A new type of electroplating experimental tank

Abstract

The utility model relates to the technical field of electroplating, and specifically discloses a novel electroplating experimental tank, including an experimental tank, five slots are respectively provided on the front and rear sides of the inner wall of the experimental tank, and the ten slots correspond to each other in pairs. Four bottom pipes are fixedly provided at the bottom of the inner wall of the experimental tank, and each bottom pipe is provided with a plurality of pipe holes, and the plurality of pipe holes are located on the side of the bottom pipe away from the bottom of the experimental tank; the five slots on the same side have the same spacing, and a baffle is detachably provided on the upper side of the experimental tank, and the two sides of the baffle are respectively located in two corresponding slots, and the baffle is a square structure, and a square slot is provided on the upper side of the baffle, and three guide holes are provided below the baffle, and the height of the plurality of slots is the same as the inner wall height of the experimental tank. The utility model can solve the phenomenon of uneven thickness of electroplated copper caused by uneven current distribution, and is suitable for current densities with different requirements.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to a novel electroplating experimental tank. Background Art

[0002] The electroplating test tank is the most basic experimental equipment in the electroplating equipment. Its main function is to install the electroplating solution and provide a device to facilitate the fixing of the electroplating anode and the electroplating cathode. The electroplating test tank generally includes a single-sided electroplating test tank and a double-sided electroplating test tank, so as to simulate the electroplating effect of the production line according to the manual process. The electroplating test tank can be used to evaluate the effect of the electroplating solution, the impact of the current density, the electrode distance, etc. on the electroplating coating such as surface electroplating and through-hole electroplating.

[0003] At present, the existing technology still has the following areas for improvement: In the existing technology, due to the small size of the experimental tank, the current distribution at various positions from the anode plate to the sample plate is uneven, and the edge current density is greater than the middle current density. This will cause the problem of uneven electroplated copper thickness, making it difficult to achieve the expected electroplating effect. Too thick areas are prone to defects such as roughness, nodules, and shedding, while too thin areas have poor gloss, dark and foggy appearance, and are easy to expose the bottom during the light emission and passivation process. This phenomenon of uneven coating thickness often leads to a large proportion of edge effects in such a small experimental tank, and the negative impact on copper thickness and coating effect is far greater than that of the actual production line, and the reliability of experimental data is reduced. Utility Model Content

[0004] In order to solve the above-mentioned problems existing in the prior art, the utility model provides a novel electroplating experimental tank, which can improve the uneven thickness of electroplated copper caused by uneven edge current distribution through the design of the frame and baffle structure, and can adjust the distance between the electroplating anode and the electroplating cathode, which can be suitable for the needs of current density experiments with different requirements.

[0005] The purpose of the utility model can be achieved through the following technical solutions:

[0006] A novel electroplating experimental tank, comprising an experimental tank, wherein five slots are respectively provided on the front and rear sides of the inner wall of the experimental tank, and the ten slots correspond to each other in pairs; four bottom pipes are fixedly provided at the bottom of the inner wall of the experimental tank, and each of the bottom pipes is provided with a plurality of pipe holes, and the plurality of pipe holes are located on a side of the bottom pipe away from the bottom of the experimental tank;

[0007] The five slots on the same side have the same spacing between them. A baffle is detachably provided on the top of the experimental slot. Both sides of the baffle are respectively located in two corresponding slots. The baffle is a square structure. A square slot is provided on the top of the baffle. Three guide holes are provided on the bottom of the baffle. The height of the multiple slots is the same as the height of the inner wall of the experimental slot.

[0008] Furthermore, the lower end of the baffle contacts the bottom of the inner wall of the experimental tank.

[0009] Furthermore, two curved plates are detachably provided in the experimental tank, and both of the two curved plates are arc-shaped structures.

[0010] Furthermore, two ends of each of the bent plates are respectively located in two slots on the same side.

[0011] Furthermore, the height of the two curved plates is the same as the height of the inner wall of the test tank.

[0012] Furthermore, the bottom pipe is filled with air.

[0013] The beneficial effects of the utility model are:

[0014] (1) By setting the baffle and the experimental tank, the technical effect that can be achieved is that the baffle can effectively block the electric lines in the electroplating solution in the experimental tank, which can improve the uneven thickness of the electroplated copper caused by the uneven current distribution. The baffle is easy to disassemble and adjust the position, which is suitable for current densities with different requirements, and improves the adaptability of the experimental tank.

[0015] (2) By setting up the bottom pipe, the technical effect that can be achieved is that the bottom pipe is used to introduce air bubbling to achieve the exchange flow of the plating solution and adjust the concentration of the plating solution to be consistent.

[0016] (3) By setting the curved plates, the technical effect that can be achieved is that the curved plates are used to block the electric lines of the electroplating solution and prevent the current density from being uneven. The number of curved plates can be changed according to demand, and the applicability is strong.

[0017] (4) By setting up multiple slots, the technical effect that can be achieved is that the multiple slots can easily adjust the distance between the anode and cathode samples and improve the experimental conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings.

[0019] Figure 1 It is a three-dimensional diagram of the first embodiment;

[0020] Figure 2 This is a top view of the embodiment 1 with the baffle removed;

[0021] Figure 3 It is a left sectional view of the first embodiment;

[0022] Figure 4 It is a stereogram of the second embodiment;

[0023] Description of main component symbols:

[0024] In the figure: 1. Experimental trough; 2. Baffle; 3. Slot; 4. Diversion hole; 5. Bottom pipe; 6. Pipe hole; 7. Square groove; 8. Bending plate. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application; obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application without making creative work are within the scope of protection of the present application.

[0026] In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0027] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] Embodiment 1:

[0029] Reference Figures 1 to 3 , is a new type of electroplating experimental tank disclosed by the utility model, including an experimental tank 1, five slots 3 are respectively opened on the front and back sides of the inner wall of the experimental tank 1, and the ten slots 3 correspond to each other in pairs. Four bottom pipes 5 are fixedly arranged at the bottom of the inner wall of the experimental tank 1, and each bottom pipe 5 is opened with a plurality of pipe holes 6, and the plurality of pipe holes 6 are located on the side of the bottom pipe 5 away from the bottom of the experimental tank 1.

[0030] The five slots 3 on the same side have the same spacing. A baffle 2 is detachably provided on the experimental tank 1. Both sides of the baffle 2 are located in two corresponding slots 3. The baffle 2 is a square structure. A square slot 7 is provided on the top of the baffle 2. Three guide holes 4 are provided below the baffle 2. The height of the multiple slots 3 is the same as the inner wall height of the experimental tank 1. The ten slots 3 can easily adjust the distance between the anode and cathode samples to improve the experimental conditions.

[0031] The lower end of the baffle 2 contacts the bottom of the inner wall of the test tank 1, and air is in the bottom pipe 5. The positions of the multiple baffles 2 can be adjusted according to the needs, and the adaptability is strong.

[0032] The baffle 2 effectively blocks the electric lines in the electroplating solution of the experimental tank 1, which can improve the uneven thickness of the electroplated copper caused by uneven current distribution. The baffle 2 is easy to disassemble and adjust the position, is suitable for current densities with different requirements, and improves the adaptability of the experimental tank 1.

[0033] The square slot 7 is used to place the sample for double-sided electroplating. The window at the bottom of the baffle 2 ensures the flow of the tank liquid. At the same time, this board frame reduces the uneven distribution of power lines and improves the uniformity of small slot electroplating.

[0034] The bottom pipe 5 is used to introduce air bubbling to achieve exchange flow of the electroplating solution and adjust the concentration of the electroplating solution to be consistent.

[0035] Embodiment 2:

[0036] Reference Figure 4 A novel electroplating experimental tank is provided. The difference from the first embodiment is that two bending plates 8 are detachably provided in the experimental tank 1, and both bending plates 8 are arc-shaped structures.

[0037] The two ends of each bending plate 8 are respectively located in two slots 3 on the same side, and the bending plate 8 is slidably connected to the slot 3. The height of the two bending plates 8 is the same as the height of the inner wall of the test tank 1.

[0038] The curved plate 8 is used to block the electric lines of the electroplating solution to prevent uneven current density. The number of curved plates 8 can be changed according to demand. It has strong applicability and can shield the electric lines radiating from the surroundings to improve the current uniformity in the electroplating solution.

[0039] The working principle and use process of the utility model are as follows: a sample is placed on a square groove 7, two sides of a baffle 2 are inserted into slots 3 of an experimental groove 1, the baffle 2 blocks the flow of the electroplating solution, and the electroplating solution flows out from three guide holes 4.

[0040] Two curved plates 8 are placed in the slots 3 of the experimental tank 1. The two curved plates 8 hinder the flow of the electroplating solution. Air bubbles are input into the bottom pipe 5 to achieve exchange flow of the electroplating solution and make the current density more uniform.

[0041] The above are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A new type of electroplating test tank, characterized by: The experimental tank comprises an experimental tank, wherein five slots are respectively provided on the front and rear sides of the inner wall of the experimental tank, and the ten slots correspond to each other in pairs. Four bottom pipes are fixedly provided at the bottom of the inner wall of the experimental tank, and each of the bottom pipes is provided with a plurality of pipe holes, and the plurality of pipe holes are located on a side of the bottom pipe away from the bottom of the experimental tank; The five slots on the same side have the same spacing between them. A baffle is detachably provided on the top of the experimental slot. Both sides of the baffle are respectively located in two corresponding slots. The baffle is a square structure. A square slot is provided on the top of the baffle. Three guide holes are provided on the bottom of the baffle. The height of the multiple slots is the same as the height of the inner wall of the experimental slot.

2. A novel electroplating test tank according to claim 1, characterized in that: The lower end of the baffle contacts the bottom of the inner wall of the experimental tank.

3. A novel electroplating test tank according to claim 1, characterized in that: Two curved plates are detachably arranged in the experimental tank, and both of the curved plates are arc-shaped structures.

4. A novel electroplating test tank according to claim 3, characterized in that: Two ends of each of the bent plates are respectively located in two slots on the same side.

5. A novel electroplating test tank according to claim 4, characterized in that: The height of the two curved plates is the same as the height of the inner wall of the test tank.

6. A novel electroplating test tank according to claim 1, characterized in that: The bottom pipe contains air.

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