Integrated circuit filter operation device

By designing an integrated circuit filter operating device, using precise positioning and movement control, the problems of low peeling detection efficiency and high risk of traditional filter products are solved, and the precise separation between the substrate and the laminated layer and the accurate observation of CPD filling are achieved.

CN222734047UActive Publication Date: 2025-04-08SUZHOU ASEN SEMICON CO LTD
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Patent Information

Application Number
CN202421126720.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-22
Publication Date
2025-04-08
Estimated Expiration
2034-05-22

AI Technical Summary

Technical Problem

Traditional filter products have low peel detection efficiency and high risk coefficient, and manual operation can easily lead to damage and low accuracy.

Method used

An integrated circuit filter operating device is designed, using a combination of mounting plate, platform, mold, blade, left spiral rod and right spiral rod. Through precise positioning and movement control, the substrate layer and the adhesive layer are accurately peeled off and separated.

Benefits of technology

The peel detection efficiency of filter products is improved, the risk of manual operation is reduced, and the precise separation between the substrate and the laminated layer is achieved, ensuring accurate observation of whether CPD is poured into the cavity between the laminated layer and the chip.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to an integrated circuit filter operation device in the field of filter operation technology, including a mounting plate, a platform mounted on the mounting plate, a mold fixedly mounted on the platform, a blade fixedly mounted on the mounting plate, and a left spiral rod arranged on the side of the mounting plate. The utility model adopts a new type of peeling device to replace manual stripping. After fixing a single chip product by a special fixture, the desired peeling position is aligned with the peeling knife under a low-power microscope to achieve separation between the substrate and the laminate layer, so as to observe whether the CPD is poured into the cavity between the laminate layer and the chip; the chip is placed in a specific mold and fixed, a left spiral rod is arranged to control the up and down lifting of the platform, and a right spiral rod is arranged to control the forward and backward movement of the platform. The left spiral rod is used to achieve micron-level precision control, so that the desired separation position and the blade are accurately positioned, and the right spiral rod is controlled to move the platform to complete the peeling and separation of the substrate layer and the film layer.
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Description

Technical Field

[0001] The utility model relates to the technical field of filter operation, in particular to an integrated circuit filter operation device. Background Art

[0002] At present, in the traditional stripping test of filter products, tweezers are used to fix the product manually, and then a stripping knife is used under a low-power microscope to align the substrate layer and the film layer to separate the substrate from the laminate layer in order to observe whether the CPD is injected into the cavity between the laminate layer and the chip. The traditional method is inefficient and easy to hurt the hands, resulting in a high risk factor in the entire stripping process. Utility Model Content

[0003] The utility model aims to solve the shortcomings in the prior art and proposes an integrated circuit filter operating device.

[0004] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a platform is installed on the mounting plate, a mold is fixedly installed on the platform, a blade is fixedly installed on the mounting plate, a left spiral rod is arranged on the side of the mounting plate, and a right spiral rod is installed on the side of the mounting plate.

[0005] As a further description of the above technical solution:

[0006] The platform can be lifted up and down or moved forward and backward on the mounting plate, thereby driving the mold on the platform to be lifted up and down or moved forward and backward.

[0007] As a further description of the above technical solution:

[0008] The interior of the mold is used to place and clamp the chip. The mold uses chips of various sizes and shapes and can adapt to the fixing requirements of different chips by quickly replacing mold components. Precision positioning pins and clamps are used inside the mold to ensure the stability of the chip during the peeling process. When the platform is raised and lowered or moved forward and backward on the mounting plate, the mold on the platform and the chip in the mold are raised and lowered or moved forward and backward.

[0009] As a further description of the above technical solution:

[0010] The left screw rod is used to control the up and down movement of the platform, and the right screw rod is used to control the forward and backward movement of the platform.

[0011] As a further description of the above technical solution:

[0012] The left and right screw rods are designed with precision ball screws and cooperate with servo motors to achieve precise control. The rotation accuracy of the left and right screw rods reaches micron level, ensuring the precise positioning of the platform.

[0013] As a further description of the above technical solution:

[0014] The left screw rod realizes micron-level precision control.

[0015] As a further description of the above technical solution:

[0016] The right spiral rod moves the platform to complete the peeling and separation of the substrate layer and the film layer.

[0017] The utility model has the following beneficial effects:

[0018] (1) The utility model adopts a new type of peeling device for filter products to replace manual stripping. After fixing a single chip product with a special fixture, the desired peeling position is aligned with the blade under a low-power microscope to separate the substrate from the laminate layer, so as to observe whether the CPD is injected into the cavity between the laminate layer and the chip;

[0019] (2) The utility model places the chip into a specific mold and fixes it, sets a left screw rod to control the up and down movement of the platform, and sets a right screw rod to control the forward and backward movement of the platform. The left screw rod is used to achieve micron-level precision control, so that the required separation position and the blade are accurately positioned, and the right screw rod is controlled to move the platform to complete the peeling and separation of the substrate layer and the film layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a top structural schematic diagram of the integrated circuit filter operating device proposed by the utility model;

[0021] Figure 2 The schematic diagram of the structure of the integrated circuit filter operation device after the chip position is adjusted. Figure 1 ;

[0022] Figure 3 The schematic diagram of the structure of the integrated circuit filter operation device after the chip position is adjusted. Figure 2 .

[0023] Legend:

[0024] 1. Mounting plate; 2. Platform; 3. Mold; 4. Blade; 5. Left spiral rod; 6. Right spiral rod. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Reference Figure 1-3 The utility model provides an embodiment: an integrated circuit filter operating device, including a mounting plate 1, a platform 2 is installed on the mounting plate 1, a mold 3 is fixedly installed on the platform 2, a blade 4 is fixedly installed on the mounting plate 1, a left screw rod 5 is arranged on the side of the mounting plate 1, and a right screw rod 6 is installed on the side of the mounting plate 1.

[0027] The mounting plate 1 serves as a supporting base for the entire device. The mounting plate 1 needs to have sufficient stability and load-bearing capacity to ensure mechanical stability during operation.

[0028] The platform 2 is a movable component mounted on the mounting plate 1 and is used to carry the mold 3 and the chip. The design of the platform 2 must ensure stability and accuracy when it is lifted up and down and moved forward and backward.

[0029] The interior of the mold 3 is designed to place and fix the chip to ensure accurate alignment of the chip during the peeling process. The material and design of the mold 3 should take into account the size and shape of the chip, as well as the protection of the chip during operation.

[0030] The blade 4 is a key component for performing the peeling operation and needs to have extremely high sharpness and precision. The installation position of the blade 4 should be precisely aligned with the moving path of the platform 2 to ensure the accuracy of the peeling process.

[0031] The left screw rod 5 is used to control the up and down movement of the platform 2. By rotating the screw rod, the height of the platform 2 can be accurately adjusted to achieve accurate docking of the peeling knife with the chip peeling position.

[0032] The right screw rod 6 is used to control the forward and backward movement of the platform 2. By rotating the screw rod, the position of the platform 2 can be accurately adjusted to achieve accurate cutting of the substrate layer and the film layer by the peeling knife.

[0033] The mounting plate 1 is usually made of high-strength steel, and the surface is specially treated to enhance wear resistance and corrosion resistance.

[0034] The platform 2 is usually made of aluminum alloy to reduce the overall weight while maintaining sufficient rigidity. A precise guide rail system is designed at the bottom of the platform 2 to match the guide rail on the mounting plate 1 to ensure stability and accuracy during lifting and moving.

[0035] The design of mold 3 needs to take into account chips of various sizes and shapes. The mold 3 components can be quickly replaced to adapt to the fixing requirements of different chips. Precise positioning pins and clamps are used inside the mold 3 to ensure the stability of the chip during the peeling process.

[0036] The blade 4 is made of special alloy material, and is precision ground and heat-treated for multiple times to achieve extremely high sharpness and durability. The shape and size of the blade 4 are customized according to the peeling requirements to achieve the best cutting effect.

[0037] The left screw rod 5 and the right screw rod 6 are designed with precision ball screws and cooperate with servo motors to achieve precise control. The rotation accuracy of the screw rods reaches micron level, ensuring the precise positioning of the platform 2.

[0038] Working principle: First, the operator fixes the mounting plate 1 on the workbench to ensure that it is level and stable. Then, the platform 2 is installed on the mounting plate 1, and it is ensured that the platform 2 can be smoothly lifted up and down and moved forward and backward. Then the mold 3 is fixed on the platform 2, and the position of the mold 3 is adjusted to ensure that the chip placement area inside it is aligned with the moving path of the blade 4. The blade 4 is fixed on the mounting plate 1, and the height and angle of the blade 4 are adjusted to ensure that it is accurately aligned with the moving path of the platform 2. The left screw rod 5 and the right screw rod 6 are installed on the side of the mounting plate 1, and the rotation of the screw rod can smoothly control the lifting and movement of the platform 2.

[0039] After the equipment is installed, perform no-load debugging to check whether the lifting and movement of the platform 2 is stable, whether the alignment of the blade 4 and the mold 3 is accurate, and whether the control of the screw rod is sensitive;

[0040] The operator places the chip at a fixed position inside the mold 3, fixes the chip by the clamping mechanism of the mold 3, observes the relative position of the chip and the blade 4 by using a low-power microscope, adjusts the height of the platform 2 by using the left screw rod 5, aligns the blade 4 with the peeling position of the chip, makes fine adjustments under the microscope, realizes micron-level precision control by using the left screw rod 5, accurately locates the relative position of the blade 4 with the chip peeling position, and after confirming the position of the blade 4, controls the platform 2 to move forward and backward by using the right screw rod 6, so that the blade 4 cuts the substrate layer and the film layer along a predetermined trajectory, and completes the peeling separation;

[0041] After the peeling operation is completed, the accuracy and integrity of the peeling position are checked again using a microscope. If necessary, fine-tuning is performed to ensure that the peeling effect meets the process requirements. After the peeling operation is completed, it can be clearly observed whether the CPD has been poured into the cavity between the laminate layer and the chip to verify the integrity of the packaging process.

[0042] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit filter operating device, comprising a mounting plate (1), characterized in that: A platform (2) is installed on the plate, a mold (3) is fixedly installed on the platform (2), a blade (4) is fixedly installed on the mounting plate (1), a left spiral rod (5) is arranged on the side of the mounting plate (1), and a right spiral rod (6) is installed on the side of the mounting plate (1).

2. The integrated circuit filter operating device according to claim 1, characterized in that: The platform (2) can be lifted up and down or moved forward and backward on the mounting plate (1), thereby driving the mold (3) on the platform (2) to be lifted up and down or moved forward and backward.

3. The integrated circuit filter operating device according to claim 1, characterized in that: The mold (3) is used to place and clamp the chip. The mold (3) uses chips of various sizes and shapes, and can adapt to the fixing requirements of different chips by quickly replacing the mold (3) components. Precision positioning pins and clamps are used inside the mold (3) to ensure the stability of the chip during the peeling process. When the platform (2) is raised and lowered or moved forward and backward on the mounting plate (1), the mold (3) on the platform (2) and the chip inside the mold (3) are raised and lowered or moved forward and backward.

4. The integrated circuit filter operating device according to claim 1, characterized in that: The left screw rod (5) is used to control the up and down movement of the platform (2), and the right screw rod (6) is used to control the forward and backward movement of the platform (2).

5. The integrated circuit filter operating device according to claim 1, characterized in that: The left screw rod (5) and the right screw rod (6) are designed with precision ball screws and cooperate with servo motors to achieve precise control. The rotation accuracy of the left screw rod (5) and the right screw rod (6) reaches the micron level, ensuring the precise positioning of the platform (2).

6. The integrated circuit filter operating device according to claim 1, characterized in that: The left spiral rod (5) can achieve micron-level precision control.

7. The integrated circuit filter operating device according to claim 1, characterized in that: The platform (2) is moved by the right spiral rod (6) to complete the peeling and separation of the substrate layer and the film layer.