Thermal diffusion device and electronic equipment

Abstract

A thermal diffusion device and an electronic apparatus are provided. A vapor chamber (1), which is an embodiment of a heat diffusion device, is provided with: a housing (10) having a first inner wall surface (11a) and a second inner wall surface (12a) that face each other in the thickness direction (Z); a working medium (20) sealed in the internal space of the housing (10); and a sheet-like core (30) disposed in the internal space of the case (10). The core (30) has a curved section (35) provided so as to protrude from the first inner wall surface (11a) toward the second inner wall surface (12a). A liquid flow path (40) for the working medium (20) is formed in a space surrounded by the bent portion (35) of the core (30) and the first inner wall surface (11a).

Description

Technical Field

[0001] The utility model relates to a heat diffusion device and an electronic device. Background Art

[0002] In recent years, the heat generation has increased due to the high integration and high performance of components. In addition, as the miniaturization of products develops, the heat density increases, so heat dissipation measures become important. This situation is particularly significant in the field of mobile terminals such as smartphones and tablets. As thermal countermeasure components, graphite sheets are mostly used, but their heat transfer capacity is insufficient, so the use of various thermal countermeasure components is being studied. Among them, as a thermal diffusion device that can diffuse heat very effectively, research on the use of planar heat pipes, that is, heat spreaders, is being promoted.

[0003] The heat spreader has a structure in which a working medium (also called working fluid) is sealed inside a shell and a core that transports the working medium using capillary force. The working medium absorbs heat from the heating element such as electronic components at the evaporation portion that absorbs heat from the heating element. After the working medium evaporates in the heat spreader, it moves in the heat spreader, and the working medium is cooled and returns to the liquid phase. The working medium that returns to the liquid phase moves toward the evaporation portion on the heating element side again due to the capillary force of the core, cooling the heating element. By repeating the above actions, the heat spreader works autonomously without external power, and can diffuse heat two-dimensionally and at high speed using the latent heat of evaporation and latent heat of condensation of the working medium.

[0004] In order to cope with the thinning and lightening of mobile terminals such as smartphones and tablet computers, the heat spreader is also being sought to be thinner and lighter. In such a thin heat spreader, it is difficult to ensure mechanical strength and heat transfer efficiency.

[0005] Therefore, as described in Patent Document 1, it is proposed to "provide a support portion inside the housing in order to maintain the internal space of the housing constituting the heat spreader."

[0006] Patent document 1 discloses a heat spreader, comprising: a container, which forms a cavity portion by a plate-like body to which a heat source is thermally connected and another plate-like body facing the one plate-like body; a working fluid, which is sealed in the above-mentioned cavity portion; and a core structure, which is accommodated in the above-mentioned cavity portion and is an individual independent of the above-mentioned container, wherein the above-mentioned container has a supporting portion protruding from the inner surface of the other plate-like body toward the above-mentioned one plate-like body by providing a recess on the outer surface of the above-mentioned other plate-like body, and the angle formed between the supporting portion and the inner surface of the above-mentioned other plate-like body at a rising base rising from the inner surface of the above-mentioned other plate-like body is an obtuse angle.

[0007] Patent Document 1: Japanese Patent Application Publication No. 2021-76355

[0008] In the heat spreader described in Patent Document 1, the sum of the height of the support portion and the thickness of the core structure is equivalent to the thickness of the internal space, so the heat spreader can be made thinner by adjusting the height of the support portion and the thickness of the core structure. However, from the perspective of improving the heat dissipation efficiency of the heat spreader, there is room for improvement.

[0009] The above-mentioned problem is not limited to the vapor chamber, but is also a problem common to heat diffusion devices that can diffuse heat with the same structure as the vapor chamber. Utility Model Content

[0010] The present invention is made to solve the above problems, and its purpose is to provide a heat diffusion device with high heat dissipation efficiency. In addition, the present invention is to provide an electronic device having the above heat diffusion device.

[0011] The heat diffusion device of the utility model comprises: a shell having a first inner wall surface and a second inner wall surface facing each other in the thickness direction; a working medium sealed in the internal space of the shell; and a sheet-shaped core body arranged in the internal space of the shell. The core body has a curved portion, and the curved portion is provided by protruding from the first inner wall surface toward the second inner wall surface. A liquid flow path of the working medium is formed in the space surrounded by the curved portion of the core body and the first inner wall surface.

[0012] The thermal diffusion device may further include a support, the support being arranged in the internal space of the housing and in contact with the second inner wall surface, and the bent portion of the core may be arranged in a region not sandwiched between the support and the first inner wall surface.

[0013] The bent portion of the core may extend along a longitudinal direction of the casing.

[0014] Alternatively, the bent portion of the core extends in only one direction.

[0015] The bent portions of the core may be arranged in parallel in two or more rows.

[0016] The curved portion of the core may be arranged along an outer peripheral portion of the internal space of the casing.

[0017] The electronic device of the present invention is provided with the heat diffusion device of the present invention.

[0018] According to the technical solution of the present invention, a heat diffusion device with high heat dissipation efficiency can be provided. In addition, according to the technical solution of the present invention, an electronic device including the heat diffusion device can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a perspective view schematically showing an example of the heat diffusion device according to the first embodiment of the present invention.

[0020] Figure 2 It is a plan view schematically showing an example of the internal structure of the heat diffusion device according to the first embodiment of the present invention.

[0021] Figure 3 yes Figure 2 An example of a cross-sectional view of a heat spreader along line AA is shown.

[0022] Figure 4 yes Figure 2 Another example of a cross-sectional view of a heat spreader along line AA is shown.

[0023] Figure 5 It is a plan view schematically showing an example of the internal structure of the heat diffusion device according to the second embodiment of the present invention.

[0024] Figure 6 yes Figure 5 An example of a cross-sectional view of a heat spreader along line AA is shown.

[0025] Figure 7 It is a plan view schematically showing an example of the internal structure of a heat diffusion device according to a third embodiment of the present invention.

[0026] Figure 8 yes Figure 7 An example of a cross-sectional view of a heat spreader along line AA is shown. DETAILED DESCRIPTION

[0027] Hereinafter, the heat diffusion device of the present invention will be described.

[0028] However, the present invention is not limited to the following embodiments, and can be appropriately changed and applied within the scope of the gist of the present invention. In addition, a structure obtained by combining two or more of the preferred structures of the present invention described below is also a technical solution of the present invention.

[0029] In the heat diffusion device of the present invention, a sheet-shaped core is disposed in the inner space of the housing, so that the size of the gas-liquid exchange surface is not limited compared to the case where a linearly extending core is disposed.

[0030] The sheet-like core has a curved portion, which is provided by protruding from the first inner wall surface of the housing toward the second inner wall surface, and a liquid flow path of the working medium is formed in a space surrounded by the curved portion of the core and the first inner wall surface. Therefore, not only can capillary force be generated by the core located around the liquid flow path, but also the working medium can be smoothly moved in the liquid flow path by reducing the liquid resistance passing through the liquid flow path. As a result, the permeability can be improved compared with the core alone.

[0031] As described above, in the heat spreader of the present invention, the maximum heat transfer amount becomes larger, and therefore the heat dissipation efficiency can be improved.

[0032] The embodiments shown below are examples, and it is of course possible to partially replace or combine the structures shown in different embodiments. In the second embodiment and subsequent embodiments, the description of the technical features shared with the first embodiment is omitted, and only the differences are described. In particular, the same effects brought about by the same structure are not mentioned in sequence according to each embodiment.

[0033] In the following description, when the embodiments are not particularly distinguished, they are simply referred to as "the heat diffusion device of the present invention".

[0034] Hereinafter, as an embodiment of the heat diffusion device of the present invention, a heat diffusion plate is used as an example to describe the heat diffusion device of the present invention. The heat diffusion device of the present invention can also be applied to heat diffusion devices such as heat pipes.

[0035] The drawings shown below are schematic, and their dimensions, aspect ratios, and the like may differ from those of actual products.

[0036] In this specification, terms indicating the relationship between elements (such as "vertical", "parallel", "orthogonal", etc.) and terms indicating the shape of an element do not express only strict meanings, but mean expressions of a range that is substantially equivalent to them, for example, also including expressions with a difference of about several percent.

[0037] [First embodiment]

[0038] In the heat diffusion device according to the first embodiment of the present invention, the bent portions of the core are arranged in parallel in two or more rows. These bent portions are arranged so as to converge at the evaporation portion.

[0039] Figure 1 It is a perspective view schematically showing an example of the heat diffusion device according to the first embodiment of the present invention. Figure 2 It is a plan view schematically showing an example of the internal structure of the heat diffusion device according to the first embodiment of the present invention. Figure 3 yes Figure 2An example of a cross-sectional view of a heat spreader along line AA is shown.

[0040] Figure 1 The heat spreader (heat diffusion device) 1 shown in the figure has a hollow housing 10 which is sealed in an airtight state. Figure 3 As shown, the housing 10 has a first inner wall surface 11 a and a second inner wall surface 12 a facing each other in the thickness direction Z. The heat spreader 1 further includes a working medium 20 sealed in the inner space of the housing 10 and a core 30 disposed in the inner space of the housing 10 .

[0041] like Figure 2 As shown, the housing 10 is provided with a sealing member 20 (see Figure 3 ) Evaporation portion EP. Figure 1 As shown, a heat source HS as a heating element is arranged on the outer wall surface of the housing 10. The heat source HS may be an electronic component of an electronic device such as a central processing unit (CPU), etc. The portion of the internal space of the housing 10 that is near the heat source HS and heated by the heat source HS corresponds to the evaporation portion EP.

[0042] Preferably, the heat spreader 1 is planar as a whole. That is, preferably, the housing 10 is planar as a whole. Here, "planar" includes plate-like and sheet-like, and refers to a shape in which the dimension in the width direction X (hereinafter referred to as the width) and the dimension in the length direction Y (hereinafter referred to as the length) are considerably larger than the dimension in the thickness direction Z (hereinafter referred to as the thickness or height), for example, a shape in which the width and length are more than 10 times the thickness, preferably more than 100 times.

[0043] The size of the heat spreader 1, that is, the size of the housing 10, is not particularly limited. The width and length of the heat spreader 1 can be appropriately set according to the purpose. The width and length of the heat spreader 1 are, for example, 5 mm to 500 mm, 20 mm to 300 mm, or 50 mm to 200 mm. The width and length of the heat spreader 1 may be the same or different.

[0044] The housing 10 is preferably composed of a first sheet material 11 and a second sheet material 12 that face each other and are joined at their outer edges.

[0045] When the housing 10 is composed of the first sheet 11 and the second sheet 12, the materials constituting the first sheet 11 and the second sheet 12 are not particularly limited as long as they have properties suitable for use as a heat spreader, such as thermal conductivity, strength, softness, flexibility, etc. The materials constituting the first sheet 11 and the second sheet 12 are preferably metals, such as copper, nickel, aluminum, magnesium, titanium, iron, or alloys containing them as main components, and copper is particularly preferred. The materials constituting the first sheet 11 and the second sheet 12 may be the same or different, but are preferably the same.

[0046] When the housing 10 is composed of the first sheet 11 and the second sheet 12, the first sheet 11 and the second sheet 12 are joined to each other at their outer edges. Such a joining method is not particularly limited, but for example, laser welding, resistance welding, diffusion bonding, brazing, TIG welding (tungsten-inert gas welding), ultrasonic bonding or resin sealing can be used, preferably laser welding, resistance welding or brazing.

[0047] The thickness of the first sheet 11 and the second sheet 12 is not particularly limited, but is preferably 10 μm or more and 200 μm or less, more preferably 30 μm or more and 100 μm or less, and further preferably 40 μm or more and 60 μm or less. The thickness of the first sheet 11 and the second sheet 12 may be the same or different. In addition, the thickness of each sheet of the first sheet 11 and the second sheet 12 may be the same as a whole or may be thinner in part.

[0048] The shapes of the first sheet 11 and the second sheet 12 are not particularly limited. For example, the first sheet 11 and the second sheet 12 may each be shaped such that the outer edge portion is thicker than the portion other than the outer edge portion.

[0049] The thickness of the entire heat spreader 1 is not particularly limited, but is preferably 50 μm or more and 500 μm or less.

[0050] The plane shape of the housing 10 observed from the thickness direction Z is not particularly limited, and examples thereof include: polygons such as triangles or rectangles, circles, ellipses, and shapes obtained by combining these shapes. In addition, the plane shape of the housing 10 may also be a letter L shape, a letter C shape (Japanese kana コ shape), a step shape, etc. In addition, the housing 10 may also have a through opening. The plane shape of the housing 10 may also be a shape corresponding to the purpose of the heat spreader, or a shape corresponding to the shape of the assembly portion of the heat spreader or other components present nearby.

[0051] The working medium 20 is not particularly limited as long as it is a medium that can produce a gas-liquid phase change under the environment in the housing 10, and can be, for example, water, alcohol, freon substitutes, etc. For example, the working medium 20 is an aqueous compound, preferably water.

[0052] like Figure 2 and Figure 3 As shown, the core 30 is in a sheet shape as a whole. Here, "sheet shape" refers to a shape in which the width and length are considerably larger than the thickness, for example, a shape in which the width and length are 10 times or more, preferably 100 times or more than the thickness.

[0053] The core 30 has a capillary structure that can move the working medium 20 by capillary force. The capillary structure of the core 30 may also be a known structure used in an existing heat spreader. As the capillary structure, there can be listed microstructures with pores, grooves, protrusions, etc., such as a porous structure, a fiber structure, a groove structure, a mesh structure, etc.

[0054] The material of the core 30 is not particularly limited, and for example, a metal porous film, a mesh, a nonwoven fabric, a sintered body, a porous body, etc. formed by etching or metal processing can be used. The mesh that becomes the material of the core 30 can be composed of, for example, a metal mesh, a resin mesh, or these meshes with a surface coating, preferably a copper mesh, a stainless steel (SUS) mesh, or a polyester mesh. The sintered body that becomes the material of the core 30 can also be composed of, for example, a metal porous sintered body, a ceramic porous sintered body, etc., preferably a porous sintered body of copper or nickel. The porous body that becomes the material of the core 30 can also be composed of, for example, a metal porous body, a ceramic porous body, a resin porous body, etc.

[0055] The thickness of the core 30 is not particularly limited, but is, for example, 2 μm to 200 μm, preferably 5 μm to 100 μm, and more preferably 10 μm to 40 μm. The thickness of the core 30 may vary partially, but is preferably constant.

[0056] The size and shape of the core 30 are not particularly limited, but for example, the core 30 is preferably disposed continuously in the internal space of the housing 10. Figure 2 and Figure 3 In the example shown, the core 30 is disposed in the entire internal space of the housing 10, but the core 30 may not be disposed in part of the internal space of the housing 10. Figure 2 and Figure 3 In the embodiment, the outer peripheral portion of the inner space of the shell 10 is in contact with the core 30 , but the outer peripheral portion of the inner space of the shell 10 may not be in contact with the core 30 .

[0057] like Figure 3As shown, the core 30 is arranged along the first inner wall surface 11a of the housing 10. The core 30 has a curved portion 35 that is provided by protruding from the first inner wall surface 11a toward the second inner wall surface 12a. On the one hand, a liquid flow path 40 of the working medium 20 is formed in the space surrounded by the curved portion 35 of the core 30 and the first inner wall surface 11a. On the other hand, a vapor flow path 50 of the working medium 20 is formed in the gap other than the liquid flow path 40 in the housing 10.

[0058] like Figure 2 and Figure 3 As shown, when viewed from the thickness direction Z, the bent portion 35 of the core 30 is along the long side direction ( Figure 2 and Figure 3 Extending in the length direction Y).

[0059] exist Figure 2 and Figure 3 In the illustrated example, two or more rows of the bent portions 35 are arranged in parallel to each other, but only one row of the bent portions 35 may be arranged.

[0060] When two or more rows of curved portions 35 are provided, these curved portions 35 may also be arranged as follows. Figure 2 As shown, the bent portions 35 are arranged to converge at the evaporation portion EP. That is, when viewed from the thickness direction Z, the bent portions 35 may converge at the evaporation portion EP and at least one row of bent portions may have at least one bent portion. By converging the bent portions 35 at the evaporation portion EP, the working medium 20 can be circulated over a shorter distance.

[0061] In the cross section of the curved portion 35 perpendicular to the extension direction, the width of the curved portion 35 is not particularly limited, but is, for example, 10 μm or more and 1000 μm or less. The width of the curved portion 35 corresponds to the width of the liquid flow path 40. The width of the curved portion 35 may be constant or not constant in the thickness direction Z. In addition, when the width of the curved portion 35 in the thickness direction Z is different, the width of the widest part is defined as the width of the curved portion 35.

[0062] In the cross section of the curved portion 35 perpendicular to the extension direction, the height of the curved portion 35 is not particularly limited, but is, for example, 10 μm or more and 100 μm or less. The height of the curved portion 35 corresponds to the height of the liquid flow path 40. The height of the curved portion 35 may be constant or not constant in the width direction X and the length direction Y. In addition, when the height of the curved portion 35 is different in the width direction X and the length direction Y, the height of the highest portion is defined as the height of the curved portion 35.

[0063] like Figure 2 and Figure 3As shown, it is preferred that a support 60 in contact with the second inner wall surface 12a is arranged in the internal space of the housing 10. The support 60 is arranged in the steam flow path 50. The steam flow path 50 is partitioned between the support 60. By arranging the support 60 in the internal space of the housing 10, the housing 10 can be supported. In addition, the core 30 can also be supported by pressing the core 30 with the support 60.

[0064] like Figure 2 and Figure 3 As shown, when the support 60 is disposed in the internal space of the housing 10, the curved portion 35 of the core 30 is preferably disposed in a region not sandwiched between the support 60 and the first inner wall surface 11a. In other words, it is preferred that the curved portion 35 of the core 30 is not disposed between the support 60 and the first inner wall surface 11a in the thickness direction Z. By disposing the curved portion 35 forming the liquid flow path 40 between the support 60, the maximum heat transfer amount can be increased without increasing the overall thickness of the heat spreader 1.

[0065] When two or more rows of bent portions 35 are arranged in a region not sandwiched between the support pillars 60 and the first inner wall surface 11 a , the numbers of bent portions 35 arranged between the support pillars 60 may be the same or different.

[0066] The support 60 may be in contact with the core 30 or may be fixed to the core 30. When the support 60 is fixed to the core 30, the assembly of the heat spreader 1 becomes easier. For example, when the core 30 and the support 60 are made of metal, the core 30 and the support 60 are bonded. The bonding method is not particularly limited, and for example, diffusion bonding and the like can be used. In addition, the core 30 may be bonded to the support 60 via a silicon dioxide film or the like.

[0067] The support pillars 60 may be disposed throughout the steam flow path 50 , or the support pillars 60 may not be disposed partially within the steam flow path 50 .

[0068] The material forming the support 60 is not particularly limited, but examples thereof include resin, metal, ceramic, or mixtures and laminates thereof. In addition, the support 60 may be integrated with the housing 10 , for example, by etching the inner wall surface of the housing 10 .

[0069] The shape of the support 60 is not particularly limited as long as it can support the housing 10 and the core 30 , but examples of the shape of the cross section of the support 60 perpendicular to the height direction include polygonal shapes such as rectangles, circles, and ellipses.

[0070] The heights of the pillars 60 may be the same or different in one heat spreader.

[0071] exist Figure 3 In the cross section shown, the width of the support 60 is not particularly limited as long as it is a width that provides strength to suppress the deformation of the housing 10, but the equivalent circle diameter of the cross section perpendicular to the height direction of the end of the support 60 is, for example, 100 μm or more and 2000 μm or less, preferably 300 μm or more and 1000 μm or less. On the one hand, by increasing the equivalent circle diameter of the support 60, the deformation of the housing 10 can be further suppressed. On the other hand, by reducing the equivalent circle diameter of the support 60, a larger space for the steam of the working medium 20 to move can be ensured.

[0072] The arrangement of the pillars 60 is not particularly limited, but they are preferably evenly arranged in a predetermined area, and more preferably evenly arranged throughout the entirety, for example, so that the distance between the pillars 60 is constant. By evenly arranging the pillars 60, uniform strength can be ensured throughout the entirety of the vapor chamber 1.

[0073] The curved portion 35 of the core 30 forming the liquid flow path 40 has a shape in which the core 30 is curved. The curved portion 35 of the core 30 can be formed, for example, by embossing the core 30. The cross-sectional shape of the curved portion 35 perpendicular to the extending direction is not particularly limited. Figure 3 In the illustrated heat spreader 1, the cross-sectional shape of the curved portion 35 perpendicular to the extending direction is a quadrilateral such as a rectangle. When two or more rows of curved portions 35 are arranged, the cross-sectional shapes of the curved portions 35 may be the same or different.

[0074] Figure 4 yes Figure 2 Another example of a cross-sectional view of a heat spreader along line AA is shown.

[0075] exist Figure 4 In the illustrated heat spreader (heat spreading device) 1A, the cross-sectional shape of the bent portion 35 perpendicular to the extending direction is a semicircle.

[0076] like Figure 4 As shown, the cross-sectional shape of the curved portion 35 perpendicular to the extending direction may also be a semicircle or a semi-ellipse, or may be a polygon such as a triangle. In addition, the corners of the polygon may be rounded. If the cross-sectional shape of the curved portion 35 has rounded corners, the liquid resistance passing through the liquid flow path 40 can be reduced.

[0077] [Second embodiment]

[0078] In the heat diffusion device according to the second embodiment of the present invention, the bent portion of the core extends only in one direction.

[0079] In the second embodiment of the present invention, the jig and process for forming the bent portion of the core are simplified compared to the first embodiment of the present invention. Therefore, the yield of the heat diffusion device can be improved.

[0080] Figure 5 It is a plan view schematically showing an example of the internal structure of the heat diffusion device according to the second embodiment of the present invention. Figure 6 yes Figure 5 An example of a cross-sectional view of a heat spreader along line AA is shown.

[0081] exist Figure 5 and Figure 6 In the heat spreader (heat diffusion device) 2 shown, the bent portion 35 of the core 30 is not configured to converge at the evaporation portion EP, but extends only in one direction. Therefore, when viewed from the thickness direction Z, the bent portion 35 has no bend. Specifically, when viewed from the thickness direction Z, the bent portion 35 extends only in the long side direction ( Figure 5 and Figure 6 Extending in the length direction Y).

[0082] exist Figure 5 and Figure 6 In the illustrated example, two or more rows of the bent portions 35 are arranged in parallel to each other, but only one row of the bent portions 35 may be arranged.

[0083] [Third Embodiment]

[0084] In the heat diffusion device according to the third embodiment of the present invention, the bent portion of the core is arranged along the outer peripheral portion of the internal space of the housing.

[0085] In the third embodiment of the present invention, the curved portion of the core is not arranged throughout the entire internal space of the shell. Therefore, a larger steam flow path is ensured. Therefore, the central portion of the internal space of the shell has excellent thermal conductivity, and thus the heat distribution performance is improved.

[0086] Figure 7 It is a plan view schematically showing an example of the internal structure of a heat diffusion device according to a third embodiment of the present invention. Figure 8 yes Figure 7 An example of a cross-sectional view of a heat spreader along line AA is shown.

[0087] exist Figure 7 and Figure 8 In the heat spreader (heat diffusion device) 3 shown in FIG. 1 , the curved portion 35 of the core 30 is arranged along the outer periphery of the inner space of the housing 10 . Figure 7 and Figure 8In the illustrated example, the two or more rows of bent portions 35 are not arranged in the center of the internal space of the housing 10 , but are concentratedly arranged along the outer periphery of the internal space of the housing 10 .

[0088] exist Figure 7 and Figure 8 In the example shown, two or more rows of curved portions 35 are arranged in parallel, but only one row of curved portions 35 may be arranged. In either case, the curved portions 35 are not arranged in the center of the internal space of the housing 10, but are arranged only in the outer periphery of the internal space of the housing 10.

[0089] [Other embodiments]

[0090] The heat diffusion device of the present invention is not limited to the above-mentioned embodiment, and various applications and modifications can be made within the scope of the present invention regarding the structure, manufacturing conditions, etc. of the heat diffusion device.

[0091] In the heat diffusion device of the present invention, the shell may have one evaporation part or multiple evaporation parts. That is, the outer wall surface of the shell may be provided with one heat source or multiple heat sources. The number of evaporation parts and heat sources is not particularly limited.

[0092] In the heat diffusion device of the present invention, when the housing is composed of the first sheet and the second sheet, the first sheet and the second sheet may be overlapped with their ends aligned or with their ends offset.

[0093] Alternatively, in the heat diffusion device of the present invention, when the housing is composed of a first sheet and a second sheet, the material constituting the first sheet is different from the material constituting the second sheet. For example, by using a high-strength material for the first sheet, the stress applied to the housing can be dispersed. In addition, by making the materials of the two different, one function can be obtained by using one sheet, and another function can be obtained by using the other sheet. The above-mentioned functions are not particularly limited, and examples thereof include a heat conduction function, an electromagnetic wave shielding function, and the like.

[0094] The heat diffusion device of the utility model can be mounted on an electronic device for heat dissipation. Therefore, an electronic device equipped with the heat diffusion device of the utility model is also one of the technical solutions of the utility model. As electronic devices of the utility model, for example, smart phones, tablet terminals, laptop computers, game consoles, wearable devices, etc. can be listed. The heat diffusion device of the utility model does not require external power and works independently as described above. It can diffuse heat in two dimensions and at high speed by utilizing the latent heat of evaporation and latent heat of condensation of the working medium. Therefore, by using an electronic device equipped with the heat diffusion device of the utility model, heat dissipation can be effectively achieved in a limited space inside the electronic device.

[0095] Industrial Applicability

[0096] The heat diffusion device of the utility model can be used for a wide range of purposes in the fields of portable information terminals, etc. For example, it can be used to reduce the temperature of heat sources such as CPUs and extend the use time of electronic devices, and can be used in smart phones, tablet terminals, notebook computers, etc.

[0097] Description of Reference Numerals

[0098] 1, 1A, 2, 3...heat spreader (heat diffusion device); 10...housing; 11...first sheet; 11a...first inner wall; 12...second sheet; 12a...second inner wall; 20...working medium; 30...core; 35...bend; 40...liquid flow path; 50...vapor flow path; 60...pillar; EP...evaporation part; HS...heat source; X...width direction; Y...length direction; Z...thickness direction.

Claims

1. A heat diffusion device, characterized in that: have: A shell having a first inner wall surface and a second inner wall surface facing each other in a thickness direction; a working medium sealed in the inner space of the housing; and A sheet-shaped core is disposed in the inner space of the shell, The core has a curved portion, and the curved portion is provided by protruding from the first inner wall surface toward the second inner wall surface. A liquid flow path of the working medium is formed in a space surrounded by the curved portion of the core and the first inner wall surface. further comprising a support, the support being arranged in the internal space of the housing and in contact with the second inner wall surface, The bent portion of the core is disposed in a region not sandwiched between the support column and the first inner wall surface.

2. The heat diffusion device according to claim 1, characterized in that: The bent portion of the core extends along a long side direction of the housing.

3. The heat diffusion device according to claim 2, characterized in that: The bent portion of the core extends in only one direction.

4. The heat diffusion device according to claim 2, characterized in that: The bent portions of the core are arranged in parallel in two or more rows.

5. The heat diffusion device according to claim 2, characterized in that: The bent portion of the core is arranged along an outer peripheral portion of the internal space of the housing.

6. An electronic device, characterized in that: A heat diffusion device according to any one of claims 1 to 5.

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