Self-loop test module
By using a refrigeration chip in the self-loop test module, replacing the traditional chip power resistor, automatic dynamic balance of temperature is achieved, and the high temperature problem caused by the module due to high power consumption is solved, ensuring the continuous operation capability of the module.
Patent Information
- Application Number
- CN202421135458.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-23
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2034-05-23
AI Technical Summary
The existing self-loop test modules are prone to high temperatures under high power consumption, which makes the devices in the module unbearable and cannot operate continuously.
Refrigeration chips are used to replace traditional chip power resistors, and dynamic balance is automatically achieved through periodic transformation of the cold and hot surfaces of the refrigeration chip to achieve temperature control.
It effectively reduces the temperature of the self-loop test module, avoids the problem of stopping work due to overheating, and is suitable for high-power design.
Smart Images
Figure CN222734244U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to a self-loop test module, and more particularly to a self-loop test module equipped with a cooling chip. Background Art
[0002] The network and data center system has a fiber optic port. The transmission end connected to the fiber optic port and the fiber optic transceiver module (hereinafter referred to as the optical module) sends data. The optical module converts the electrical signal into an optical signal and transmits the data through the optical fiber to the fiber optic port in the data center system at the other end. The receiving end in the optical module converts the optical signal into an electrical signal and transmits the data to the data center system to complete the transmission. During the system production and testing process, the optical module will generate heat energy. The system must be maintained at a certain temperature to work. However, the price of the optical module accounts for a very high cost in the production and testing process. In order to reduce the testing cost, a self-loop test module is derived.
[0003] The self-loop test module replaces the optical module and is connected to the optical fiber port of the data center. After the data is sent out from the transmitting end, it is transmitted back to the receiving end of the same port through the self-loop line of the self-loop test module, so as to test whether the transceiver function of each port of the data center system is normal. However, the self-loop transceiver module simulates the heat energy consumption generated by the optical module. The self-loop test module of the prior art uses a chip power resistor as a power consumption device. When the power consumption of the self-loop test module is large, the chip power resistor will quickly generate a high temperature of more than 100 degrees, and the temperature will continue to rise. The components in the self-loop test module will not be able to withstand it and need to stop working. After the temperature drops, it can provide heat energy consumption to allow the data center system to continue testing. In this way, the simulation test function of continuous operation is lost. Utility Model Content
[0004] The present application provides a self-loop test module equipped with a cooling chip to solve the above problems.
[0005] According to one embodiment, the self-loop test module of the present application includes a housing, a circuit board and a cooling chip. The circuit board is arranged in the housing, and the circuit board includes a self-loop test circuit, a microcontroller, a temperature sensor and a cooling chip driver. The cooling chip is arranged in the housing. The cooling chip has a first surface and a second surface located on two opposite sides, wherein the first surface contacts the circuit board, and the second surface contacts the housing. One of the first surface and the second surface is a cold surface, and the other of the first surface and the second surface is a hot surface.
[0006] In one embodiment, the microcontroller is coupled to the cooling chip. The cooling chip driver is coupled to the cooling chip and the microcontroller. When a current temperature of the circuit board is lower than or equal to a temperature threshold, the microcontroller controls the cooling chip driver to periodically transform the first surface into one of the cold surface and the hot surface, and periodically transform the second surface into the other of the cold surface and the hot surface, until the temperature automatically reaches a dynamic balance.
[0007] In one embodiment, when the current temperature of the circuit board is higher than the temperature threshold, the microcontroller controls the cooling chip driver to maintain the first surface as a cold surface and the second surface as a hot surface.
[0008] In one embodiment, the temperature sensor is used to sense the current temperature of the circuit board.
[0009] In one embodiment, the housing includes an upper cover and a lower cover, and the second surface of the cooling chip contacts one of the upper cover and the lower cover.
[0010] In one embodiment, the second surface of the cooling chip is used as a heat dissipation surface by the upper cover or the lower cover of the shell.
[0011] In one embodiment, the cooling chip is designed for power consumption simulation. The cooling chip has a cold surface for cooling and a hot surface for heating, so that the cooling chip consumes more power than other devices.
[0012] In summary, the present application replaces the chip power resistor of the prior art with a cooling chip. Further, the present application can use the cold surface of the cooling chip to cool down, use the hot surface of the cooling chip to generate heat, and use the cooling chip as a power consumption device. When the current temperature of the circuit board is lower than or equal to the temperature threshold value (for example, 75°C), it means that the temperature is normal. At this time, the cold surface and the hot surface of the cooling chip can be periodically changed so that the temperature of the cooling chip automatically reaches a dynamic balance (for example, close to 65°C). When the current temperature of the circuit board is higher than the temperature threshold value, it means that the temperature is too high. At this time, the cold surface of the cooling chip can be kept in contact with the circuit board, and the hot surface of the cooling chip can be kept in contact with the shell, so that the cold surface continues to cool down the circuit board, and the hot surface continues to transfer heat to the shell for heat dissipation. In this way, the self-loop test module of the present application can be applied to high-power designs and will not stop working due to overheating.
[0013] The advantages and spirit of the present application can be further understood through the following detailed description and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 4 is a three-dimensional diagram of a self-loop test module according to an embodiment of the present application.
[0015] Figure 2 for Figure 1 Exploded diagram of the self-loop test module in .
[0016] Figure 3 for Figure 1 Functional block diagram of the self-loop test module in .
[0017] Explanation of symbols
[0018] 1: Self-loop test module
[0019] 10: Shell
[0020] 12: Circuit Board
[0021] 14: Refrigeration chip
[0022] 100: Upper cover
[0023] 102: Lower cover
[0024] 120: Microcontroller
[0025] 122: Refrigeration chip driver
[0026] 124: Temperature sensor
[0027] 126: Transmission terminal
[0028] 128: Receiver
[0029] 140: Side 1
[0030] 142: Side 2 DETAILED DESCRIPTION
[0031] See also Figures 1 to 3 , Figure 1 is a three-dimensional diagram of a self-loop test module 1 according to an embodiment of the present application. Figure 2 for Figure 1 The exploded diagram of the self-loop test module 1 in Figure 3 for Figure 1 Functional block diagram of the self-loop test module 1 in FIG.
[0032] like Figure 1 and Figure 2 As shown, the self-loop test module 1 includes a housing 10, a circuit board 12 and a cooling chip 14, wherein the circuit board 12 and the cooling chip 14 are both disposed in the housing 10. The self-loop test module 1 is used to test the signal return in the system or network. Through the return signal, various potential abnormalities in the network can be detected and power consumption simulation can be performed. In this embodiment, the circuit board 12 includes a self-loop test circuit, and the self-loop test circuit includes a transmitting end 126 and a receiving end 128. Figure 3The transmission end 126 transmits the data to the receiving end 128 for data transmission test. Generally speaking, the self-loop test module 1 is also equipped with necessary hardware and software components for operation, depending on the actual application.
[0033] The cooling chip 14 has a first surface 140 and a second surface 142 located at two opposite sides, wherein the first surface 140 contacts the circuit board 12, and the second surface 142 contacts the housing 10. In the present embodiment, the housing 10 may include an upper cover 100 and a lower cover 102, but is not limited thereto. The cooling chip 14 may be located between the circuit board 12 and the upper cover 100, and at this time, the second surface 142 of the cooling chip 14 may contact the inner surface of the upper cover 100 of the housing 10. It should be noted that the cooling chip 14 may also be located between the circuit board 12 and the lower cover 102, depending on the actual application. In other words, the second surface 142 of the cooling chip 14 may contact one of the upper cover 100 and the lower cover 102. In another embodiment, a thermal interface material (TIM) may be provided between the second surface 142 of the cooling chip 14 and the inner surface of the upper cover 100, wherein the thermal interface material may be a heat dissipation paste or a similar device.
[0034] In the present embodiment, one of the first surface 140 and the second surface 142 may be a cold surface, and the other of the first surface 140 and the second surface 142 may be a hot surface. Generally speaking, the exterior of the cooling chip 14 may be composed of two insulating ceramic substrates, and the interior of the cooling chip 14 may be composed of multiple groups of P-type and N-type bismuth telluride-based thermoelectric materials and conductive copper electrodes in series. When the current enters the thermoelectric material from the electrode, or the thermoelectric material enters the electrode, due to the Peltier effect, the interface position where the heterogeneous materials are joined will produce heat absorption and heat release phenomena, thereby forming a cold surface and a hot surface on the opposite sides of the cooling chip 14. By controlling the direction of the current, it can be determined which side of the first surface 140 and the second surface 142 is the cold surface and which side is the hot surface.
[0035] like Figure 3 As shown, the circuit board 12 may include a microcontroller 120 and a cooling chip driver 122. The microcontroller 120 is coupled to the cooling chip 14, and the cooling chip driver 122 is coupled to the cooling chip 14 and the microcontroller 120. In this embodiment, the microcontroller 120, the cooling chip driver 122 and the cooling chip 14 can be coupled to each other through appropriate circuit layout. In addition, the microcontroller 120 may include a temperature sensor 124 for sensing the current temperature of the circuit board 12.
[0036] When the current temperature of the circuit board 12 is lower than or equal to a temperature threshold value (e.g., 75° C.), it indicates that the temperature is normal. At this time, the microcontroller 120 can control the cooling chip driver 122 to periodically transform the first surface 140 of the cooling chip 14 into one of the cold surface and the hot surface, and periodically transform the second surface 142 of the cooling chip 14 into the other of the cold surface and the hot surface. In other words, when the temperature is normal, the cold surface and the hot surface of the cooling chip 14 can be periodically transformed so that the temperature of the cooling chip 14 automatically reaches a dynamic balance (e.g., close to 65° C.).
[0037] When the current temperature of the circuit board 12 is higher than the temperature threshold value, it indicates that the temperature is too high. At this time, the microcontroller 120 can control the cooling chip driver 122 to maintain the first surface 140 of the cooling chip 14 as a cold surface, and maintain the second surface 142 of the cooling chip 14 as a hot surface. In other words, when the temperature is too high, the cold surface of the cooling chip 14 can be maintained in contact with the circuit board 12, and the hot surface of the cooling chip 14 can be maintained in contact with the housing 10, so that the cold surface continues to cool the circuit board 12, and the hot surface continues to transfer heat to the housing 10 for heat dissipation. At this time, the second surface 142 of the cooling chip 14 is used as a heat dissipation surface. By this, the self-loop test module 1 of the present application can be applied to high-power design and will not stop working due to overheating. The cooling chip 14 of the present application is designed with power consumption simulation. The cooling chip 14 has a cold surface to cool down and a hot surface to heat up at the same time, so that the cooling chip 14 consumes more power than other devices. This is the first original application of the present application. No other cooling chip design is used, only cooling or temperature control is used.
[0038] It should be noted that the above temperature threshold value can be set according to actual applications.
[0039] In summary, the present application replaces the chip power resistor of the prior art with a cooling chip. Further, the present application can use the cold surface of the cooling chip to cool down, use the hot surface of the cooling chip to generate heat, and use the cooling chip as a power consumption device. When the current temperature of the circuit board is lower than or equal to the temperature threshold value, it means that the temperature is normal. At this time, the cold surface and the hot surface of the cooling chip can be periodically changed so that the temperature of the cooling chip automatically reaches a dynamic balance. When the current temperature of the circuit board is higher than the temperature threshold value, it means that the temperature is too high. At this time, the cold surface of the cooling chip can be kept in contact with the circuit board, and the hot surface of the cooling chip can be kept in contact with the shell, so that the cold surface continues to cool down the circuit board, and the hot surface continues to transfer heat to the shell for heat dissipation. Thereby, the self-loop test module of the present application can be suitable for high-power design and will not stop working due to overheating.
[0040] The above description is only a preferred embodiment of the present application, and all equivalent changes and modifications made according to the claims of the present application should fall within the scope of the present application.
Claims
1. A self-loop test module, characterized in that: Include: a housing; a circuit board disposed in the housing, the circuit board comprising a self-loop test circuit, a microcontroller, a temperature sensor and a cooling chip driver; and A cooling chip is disposed in the housing, wherein the cooling chip has a first surface and a second surface located at two opposite sides, wherein the first surface contacts the circuit board, and the second surface contacts the housing; One of the first surface and the second surface is a cold surface, and the other of the first surface and the second surface is a hot surface.
2. The self-loop test module according to claim 1, characterized in that: The microcontroller is coupled to the cooling chip; and The cooling chip driver is coupled to the cooling chip and the microcontroller; When a current temperature of the circuit board is lower than or equal to a temperature threshold, the microcontroller controls the cooling chip driver to periodically transform the first surface into one of the cold surface and the hot surface, and periodically transform the second surface into the other of the cold surface and the hot surface until the temperature automatically reaches a dynamic balance.
3. The self-loop test module according to claim 2, characterized in that: When the current temperature of the circuit board is higher than the temperature threshold, the microcontroller controls the cooling chip driver to maintain the first surface as the cold surface and the second surface as the hot surface.
4. The self-loop test module according to claim 2, characterized in that: The temperature sensor is used to sense the current temperature of the circuit board.
5. The self-loop test module according to claim 1, characterized in that: The housing includes an upper cover and a lower cover, and the second surface of the cooling chip contacts one of the upper cover and the lower cover.
6. The self-loop test module according to claim 5, characterized in that: The second surface of the cooling chip uses the upper cover or the lower cover of the shell as a heat dissipation surface.
7. The self-loop test module according to claim 1, characterized in that: The cooling chip is designed for power consumption simulation. The cooling chip has the cold surface for cooling and the hot surface for heating, so that the cooling chip consumes more power than other devices.