged on one side of the front part of the top of the base plate seat (1); a limiting block 1 (9) is fixedly connected to the middle of the front part of the top of the base plate seat (1); and a plurality of limiting blocks 2 (10) arranged in a longitudinal direction are arranged directly behind the limiting block 1 (9). The second limit block (10) is fixedly connected to the base plate seat (1); a clamping device (11) is arranged in the middle of the rear part of the top end of the base plate seat (1); a silicon rod (12) is arranged on the first limit block (9) and the second limit block (10); the rear part of the silicon rod (12) is located in the clamping device (11); the bottom ends of the adjacent sides of the support plates (3) on both sides are fixedly connected to threaded blocks (13); a screw rod (14) is threadedly connected to the threaded blocks (13); the front ends of the screw rods (14) on both sides are rotatably connected to stoppers (15); the stoppers (15) are fixedly connected to the base plate seat (1); the rear ends of the screw rods (14) on both sides are fixedly connected to motor one (16); the motor one (16) is fixedly connected to the base plate seat (1) by means of a motor seat one (17).

2. A raw material slicing device for semiconductor chip processing according to claim 1, characterized in that: The cutting device (7) comprises a cutting base (701) fixedly connected to the connecting plate (6); a through slot 1 (702) is provided in the middle of the upper front end of the cutting base (701); through slots 2 (703) are provided on both sides of the lower front end of the cutting base (701); a rotating shaft 1 (704) is connected to a bearing in the through slot 1 (702); and a rotating shaft 2 (705) is connected to a bearing in the through slot 2 (703).

3. A raw material slicing device for semiconductor chip processing according to claim 2, characterized in that: Pulley seats (706) are fixedly connected to both sides of the lower front end of the cutting base (701), and the pulley seats (706) are located between the rotating shafts (705) on both sides. Rolling wheels (707) are arranged on the pulley seats (706) on both sides. A cutting saw rope (708) is arranged in front of the cutting base (701), and the cutting saw rope (708) is wound around the rolling wheels (707), the rotating shaft (705) and the rotating shaft (704).

4. A raw material slicing device for semiconductor chip processing according to claim 3, characterized in that: The rear ends of the rotating shafts 2 (705) on both sides are fixedly connected to motors 2 (709), and the motors 2 (709) are fixedly connected to the cutting base (701) by means of motor bases 2 (710). The rear end of the rotating shaft 1 (704) is rotatably connected to a baffle frame (711), and the front end of the baffle frame (711) is fixedly connected to the cutting base (701).

5. The raw material slicing device for semiconductor chip processing according to claim 1, characterized in that: The clamping device (11) comprises a fixing plate (1101) fixedly connected to the base plate seat (1), a light rod (1102) is arranged above the fixing plate (1101), and a baffle (1103) is rotatably connected to one end of the light rod (1102) close to the controller (8), and the baffle (1103) is fixedly connected to the fixing plate (1101).

6. A raw material slicing device for semiconductor chip processing according to claim 5, characterized in that: One end of the polished rod (1102) away from the baffle (1103) is fixedly connected to a motor three (1104), and the motor three (1104) is fixedly connected to the fixed plate (1101) by providing a motor seat three (1105).

7. A raw material slicing device for semiconductor chip processing according to claim 6, characterized in that: The bare rod (1102) is respectively provided with a threaded portion 1 (1106) and a threaded portion 2 (1107) with opposite thread rotation directions, and the threaded portion 1 (1106) and the threaded portion 2 (1107) are respectively threadedly connected with a clamping block 1 (1108) and a clamping block 2 (1109), and the clamping block 1 (1108) and the clamping block 2 (1109) are both slidably connected to the fixed plate (1101).

Citation Information

Patent Citations

  • Silicon carbide chip slicing device with high yield

    CN218195456U