Thermal diffusion device and electronic equipment

Abstract

A thermal diffusion device and an electronic apparatus are provided. A heat diffusion device (1) is provided with a case (10), a working medium (20) sealed in the inner space of the case (10), and a core (30) disposed in the inner space of the case (10). The internal space of the housing (10) has: a flow path region (Ra) formed by being surrounded by at least a portion of the housing (10) and a portion of the core (30); a first vapor region (Rb) that overlaps a portion of the core (30) when viewed from the thickness direction (Z); and a second vapor region (Rc) that does not overlap the core (30) when viewed from the thickness direction (Z). The flow path region (Ra) is disposed along the edge of the internal space of the housing (10) when viewed from the thickness direction (Z). The first vapor region (Rb) has a portion located between the second vapor region (Rc) and the flow path region (Ra) in a cross-sectional view from the direction in which the flow path region (Ra) extends.

Description

Technical Field

[0001] The utility model relates to a heat diffusion device and an electronic device. Background Art

[0002] In recent years, the heat generation has increased due to the high integration and high performance of components. In addition, as the miniaturization of products develops, the heat density increases, so heat dissipation measures become important. This situation is particularly significant in the field of mobile terminals such as smartphones and tablets. As thermal countermeasure components, graphite sheets are mostly used, but their heat transfer capacity is insufficient, so the use of various thermal countermeasure components is being studied. Among them, as a thermal diffusion device that can diffuse heat very effectively, research on the use of planar heat pipes, that is, heat spreaders, is being promoted.

[0003] The heat spreader has a structure in which a working medium (also called working fluid) is sealed inside a shell and a core body composed of a porous body and uses capillary force to transport the working medium. The working medium absorbs heat from the heating element such as electronic components at the evaporation part that absorbs heat from the heating element, and after evaporating in the heat spreader, it moves in the heat spreader, is cooled and returns to the liquid phase. The working medium that returns to the liquid phase moves again to the evaporation part on the heating element side by the capillary force of the core body to cool the heating element. By repeating the above-mentioned actions, the heat spreader works independently without external power, and can use the latent heat of evaporation and latent heat of condensation of the working medium to diffuse heat at high speed in two dimensions.

[0004] Patent document 1 discloses a heat spreader, comprising: an upper plate; a lower plate; a plurality of side walls, which are arranged between the upper plate and the lower plate; a core, which is arranged in a space enclosed by the upper plate, the lower plate and the plurality of side walls, and is in contact with the upper plate and the lower plate; and a support, which is arranged in the space and is in contact with the upper plate and the lower plate, the core having: a plurality of first core portions, which extend from respective first terminals located in the evaporation portion toward the side walls and have a straight portion; and a second core portion, which connects the second terminals of the plurality of first core portions to each other, the support being arranged between the straight portions of two adjacent first core portions among the plurality of first core portions, and spaced apart from the straight portions.

[0005] Patent Document 1: International Publication No. 2017 / 104819

[0006] According to the heat spreader described in Patent Document 1, the plurality of first core parts have straight sections, and the pillars are located between these straight sections, so that the flow path of the gas phase working fluid extends straight to the low temperature area away from the evaporation part. Thus, by shortening the path of the gas phase working fluid from the evaporation part to the low temperature area, the gas phase working fluid is quickly moved to the low temperature area, which can improve the heat transfer efficiency. In addition, by improving the heat transfer efficiency in this way, even if the thickness of the heat spreader is reduced, the heat of the heat source can be fully dissipated.

[0007] However, in the heat spreader described in Patent Document 1, Figure 2 or Figure 4 Therefore, in the heat spreader described in Patent Document 1, the area occupied by the steam flow path in the internal space of the shell is limited, so that not only the heat spread area is reduced but also the thermal conductivity itself is reduced.

[0008] The above-mentioned problem is not limited to the vapor chamber, but is also a common problem in heat diffusion devices that can diffuse heat with the same structure as the vapor chamber. Utility Model Content

[0009] The present invention is made to solve the above problems, and aims to provide a heat diffusion device capable of improving thermal conductivity and maximum heat transfer rate. In addition, the present invention aims to provide an electronic device having the above heat diffusion device.

[0010] The heat diffusion device of the utility model comprises: a shell having a first inner wall surface and a second inner wall surface facing each other in the thickness direction and provided with an internal space; a working medium sealed in the internal space of the shell; and a core body arranged in the internal space of the shell. The internal space of the shell has: a flow path region formed by at least a part of the shell and a part of the core body; a first steam region, when viewed from the thickness direction, the first steam region overlaps with a part of the core body; and a second steam region, when viewed from the thickness direction, the second steam region does not overlap with the core body. When viewed from the thickness direction, the flow path region is arranged along the edge of the internal space of the shell. When viewed in section from the extension direction of the flow path region, the first steam region has a portion located between the second steam region and the flow path region.

[0011] Alternatively, the heat diffusion device further includes a guide rail-shaped partition wall, which is arranged on the first inner wall surface of the shell along the edge end at a distance relative to the edge end of the internal space of the shell, and when viewed in section from the extension direction of the flow path area, the flow path area is sandwiched between the first inner wall surface of the shell and a part of the core body in the thickness direction, and in the plane direction orthogonal to the thickness direction, the flow path area is sandwiched between a part of the shell and the partition wall.

[0012] In the first steam region, the core may be spaced apart from the first inner wall surface.

[0013] In the first steam region, at least a portion of the core may be in contact with the first inner wall surface.

[0014] It is also possible that, when viewed in section from the extension direction of the flow path area, the flow path area is sandwiched between the first inner wall surface of the shell and a part of the core in the thickness direction, and in the surface direction orthogonal to the thickness direction, the flow path area is sandwiched between a part of the shell and a part of the core.

[0015] It is also possible that, when viewed in section from the extension direction of the flow path area, the flow path area is sandwiched between the first inner wall surface of the shell and a part of the core body in the thickness direction, and in the surface direction orthogonal to the thickness direction, the flow path area is sandwiched between a part of the core body and a part of the core body.

[0016] It can also be that when the flow path area is viewed in section from the extension direction of the flow path area, the flow path area includes a first flow path area and a second flow path area, the first flow path area is sandwiched by the first inner wall surface of the shell and a part of the core in the thickness direction, and in the surface direction orthogonal to the thickness direction, the first flow path area is sandwiched by a part of the core and a part of the core, and the second flow path area is sandwiched by the second inner wall surface of the shell and a part of the core in the thickness direction, and in the surface direction orthogonal to the thickness direction, the second flow path area is sandwiched by a part of the core and a part of the core.

[0017] The flow path region may further include a plurality of pillars for supporting the core.

[0018] The housing may include an evaporation portion in the internal space, and the evaporation portion may overlap with the flow path region when viewed in the thickness direction.

[0019] The evaporation portion may overlap an edge of the internal space of the casing when viewed in the thickness direction.

[0020] The flow path region may also be arranged at a portion other than an edge of the internal space of the shell when viewed from the thickness direction, and the evaporation portion may not overlap with an edge of the internal space of the shell when viewed from the thickness direction.

[0021] The flow path region may be arranged to pass through the interior of the evaporation portion when viewed from the thickness direction.

[0022] The flow path region may be arranged along an outer periphery of the evaporation portion when viewed in the thickness direction.

[0023] The electronic device of the present invention is provided with the heat diffusion device of the present invention.

[0024] According to the present invention, a heat diffusion device capable of improving thermal conductivity and maximum heat transfer amount can be provided. In addition, according to the present invention, an electronic device including the heat diffusion device can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a perspective view schematically showing an example of the heat diffusion device according to the first embodiment of the present invention.

[0026] Figure 2 It is an exploded perspective view schematically showing an example of the heat diffusion device according to the first embodiment of the present invention.

[0027] Figure 3 It is a cross-sectional view schematically showing an example of the heat diffusion device according to the first embodiment of the present invention.

[0028] Figure 4 It is a plan view schematically showing an example of the internal structure of the heat diffusion device according to the first embodiment of the present invention.

[0029] Figure 5 It is an exploded perspective view schematically showing another example of the heat diffusion device according to the first embodiment of the present invention.

[0030] Figure 6 It is a cross-sectional view schematically showing another example of the heat diffusion device according to the first embodiment of the present invention.

[0031] Figure 7 It is an exploded perspective view schematically showing an example of a heat diffusion device according to a second embodiment of the present invention.

[0032] Figure 8 It is a cross-sectional view schematically showing an example of a heat diffusion device according to a second embodiment of the present invention.

[0033] Fig. 9 It is an exploded perspective view schematically showing another example of the heat diffusion device according to the second embodiment of the present invention.

[0034] Fig.10 It is a cross-sectional view schematically showing another example of the heat diffusion device according to the second embodiment of the present invention.

[0035] Fig.11 It is an exploded perspective view schematically showing an example of a heat diffusion device according to a third embodiment of the present invention.

[0036] Fig.12 It is a cross-sectional view schematically showing an example of a heat diffusion device according to a third embodiment of the present invention.

[0037] Fig.13 It is an exploded perspective view schematically showing another example of the heat diffusion device according to the third embodiment of the present invention.

[0038] Fig.14 It is a cross-sectional view schematically showing another example of the heat diffusion device according to the third embodiment of the present invention.

[0039] Fig.15 It is an exploded perspective view schematically showing an example of a heat diffusion device according to a fourth embodiment of the present invention.

[0040] Fig.16 It is a cross-sectional view schematically showing an example of a heat diffusion device according to a fourth embodiment of the present invention.

[0041] Fig.17 This is a plan view schematically showing a first modified example of the internal structure of the heat diffusion device of the present invention.

[0042] Fig.18 It is a plan view schematically showing a second modified example of the internal structure of the heat diffusion device of the present invention.

[0043] Fig.19 It is a plan view schematically showing a third modified example of the internal structure of the heat diffusion device of the present invention. DETAILED DESCRIPTION

[0044] Hereinafter, the heat diffusion device of the present invention will be described.

[0045] However, the present invention is not limited to the following embodiments, and can be appropriately changed and applied within the scope of the gist of the present invention. In addition, a structure in which two or more of the preferred structures of the present invention described below are combined is also the present invention.

[0046] In the heat diffusion device of the present invention, the internal space of the shell has: a flow path area, which is formed by at least a part of the shell and a part of the core; a first vapor area, when viewed from the thickness direction, the first vapor area overlaps with a part of the core; and a second vapor area, when viewed from the thickness direction, the second vapor area does not overlap with the core.

[0047] In the heat diffusion device of the utility model, a flow path region that functions as a liquid flow path of the working medium is formed in a space surrounded by at least a part of the shell and a part of the core. Therefore, not only can the capillary force of the core around the liquid flow path be exerted to make the working medium move smoothly in the liquid flow path, but also the flow resistance of the liquid passing through the liquid flow path can be reduced to make the working medium move smoothly in the liquid flow path. As a result, the transmittance can be increased.

[0048] Furthermore, when viewed from the thickness direction, a flow path region is arranged along the edge of the internal space of the shell, and when viewed in section from the extension direction of the flow path region, the first steam region has a portion located between the second steam region and the flow path region. Therefore, the core is not arranged throughout the entire internal space of the shell. In this way, by arranging the core only on the periphery of the internal space of the shell, it is possible to ensure a larger steam flow path in the internal space of the shell. As a result, the thermal conductivity is improved.

[0049] Furthermore, by arranging the first vapor region so that a portion of the core protrudes from the flow path region, the gas-liquid exchange surface can be increased. As a result, the maximum heat transport amount is increased.

[0050] The embodiments shown below are only examples, and of course, the structures shown in different embodiments can be partially replaced or combined. After the second embodiment, the description of the technical features shared with the first embodiment is omitted, and only the differences are described. In particular, the same effects brought about by the same structure are not mentioned in sequence according to each embodiment.

[0051] In the following description, when the embodiments are not particularly distinguished, they are simply referred to as "the heat diffusion device of the present invention".

[0052] Hereinafter, as an embodiment of the heat diffusion device of the present invention, a heat diffusion plate is used as an example to explain. The heat diffusion device of the present invention can also be applied to heat diffusion devices such as heat pipes.

[0053] The drawings shown below are schematic, and their dimensions, aspect ratios, and the like may differ from those of actual products.

[0054] [First embodiment]

[0055] In the heat diffusion device involved in the first embodiment of the utility model, the guide rail-shaped partition wall is arranged on the first inner wall surface of the shell along the edge at a distance from the edge of the internal space of the shell. When the flow path area is cross-sectionally viewed from the extension direction of the flow path area, the flow path area is sandwiched by the first inner wall surface of the shell and a part of the core in the thickness direction, and in the plane direction orthogonal to the thickness direction, the flow path area is sandwiched by a part of the shell and the partition wall.

[0056] Figure 1 It is a perspective view schematically showing an example of the heat diffusion device according to the first embodiment of the present invention. Figure 2 It is an exploded perspective view schematically showing an example of the heat diffusion device according to the first embodiment of the present invention. Figure 3 It is a cross-sectional view schematically showing an example of the heat diffusion device according to the first embodiment of the present invention. Figure 4 1 is a plan view schematically showing an example of the internal structure of the heat diffusion device according to the first embodiment of the present invention. Figure 3 yes Figure 4 A cross-sectional view of the heat spreading device along line III-III is shown.

[0057] Figure 1 The heat spreader (heat diffusion device) 1 shown in the figure has a hollow housing 10 which is sealed in an airtight state. Figure 3 As shown, the housing 10 has a first inner wall surface 11 a and a second inner wall surface 12 a facing each other in the thickness direction Z. The heat spreader 1 further includes a working medium 20 sealed in the inner space of the housing 10 and a core 30 disposed in the inner space of the housing 10 .

[0058] like Figure 4 As shown, the housing 10 is provided with a sealing member 20 (see Figure 3 ) Evaporation portion EP. Figure 1 As shown, a heat source HS as a heating element is arranged on the outer wall surface of the housing 10. The heat source HS may be an electronic component of an electronic device such as a central processing unit (CPU), etc. The portion of the internal space of the housing 10 near the heat source HS and heated by the heat source HS corresponds to the evaporation portion EP.

[0059] Preferably, the heat spreader 1 is planar as a whole. That is, preferably, the housing 10 is planar as a whole. Here, "planar" includes plate-like and sheet-like, and refers to a shape in which the dimension in the width direction X (hereinafter referred to as width) and the dimension in the length direction Y (hereinafter referred to as length) are considerably larger than the dimension in the thickness direction Z (hereinafter referred to as thickness or height), for example, a shape in which the width and length are more than 10 times the thickness, preferably more than 100 times.

[0060] The size of the heat spreader 1, that is, the size of the housing 10, is not particularly limited. The width and length of the heat spreader 1 can be appropriately set according to the purpose. The width and length of the heat spreader 1 are, for example, 5 mm to 500 mm, 20 mm to 300 mm, or 50 mm to 200 mm. The width and length of the heat spreader 1 may be the same or different.

[0061] The housing 10 is preferably composed of a first sheet material 11 and a second sheet material 12 that face each other and are joined at their outer edges.

[0062] When the housing 10 is composed of the first sheet 11 and the second sheet 12, the materials constituting the first sheet 11 and the second sheet 12 are not particularly limited as long as they have properties suitable for use as a heat spreader, such as thermal conductivity, strength, softness, flexibility, etc. The materials constituting the first sheet 11 and the second sheet 12 are preferably metals, such as copper, nickel, aluminum, magnesium, titanium, iron, or alloys containing them as main components, and copper is particularly preferred. The materials constituting the first sheet 11 and the second sheet 12 may be the same or different, but are preferably the same.

[0063] When the housing 10 is composed of the first sheet 11 and the second sheet 12, the first sheet 11 and the second sheet 12 are joined to each other at their outer edges. Such a joining method is not particularly limited, but for example, laser welding, resistance welding, diffusion bonding, brazing, TIG welding (tungsten-inert gas welding), ultrasonic bonding or resin sealing can be used, preferably laser welding, resistance welding or brazing.

[0064] The thickness of the first sheet 11 and the second sheet 12 is not particularly limited, but is preferably 10 μm or more and 200 μm or less, more preferably 30 μm or more and 100 μm or less, and further preferably 40 μm or more and 60 μm or less. The thickness of the first sheet 11 and the second sheet 12 may be the same or different. In addition, the thickness of each sheet of the first sheet 11 and the second sheet 12 may be the same as a whole or may be thinner in part.

[0065] The shapes of the first sheet 11 and the second sheet 12 are not particularly limited. For example, the first sheet 11 and the second sheet 12 may each be shaped such that the outer edge portion is thicker than the portion other than the outer edge portion.

[0066] The thickness of the entire heat spreader 1 is not particularly limited, but is preferably 50 μm or more and 500 μm or less.

[0067] The plane shape of the housing 10 observed from the thickness direction Z is not particularly limited, and examples thereof include polygons such as triangles or rectangles, circles, ellipses, and shapes obtained by combining these shapes. In addition, the plane shape of the housing 10 may also be a letter L shape, a letter C shape (Japanese kana コ shape), a step shape, etc. In addition, the housing 10 may also have a through opening. The plane shape of the housing 10 may also be a shape corresponding to the purpose of the heat spreader, or a shape corresponding to the shape of the assembly portion of the heat spreader or other components present nearby.

[0068] The working medium 20 is not particularly limited as long as it can undergo a gas-liquid phase change under the environment in the housing 10 , and can be, for example, water, alcohols, freon substitutes, etc. For example, the working medium is an aqueous compound, preferably water.

[0069] The core 30 has a capillary structure that can move the working medium 20 by capillary force. The capillary structure of the core 30 can also be a known structure used in an existing thermal diffusion device. As the capillary structure, there can be cited a microstructure with pores, grooves, protrusions, etc., such as a porous structure, a fiber structure, a groove structure, a mesh structure, etc.

[0070] The material of the core 30 is not particularly limited, and for example, a metal porous film, a mesh, a nonwoven fabric, a sintered body, a porous body, etc. formed by etching or metal processing can be used. The mesh that becomes the material of the core 30 can be composed of, for example, a metal mesh, a resin mesh, or these meshes of a surface coating, preferably a copper mesh, a stainless steel (SUS) mesh, or a polyester mesh. The sintered body that becomes the material of the core 30 can also be composed of, for example, a metal porous sintered body, a ceramic porous sintered body, etc., preferably a porous sintered body of copper or nickel. The porous body that becomes the material of the core 30 can also be composed of, for example, a metal porous body, a ceramic porous body, a resin porous body, etc.

[0071] The thickness of the core 30 is not particularly limited, but is, for example, 2 μm to 200 μm, preferably 5 μm to 100 μm, and more preferably 10 μm to 40 μm. The thickness of the core 30 may be partially different.

[0072] like Figure 3 As shown, a liquid flow path 40 of the working medium 20 is formed in a space surrounded by at least a part of the housing 10 and a part of the core 30. On the other hand, a vapor flow path 50 of the working medium 20 is formed in a gap in the housing 10 other than the liquid flow path 40. Figure 3In FIG. 1 , an example of a diffusion path of vapor is shown by arrows.

[0073] The liquid flow path 40 has a bottom surface 40a formed by the first inner wall surface 11a or the second inner wall surface 12a of the shell 10, an upper surface 40b separated from the first inner wall surface 11a and the second inner wall surface 12a of the shell 10, and a first side surface 40c and a second side surface 40d continuous with the upper surface 40b and in contact with the first inner wall surface 11a or the second inner wall surface 12a of the shell 10. Figure 3 In the example shown, the bottom surface 40a of the liquid flow path 40 is formed by the first inner wall surface 11a of the housing 10, but it may be formed by the second inner wall surface 12a of the housing 10. Thus, in this specification, the bottom surface 40a of the liquid flow path 40 does not refer to the surface located vertically below. Similarly, the upper surface 40b of the liquid flow path 40 does not refer to the surface located vertically above.

[0074] like Figure 2 , Figure 3 and Figure 4 As shown, the core 30 is arranged along the edge of the internal space of the housing 10 when viewed from the thickness direction Z. In addition, a part of the core 30 is arranged to extend from the liquid flow path 40 to the vapor flow path 50 .

[0075] As a result, Figure 3 As shown, the internal space of the shell 10 has: a flow path region Ra formed by at least a part of the shell 10 and a part of the core 30 and functioning as a liquid flow path 40 of the working medium 20, a first vapor region Rb overlapping with a part of the core 30 when viewed from the thickness direction Z, and a second vapor region Rc not overlapping with the core 30 when viewed from the thickness direction Z. When viewed from the thickness direction Z, the flow path region Ra is arranged along the edge of the internal space of the shell 10. In the extension direction ( Figure 3 When the first vapor region Rb is viewed in section along the Y direction (in the middle Y direction), the first vapor region Rb has a portion located between the second vapor region Rc and the flow path region Ra. Preferably, the first vapor region Rb is located entirely between the second vapor region Rc and the flow path region Ra in the above-mentioned section, but it is also possible not to have a portion located between the second vapor region Rc and the flow path region Ra. In addition, the first vapor region Rb is a region that does not overlap with the liquid flow path 40 when viewed from the thickness direction Z.

[0076] When viewed in section from the extension direction of the flow path region Ra, the width of the flow path region Ra is not particularly limited, but is, for example, 500 μm or more and 3000 μm or less. In addition, when viewed in section from the extension direction of the flow path region Ra, when the width of the flow path region Ra in the thickness direction Z is different, the width of the widest part is defined as the width of the flow path region Ra.

[0077] When viewed in section from the extension direction of the flow path region Ra, the width of the first vapor region Rb is not particularly limited, but is, for example, 1 mm or more and 10 mm or less. In addition, when viewed in section from the extension direction of the flow path region Ra, when the width of the first vapor region Rb in the thickness direction Z is different, the width of the widest portion is defined as the width of the first vapor region Rb.

[0078] exist Figure 2 , Figure 3 and Figure 4 In the illustrated example, the rail-shaped partition wall 60 is disposed on the first inner wall surface 11 a of the housing 10 along the edge at a distance from the edge of the internal space of the housing 10 .

[0079] Therefore, the liquid flow path 40 is formed by being surrounded by a part of the housing 10, a part of the core 30, and the partition wall 60. Specifically, the liquid flow path 40 has a bottom surface 40a formed by the first inner wall surface 11a of the housing 10, an upper surface 40b formed by a part of the core 30, a first side surface 40c formed by the outer edge of the housing 10 (for example, the outer edge of the first sheet 11 of the housing 10), and a second side surface 40d formed by the partition wall 60.

[0080] In this case, when the flow path region Ra is viewed in section from the extension direction thereof, the flow path region Ra is sandwiched between the first inner wall surface 11a of the shell 10 and a part of the core 30 in the thickness direction Z, and is sandwiched between a part of the shell 10 and the partition wall 60 in the plane direction orthogonal to the thickness direction Z. In other words, the flow path region Ra is surrounded by the first inner wall surface 11a of the shell 10, the outer edge of the shell 10 (for example, the outer edge of the first sheet 11 of the shell 10), a part of the core, and the partition wall 60.

[0081] When the partition wall 60 is disposed on the first inner wall surface 11a of the housing 10, the core 30 is supported by the partition wall 60. Therefore, even if the core 30 is thinned as the heat spreader 1 is made thinner, the liquid flow path 40 is unlikely to collapse, and thus the volume of the liquid flow path 40 can be ensured.

[0082] exist Figure 2 and Figure 3 In the example shown, one row of partition walls 60 is arranged, but two or more rows of partition walls 60 may be arranged in parallel. In this case, liquid flow paths 40 surrounded by the partition walls 60 may be formed.

[0083] The material forming the partition wall 60 is not particularly limited, but examples thereof include resin, metal, ceramic, or a mixture or laminate thereof. Figure 2 and Figure 3As shown, the partition wall 60 may be integrated with the housing 10 , and may be formed by, for example, etching the inner wall surface of the housing 10 .

[0084] The core 30 may be fixed to the partition wall 60. For example, when the core 30 and the partition wall 60 are made of metal, the core 30 and the partition wall 60 may be bonded. The bonding method is not particularly limited, and diffusion bonding or the like may be used, for example.

[0085] The core 30 may be fixed to the case 10. For example, when the case 10 and the core 30 are made of metal, the core 30 and the case 10 may be joined. The joining method is not particularly limited, and diffusion bonding or the like may be used, for example.

[0086] like Figure 3 As shown, preferably, there is no space between the second inner wall surface 12a of the housing 10 and the core 30. In this case, the core 30 may be fixed to the second inner wall surface 12a of the housing 10. For example, the core 30 may be joined to the second inner wall surface 12a of the housing 10.

[0087] like Figure 3 As shown, preferably, there is no space between the outer edge of the second sheet 12 of the shell 10 and the end of the core 30. In this case, the end of the core 30 may be fixed to the outer edge of the second sheet 12 of the shell 10. For example, the end of the core 30 may be joined to the outer edge of the second sheet 12 of the shell 10.

[0088] like Figure 3 As shown, the end of the core 30 may be supported by the outer edge of the first sheet 11 of the shell 10. In this case, the end of the core 30 may be fixed to the outer edge of the first sheet 11 of the shell 10. For example, the end of the core 30 may be joined to the outer edge of the first sheet 11 of the shell 10.

[0089] like Figure 2 , Figure 3 and Figure 4 As shown, it is preferable to arrange|position a some support|pillar 70 in the steam flow path 50. The steam flow path 50 is disconnected between the support|pillar 70. By arranging the support|pillar 70 in the steam flow path 50, the housing|casing 10 or the core body 30 can be supported.

[0090] like Figure 2 and Figure 4 As shown, it is preferred that the support 70 is disposed throughout the steam flow path 50, but it is also possible that the support 70 is not disposed partially within the steam flow path 50. The support 70 may be disposed in both the first steam region Rb and the second steam region Rc, or may be disposed in only one of the first steam region Rb and the second steam region Rc.

[0091] exist Figure 3 In the example shown, the support 70 disposed in the first steam region Rb contacts the first inner wall surface 11a of the housing 10, and the support 70 disposed in the second steam region Rc contacts the first inner wall surface 11a and the second inner wall surface 12a. The support 70 may contact at least one of the first inner wall surface 11a and the second inner wall surface 12a, or may not contact the first inner wall surface 11a and the second inner wall surface 12a.

[0092] The material forming the support 70 is not particularly limited, but for example, resin, metal, ceramic, or a mixture or laminate thereof can be cited. In addition, the support 70 can also be integrated with the housing 10, and the support 70 can also be formed by, for example, etching the inner wall surface of the housing 10.

[0093] The shape of the support 70 is not particularly limited as long as it can support the case 10 or the core 30 , but examples of the shape of the cross section of the support 70 perpendicular to the height direction include polygonal shapes such as a rectangle, a circle, and an ellipse.

[0094] In one uniform heat sink, the heights of the pillars 70 may be the same or different. For example, the height of the pillars 70 in the first vapor region Rb may be different from the height of the pillars 70 in the second vapor region Rc.

[0095] exist Figure 3 In the cross section shown, the width of the support 70 is not particularly limited as long as it is a width that provides strength that can suppress the deformation of the shell 10 of the heat spreader 1, but the equivalent circle diameter of the cross section perpendicular to the height direction of the end of the support 70 is, for example, 100 μm or more and 2000 μm or less, preferably 300 μm or more and 1000 μm or less. By increasing the equivalent circle diameter of the support 70, the deformation of the shell 10 of the heat spreader 1 can be further suppressed. On the other hand, by reducing the equivalent circle diameter of the support 70, a larger space for the steam of the working medium 20 to move can be ensured.

[0096] The arrangement of the pillars 70 is not particularly limited, but preferably they are evenly arranged in a predetermined area, and more preferably evenly arranged throughout the entirety, for example, arranged so that the distance between the pillars 70 is constant. By evenly arranging the pillars 70, uniform strength can be ensured throughout the entirety of the vapor chamber 1.

[0097] exist Figure 3 In the heat spreader 1 shown in FIG. 1 , the core 30 is spaced apart from the first inner wall surface 11a in the first vapor region Rb. Figure 3As shown, the core 30 may be supported by the support 70 disposed on the first inner wall surface 11 a side of the casing 10 in the first steam region Rb.

[0098] Figure 5 It is an exploded perspective view schematically showing another example of the heat diffusion device according to the first embodiment of the present invention. Figure 6 It is a cross-sectional view schematically showing another example of the heat diffusion device according to the first embodiment of the present invention.

[0099] exist Figure 5 and Figure 6 In the illustrated heat spreader (heat diffusion device) 1A, at least a portion of the core 30 is in contact with the first inner wall surface 11 a in the first vapor region Rb.

[0100] In the first vapor region Rb, for the heat spreader 1A in which at least a portion of the core 30 is in contact with the first inner wall surface 11a, the core 30 sags toward the first inner wall surface 11a. Therefore, compared with the heat spreader 1 in which the core 30 is separated from the first inner wall surface 11a, the gas-liquid exchange surface can be increased. In addition, the leakage at the interface between the core 30 and the partition wall 60 can be reduced.

[0101] like Figure 6 As shown, the core 30 may be supported by the support 70 disposed on the second inner wall surface 12a side of the housing in the first vapor region Rb. The heat spreader 1A in which the core 30 is pressed by the support 70 can be manufactured more easily than the heat spreader 1 .

[0102] [Second embodiment]

[0103] In the heat diffusion device involved in the second embodiment of the present invention, when the flow path area is viewed in section from the extension direction of the flow path area, the flow path area is sandwiched by the first inner wall surface of the shell and the part of the core in the thickness direction, and in the surface direction orthogonal to the thickness direction, the flow path area is sandwiched by the part of the shell and the part of the core.

[0104] Figure 7 It is an exploded perspective view schematically showing an example of a heat diffusion device according to a second embodiment of the present invention. Figure 8 It is a cross-sectional view schematically showing an example of a heat diffusion device according to a second embodiment of the present invention.

[0105] exist Figure 7 and Figure 8 In the heat spreader (heat diffusion device) 2 shown in FIG. Figure 5 and Figure 6 The illustrated vapor chamber 1A is different in that the partition wall 60 is not provided.

[0106] In the heat spreader 2, a liquid flow path 40 is formed by being surrounded by a part of the shell 10 and a part of the core 30. Specifically, the liquid flow path 40 has a bottom surface 40a formed by the first inner wall surface 11a of the shell 10, an upper surface 40b and a second side surface 40d formed by a part of the core 30, and a first side surface 40c formed by the outer edge of the shell 10 (for example, the outer edge of the first sheet 11 of the shell 10).

[0107] In this case, when the flow path region Ra is viewed in section from the extension direction thereof, the flow path region Ra is sandwiched between the first inner wall surface 11a of the shell 10 and a part of the core 30 in the thickness direction Z, and the flow path region Ra is sandwiched between a part of the shell 10 and a part of the core 30 in the plane direction orthogonal to the thickness direction Z. In other words, the flow path region Ra is surrounded by the first inner wall surface 11a of the shell 10, the outer edge of the shell 10 (for example, the outer edge of the first sheet 11 of the shell 10), and a part of the core 30.

[0108] In the heat spreader 2 , compared with the heat spreader 1A, the cross-sectional area of ​​the liquid flow path 40 can be increased by the fact that the partition wall 60 is not provided.

[0109] Fig. 9 It is an exploded perspective view schematically showing another example of the heat diffusion device according to the second embodiment of the present invention. Fig.10 It is a cross-sectional view schematically showing another example of the heat diffusion device according to the second embodiment of the present invention.

[0110] exist Fig. 9 and Fig.10 In the heat spreader (heat diffusion device) 2A shown, a plurality of pillars 75 for supporting the core 30 are arranged in the flow path region Ra. By arranging the pillars 75 in the flow path region Ra, it is easy to maintain the shape of the core 30. In addition, it is easy to expand the core 30 in the surface direction, so that the cross-sectional area of ​​the flow path region Ra can be increased compared to the heat spreader 2.

[0111] like Fig. 9 As shown, it is preferable that the support 75 is arranged in the entire flow path region Ra, but the support 75 may not be arranged in part of the flow path region Ra.

[0112] The arrangement of the pillars 75 is not particularly limited, but is preferably evenly arranged in a predetermined area, more preferably evenly arranged throughout the entire structure, for example, arranged so that the distance between the pillars 75 is constant. The distance between the pillars 75 may be the same as or different from the distance between the pillars 70.

[0113] The support column 75 may or may not be in contact with the first inner wall surface 11 a of the housing 10 .

[0114] The material for forming the support 75 may be the same as that for the support 70. The material of the support 75 may be the same as or different from that of the support 70. In addition, the support 75 may be integrated with the housing 10, and the support 75 may be formed by etching the inner wall surface of the housing 10, for example.

[0115] The shape of the support 75 is not particularly limited as long as it can support the core 30, but the shape of the cross section perpendicular to the height direction of the support 75 may be, for example, a polygon such as a rectangle, a circle, an ellipse, etc. The shape of the support 75 may be the same as or different from that of the support 70.

[0116] In one vapor chamber, the heights of the pillars 75 may be the same or different.

[0117] exist Fig.10 In the cross section shown, the width of support 75 may be the same as or different from the width of support 70 .

[0118] [Third Embodiment]

[0119] In the heat diffusion device involved in the third embodiment of the present invention, when the flow path area is viewed in section from the extension direction of the flow path area, the flow path area is sandwiched by the first inner wall surface of the shell and the part of the core in the thickness direction, and in the surface direction orthogonal to the thickness direction, the flow path area is sandwiched by the part of the core and the part of the core.

[0120] Fig.11 It is an exploded perspective view schematically showing an example of a heat diffusion device according to a third embodiment of the present invention. Fig.12 It is a cross-sectional view schematically showing an example of a heat diffusion device according to a third embodiment of the present invention.

[0121] exist Fig.11 and Fig.12 In the heat spreader (heat diffusion device) 3 shown, in addition to passing through the first inner wall surface 11a of the shell 10, the liquid flow path 40 is also formed by being surrounded by a part of the core 30. Specifically, the liquid flow path 40 has a bottom surface 40a formed by the first inner wall surface 11a of the shell 10, an upper surface 40b formed by a part of the core 30, a first side surface 40c, and a second side surface 40d.

[0122] In this case, when the flow path region Ra is viewed in section from the extension direction thereof, the flow path region Ra is sandwiched between the first inner wall surface 11a of the shell 10 and a part of the core 30 in the thickness direction Z, and the flow path region Ra is sandwiched between a part of the core 30 and a part of the core 30 in the plane direction orthogonal to the thickness direction Z. In other words, the flow path region Ra is surrounded by the first inner wall surface 11a of the shell 10 and a part of the core 30.

[0123] In the heat spreader 3 , similarly to the heat spreader 2 , the cross-sectional area of ​​the liquid flow path 40 can be made larger than that of the heat spreader 1A.

[0124] The heat spreader 3 can be manufactured by placing a core 30 formed into a predetermined shape by press forming using a die, for example.

[0125] Fig.13 It is an exploded perspective view schematically showing another example of the heat diffusion device according to the third embodiment of the present invention. Fig.14 It is a cross-sectional view schematically showing another example of the heat diffusion device according to the third embodiment of the present invention.

[0126] exist Fig.13 and Fig.14 In the heat spreader (heat diffusion device) 3A shown, a plurality of pillars 75 for supporting the core 30 are arranged in the flow path region Ra. By arranging the pillars 75 in the flow path region Ra, it is easy to maintain the shape of the core 30. In addition, it is easy to expand the core 30 in the surface direction, so that the cross-sectional area of ​​the flow path region Ra can be made larger than that of the heat spreader 3.

[0127] [Fourth embodiment]

[0128] In the heat diffusion device involved in the fourth embodiment of the present utility model, when the flow path region is cross-sectionally viewed from the extension direction of the flow path region, the flow path region includes a first flow path region and a second flow path region. The first flow path region is sandwiched between the first inner wall surface of the shell and a part of the core in the thickness direction, and is sandwiched between parts of the core and parts of the core in the surface direction orthogonal to the thickness direction. The second flow path region is sandwiched between the second inner wall surface of the shell and a part of the core in the thickness direction, and is sandwiched between parts of the core and parts of the core in the surface direction orthogonal to the thickness direction.

[0129] Fig.15 It is an exploded perspective view schematically showing an example of a heat diffusion device according to a fourth embodiment of the present invention. Fig.16 It is a cross-sectional view schematically showing an example of a heat diffusion device according to a fourth embodiment of the present invention.

[0130] exist Fig.15 and Fig.16In the heat spreader (heat diffusion device) 4 shown, in addition to the first inner wall surface 11a or the second inner wall surface 12a of the shell 10, a liquid flow path 40 is formed by being surrounded by a part of the core 30. The liquid flow path 40 includes a first liquid flow path 41 and a second liquid flow path 42. Specifically, the first liquid flow path 41 has a bottom surface 41a formed by the first inner wall surface 11a of the shell 10, an upper surface 41b formed by a part of the core 30, a first side surface 41c, and a second side surface 41d. The second liquid flow path 42 has a bottom surface 42a formed by the second inner wall surface 12a of the shell 10, an upper surface 42b formed by a part of the core 30, a first side surface 42c, and a second side surface 42d.

[0131] In this case, when the flow path region Ra is viewed in section from the extension direction of the flow path region Ra, the flow path region Ra includes a first flow path region Ra1 and a second flow path region Ra2. The first flow path region Ra1 is sandwiched between the first inner wall surface 11a of the shell 10 and a part of the core 30 in the thickness direction Z, and the first flow path region Ra1 is sandwiched between a part of the core 30 and a part of the core 30 in the plane direction orthogonal to the thickness direction Z. The second flow path region Ra2 is sandwiched between the second inner wall surface 12a of the shell 10 and a part of the core 30 in the thickness direction Z, and the second flow path region Ra2 is sandwiched between a part of the core 30 and a part of the core 30 in the plane direction orthogonal to the thickness direction Z. In other words, the first flow path region Ra1 is surrounded by the first inner wall surface 11a of the shell 10 and a part of the core 30, and the second flow path region Ra2 is surrounded by the second inner wall surface 12a of the shell 10 and a part of the core 30.

[0132] In the heat spreader 4 , even if one of the first liquid flow path 41 and the second liquid flow path 42 cannot be used, the other flow path can be used to ensure the operation of the heat spreader 4 , thereby preventing the flow of the liquid working medium 20 from being stopped.

[0133] Alternatively, in the heat spreader 4, a plurality of pillars 75 for supporting the core 30 may be arranged in the flow path region Ra. In this case, a plurality of pillars 75 may be arranged in the first flow path region Ra1, a plurality of pillars 75 may be arranged in the second flow path region Ra2, or a plurality of pillars 75 may be arranged in both the first flow path region Ra1 and the second flow path region Ra2.

[0134] In the uniform heat plate 4 , the liquid flow path 40 may further include a third liquid flow path or the like. In other words, the flow path region Ra may further include a third flow path region or the like.

[0135] [Other embodiments]

[0136] The heat diffusion device of the present invention is not limited to the above-mentioned embodiment, and various applications and modifications can be made within the scope of the present invention regarding the structure, manufacturing conditions, etc. of the heat diffusion device.

[0137] In the heat diffusion device of the present invention, it is preferred that the evaporation portion and the flow path region overlap when viewed in the thickness direction.

[0138] For example, in Figure 4 In the illustrated heat spreader 1 , when viewed in the thickness direction Z, the evaporation portion EP overlaps with the edge of the internal space of the housing 10 . Therefore, when viewed in the thickness direction Z, the evaporation portion EP overlaps with the flow path region Ra.

[0139] Fig.17 This is a plan view schematically showing a first modified example of the internal structure of the heat diffusion device of the present invention.

[0140] exist Fig.17 In the heat spreader (heat diffusion device) 5 shown in FIG. 1 , the planar shape of the housing 10 is L-shaped when viewed from the thickness direction Z. Figure 4 The heat sink 1 shown is different. Fig.17 In the illustrated heat spreader 5, the evaporation portion EP does not overlap with the edge of the internal space of the housing 10 when viewed in the thickness direction Z. However, in the heat spreader 5, the flow path region Ra is also arranged in a portion other than the edge of the internal space of the housing 10 when viewed in the thickness direction Z. Therefore, when viewed in the thickness direction Z, the evaporation portion EP overlaps with the flow path region Ra.

[0141] Alternatively, in the heat diffusion device of the present invention, the evaporation portion may be provided at a central portion of the housing or at a periphery thereof.

[0142] Fig.18 It is a plan view schematically showing a second modified example of the internal structure of the heat diffusion device of the present invention. Fig.19 It is a plan view schematically showing a third modified example of the internal structure of the heat diffusion device of the present invention.

[0143] exist Fig.18 The heat spreader (heat diffusion device) 6 and Fig.19 In the illustrated heat spreader (heat diffusion device) 7 , the evaporation portion EP is provided near the center of the housing 10 .

[0144] exist Fig.18 In the illustrated uniform heat plate 6 , when viewed from the thickness direction Z, the flow path region Ra is arranged to pass through the interior of the evaporation portion EP.

[0145] exist Fig.19 In the illustrated uniform heat plate 7 , when viewed from the thickness direction Z, the flow path region Ra is arranged along the outer periphery of the evaporation portion EP.

[0146] exist Fig.18 In the heat spreader 6 shown in FIG. Fig.19 Compared with the heat spreader 7 shown in FIG. 1 , the proportion of the steam flow path 50 in the internal space of the housing 10 can be increased. Fig.19 In the heat spreader 7 shown, Fig.18 Compared with the heat spreader 6 shown in FIG. 1 , the heat source HS (refer to Figure 1 ) is easily transferred to the working medium 20.

[0147] In the heat diffusion device of the present invention, the shell may have one evaporation part or multiple evaporation parts. That is, the outer wall surface of the shell may be provided with one heat source or multiple heat sources. The number of evaporation parts and heat sources is not particularly limited.

[0148] In the heat diffusion device of the present invention, when the housing is composed of the first sheet and the second sheet, the first sheet and the second sheet may be overlapped with their ends aligned or offset.

[0149] Alternatively, in the heat diffusion device of the present invention, when the housing is composed of a first sheet and a second sheet, the material constituting the first sheet is different from the material constituting the second sheet. For example, by using a high-strength material for the first sheet, the stress applied to the housing can be dispersed. In addition, by making the materials of the two different, one function can be obtained by using one sheet, and another function can be obtained by using the other sheet. The above-mentioned functions are not particularly limited, but for example, heat conduction function, electromagnetic wave shielding function, etc. can be cited.

[0150] The heat diffusion device of the present invention can be mounted on an electronic device for heat dissipation. Therefore, an electronic device equipped with the heat diffusion device of the present invention is also one of the present inventions. As electronic devices of the present invention, for example, smart phones, tablet terminals, laptop computers, game consoles, wearable devices, etc. can be cited. As described above, the heat diffusion device of the present invention works by itself without the need for external power, and utilizes the latent heat of evaporation and latent heat of condensation of the working medium to diffuse heat in two dimensions and at high speed. Therefore, by using an electronic device equipped with the heat diffusion device of the present invention, heat dissipation can be effectively achieved within the limited space inside the electronic device.

[0151] Industrial Applicability

[0152] The heat diffusion device of the utility model can be used for a wide range of purposes in the fields of portable information terminals, etc. For example, it can be used to reduce the temperature of heat sources such as CPUs and extend the use time of electronic devices, and can be used in smart phones, tablet terminals, notebook computers, etc.

[0153] Description of Reference Numerals

[0154] 1, 1A, 2, 2A, 3, 3A, 4, 5, 6, 7...heat spreader (heat diffusion device); 10...housing; 11...first sheet; 11a...first inner wall surface; 12...second sheet; 12a...second inner wall surface; 20...working medium; 30...core; 40...liquid flow path; 40a...bottom surface of liquid flow path; 40b...upper surface of liquid flow path; 40c...first side surface of liquid flow path; 40d...second side surface of liquid flow path; 41...first liquid flow path; 41a...bottom surface of first liquid flow path; 41b...upper surface of first liquid flow path; 41c...second side surface of first liquid flow path 1 side; 41d...the second side of the first liquid flow path; 42...the second liquid flow path; 42a...the bottom surface of the second liquid flow path; 42b...the upper surface of the second liquid flow path; 42c...the first side of the second liquid flow path; 42d...the second side of the second liquid flow path; 50...the vapor flow path; 60...the partition wall; 70, 75...the pillar; EP...the evaporation part; HS...the heat source; Ra...the flow path region; Ra1...the first flow path region; Ra2...the second flow path region; Rb...the first vapor region; Rc...the second vapor region; X...the width direction; Y...the length direction; Z...the thickness direction.

Claims

1. A heat diffusion device, characterized in that: have: A shell having a first inner wall surface and a second inner wall surface facing each other in a thickness direction and provided with an internal space; a working medium sealed in the internal space of the housing; as well as a core body disposed in the inner space of the shell, The inner space of the housing has: a flow path region formed by being surrounded by at least a portion of the shell and a portion of the core, and the flow path region overlaps a portion of the core when viewed in the thickness direction; a first vapor region, the first vapor region overlapping a portion of the core body when viewed in the thickness direction; as well as a second vapor region, wherein the second vapor region does not overlap with the core body when viewed in the thickness direction, When viewed from the thickness direction, the flow path region is arranged along an edge of the internal space of the housing. The first steam region has a portion located between the second steam region and the flow path region when viewed in section in the extending direction of the flow path region.

2. The heat diffusion device according to claim 1, characterized in that: further comprising a rail-shaped partition wall, the partition wall being arranged on the first inner wall surface of the housing along the edge of the inner space of the housing at a distance from the edge of the inner space of the housing, When viewed in section from the extension direction of the flow path area, the flow path area is sandwiched between the first inner wall surface of the shell and a part of the core in the thickness direction, and in the surface direction orthogonal to the thickness direction, the flow path area is sandwiched between a part of the shell and the partition wall.

3. The heat diffusion device according to claim 2, characterized in that: In the first steam region, the core is spaced apart from the first inner wall surface.

4. The heat diffusion device according to claim 2, characterized in that: In the first vapor region, at least a portion of the core is in contact with the first inner wall surface.

5. The heat diffusion device according to claim 1, characterized in that: When viewed in section from the extension direction of the flow path area, the flow path area is sandwiched between the first inner wall surface of the shell and a part of the core in the thickness direction, and in the surface direction orthogonal to the thickness direction, the flow path area is sandwiched between a part of the shell and a part of the core.

6. The heat diffusion device according to claim 1, characterized in that When viewed in section from the extension direction of the flow path area, the flow path area is sandwiched between the first inner wall surface of the shell and a part of the core in the thickness direction, and in the surface direction orthogonal to the thickness direction, the flow path area is sandwiched between a part of the core and a part of the core.

7. The heat diffusion device according to claim 1, characterized in that When the flow path area is viewed in section from the extension direction of the flow path area, the flow path area includes a first flow path area and a second flow path area, the first flow path area is sandwiched by the first inner wall surface of the shell and a part of the core in the thickness direction, and in the surface direction orthogonal to the thickness direction, the first flow path area is sandwiched by a part of the core and a part of the core, and the second flow path area is sandwiched by the second inner wall surface of the shell and a part of the core in the thickness direction, and in the surface direction orthogonal to the thickness direction, the second flow path area is sandwiched by a part of the core and a part of the core.

8. The heat diffusion device according to any one of claims 5 to 7, characterized in that: A plurality of pillars supporting the core are further provided in the flow path region.

9. The heat diffusion device according to any one of claims 1 to 7, characterized in that: The housing has an evaporation portion in the inner space. When viewed from the thickness direction, the evaporation portion overlaps the flow path region.

10. The heat diffusion device according to claim 9, characterized in that The evaporation portion overlaps an edge of the internal space of the casing when viewed in the thickness direction.

11. The heat diffusion device according to claim 9, characterized in that When viewed from the thickness direction, the flow path region is also arranged at a portion other than an edge of the internal space of the housing. The evaporation portion does not overlap with an edge of the internal space of the casing when viewed in the thickness direction.

12. The heat diffusion device according to claim 9, characterized in that The flow path region is arranged to pass through the interior of the evaporation portion when viewed from the thickness direction.

13. The heat spreading device according to claim 9, characterized in that The flow path region is arranged along the outer periphery of the evaporation portion when viewed from the thickness direction.

14. An electronic device, characterized in that: A heat diffusion device according to any one of claims 1 to 13.

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