Electroplating device for metal packaging shell of semiconductor integrated circuit

Abstract

The utility model is applicable to the technical field of semiconductor integrated circuit metal package shell processing, and provides an electroplating device for semiconductor integrated circuit metal package shell, including: a base; an electroplating tank fixedly installed on the top of the base, the electroplating tank is used to electroplate the semiconductor integrated circuit metal package shell, and the electroplating tank is equipped with a conductive rod extending into the electroplating liquid and electrically connected to the positive pole of the power supply of the external device; a top plate arranged directly above the electroplating tank, and two symmetrically arranged side plates are fixedly installed at the bottom of the top plate, and a rolling plating mechanism for rolling and electroplating the semiconductor integrated circuit metal package shell is installed between the two side plates. The electroplating device for semiconductor integrated circuit metal package shell provided by this scheme realizes efficient and uniform electroplating of the semiconductor integrated circuit metal package shell, significantly improves the quality and efficiency of the electroplating operation, and brings higher economic benefits to users.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor integrated circuit metal packaging shell processing, in particular to an electroplating device for a semiconductor integrated circuit metal packaging shell. Background Art

[0002] With the continuous development of science and technology, semiconductor integrated circuits have become an indispensable core component in modern electronic devices. In order to protect integrated circuits from the influence of the external environment, provide a stable working environment, and enhance the reliability and performance of integrated circuits, metal packaging shells are widely used in the packaging process of integrated circuits. Metal packaging shells not only play the role of circuit support, electrical signal transmission, heat dissipation, sealing and chemical protection, but also improve the seismic and impact resistance of integrated circuits.

[0003] In the process of making metal package shells, electroplating technology plays a vital role. Electroplating is a process of depositing a layer of metal or alloy on the metal surface by electrochemical method, which can enhance the corrosion resistance, conductivity, aesthetics and other functions of the metal surface. In the manufacturing process of semiconductor integrated circuit metal package shells, electroplating technology is used to deposit a layer of metal layer with good conductivity, corrosion resistance and aesthetics on the surface of the metal shell, such as gold, silver, nickel, etc.

[0004] However, there are some problems with conventional electroplating devices in the manufacturing process of semiconductor integrated circuit metal packaging shells. For example, when electroplating some small-volume metal packaging shells produced in batches, there is a problem of uneven distribution of plating liquid components during the electroplating process, which can easily lead to unstable product electroplating quality, thereby affecting the performance and quality of the metal packaging shell; and there is also a problem of low electroplating efficiency.

[0005] In view of the above problems, the present invention provides an electroplating device for a metal package shell of a semiconductor integrated circuit. Utility Model Content

[0006] In order to solve the technical problems of uneven distribution of plating liquid components and low plating efficiency during the electroplating process for metal packaging shells of small volume produced in batches, the utility model provides an electroplating device for semiconductor integrated circuit metal packaging shells.

[0007] The utility model is implemented as follows: a plating device for a semiconductor integrated circuit metal packaging shell, comprising: a base; a plating tank fixedly mounted on the top of the base, the plating tank being used to electroplate the semiconductor integrated circuit metal packaging shell, the plating tank being provided with a conductive rod extending into the plating solution and electrically connected to the positive pole of an external power supply; a top plate arranged directly above the plating tank, two symmetrically arranged side plates fixedly mounted on the bottom of the top plate, a rolling plating mechanism for rolling the semiconductor integrated circuit metal packaging shell for electroplating it is arranged between the two side plates.

[0008] Preferably, the roller plating mechanism includes: a conductive roller arranged directly above the electroplating tank, the arc-shaped surface of the conductive roller being evenly distributed with a number of mesh holes; two support plates respectively fixedly installed on both sides of the conductive roller, the two support plates are circular, a plurality of support rods are fixedly installed between the two support plates, the outer wall of the conductive roller is fixedly connected to the plurality of support rods, the support plates and the support rods are used to support the conductive roller; two rotating tubes fixedly installed on the side away from each other of the two support plates, the two rotating tubes are respectively rotatably connected to the two side plates; a driving mechanism arranged on the top plate and any side plate, the driving mechanism is used to drive the conductive roller to rotate.

[0009] Preferably, the driving mechanism includes: a rotating shaft rotatably mounted on any side panel, a spur gear fixedly sleeved on one end of the rotating shaft, a ring gear fixedly sleeved on the outer wall of the support plate below the spur gear, and the spur gear meshes with the ring gear; a reduction motor fixedly mounted on the top of the top plate; two sprockets fixedly sleeved on the output shaft of the reduction motor and one end of the rotating shaft, respectively, and the same chain is sleeved on the two sprockets.

[0010] Preferably, a support frame is fixedly installed on the side plate away from the ring gear, a conductive slip ring is installed on one side of the support frame, the rotor of the conductive slip ring is fixedly connected to the inner wall of the corresponding rotating tube, the conductive slip ring is arranged cocentrically with the rotating tube, and both ends of the conductive slip ring are electrically connected to one side of the conductive roller and the negative pole of the external power supply through wires.

[0011] Preferably, the top plate and the corresponding side plate are fixedly mounted with a same protective cover, and the reduction motor, two sprockets and the chain are all located inside the protective cover.

[0012] Preferably, two symmetrically arranged electric slide rails are fixedly installed on the top of the base for horizontally moving the conductive roller and the metal packaging shell of the semiconductor integrated circuit therein; electric telescopic rods are fixedly installed on the slide seats of the two electric slide rails; the top ends of the output rods of the two electric telescopic rods are fixedly connected to the bottom of the top plate for lifting the top plate, thereby lifting the conductive roller and the metal packaging shell of the semiconductor integrated circuit therein.

[0013] Preferably, the conductive roller is provided with a feeding port and is hingedly provided with a cover mesh plate, and a fixing mechanism is installed on the cover mesh plate for fixing the cover mesh plate when the cover mesh plate closes the feeding port, and the fixing mechanism includes: a mounting sleeve fixedly installed on the cover mesh plate, a spring being arranged in the mounting sleeve; two pin rods both slidably installed on the inner wall of the mounting sleeve, and the two pin rods are symmetrically arranged; two shifting blocks respectively fixedly installed on the top of the two pin rods, and the two shifting blocks respectively penetrate the sliding holes opened on the top of the mounting sleeve; and a limiting sleeve both fixedly installed on the conductive roller, and the two pin rods respectively extend into the two limiting sleeves.

[0014] Compared with the related art, the electroplating device for semiconductor integrated circuit metal packaging shell provided by the utility model has the following beneficial effects:

[0015] Firstly, by arranging the roller plating mechanism on the two side plates at the bottom of the top plate, the utility model can perform electroplating operations on batches of semiconductor integrated circuit metal package shells, significantly improving the electroplating efficiency. At the same time, the design of the roller plating mechanism enables the semiconductor integrated circuit metal package shell to roll in the electroplating solution, effectively avoiding the problem of uneven contact between the shell and the electroplating solution components, thereby eliminating the electroplating quality problem that may be caused by the uneven distribution of the electroplating solution components.

[0016] Secondly, the utility model is provided with a feeding port and a cover screen on the conductive roller, and is equipped with a fixing mechanism, so that the feeding and closing process is more convenient and firmly fixed, and effectively prevents the cover screen from being opened due to vibration or external force, thereby ensuring the stability and continuity of the electroplating process;

[0017] In addition, the utility model also cleverly utilizes the combined design of the electric slide rail and the electric telescopic rod to achieve precise horizontal movement and vertical lifting of the conductive roller and its internal semiconductor integrated circuit metal packaging shell, greatly improving the quality and efficiency of the electroplating operation. This design not only improves the degree of automation of the operation, but also reduces the difficulty of operation, making the electroplating process simpler and more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the front cross-sectional structure of an electroplating device for a metal package shell of a semiconductor integrated circuit provided by the utility model;

[0019] Figure 2 for Figure 1 An enlarged structural diagram of part A shown in FIG.

[0020] Figure 3 for Figure 1 An enlarged schematic diagram of the structure of part B shown in FIG.

[0021] Figure 4 It is a side view structural schematic diagram of the utility model;

[0022] Figure 5 It is a schematic diagram of the three-dimensional structure of the cover screen on the conductive roller in the utility model when it is opened;

[0023] Figure 6 It is a front view structural schematic diagram of the cover mesh plate on the conductive roller in the utility model when it is closed;

[0024] Figure 7 for Figure 6 Schematic diagram of the enlarged structure of part C shown in FIG.

[0025] Figure numerals: 1. base; 2. electroplating tank; 3. electric slide rail; 4. electric telescopic rod; 5. top plate; 6. side plate; 7. support plate; 8. support rod; 9. conductive roller; 10. rotating tube; 11. support frame; 12. conductive slip ring; 13. conductive rod; 14. ring gear; 15. rotating shaft; 16. spur gear; 17. reduction motor; 18. sprocket; 19. chain; 20. protective cover; 91. cover mesh plate; 92. mounting sleeve; 93. pin rod; 94. shift block; 95. spring; 96. limiting sleeve. DETAILED DESCRIPTION

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification of this application and the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0027] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0028] The utility model provides an electroplating device for a metal package shell of a semiconductor integrated circuit, such as Figure 1-7 As shown, the electroplating device for the metal package shell of the semiconductor integrated circuit comprises: a base 1; an electroplating tank 2 fixedly mounted on the top of the base 1, the electroplating tank 2 is used to electroplate the metal package shell of the semiconductor integrated circuit, and the electroplating tank 2 is equipped with a conductive rod 13 extending into the plating solution and electrically connected to the positive pole of the power supply of the external device; a top plate 5 arranged directly above the electroplating tank 2, two symmetrically arranged side plates 6 are fixedly mounted on the bottom of the top plate 5, and a rolling plating mechanism for rolling the metal package shell of the semiconductor integrated circuit for electroplating is installed between the two side plates 6.

[0029] In this embodiment, the electroplating device is mainly composed of an electroplating tank 2 and a roller plating mechanism on a base 1, and a top plate 5 is provided, and two side plates 6 are provided at the bottom of the top plate 5 for installing the roller plating mechanism. By adding the required plating solution into the electroplating tank 2, a batch of semiconductor integrated circuit metal packaging shells are placed in the plating solution through the roller plating mechanism for electroplating. Through batch electroplating operations, the electroplating efficiency is improved.

[0030] In a further preferred embodiment of the utility model, the roller plating mechanism includes: a conductive roller 9 arranged directly above the electroplating tank 2, and the arc-shaped surface of the conductive roller 9 is evenly distributed with a number of mesh holes; two support plates 7 respectively fixedly installed on both sides of the conductive roller 9, the two support plates 7 are both circular, and a plurality of support rods 8 are fixedly installed between the two support plates 7, the outer wall of the conductive roller 9 is fixedly connected to the plurality of support rods 8, and the support plates 7 and the support rods 8 are used to support the conductive roller 9; two rotating tubes 10 fixedly installed on the side away from each other of the two support plates 7, and the two rotating tubes 10 are respectively rotatably connected to the two side plates 6; a driving mechanism arranged on the top plate 5 and any side plate 6, and the driving mechanism is used to drive the conductive roller 9 to rotate.

[0031] In this embodiment, the specific structure of the roller plating mechanism is further described in detail. The design of this roller plating mechanism cleverly solves the problem of uneven distribution of plating solution components and improves the electroplating efficiency.

[0032] First, the roller plating mechanism includes a conductive roller 9, which is arranged directly above the electroplating tank 2. There are several meshes evenly distributed on the arc surface of the conductive roller 9, which allow the electroplating solution to penetrate into it, thereby ensuring that the conductive roller 9 can evenly distribute the electroplating solution to every part of the metal package shell of the semiconductor integrated circuit when rolling. The conductive roller 9 is supported by two support plates 7 and a plurality of support rods 8. The two support plates 7 are circular and are fixedly mounted on both sides of the conductive roller 9. The plurality of support rods 8 are connected between the two support plates 7 and are fixedly connected to the outer wall of the conductive roller 9, thereby ensuring that the conductive roller 9 can remain stable when rotating. In addition, two rotating tubes 10 are fixedly installed on the sides of the two support plates 7 away from each other. The two rotating tubes 10 are rotatably connected to the two side plates 6, which means that the conductive roller 9 can rotate freely between the side plates 6 under the guidance of the rotating tubes 10. Finally, the roller plating mechanism also includes a driving mechanism, which is arranged on the top plate 5 and any side plate 6. This driving mechanism is used to drive the conductive roller 9 to rotate, thereby driving the metal package shell of the semiconductor integrated circuit to roll in the electroplating solution.

[0033] Through this design, the rolling action of the conductive roller 9 not only solves the problem of uneven distribution of the electroplating solution components, but also significantly improves the electroplating efficiency. At the same time, the use of the drive mechanism also ensures that the conductive roller 9 can rotate at a stable speed, thereby further improving product quality and production efficiency.

[0034] In a further preferred embodiment of the present invention, the driving mechanism (such as Figure 3 The invention discloses a rotating shaft 15 as shown in the figure, comprising: a rotating shaft 15 rotatably mounted on any side plate 6, one end of the rotating shaft 15 is fixedly sleeved with a spur gear 16, an outer wall of the support plate 7 below the spur gear 16 is fixedly sleeved with a ring gear 14, the spur gear 16 is meshed with the ring gear 14; a reduction motor 17 fixedly mounted on the top of the top plate 5; two sprockets 18 fixedly sleeved on the output shaft of the reduction motor 17 and one end of the rotating shaft 15, respectively, and the two sprockets 18 are sleeved with the same chain 19.

[0035] In this embodiment, the design of the driving mechanism is described in detail. This driving mechanism achieves precise control of the conductive roller 9 through a clever structural combination, thereby ensuring the stability and efficiency of the electroplating process. Specifically, the driving mechanism includes a rotating shaft 15 rotatably mounted on any side plate 6. A spur gear 16 is fixedly sleeved at one end of the rotating shaft 15. And on the outer wall of the support plate 7 below the spur gear 16, a ring gear 14 is fixedly sleeved. The spur gear 16 is meshed with the ring gear 14, which means that when the spur gear 16 rotates, it drives the ring gear 14 to rotate together, thereby achieving the driving of the conductive roller 9. In addition, the driving mechanism also includes a reduction motor 17 fixedly mounted on the top of the top plate 5. The output shaft of the reduction motor 17 and one end of the rotating shaft 15 are respectively fixedly sleeved with two sprockets 18. The two sprockets 18 are sleeved with the same chain 19. This chain drive design allows the power of the reduction motor 17 to be transmitted to the rotating shaft 15 through the chain 19, thereby achieving the driving of the conductive roller 9.

[0036] Through this design, the driving mechanism can realize accurate control of the conductive roller 9, including the rotation speed and rotation direction, etc. At the same time, due to the use of the reduction motor 17, the reduction drive of the conductive roller 9 can also be realized, thereby ensuring the stability and efficiency of the electroplating process.

[0037] In a further preferred embodiment of the present invention, a support frame 11 (such as Figure 2 As shown), a conductive slip ring 12 is installed on one side of the support frame 11, and the rotor of the conductive slip ring 12 is fixedly connected to the inner wall of the corresponding rotating tube 10. The conductive slip ring 12 is arranged cocentrically with the rotating tube 10, and both ends of the conductive slip ring 12 are electrically connected to one side of the conductive roller 9 and the negative pole of the external power supply through wires.

[0038] In this embodiment, the power supply method of the conductive roller 9 is optimized. Specifically, a support frame 11 is fixedly installed on the side plate 6 away from the ring gear 14. A conductive slip ring 12 is installed on one side of the support frame 11, and the rotor of the conductive slip ring 12 is fixedly connected to the inner wall of the corresponding rotating tube 10. This design allows the conductive slip ring 12 to be arranged coaxially with the rotating tube 10, ensuring that the conductive slip ring 12 can remain stable when the rotating tube 10 rotates.

[0039] More importantly, the two ends of the conductive slip ring 12 are electrically connected to one side of the conductive roller 9 and the negative pole of the external power supply through wires. In this way, when the conductive roller 9 rolls in the roller plating mechanism, it can maintain a stable electrical connection with the external power supply through the conductive slip ring 12. This design not only ensures that the conductive roller 9 can continuously obtain current during the rotation process, thereby maintaining a stable electroplating effect, but also greatly improves the efficiency and quality of the electroplating operation.

[0040] In general, the arrangement of the conductive slip ring 12 is one of the important innovations of the utility model. It not only solves the problem of unstable power supply of the conductive roller 9 in the traditional electroplating device, but also improves the manufacturing efficiency and quality of the metal packaging shell of the semiconductor integrated circuit. This device has broad application prospects and market potential, and is expected to be widely used in the future.

[0041] In a further preferred embodiment of the present invention, the top plate 5 and the corresponding side plate 6 are fixedly mounted with a same protective cover 20 (such as Figure 3 As shown), the reduction motor 17, the two sprockets 18 and the chain 19 are all located in the protective cover 20.

[0042] In this embodiment, in order to improve the safety and reliability of the equipment, a protective cover 20 is fixedly installed on the top plate 5 and the corresponding side plate 6. This protective cover 20 is a cover with a solid structure and good sealing performance, which is used to completely cover the reduction motor 17, the two sprockets 18 and the chain 19. Through the wrapping of the protective cover 20, it is possible to effectively prevent external impurities, dust or splashing plating liquid from entering the interior of the drive mechanism, thereby protecting the precision parts inside it from damage. This not only extends the service life of the drive mechanism, but also reduces the maintenance and replacement required due to failures. Secondly, the protective cover 20 also has a certain sound insulation effect, which can reduce the noise generated by the drive mechanism during operation, thereby improving the working environment and reducing noise interference to the operator.

[0043] In addition, the protective cover 20 also has a certain safety protection function. Since the reduction motor 17 and sprocket chain and other components in the driving mechanism may cause certain safety risks when running at high speed, the presence of the protective cover 20 can effectively prevent the operator from accidentally contacting these rotating components, thereby avoiding possible injury accidents.

[0044] In a further preferred embodiment of the present invention, two symmetrically arranged electric slide rails 3 (such as Figure 1 , 4 As shown), it is used to horizontally move the conductive roller 9 and the metal packaging shell of the semiconductor integrated circuit therein, and the slide seats of the two electric slide rails 3 are fixedly installed with electric telescopic rods 4, and the top ends of the output rods of the two electric telescopic rods 4 are fixedly connected to the bottom of the top plate 5, which are used to lift the top plate 5, thereby lifting the conductive roller 9 and the metal packaging shell of the semiconductor integrated circuit therein.

[0045] In this embodiment, the moving and lifting mechanism of the device is designed and optimized in detail. Specifically, two symmetrically arranged electric slide rails 3 are fixedly installed on the top of the base 1. Electric telescopic rods 4 are fixedly installed on the slide seats of the two electric slide rails 3. The top of the output rod of the electric telescopic rod 4 is fixedly connected to the bottom of the top plate 5.

[0046] The design of the electric telescopic rod 4 enables the top plate 5 and all components on the top plate 5, including the conductive roller 9 and the metal package shell of the semiconductor integrated circuit inside it, to be lifted and lowered in the vertical direction. This lifting function is also very critical in the electroplating process, because it can ensure that the conductive roller 9 and the metal package shell of the semiconductor integrated circuit inside it can be accurately immersed in the electroplating solution, thereby ensuring the uniformity and consistency of the electroplating.

[0047] The design of the electric slide rail 3 enables the conductive roller 9 and the metal package shell of the semiconductor integrated circuit inside to move accurately in the horizontal direction. This movement function is very necessary in the electroplating process, because it can ensure that the conductive roller 9 and the metal package shell of the semiconductor integrated circuit inside can accurately enter and exit the top of the electroplating tank 2. For example, the conductive roller 9 and the metal package shell of the semiconductor integrated circuit after electroplating inside can be moved to the top of the water washing tank through the electric slide rail 3, and then dropped into the hydrolysis tank for water washing through the electric telescopic rod 4 (such as Figure 4 shown).

[0048] In a further preferred embodiment of the present invention, the conductive roller 9 is provided with a feeding port and is hingedly provided with a cover mesh plate 91 (such as Figure 5 , 6 As shown), the cover mesh plate 91 is provided with a fixing mechanism (as shown Figure 7 As shown), it is used to fix the cover mesh plate 91 when the cover mesh plate 91 closes the feeding port, and the fixing mechanism includes: a mounting sleeve 92 fixedly mounted on the cover mesh plate 91, and a spring 95 is arranged in the mounting sleeve 92; two pin rods 93 are slidably mounted on the inner wall of the mounting sleeve 92, and the two pin rods 93 are symmetrically arranged; two shifting blocks 94 are respectively fixedly mounted on the top of the two pin rods 93, and the two shifting blocks 94 respectively pass through the sliding holes opened on the top of the mounting sleeve 92; and limiting sleeves 96 are both fixedly mounted on the conductive roller 9, and the two pin rods 93 extend into the two limiting sleeves 96 respectively.

[0049] In this embodiment, a feeding port is provided on the conductive roller 9, which is used to feed the semiconductor integrated circuit metal packaging shells to be electroplated into the conductive roller 9 in batches, and is also used to discharge the electroplated semiconductor integrated circuit metal packaging shells when the feeding port is facing downward. A cover mesh plate 91 is hinged on the feeding port to close the feeding port. A fixing mechanism is installed on the cover mesh plate 91, which is used to fix the cover mesh plate 91 when the cover mesh plate 91 closes the feeding port. The specific design of this fixing mechanism includes a mounting sleeve 92 fixedly mounted on the cover mesh plate 91, and a spring 95 is arranged in the mounting sleeve 92. In addition, there are two pins 93, which are both slidably mounted on the inner wall of the mounting sleeve 92, and the two pins 93 are symmetrically arranged. At the top of the pin 93, two shifting blocks 94 are respectively fixedly mounted, and the two shifting blocks 94 respectively penetrate the sliding holes opened at the top of the mounting sleeve 92. At the same time, two limit sleeves 96 are also fixedly mounted on the conductive roller 9, and the two pins 93 extend into the two limit sleeves 96 respectively. The design of this fixing mechanism enables the cover mesh plate 91 to automatically extend into the limiting sleeve 96 under the action of the spring 95 when the feed opening is closed, thereby fixing the cover mesh plate 91. When the feed opening needs to be opened, the two shifting blocks 94 are simply moved to bring the two pins 93 closer to each other until they are separated from the two limiting sleeves 96, and the cover mesh plate 91 can be easily opened. This design is not only easy to operate, but also has a good fixing effect, which can ensure that the cover mesh plate 91 remains stable when the feed opening is closed, and prevent the cover mesh plate 91 from being opened when the conductive roller 9 rotates.

[0050] It is worth noting that the circuits, electronic components and modules involved in the utility model are all prior art, which can be fully implemented by those skilled in the art. Needless to say, the content protected by the utility model does not involve improvements to software and methods.

[0051] In addition, the temperature control of the plating solution and the control of the current and voltage are not within the scope of the present invention and will not be described in detail in this invention. Those skilled in the art can clearly understand how to control the temperature, current and voltage of the plating solution through the existing technology.

[0052] This solution also provides an electric control cabinet, which is installed on the equipment. When in use, each electrical equipment can be started and operated separately through the electric control cabinet. The power connection method of each electrical equipment is an existing mature technology, which is a well-known technology for people in this field and will not be elaborated here.

[0053] In summary, compared with the related art, the utility model firstly provides a rolling plating mechanism on the two side plates 6 at the bottom of the top plate 5, so as to perform electroplating operation on batches of semiconductor integrated circuit metal package shells, thereby improving the electroplating efficiency, and can make the semiconductor integrated circuit metal package shell roll in the electroplating solution, thereby avoiding uneven contact between the semiconductor integrated circuit metal package shell and the electroplating solution components, and avoiding the electroplating quality problem caused by the uneven components of the electroplating solution;

[0054] Secondly, by setting a feeding port and a cover mesh plate 91 on the conductive roller 9 and equipping it with a fixing mechanism, the feeding and closing process is more convenient and the fixing is firm, which effectively prevents the cover mesh plate 91 from being opened due to vibration or external force;

[0055] Furthermore, by utilizing the combined design of the electric slide rail 3 and the electric telescopic rod 4, accurate horizontal movement and vertical lifting of the conductive roller 9 and the metal packaging shell of the semiconductor integrated circuit inside it are achieved, which greatly improves the quality and efficiency of the electroplating operation.

[0056] In the several embodiments provided in this application, it should be understood that the disclosed device can be implemented in other ways.

[0057] The above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit the protection scope of the utility model. Obviously, the described embodiments are only some embodiments of the utility model, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Although the utility model has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the utility model according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the utility model in essence, and these technical solutions also belong to the scope of protection of the utility model.

Claims

1. An electroplating device for a metal package shell of a semiconductor integrated circuit, characterized in that: include: Base; An electroplating tank fixedly mounted on the top of the base, the electroplating tank is used to electroplate the metal package shell of the semiconductor integrated circuit, and the electroplating tank is equipped with a conductive rod extending into the electroplating solution and electrically connected to the positive pole of the power supply of the peripheral device; A top plate is arranged just above the electroplating tank, and two symmetrically arranged side plates are fixedly mounted on the bottom of the top plate. A rolling plating mechanism for rolling and electroplating the metal packaging shell of the semiconductor integrated circuit is arranged between the two side plates.

2. The electroplating device for a semiconductor integrated circuit metal package shell according to claim 1, characterized in that: The roller plating mechanism comprises: A conductive roller is arranged directly above the electroplating tank, and a plurality of mesh holes are evenly distributed on the arc surface of the conductive roller; Two support plates are respectively fixedly mounted on both sides of the conductive roller, and both support plates are circular. A plurality of support rods are fixedly mounted between the two support plates, and the outer wall of the conductive roller is fixedly connected to the plurality of support rods. The support plates and support rods are used to support the conductive roller; Two rotating tubes are fixedly mounted on the sides of the two support plates away from each other, and the two rotating tubes are rotatably connected to the two side plates respectively; A driving mechanism is arranged on the top plate and any side plate, and the driving mechanism is used to drive the conductive roller to rotate.

3. The electroplating device for a semiconductor integrated circuit metal package shell as claimed in claim 2, characterized in that: The driving mechanism comprises: A rotating shaft mounted on any side plate is rotatably mounted, a spur gear is fixedly sleeved on one end of the rotating shaft, a ring gear is fixedly sleeved on the outer wall of the support plate below the spur gear, and the spur gear is meshed with the ring gear; A reduction motor fixedly mounted on the top of the top plate; Two sprockets are respectively fixedly sleeved on the output shaft of the reduction motor and one end of the rotating shaft, and the same chain is sleeved on the two sprockets.

4. The electroplating device for a metal package of a semiconductor integrated circuit as claimed in claim 3, characterized in that: A support frame is fixedly installed on the side plate away from the ring gear, a conductive slip ring is installed on one side of the support frame, a rotor of the conductive slip ring is fixedly connected to the inner wall of the corresponding rotating tube, the conductive slip ring is arranged cocentrically with the rotating tube, and two ends of the conductive slip ring are electrically connected to one side of the conductive roller and the negative pole of the external power supply through wires.

5. The electroplating device for a semiconductor integrated circuit metal package shell as claimed in claim 3, characterized in that: The top plate and the corresponding side plate are fixedly mounted with a same protective cover, and the reduction motor, two sprockets and chains are all located inside the protective cover.

6. The electroplating device for a metal package of a semiconductor integrated circuit as claimed in claim 1, characterized in that: Two symmetrically arranged electric slide rails are fixedly installed on the top of the base for horizontally moving the conductive roller and the metal packaging shell of the semiconductor integrated circuit inside it. Electric telescopic rods are fixedly installed on the slide seats of the two electric slide rails. The top ends of the output rods of the two electric telescopic rods are fixedly connected to the bottom of the top plate for lifting the top plate, thereby lifting the conductive roller and the metal packaging shell of the semiconductor integrated circuit inside it.

7. The electroplating device for a semiconductor integrated circuit metal package shell as claimed in claim 2, characterized in that: The conductive roller is provided with a feeding port and is hinged with a cover mesh plate, and a fixing mechanism is installed on the cover mesh plate for fixing the cover mesh plate when the cover mesh plate closes the feeding port, and the fixing mechanism includes: A mounting sleeve fixedly mounted on the cover mesh plate, wherein a spring is arranged in the mounting sleeve; Two pins are slidably mounted on the inner wall of the mounting sleeve, and the two pins are symmetrically arranged; Two shifting blocks are respectively fixedly mounted on the tops of the two pin rods, and the two shifting blocks respectively penetrate the sliding holes opened on the top of the mounting sleeve; The two limiting sleeves are fixedly mounted on the conductive roller, and the two pin rods extend into the two limiting sleeves respectively.

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