Cooling device and air supply device

Abstract

The present disclosure relates to a cooling device and an air supply device, wherein the cooling device is used for a fan, and comprises a housing, wherein the housing is connected to the structural wall of the fan and is arranged along the circumference of the air inlet of the fan, and wherein a chamber for storing and / or circulating a cooling medium is formed inside the housing, so as to be used for heat conduction with the structural wall of the fan. Through the above technical solution, the cooling medium is stored and / or circulated in the chamber, so as to be able to conduct heat exchange with the structural wall of the fan, thereby dissipating heat from the fan. In addition, the housing is arranged along the circumference of the air inlet of the fan, which will not affect the normal air intake of the fan, and reduces the possibility of heat generation caused by the operating resistance generated by the fan during the air intake process.

Description

Technical Field

[0001] The present disclosure relates to the technical field of fan equipment, and in particular, to a cooling device and an air supply device. Background Art

[0002] Fan is a customary abbreviation for gas compression and gas delivery machinery. It is a machine that relies on input mechanical energy to increase gas pressure and deliver gas. It is a driven fluid machine. Commonly referred to fans include ventilators, blowers and wind turbines. Fans will generate heat after being used for a period of time. For example, the temperature of the air at the fan inlet is high, which can easily cause the temperature of the fan to rise. In order to ensure the normal operation of the fan, the fan needs to be cooled.

[0003] In the related art, a heat sink is provided at the air inlet of the fan to dissipate heat from the fan. Cooling water or ventilation can flow through the heat sink so that the fan can be cooled through the heat sink. However, the heat sink makes the air intake of the fan difficult to a certain extent, which easily increases the operating resistance of the fan and causes the fan to heat up. Utility Model Content

[0004] The purpose of the present disclosure is to provide a cooling device and an air supply device, wherein the cooling device has good heat dissipation performance acting on a fan, so as to at least partially solve the above technical problems.

[0005] In order to achieve the above-mentioned purpose, according to a first aspect of the present disclosure, a cooling device is provided for a fan, wherein the cooling device comprises a shell, the shell is connected to the structural wall of the fan and is arranged along the circumference of the air inlet of the fan, and a chamber for storing and / or circulating a cooling medium is formed inside the shell for heat conduction with the structural wall of the fan.

[0006] Optionally, the shell is configured as an annular structure.

[0007] Optionally, the cooling device includes a liquid inlet pipeline and a liquid outlet pipeline connected to the chamber, and a liquid storage structure connected to the liquid inlet pipeline and the liquid outlet pipeline, and at least one of the liquid inlet pipeline, the liquid outlet pipeline and the liquid storage structure is provided with a pump structure.

[0008] Optionally, at least one of the liquid inlet pipeline, the liquid outlet pipeline and the liquid storage structure is provided with a cooler.

[0009] Optionally, the cooling device further comprises a filter screen arranged at the air inlet of the fan, and the filter screen is connected to the inner circumferential wall of the shell.

[0010] Optionally, the filter is arranged at the center of the air inlet of the fan and is connected to the inner circumferential wall of the shell through a steel wire.

[0011] Optionally, the shell is connected to the structural wall of the fan via fastening bolts, and a sealing structure is provided at the connection between the fastening bolts and the shell.

[0012] According to a second aspect of the present disclosure, there is provided an air supply device, comprising a fan and the cooling device as described above.

[0013] Optionally, the air supply device further includes a voltage compensation mechanism electrically connected to the motor of the fan.

[0014] Optionally, the voltage compensation mechanism is configured as a voltage compensator, which includes a capacitor, a capacitor and a transformer arranged in series.

[0015] Through the above technical scheme, the cooling device provided by the present invention can dissipate heat for the fan, and has good heat dissipation performance. Specifically, the cooling device includes a shell connected to the structural wall of the fan, and a chamber is formed inside the shell to store and / or circulate the cooling medium through the chamber, so that heat can be transferred and heat exchanged with the structural wall of the fan to dissipate heat for the fan. At the same time, the shell is arranged along the circumference of the air inlet of the fan, and the cooling effect on the fan will not affect the normal air intake of the fan, thereby reducing the possibility of heat caused by the operating resistance of the fan during the air intake process.

[0016] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0018] Figure 1 Schematic diagram of the overall structure of the air supply device provided in an exemplary embodiment of the present disclosure.

[0019] Description of Reference Numerals

[0020] 1. Fan; 11. Air inlet; 2. Shell; 3. Liquid inlet pipeline; 4. Liquid outlet pipeline; 5. Liquid storage structure; 6. Pump structure; 7. Cooler; 8. Filter; 81. Steel wire; 9. Fastening bolts. DETAILED DESCRIPTION

[0021] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0022] In the present disclosure, unless otherwise stated, "inside" and "outside" refer to the inside and outside of the outline of the corresponding component; "far" and "near" refer to the distance and nearness of the corresponding component in space relative to another component. In addition, the terms "first", "second", etc. used in the present disclosure are to distinguish one element from another element and do not have order and importance. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0023] According to the first aspect of the present disclosure, referring to Figure 1 The present disclosure provides a cooling device for a fan 1, the cooling device comprising a housing 2, the housing 2 being connected to the structural wall of the fan 1 and arranged along the circumference of the air inlet 11 of the fan 1, the housing 2 forming a chamber for storing and / or circulating a cooling medium for heat conduction with the structural wall of the fan 1. The cooling medium can be selected according to actual use conditions, for example, the cooling medium can be water or air, when the heating condition of the fan 1 is serious, liquid such as water can be used as the cooling medium, and when the heating condition of the fan 1 is not serious, gas such as air can be used as the cooling medium.

[0024] Through the above technical scheme, the cooling device provided by the present invention can dissipate heat for the fan 1, and has good heat dissipation performance. Specifically, the cooling device includes a shell 2 connected to the structural wall of the fan 1, and a chamber is formed inside the shell 2 to store and / or circulate the cooling medium through the chamber, so that heat conduction and heat exchange with the structural wall of the fan 1 can be carried out to dissipate heat for the fan 1. At the same time, the shell 2 is arranged along the circumference of the air inlet 11 of the fan 1, and the cooling effect on the fan 1 will not affect the normal air intake of the fan 1, thereby reducing the possibility of heat caused by the operating resistance generated by the fan 1 during the air intake process.

[0025] In some embodiments, reference Figure 1 , the shell 2 can be constructed as an annular structure, so that the number of shells 2 is set to one and arranged around the circumference of the air inlet 11 of the fan 1, so as to increase the storage capacity of the cooling medium, thereby improving the heat dissipation capacity of the cooling device acting on the fan 1. It can be understood that in some other possible embodiments not shown in the drawings, the number of shells 2 can also be set to multiple and arranged at intervals along the circumference of the air inlet 11 of the fan 1, wherein each shell 2 can be constructed as an arc structure, and similarly, the cooling medium contained in the shell 2 can act on the structural wall of the fan 1 through heat exchange to dissipate heat from the fan 1. Of course, the above description of the number and shape structure of the shell 2 is only exemplary, and the number and shape structure of the shell 2 can be arbitrarily set according to actual use requirements, so as to be able to exchange heat with the structural wall of the fan 1 and not affect the normal air intake of the air inlet 11 of the fan 1, and the present disclosure is not limited thereto.

[0026] It is understandable that the cooling medium in the housing 2 may decrease its heat exchange capacity due to the increase in its own temperature after being used for a period of time, thereby affecting the heat dissipation of the fan 1. Therefore, the cooling medium can be replaced or cooled again to ensure the heat exchange capacity of the cooling medium. Figure 1 The cooling device may include a liquid inlet pipeline 3 and a liquid outlet pipeline 4 connected to the chamber, and a liquid storage structure 5 connected to the liquid inlet pipeline 3 and the liquid outlet pipeline 4, and at least one of the liquid inlet pipeline 3, the liquid outlet pipeline 4 and the liquid storage structure 5 is provided with a pump structure 6. The liquid storage structure 5 may be, for example, a liquid storage tank, so that, under the action of the pump structure 6, the cooling medium may be transported from the liquid storage structure 5 to the chamber via the liquid inlet pipeline 3 for heat conduction with the structural wall of the fan 1, thereby dissipating heat from the fan 1, and then the cooling medium in the chamber may flow back to the liquid storage structure 5 via the liquid outlet pipeline 4. The present disclosure exemplarily sets the pump structure 6 on the liquid storage structure 5, so that the pump structure 6 can play a pumping role and subsequent maintenance and other work. Of course, in some other possible embodiments not shown in the drawings, the pump structure 6 can also be arranged on the liquid inlet pipeline 3 or the liquid outlet pipeline 4, and can also play a pumping role, or the number of pump structures 6 can be set to multiple, and illustratively, the number of pump structures 6 can be set to three, and the three pump structures 6 are respectively arranged on the liquid inlet pipeline 3, the liquid outlet pipeline 4 and the liquid storage structure 5 to improve the circulation capacity of the cooling medium. The present disclosure does not make specific limitations on this.

[0027] During the operation of the above cooling device, the cooling medium can continue to flow in the chamber to improve the heat exchange capacity, and the cooling medium circulating in the liquid storage structure 5, the liquid inlet pipeline 3, the chamber, and the liquid outlet pipeline 4 can be replaced to ensure the heat exchange capacity of the cooling medium. For example, a liquid exchange port can be opened on the liquid storage structure 5 and a sealing cover can be set to extract the original cooling medium in the liquid storage structure 5, the liquid inlet pipeline 3, the chamber, and the liquid outlet pipeline 4 through the liquid exchange port, and then inject a new cooling medium or cool the original high-temperature cooling medium and inject it again. The present disclosure is not limited to this.

[0028] In some embodiments, reference Figure 1 At least one of the liquid inlet pipeline 3, the liquid outlet pipeline 4 and the liquid storage structure 5 may be provided with a cooler 7, so that the cooling medium can be cooled by the cooler 7, the temperature of the cooling medium can be reduced, the heat exchange capacity of the cooling medium can be improved, and the heat dissipation capacity of the cooling device to the fan 1 can be improved. As is known, the cooler 7 is a type of heat exchange equipment, which is used to cool the fluid, and usually uses water or air as a coolant to remove heat. Therefore, in the present disclosure, illustratively, the cooler 7 can use water as a coolant to cool the cooling medium, thereby ensuring the heat exchange capacity of the cooling medium, that is, the heat dissipation capacity of the cooling device to the fan 1.

[0029] The present disclosure exemplarily arranges the cooler 7 on the liquid inlet pipeline 3, so that the cooling medium cooled by the cooler 7 can flow into the chamber as quickly as possible to exchange heat with the structural wall of the fan 1, thereby reducing the heat exchange loss of the cooling medium outside the chamber. Of course, in some other possible implementations not shown in the accompanying drawings, the cooler 7 can also be arranged on the liquid outlet pipeline 4 or the cooling structure, and the cooling effect of the cooler 7 on the cooling medium can also be exerted, or the number of coolers 7 can be set to multiple, and exemplarily, the number of coolers 7 can be set to three, and the three coolers 7 are respectively arranged on the liquid inlet pipeline 3, the liquid outlet pipeline 4 and the liquid storage structure 5 to improve the cooling effect on the cooling medium. The present disclosure does not make specific limitations on this.

[0030] The cooler 7 may adopt any suitable structural form. For example, when the number of coolers 7 is set to one, the cooler 7 may adopt any one of a tube-and-tube cooler 7, a plate cooler 7, and an air-cooled cooler 7. When the number of coolers 7 is set to multiple, the cooler 7 may adopt one or more of a tube-and-tube cooler 7, a plate cooler 7, and an air-cooled cooler 7. The present disclosure is not limited thereto.

[0031] In some embodiments, reference Figure 1 The cooling device may also include a filter 8 disposed at the air inlet 11 of the fan 1. In this way, the filter 8 can effectively reduce the dust impurities entering the fan 1 through the air inlet 11, thereby reducing the possibility of heating of the fan 1 due to the blockage of the air inlet 11 by too many dust impurities and the increase in the load on the fan blades of the fan 1. In order to reduce the layout area of ​​the filter 8 and reduce the use cost, the present disclosure exemplarily connects the filter 8 to the inner peripheral wall of the housing 2. Of course, if it is for the convenience of processing, the filter 8 can also be connected to the outer wall of the housing 2. The present disclosure does not specifically limit this.

[0032] It is understandable that the air will form a vortex when entering the fan 1. At this time, the dust impurities in the air will gather in large quantities at the center of the air inlet 11 of the fan 1. Therefore, in some exemplary embodiments, referring to Figure 1 , the filter 8 can be arranged at the center of the air inlet 11 of the fan 1, so that the dust impurities can be filtered through the filter 8, reducing the possibility of dust impurities accumulating at the air inlet 11 or the fan blades of the fan 1, increasing the load of the fan 1 and causing the fan 1 to heat up. At the same time, the filter 8 is only arranged at the center of the air inlet 11 of the fan 1, which can reduce the impact on the normal air intake of the air inlet 11, thereby reducing the possibility of heating caused by the operating resistance of the fan 1 during the air intake process.

[0033] The filter 8 can be connected to the inner wall of the housing 2 in any suitable manner. For example, the filter 8 can be connected to the inner wall of the housing 2 by a steel wire 81. In this way, the steel wire 81, which occupies a small space, can also reduce the impact on the normal air intake of the air inlet 11, thereby reducing the possibility of heat caused by the operating resistance generated by the fan 1 during the air intake process. Among them, one end of the steel wire 81 is connected to the filter 8. In order to facilitate dust removal or replacement of the filter 8, the end of the steel wire 81 away from the filter 8 can be detachably connected to the inner wall of the housing 2 by means of a magnet, a clamping structure or bonding, wherein the bonding can be made of hot melt adhesive, etc. The present disclosure is not limited to this.

[0034] In some embodiments, reference Figure 1 The housing 2 is connected to the structural wall of the fan 1 by fastening bolts 9, and a sealing structure is provided at the connection between the fastening bolts 9 and the housing 2. In this way, the housing 2 and the structural wall of the fan 1 can be fixed by the fastening bolts 9, and the housing 2 can be sealed by the sealing structure to reduce the possibility of overflow of the cooling medium in the chamber, wherein the sealing structure can be, for example, a sealing ring, etc., which is not specifically limited in the present disclosure. In addition, the housing 2 and the structural wall of the fan 1 can also be fixed by, for example, magnets or bonding, so that the cooling device can be connected to the structural wall of the fan 1 without detachment, and the present disclosure is not limited thereto.

[0035] According to a second aspect of the present disclosure, an air supply device is provided, comprising a fan 1 and the cooling device as described above. The air supply device has all the beneficial effects of the cooling device as described above, which will not be described in detail in the present disclosure.

[0036] In some embodiments, the air supply device may also include a voltage compensation mechanism (not shown in the figure) electrically connected to the motor of the fan 1. In this way, the voltage compensation structure can effectively stabilize the voltage of the motor when it is working, thereby reducing the possibility of heating of the fan 1 due to unstable operating voltage of the motor.

[0037] The voltage compensation structure can be constructed in any suitable manner. For example, in one embodiment, the voltage compensation mechanism can be constructed as a voltage compensator, and the voltage compensator can include a capacitor, a capacitor and a transformer arranged in series. Among them, voltage compensators are generally divided into two types: static and dynamic, and their implementation methods and compensation capabilities are different. Static voltage compensators usually use capacitors or inductors to adjust the voltage, and use electromagnetic principles to adjust the output voltage by changing the magnetic flux of the transformer. The dynamic voltage compensator uses high-end electronic devices such as IGBT, GTO, etc., which can achieve more accurate voltage regulation. It is based on electronic circuit design and uses electronic components such as transistors and integrated circuits to adjust the voltage. It is small in size and fast in response. The present disclosure is not limited to this.

[0038] The present disclosure exemplarily describes the use process of the cooling device.

[0039] When it is necessary to dissipate heat from the fan 1 through a cooling device, under the action of the pump structure 6, the cooling medium can be transported from the liquid storage structure 5 to the chamber through the liquid inlet pipe 3 for heat conduction with the structural wall of the fan 1, thereby dissipating heat from the fan 1, and then the cooling medium in the chamber can flow back to the liquid storage structure 5 through the liquid outlet pipe 4. In this process, the cooling medium is cooled by the cooler 7; at the same time, the filter 8 can effectively reduce the dust and impurities entering the fan 1 through the air inlet 11, reduce the accumulation of dust and impurities, and increase the load of the fan 1 to cause the fan 1 to heat up; the voltage compensation structure can effectively stabilize the voltage of the motor during operation, reducing the possibility of heating of the fan 1 due to unstable motor operating voltage.

[0040] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0041] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0042] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A cooling device for a fan, characterized in that: The invention comprises a shell, which is connected to the structural wall of the fan and arranged along the circumference of the air inlet of the fan. A chamber for storing and / or circulating a cooling medium is formed inside the shell for heat conduction with the structural wall of the fan.

2. The cooling device according to claim 1, characterized in that: The housing is configured as an annular structure.

3. The cooling device according to claim 1 or 2, characterized in that: The cooling device includes a liquid inlet pipeline and a liquid outlet pipeline connected to the chamber, and a liquid storage structure connected to the liquid inlet pipeline and the liquid outlet pipeline, and at least one of the liquid inlet pipeline, the liquid outlet pipeline and the liquid storage structure is provided with a pump structure.

4. The cooling device according to claim 3, characterized in that: At least one of the liquid inlet pipeline, the liquid outlet pipeline and the liquid storage structure is provided with a cooler.

5. The cooling device according to claim 1 or 2, characterized in that: The cooling device further comprises a filter screen arranged at the air inlet of the fan, and the filter screen is connected to the inner peripheral wall of the shell.

6. The cooling device according to claim 5, characterized in that: The filter screen is arranged at the center of the air inlet of the fan and is connected to the inner peripheral wall of the shell through a steel wire.

7. The cooling device according to claim 1, characterized in that: The shell is connected to the structural wall of the fan by fastening bolts, and a sealing structure is provided at the connection point between the fastening bolts and the shell.

8. An air supply device, characterized in that: It comprises a fan and the cooling device according to any one of claims 1 to 7.

9. The air supply device according to claim 8, characterized in that: The air supply device also includes a voltage compensation mechanism electrically connected to the motor of the fan.

10. The air supply device according to claim 9, characterized in that: The voltage compensation mechanism is configured as a voltage compensator, which includes a capacitor, a capacitor and a transformer which are arranged in series.

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