Silicon wafer draining device and cleaning equipment

Abstract

The present application discloses a silicon wafer draining device and cleaning equipment, wherein the silicon wafer draining device comprises a manipulator cross arm arranged in the horizontal direction; a first movable hanging plate, a second movable hanging plate and a third movable hanging plate installed below the manipulator cross arm, wherein the second movable hanging plate is arranged between the first movable hanging plate and the third movable hanging plate; a lifting and adjusting component connected to the second movable hanging plate, the lifting and adjusting component drives the second movable hanging plate to move in the vertical direction; a horizontal adjusting component connected to the first movable hanging plate and the third movable hanging plate respectively, the horizontal adjusting component drives the first movable hanging plate and / or the third movable hanging plate to adjust in the horizontal direction. The present application effectively shortens the time of transplanting back and forth between each process tank, improves the utilization rate of the equipment, and is compatible with silicon wafer carriers of different specifications.

Description

Technical Field

[0001] The present application relates to the technical field of silicon wafer cleaning, and in particular to a silicon wafer draining device and cleaning equipment. Background Art

[0002] When producing photovoltaic silicon wafers, the cleaning steps after silicon wafer processing require the silicon wafers to be placed in a silicon wafer carrier and then placed in a solution process tank by a robot to complete the cleaning after silicon wafer processing.

[0003] However, in the prior art, after the existing robot hooks up the silicon wafer carrier, it needs to hover to complete the natural dripping of the process tank reagent, which is time-consuming. In addition, unclean natural dripping can easily cause the robot to drip onto the tank cover during movement, corroding the tank cover and reducing the life of the tank cover. At the same time, unclean natural dripping can easily cause the reagent in the tank to be contaminated after the robot moves to the next process tank, shortening the service life of the reagent. During the movement of the robot, the reagent evaporates, causing environmental pollution in the entire equipment. Unclean natural dripping can easily cause the process time to be prolonged. Utility Model Content

[0004] In order to solve the deficiencies of the prior art, the purpose of the present application is to provide a silicon wafer draining device and a cleaning device.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] In a first aspect, a silicon wafer draining device comprises a manipulator cross arm arranged in a horizontal direction; a first movable hanging plate, a second movable hanging plate and a third movable hanging plate installed below the manipulator cross arm, wherein the second movable hanging plate is arranged between the first movable hanging plate and the third movable hanging plate; a lifting adjustment component connected to the second movable hanging plate, the lifting adjustment component drives the second movable hanging plate to move in a vertical direction to adjust the height of the second movable hanging plate; a horizontal adjustment component connected to the first movable hanging plate and the third movable hanging plate respectively, the horizontal adjustment component drives the first movable hanging plate and / or the third movable hanging plate to move in a horizontal direction to adjust the distance between the second movable hanging plate and the first movable hanging plate, and / or adjust the distance between the third movable hanging plate and the first movable hanging plate.

[0007] Furthermore, the lifting and adjusting assembly includes a guide shaft and a guide shaft connecting plate, one end of the guide shaft is fixedly connected to the robot cross arm, and the other end is fixedly connected to the guide shaft connecting plate.

[0008] Furthermore, the lifting and adjusting assembly also includes a cylinder mounting plate and a cylinder that can be extended and retracted in a vertical direction, and the cylinder is mounted on the cross arm of the manipulator through the cylinder mounting plate.

[0009] Furthermore, the guide shaft is vertically penetrated through the cylinder mounting plate, and the cylinder mounting plate has the freedom of movement relative to the guide shaft in the vertical direction.

[0010] Further, the horizontal adjustment component includes a first slider and a first sliding track, the first slider has a degree of freedom to slide relative to the first sliding track in a horizontal direction, and the first slider is connected to the first movable hanging plate. The horizontal adjustment component also includes a second slider and a second sliding track, the second slider has a degree of freedom to slide relative to the second sliding track in a horizontal direction, and the second slider is connected to the third movable hanging plate.

[0011] Furthermore, the horizontal adjustment component includes a first slider clamp and a second slider clamp, the first slider clamp is installed on the first slider, and the first slider clamp limits the horizontal movement of the first slider according to the size of the silicon wafer carrier; the second slider clamp is installed on the second slider, and the second slider clamp limits the horizontal movement of the second slider according to the size of the silicon wafer carrier.

[0012] Furthermore, the manipulator cross arm includes a plurality of hanging holes, and the manipulator cross arm is connected to the first movable hanging plate and the third movable hanging plate through the plurality of hanging holes.

[0013] Furthermore, the first movable hanging plate is provided with a first sensor, the third movable hanging plate is provided with a second sensor, the silicon wafer drainage device is also equipped with a silicon wafer carrier, the first sensor is used to detect whether the first movable hanging plate is connected to the silicon wafer carrier, and the second sensor is used to detect whether the third movable hanging plate is connected to the silicon wafer carrier.

[0014] In the second aspect, the present application also provides a cleaning device, including the silicon wafer draining device in the above-mentioned first aspect, and the cleaning device also includes: a support frame, the support frame is connected to the silicon wafer draining device; a plurality of silicon wafer carriers, at least some of the silicon wafer carriers are arranged between the first movable hanging plate and the second movable hanging plate, and at least some of the silicon wafer carriers are arranged between the second movable hanging plate and the third movable hanging plate; a process tank, the process tank is arranged below the silicon wafer draining device, for holding the cleaning liquid; wherein, the silicon wafer draining device is used to clamp a plurality of silicon wafer carriers to enter or leave the process tank.

[0015] Furthermore, the cleaning device also includes a driving motor that is transmission-connected to the cross arm of the manipulator. The driving motor is installed on the support frame and drives the cross arm of the manipulator to move along the extension direction of the support frame.

[0016] Compared with the prior art, the lifting and adjusting assembly proposed in the present application can drive the second movable hanging plate to move in the vertical direction during the rising process of the silicon wafer draining device, so that the silicon wafer is tilted to complete the dripping of the cleaning liquid, effectively shortening the movement time of the silicon wafer carrier during the silicon wafer draining process, and improving the equipment utilization rate. At the same time, the horizontal adjustment assembly proposed in the present application can adjust the distance between the second movable hanging plate and the first movable hanging plate, or adjust the distance between the second movable hanging plate and the third movable hanging plate, so that any two adjacent movable hanging plates can be compatible with different silicon wafer carrier specifications, thereby increasing the compatibility of the silicon wafer draining device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the structure of a silicon wafer draining device provided in an embodiment of the present application;

[0018] Figure 2 A schematic diagram of the structure of a lifting and adjusting assembly of a silicon wafer draining device provided in an embodiment of the present application;

[0019] Figure 3 A schematic diagram of the structure of a level adjustment component of a silicon wafer draining device provided in an embodiment of the present application;

[0020] Figure 4 A schematic diagram of the structure of a silicon wafer draining device and a cleaning device in use provided in an embodiment of the present application;

[0021] Figure 5 A structural schematic diagram of another silicon wafer draining device and cleaning equipment in use provided in an embodiment of the present application.

[0022] Explanation of the reference numerals: 100, silicon wafer draining device; 200, cleaning equipment; 11, robot cross arm; 12, first movable hanging plate; 13, second movable hanging plate; 14, third movable hanging plate; 15, lifting adjustment component; 16, horizontal adjustment component; 111, hanging hole; 151, guide shaft; 152, guide shaft connecting plate; 153, cylinder; 154, cylinder mounting plate; 161, first slider; 162, first sliding track; 163, second slider; 164, second sliding track; 165, first slider clamp; 166, second slider clamp; 121, first sensor; 141, second sensor; 21, support frame; 22, silicon wafer carrier; 23, process tank; 24, drive motor. DETAILED DESCRIPTION

[0023] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the specific implementation manner of the present invention will be clearly and completely described below in conjunction with the drawings in the implementation manner of the present application.

[0024] like Figure 1As shown, a silicon wafer draining device 100 includes:

[0025] A manipulator cross arm 11 arranged in a horizontal direction, a first movable hanging plate 12 , a second movable hanging plate 13 , and a third movable hanging plate 14 installed below the manipulator cross arm 11 .

[0026] Among them, the first movable hanging plate 12, the second movable hanging plate 13 and the third movable hanging plate 14 are respectively connected to the manipulator cross arm 11, and the second movable hanging plate 13 is arranged between the first movable hanging plate 12 and the third movable hanging plate 14. A silicon wafer carrier can be clamped between the first movable hanging plate 12 and the second movable hanging plate 13, and a silicon wafer carrier can be clamped between the second movable hanging plate 13 and the third movable hanging plate 14.

[0027] In this embodiment, the silicon wafer draining device 100 further includes a lifting and adjusting assembly 15 connected to the second movable hanging plate 13 , and the lifting and adjusting assembly 15 can drive the second movable hanging plate 13 to move in a vertical direction to adjust the height of the second movable hanging plate 13 .

[0028] The silicon wafer draining device 100 further includes a horizontal adjustment component 16 connected to the first movable hanging plate 12 and the third movable hanging plate 14, respectively. The horizontal adjustment component 16 can drive the first movable hanging plate 12 and the third movable hanging plate 14 to adjust in the horizontal direction. The horizontal adjustment component 16 can drive the first movable hanging plate 12 to move toward the second movable hanging plate 13 in the horizontal direction to adjust the distance between the second movable hanging plate 13 and the first movable hanging plate 12. The horizontal adjustment component 16 can also drive the third movable hanging plate 14 to move toward the second movable hanging plate 13 in the horizontal direction to adjust the distance between the third movable hanging plate 14 and the second movable hanging plate 13.

[0029] Among them, Figure 2 As shown, the lifting and adjusting assembly 15 includes a guide shaft 151 and a guide shaft connecting plate 152. One end of the guide shaft 151 is fixedly connected to the robot cross arm 11, and the other end is fixedly connected to the guide shaft connecting plate 152. The lifting and adjusting assembly 15 also includes a cylinder mounting plate 154 and a cylinder 153 that is telescopic in the vertical direction. The cylinder 153 is mounted on the robot cross arm 11 through the cylinder mounting plate 154. The guide shaft 151 is mounted on the cylinder mounting plate 154 in the vertical direction, and the cylinder mounting plate 154 has the freedom of movement relative to the guide shaft 151 in the vertical direction.

[0030] Specifically, the lifting and adjusting component 15 can drive the second movable hanging plate 13 to move in the vertical direction, and the first movable hanging plate 12 and the third movable hanging plate 14 do not move in the vertical direction, so that the second movable middle hanging plate 13 forms a height difference with the first movable hanging plate 12 and the third movable hanging plate 14 respectively, and a silicon wafer carrier is arranged between the second movable middle hanging plate 13 and the first movable hanging plate 12, and a silicon wafer carrier is arranged between the second movable middle hanging plate and the third movable hanging plate 14, so that the two silicon wafer carriers form an inclined state at the same time.

[0031] For example, as the cylinder 153 moves in extension and contraction, the cylinder mounting plate 154 moves up and down along the guide shaft 151, thereby driving the second movable hanging plate 13 to move in the vertical direction. Figure 4 As shown, when the cylinder 153 is far from the robot arm 11, the cylinder mounting plate 154 moves upward, thereby driving the second movable hanging plate 13 to move upward, so that one end of the silicon wafer carrier moves upward to form an inclined state, using gravity to accelerate the flow of liquid and reduce the silicon wafer draining time. Figure 5 As shown, when the cylinder 153 is close to the robot arm 11, the cylinder mounting plate 154 moves downward, thereby driving the second movable hanging plate 13 to move downward, so that one end of the silicon wafer carrier moves downward to form an inclined state. The upward and downward movement of one end of the silicon wafer carrier to form an inclined state can make the liquid on the silicon wafer drip quickly, and Figure 4 compared to, Figure 5 The tilted state can avoid the risk of collision between the lower ends of adjacent silicon wafer carriers.

[0032] It should be noted that the silicon wafer draining device 100 can determine whether the silicon wafer carrier is tilted upward or downward according to the use environment of the silicon wafer carrier. For example, when the chemical solution on the surface of the silicon wafer needs to be removed after cleaning, an upward tilt may be adopted to use gravity to assist the solution to flow away while avoiding the redeposition of chemical residues on the surface of the silicon wafer. After the drainage process is completed, the silicon wafer may need to be tilted downward to guide the water to a specific area for easy collection and recycling.

[0033] In this embodiment, if Figure 3 As shown, the horizontal adjustment component 16 includes a first slider 161 and a first sliding track 162. The first slider 161 has a degree of freedom L1 for sliding relative to the first sliding track 162 in the horizontal direction. The first slider 161 is connected to the first movable hanging plate. The horizontal adjustment component 16 also includes a second slider 163 and a second sliding track 164. The second slider 163 has a degree of freedom L2 for sliding relative to the second sliding track 164 in the horizontal direction. The second slider 163 is connected to the third movable hanging plate 14.

[0034] The first slider 161 slides horizontally on the first slide rail 162, and the second slider 163 slides horizontally on the second slide rail 164. In this way, when the silicon wafer carrier changes, the first slider 161 and the second slider 163 can be slid to accommodate silicon wafer carriers of different specifications.

[0035] It should be noted that the horizontal adjustment component 16 includes a first slider clamp 165 and a second slider clamp 166. The first slider clamp 165 is installed on the first slider 161, and the second slider clamp 166 is installed on the second slider 163. The first slider clamp 165 limits the horizontal movement of the first slider 161 according to the size of the silicon wafer carrier. The second slider clamp 166 limits the horizontal movement of the second slider 163 according to the size of the silicon wafer carrier. The horizontal adjustment component 16 moves to different positions corresponding to silicon wafer carriers of different specifications according to the size of the silicon wafer carrier.

[0036] For example, when the wafer carrier changes and the wafer carrier is clamped between the second movable hanging plate 13 and the first movable hanging plate 12, the first slider clamp 165 is used to block the movement of the first slider 161, thereby fixing the wafer carrier. When the wafer carrier changes and the wafer carrier is clamped between the third movable hanging plate 14 and the second movable hanging plate 13, the second slider clamp 166 is used to block the movement of the second slider 163, thereby fixing the wafer carrier.

[0037] In this embodiment, if Figure 3 As shown, the robot arm 11 may further include a plurality of hanging holes 111, and the first movable hanging plate 12 and the third movable hanging plate 14 are respectively connected to the robot arm 11 through one of the plurality of hanging holes 111. For example, when the wafer carrier changes, the first movable hanging plate 12 and the third movable hanging plate 14 may be hung on different hanging holes 111 according to the size of the wafer carrier, so that the wafer draining device can accommodate wafer carriers of different specifications.

[0038] In this embodiment, the first movable hanging plate 12 is provided with a first sensor 121, and the third movable hanging plate 14 is provided with a second sensor 141. The first sensor 121 is used to detect whether the first movable hanging plate is connected to the silicon wafer carrier, and the second sensor 141 is used to detect whether the third movable hanging plate 14 is connected to the silicon wafer carrier.

[0039] Specifically, if the silicon wafer carrier is clamped between the first movable hanging plate 12 and the second movable hanging plate 13, and the silicon wafer carrier is clamped between the second movable hanging plate 12 and the third movable hanging plate 13, the first sensor 121 detects that the first movable hanging plate 12 and the second movable hanging plate 13 are successfully connected to the silicon wafer carrier, and the second sensor 141 detects that the second movable hanging plate 13 and the third movable hanging plate 14 are successfully connected to the silicon wafer carrier. The first sensor 121 and the second sensor 141 can send the silicon wafer carrier clamping success information to the silicon wafer draining device 100 through the communication line, and then the silicon wafer draining device 100 can control the lifting and adjusting component 15 to operate, so that the silicon wafer carrier forms a tilted state. If the first sensor and the second sensor do not detect the silicon wafer carrier, the silicon wafer draining device 100 cannot control the lifting and adjusting component 15 to operate. The first sensor 121 and the second sensor 141 are used to detect the position of the silicon wafer carrier, ensuring that the silicon wafer draining device 100 can accurately perform the next operation on the silicon wafer carrier, thereby improving the automation level and efficiency of the production line.

[0040] In this embodiment, if Figure 4 or Figure 5 A cleaning device 200 is shown, including a silicon wafer draining device 100 , a support frame 21 , a plurality of silicon wafer carriers 22 and a process tank 23 .

[0041] The support frame 21 is connected to the manipulator arm 11 of the wafer draining device 100. At least part of the wafer carrier 22 is disposed between the first movable hanging plate 12 and the second movable hanging plate 13, and at least part of the wafer carrier 22 is also disposed between the second movable hanging plate 13 and the third movable hanging plate (14). A driving motor 24 is disposed on the support frame 21, and the driving motor 24 is used to drive the manipulator arm 11 to move in the vertical direction.

[0042] Furthermore, the cleaning device 200 further includes a driving motor 24 that is transmission-connected to the robot arm 11, and the driving motor 24 is installed on the support frame 21, and drives the robot arm 11 to move along the extension direction of the support frame 21. For example, when the silicon wafer carrier 22 is clamped between the first movable hanging plate 12 and the second movable hanging plate 13, the driving motor 24 starts to operate, so that the robot arm 11 moves along the extension direction of the support frame 21, so that the silicon wafer carrier 22 is lifted.

[0043] Furthermore, the process tank 23 is arranged below the silicon wafer draining device 100, and is used to hold the cleaning solution. Among them, the silicon wafer draining device 100 is used to clamp a number of silicon wafer carriers 22 to enter or leave the process tank 23. The process tank 23 includes a plurality of solution tanks for holding the cleaning solution. The process tank 23 also includes a drying tank, etc., and the process tank 23 is also used to place the silicon wafer carrier 22. For example, after the solution tank completes the process reaction on the silicon wafer, the silicon wafer carrier 22 is lifted from the solution tank. Alternatively, when the silicon wafer to be dried is loaded in the silicon wafer carrier 22, it will be repeatedly soaked in different tanks in turn by acid and alkali solution and water, and then lifted into the drying tank.

[0044] In summary, compared with the prior art, the lifting and adjusting assembly proposed in the present application can drive the second movable hanging plate to move in the vertical direction during the rising process of the silicon wafer draining device, and adjust the height of the second movable hanging plate, so that the silicon wafer is tilted to complete the dripping of the cleaning liquid, which effectively shortens the movement time of the silicon wafer carrier during the silicon wafer draining process and improves the equipment utilization rate. At the same time, the horizontal adjustment assembly proposed in the present application can adjust the distance between the second movable hanging plate and the first movable hanging plate, or the second movable hanging plate and the third movable hanging plate, so that any two adjacent movable hanging plates can be compatible with different silicon wafer carrier specifications, thereby increasing the compatibility of the silicon wafer draining device.

[0045] In the embodiments according to the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance; the term "multiple" refers to two or more, unless otherwise clearly defined. Terms such as "installed", "connected", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments according to the present application can be understood according to specific circumstances.

[0046] In the description of the embodiments of the present invention, it needs to be understood that the directions or positional relationships indicated by the terms "up", "down", "left", "right", "front", "back", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments according to the present application and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, cannot be understood as a limitation on the embodiments according to the present application.

[0047] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments according to the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0048] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A silicon wafer draining device, characterized in that: The silicon wafer draining device comprises: A manipulator cross arm (11) arranged in a horizontal direction; A first movable hanging plate (12), a second movable hanging plate (13) and a third movable hanging plate (14) are installed below the robot cross arm (11), wherein the second movable hanging plate (13) is arranged between the first movable hanging plate (12) and the third movable hanging plate (14); a lifting and adjusting component (15) connected to the second movable hanging plate (13), wherein the lifting and adjusting component (15) drives the second movable hanging plate (13) to move in a vertical direction so as to adjust the height of the second movable hanging plate (13); A horizontal adjustment component (16) is connected to the first movable hanging plate (12) and the third movable hanging plate (14) respectively, and the horizontal adjustment component (16) drives the first movable hanging plate (12) and / or the third movable hanging plate (14) to move in the horizontal direction to adjust the distance between the second movable hanging plate (13) and the first movable hanging plate (12), and / or adjust the distance between the third movable hanging plate (14) and the second movable hanging plate (13).

2. The silicon wafer draining device according to claim 1, characterized in that: The lifting and lowering adjustment component (15) comprises a guide shaft (151) and a guide shaft connecting plate (152); one end of the guide shaft (151) is fixedly connected to the manipulator cross arm (11), and the other end is fixedly connected to the guide shaft connecting plate (152).

3. The silicon wafer draining device according to claim 2, characterized in that: The lifting and adjusting assembly (15) further comprises a cylinder mounting plate (154) and a cylinder (153) that is telescopic in a vertical direction, and the cylinder (153) is mounted on the manipulator cross arm (11) via the cylinder mounting plate (154).

4. The silicon wafer draining device according to claim 3, characterized in that: The guide shaft (151) is vertically penetrated through the cylinder mounting plate (154), and the cylinder mounting plate (154) has the freedom of movement relative to the guide shaft (151) in the vertical direction.

5. The silicon wafer draining device according to claim 1, characterized in that: The horizontal adjustment component (16) comprises a first sliding block (161) and a first sliding track (162), the first sliding block (161) having a degree of freedom of movement to slide relative to the first sliding track (162) in a horizontal direction, and the first sliding block (161) is connected to the first movable hanging plate (12); The horizontal adjustment component (16) further comprises a second slider (163) and a second sliding track (164); the second slider (163) has the freedom of movement to slide relative to the second sliding track (164) in a horizontal direction; the second slider (163) is connected to the third movable hanging plate (14).

6. The silicon wafer draining device according to claim 1, characterized in that: The horizontal adjustment component (16) comprises a first slider clamp (165) and a second slider clamp (166), wherein the first slider clamp (165) is mounted on the first slider (161), and the first slider clamp (165) limits the movement of the first slider (161) in the horizontal direction according to the size of the silicon wafer carrier; The second slider clamp (166) is installed on the second slider (163), and the second slider clamp (166) limits the movement of the second slider (163) in the horizontal direction according to the size of the silicon wafer carrier.

7. The silicon wafer draining device according to claim 1, characterized in that: The robot arm (11) comprises a plurality of hanging holes (111), and the first movable hanging plate (12) and the third movable hanging plate (14) are respectively connected to the robot arm (11) via one of the plurality of hanging holes (111).

8. The silicon wafer draining device according to claim 1, characterized in that: The first movable hanging plate (12) is provided with a first sensor (121), the third movable hanging plate (14) is provided with a second sensor (141), the silicon wafer drainage device is also equipped with a silicon wafer carrier, the first sensor (121) is used to detect whether the first movable hanging plate (12) is connected to the silicon wafer carrier, and the second sensor (141) is used to detect whether the third movable hanging plate (14) is connected to the silicon wafer carrier.

9. A cleaning device, characterized in that: The cleaning equipment comprises: The silicon wafer draining device according to any one of claims 1 to 8, wherein the cleaning device further comprises: A support frame (21), the support frame (21) being connected to the silicon wafer draining device (100); A plurality of silicon wafer carriers (22), at least part of the silicon wafer carriers (22) being disposed between the first movable hanging plate (12) and the second movable hanging plate (13), and at least part of the silicon wafer carriers (22) being disposed between the second movable hanging plate (13) and the third movable hanging plate (14); A process tank (23), which is arranged below the silicon wafer drain device (100) and is used to hold a cleaning liquid; The silicon wafer draining device (100) is used to clamp the plurality of silicon wafer carriers (22) to enter or leave the process tank (23).

10. The cleaning device according to claim 9, characterized in that: The cleaning device (200) further comprises a driving motor (24) which is transmission-connected to the robot cross arm (11); the driving motor (24) is mounted on the support frame (21) and drives the robot cross arm (11) to move along the extension direction of the support frame (21).

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